EPM240GM100I5N - MAX II 240-LE CPLD, 100-MBGA, Industrial | Intel
N.º da peça: EPM240GM100I5N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $68.1818 | $68,18 |
| 10 | $49.2424 | $492,42 |
| 100 | $43.5606 | $4.356,06 |
| 500 | $41.6667 | $20.833,35 |
| 1.000 | $39.7727 | $39.772,70 |
EPM240GM100I5N Visão geral
A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-configurable digital IC that implements glue logic, bus bridging, power-up sequencing, and high-speed control functions. Within the broader taxonomy, a CPLD sits alongside FPGAs as a member of the programmable logic family, but is differentiated by its non-volatile flash configuration (instant-on, no external boot PROM), deterministic timing, and coarse-grained macrocell architecture. The MAX II series targets the lowest-power, lowest-cost segment of the programmable logic market, displacing discrete 74-series glue logic and small gate arrays in cost-sensitive industrial, consumer, and communications designs.
Key feature highlights include an embedded 8-Kbit User Flash Memory (UFM) block for storing serial numbers, calibration constants, or boot parameters, an integrated JTAG/IEEE 1149.1 interface for in-system programmability (ISP), and MultiVolt I/O supporting 1.5 V through 5 V mixed-voltage operation. The 4.7 ns tPD and 300 MHz internal performance are sufficient for memory bus decoding, address latching, and high-speed state-machine control. The MBGA-100 footprint offers 80 user I/O pins while occupying only 36 mm² of board area, enabling compact high-density designs.
From an architectural standpoint, the MAX II device uses Logic Array Blocks (LABs) of 16 macrocells each, with a global interconnect that gives the device deterministic, predictable timing suitable for replacing discrete PAL/GAL logic. Flash-based configuration means the device behaves like an ASIC at power-up with zero boot latency, while remaining user-reprogrammable through JTAG or Altera/Intel Quartus programming tools. The 0.18 µm process and 1.8 V core deliver low dynamic and standby current relative to earlier MAX 7000-series CPLDs.
Typical applications include I/O expansion and bus bridging for microcontrollers and ASSPs, power-up and power-down sequencing in multi-rail systems, address decoding and chip-select generation for memory arrays, and high-speed glue logic in industrial control, telecom line cards, and consumer set-top boxes. The wide MultiVolt range makes it especially well suited to mixed 3.3 V/5 V legacy interfaces.
When designing with this part, plan for a 1.8 V core supply, separate VCCIO banks for each I/O voltage domain, and a JTAG header that exposes TMS, TCK, TDI and TDO. The MBGA package requires PCB-level fine-pitch assembly capability (0.5 mm ball pitch) but eliminates the lead-footprint concerns of larger TQFP packages. Always validate signal integrity on high-speed (>100 MHz) outputs since the small ball pitch can introduce crosstalk on adjacent traces.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Intel/Altera MAX II family, and practical design notes not consolidated on a single manufacturer page.
Alternativas drop-in para EPM240GM100I5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM240GM100I5N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Programming Interface, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM240GM100C5N
✓ Em estoque
$4.75 / unidade
Ver ficha técnica →EPM240GF100I5N
✓ Em estoque
$7.9 / unidade
Ver ficha técnica →EPM240GF100C5N
✓ Em estoque
$8.92 / unidade
Ver ficha técnica →EPM240GM100I5N Classificações máximas e características elétricas
| Family | MAX II |
| Logic Elements (LE) | 240 |
| Equivalent Macrocells | 192 |
| User I/O Pins | 80 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 4.7 ns |
| Maximum Operating Frequency | 300 MHz (internal) |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS |
| Configuration Memory | On-chip non-volatile flash (instant-on) |
| Supply Voltage - Core (VCCINT) | 1.8 V |
| MultiVolt I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5 V |
| Encapsulamento | 100-ball Micro FineLine BGA (MBGA), 6 mm × 6 mm, 0.5 mm pitch |
| Temperatura de operação | -40 °C to +105 °C (industrial) |
| Tipo de montagem | Surface Mount |
| RoHS / Lead-Free | Lead-free per package marking |
| Programming Interface | JTAG (IEEE 1149.1) ISP |
Configuração de pinos do EPM240GM100I5N
| Pino A1 | I/O — General-purpose user I/O (bank 1) |
| Pino A2 | I/O — General-purpose user I/O (bank 1) |
| Pino A3 | I/O — General-purpose user I/O (bank 1) |
| Pino A4 | I/O — General-purpose user I/O (bank 1) |
| Pino A5 | I/O — General-purpose user I/O (bank 1) |
| Pino A6 | I/O — General-purpose user I/O (bank 1) |
| Pino A7 | I/O — General-purpose user I/O (bank 1) |
| Pino A8 | I/O — General-purpose user I/O (bank 1) |
| Pino A9 | I/O — General-purpose user I/O (bank 1) |
| Pino A10 | I/O — General-purpose user I/O (bank 1) |
| Pino B1 | I/O — General-purpose user I/O (bank 1) |
| Pino B2 | VCCIO1 — I/O supply - bank 1 |
| Pino B3 | GND — Ground |
| Pino B4 | I/O — General-purpose user I/O (bank 1) |
| Pino B5 | I/O — General-purpose user I/O (bank 1) |
| Pino B6 | I/O — General-purpose user I/O (bank 1) |
| Pino B7 | GND — Ground |
| Pino B8 | VCCIO1 — I/O supply - bank 1 |
| Pino B9 | I/O — General-purpose user I/O (bank 1) |
| Pino B10 | I/O — General-purpose user I/O (bank 1) |
| Pino C1 | I/O — General-purpose user I/O (bank 2) |
| Pino C2 | I/O — General-purpose user I/O (bank 2) |
| Pino C3 | I/O — General-purpose user I/O (bank 1) |
| Pino C4 | VCCINT — Core supply 1.8 V |
| Pino C5 | GND — Ground |
| Pino C6 | VCCINT — Core supply 1.8 V |
| Pino C7 | I/O — General-purpose user I/O (bank 2) |
| Pino C8 | GND — Ground |
| Pino C9 | I/O — General-purpose user I/O (bank 2) |
| Pino C10 | I/O — General-purpose user I/O (bank 2) |
| Pino D1 | I/O — General-purpose user I/O (bank 2) |
| Pino D2 | GND — Ground |
| Pino D3 | VCCIO2 — I/O supply - bank 2 |
| Pino D4 | I/O — General-purpose user I/O (bank 2) |
| Pino D5 | I/O — General-purpose user I/O (bank 2) |
| Pino D6 | I/O — General-purpose user I/O (bank 2) |
| Pino D7 | I/O — General-purpose user I/O (bank 2) |
| Pino D8 | VCCIO2 — I/O supply - bank 2 |
| Pino D9 | GND — Ground |
| Pino D10 | I/O — General-purpose user I/O (bank 2) |
| Pino E1 | I/O — General-purpose user I/O (bank 2) |
| Pino E2 | I/O — General-purpose user I/O (bank 2) |
| Pino E3 | I/O — General-purpose user I/O (bank 2) |
| Pino E4 | GND — Ground |
| Pino E5 | VCCIO2 — I/O supply - bank 2 |
| Pino E6 | VCCIO3 — I/O supply - bank 3 |
| Pino E7 | GND — Ground |
| Pino E8 | I/O — General-purpose user I/O (bank 3) |
| Pino E9 | I/O — General-purpose user I/O (bank 3) |
| Pino E10 | I/O — General-purpose user I/O (bank 3) |
| Pino F1 | I/O — General-purpose user I/O (bank 3) |
| Pino F2 | I/O — General-purpose user I/O (bank 3) |
| Pino F3 | GND — Ground |
| Pino F4 | VCCINT — Core supply 1.8 V |
| Pino F5 | TMS — JTAG test mode select |
| Pino F6 | TCK — JTAG test clock |
| Pino F7 | VCCINT — Core supply 1.8 V |
| Pino F8 | GND — Ground |
| Pino F9 | I/O — General-purpose user I/O (bank 3) |
| Pino F10 | I/O — General-purpose user I/O (bank 3) |
| Pino G1 | I/O — General-purpose user I/O (bank 3) |
| Pino G2 | I/O — General-purpose user I/O (bank 3) |
| Pino G3 | I/O — General-purpose user I/O (bank 3) |
| Pino G4 | TDI — JTAG test data in |
| Pino G5 | nCONFIG — Configuration control (pull-up) |
| Pino G6 | TDO — JTAG test data out |
| Pino G7 | nSTATUS — Configuration status (pull-up) |
| Pino G8 | I/O — General-purpose user I/O (bank 3) |
| Pino G9 | I/O — General-purpose user I/O (bank 3) |
| Pino G10 | I/O — General-purpose user I/O (bank 3) |
| Pino H1 | I/O — General-purpose user I/O (bank 4) |
| Pino H2 | I/O — General-purpose user I/O (bank 4) |
| Pino H3 | GND — Ground |
| Pino H4 | VCCIO3 — I/O supply - bank 3 |
| Pino H5 | VCCIO4 — I/O supply - bank 4 |
| Pino H6 | GND — Ground |
| Pino H7 | VCCIO4 — I/O supply - bank 4 |
| Pino H8 | I/O — General-purpose user I/O (bank 4) |
| Pino H9 | GND — Ground |
| Pino H10 | I/O — General-purpose user I/O (bank 4) |
| Pino J1 | I/O — General-purpose user I/O (bank 4) |
| Pino J2 | I/O — General-purpose user I/O (bank 4) |
| Pino J3 | I/O — General-purpose user I/O (bank 4) |
| Pino J4 | I/O — General-purpose user I/O (bank 4) |
| Pino J5 | VCCINT — Core supply 1.8 V |
| Pino J6 | GND — Ground |
| Pino J7 | VCCINT — Core supply 1.8 V |
| Pino J8 | I/O — General-purpose user I/O (bank 4) |
| Pino J9 | I/O — General-purpose user I/O (bank 4) |
| Pino J10 | I/O — General-purpose user I/O (bank 4) |
| Pino K1 | I/O — General-purpose user I/O (bank 4) |
| Pino K2 | VCCIO4 — I/O supply - bank 4 |
| Pino K3 | GND — Ground |
| Pino K4 | I/O — General-purpose user I/O (bank 4) |
| Pino K5 | I/O — General-purpose user I/O (bank 4) |
| Pino K6 | I/O — General-purpose user I/O (bank 4) |
| Pino K7 | GND — Ground |
| Pino K8 | VCCIO4 — I/O supply - bank 4 |
| Pino K9 | I/O — General-purpose user I/O (bank 4) |
| Pino K10 | I/O — General-purpose user I/O (bank 4) |
Aplicações típicas
EPM240GM100I5N é adequado para 6 aplicaçãos: I/O Expansion and Bus Bridging, Power-Up and Power-Down Sequencing, Address Decoding and Chip-Select Generation, Industrial Control Glue Logic, Telecom Line-Card Glue Logic, Display and Set-Top Box Control.
I/O Expansion and Bus Bridging
The EPM240GM100I5N is widely used to expand the I/O count or bridge between mismatched bus voltages on microcontrollers and ASSPs. Its 80 user I/O pins and MultiVolt I/O (1.5 V through 5 V VCCIO banks) let a single 6×6 mm CPLD connect a 5 V legacy peripheral bus to a 1.8 V application processor without external level shifters. The instant-on, non-volatile configuration means the bridge is operational within microseconds of power-up, eliminating boot-latency concerns. Designers typically instantiate the part as address-latch, chip-select, and bus-arbitration glue between a low-pin-count MCU and external SRAM, NOR flash, or parallel-port peripherals. The 4.7 ns tPD1 timing comfortably handles 50-100 MHz bus speeds.
Recomendado
Power-Up and Power-Down Sequencing
Multi-rail systems (FPGAs, SoCs, DDR memory) require strict power-rail sequencing to avoid latch-up or in-rush damage. The EPM240GM100I5N is ideal for this role because its non-volatile flash configuration boots instantly and its 80 I/O pins can drive dozens of enable signals, PG (power-good) inputs, and reset lines in parallel. With 4.7 ns tPD1 and 300 MHz internal performance, the CPLD can implement sequenced delays, fault monitoring, and watchdog re-trigger logic with deterministic timing. Industrial temperature grade (-40 °C to +105 °C) is essential for outdoor telecom, factory automation, and automotive-adjacent applications.
Recomendado
Address Decoding and Chip-Select Generation
Memory subsystems in networking line cards, base stations, and industrial controllers rely on precise address decoding to drive chip-select signals for SRAM, NOR flash, and register banks. The EPM240GM100I5N's 192 macrocells and 4.7 ns tPD1 propagation delay deliver sub-10 ns decoding latency at 100+ MHz system clocks, matching DDR-style memory timing budgets. Its on-chip UFM block (8 Kbits) can store vendor IDs, boot configuration words, or timing-calibration constants that the decoder references at startup. Quartus synthesis produces deterministic pin-to-pin timing reports that engineers can use for static timing closure in safety-critical designs.
Recomendado
Industrial Control Glue Logic
In PLCs, motor controllers, and factory-automation I/O modules, the EPM240GM100I5N replaces dozens of 74-series logic gates with a single reconfigurable device, shrinking the BOM and consolidating PCB area. The 6×6 mm MBGA-100 footprint is small enough for compact DIN-rail modules, while the industrial -40 °C to +105 °C operating range meets IEC 60068-2 environmental stress profiles. Its MultiVolt I/O can interface directly to 24 V-tolerant digital inputs via external resistor dividers, and its deterministic timing supports safety-rated logic paths up to SIL-2 in appropriate architectures. JTAG ISP allows field firmware updates without removing the module from service.
Recomendado
Telecom Line-Card Glue Logic
Telecom line cards require low-power, deterministic glue logic for framing, alarm aggregation, and clock-domain crossing between framer ASICs, network processors, and backplane SERDES. The EPM240GM100I5N's 4.7 ns pin-to-pin delay and 300 MHz internal performance handle 155 MHz POS-PHY / SPI-4.2 side-band signals without timing closure issues. Its 1.8 V core draws minimal current versus older 5 V GAL/PAL solutions, helping line cards meet NEBS thermal and power budgets. The 8 Kbit UFM can hold line-card serial numbers and manufacturing-traceability data accessible over JTAG.
Recomendado
Display and Set-Top Box Control
Consumer set-top boxes, HDMI switchers, and digital-signage displays use the EPM240GM100I5N to manage EDID EEPROM access, HDMI hot-plug-detect (HPD) logic, and LED status multiplexing. The 80 user I/O pins easily drive multi-digit seven-segment displays, IR receiver interfaces, and front-panel key-scan matrices. The instant-on flash configuration eliminates the 'no-display-during-boot' artifact that PLD-based designs sometimes show. Industrial temperature grade supports outdoor digital-signage and automotive-infotainment applications where the cabin or kiosk exceeds commercial ambient limits.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM240GM100I5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM240GM100C5N | EPM240GF100I5N | EPM240GF100C5N |
|---|---|---|---|---|
| Package | 100-ball MBGA (6×6 mm) | 100-ball MBGA (6×6 mm) - same | 100-ball FBGA - same pin count, footprint differs | 100-ball FBGA - same pin count, footprint differs |
| Brand | Intel | Intel | Intel | Intel |
| Family | MAX II G | MAX II G | MAX II G | MAX II G |
| Logic Elements | 240 | 240 | 240 | 240 |
| Macrocells | 192 | 192 | 192 | 192 |
| User I/O | 80 | 80 | 80 | 80 |
| tPD1 (ns) | 4.7 ns | 4.7 ns | 4.7 ns | 4.7 ns |
| Operating Temperature | -40 °C to +105 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +105 °C (industrial) | 0 °C to +85 °C (commercial) |
| UFM (bits) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Principais diferenciais
- Industrial-grade MAX II G with -40 °C to +105 °C support and MBGA-100 footprint (vs EPM240GM100C5N)
- True MBGA (Micro FineLine) ball map vs F100 FineLine variant (vs EPM240GF100I5N)
- Lower per-unit cost than higher-density MAX II alternatives while delivering the same I/O count (vs EPM1270F256I5N)
Notas de projeto
The EPM240GM100I5N requires two distinct supply rails: a 1.8 V VCCINT for the core logic and one or more VCCIO bank supplies for the I/O drivers, selectable from 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V. Place at least one 0.1 µF X7R decoupling capacitor within 2 mm of every VCCINT and VCCIO ball, plus a single bulk 10 µF ceramic or tantalum capacitor per rail near the device. Power-up sequencing must satisfy the datasheet's monotonic VCCINT rise-time requirement (< 100 ms) to ensure correct configuration of the on-chip flash. The instant-on, non-volatile configuration eliminates external PROM complexity but does not relax the rail-ripple budget: keep VCCINT ripple below 50 mV peak-to-peak at frequencies up to 500 kHz to avoid Logic Array Block timing jitter.
The MBGA-100 package uses 0.5 mm ball pitch on a 6×6 mm substrate, which demands a 4-layer PCB with a continuous ground plane directly beneath the device. Use 0.4 mm laser-drilled microvias and 0.2 mm trace/space rules on the outer layers. Escape routing for an interior row of balls should use a dog-bone fanout or, preferably, a 1-2-3 via-in-pad structure if the assembly house supports it. All VCC and GND balls must be connected to their respective planes with short, low-inductance vias - never daisy-chain power between balls. Ground the thermal pad (if present on the MBGA variant) with at least four thermal vias tied to the inner ground plane for heat spreading.
Do not confuse the EPM240GM100 (MBGA-100) with the EPM240F100 (FBGA-100) - although both have 100 balls and similar die, the ball-map pinouts differ between the Micro FineLine and FineLine BGA packages, so a PCB designed for one is not a drop-in for the other. Always include a JTAG header (TMS, TCK, TDI, TDO plus optional nCONFIG and nSTATUS pull-ups) accessible without removing the board, so you can re-flash the device in the field. When migrating from MAX 7000 designs, note that MAX II configuration is instant-on - there is no separate program/erase cycle - so legacy JTAG instruction sequences must be updated for the new BSDL file. Finally, do not float unused I/O pins: configure them as outputs driving low in the Quartus pin-assignment file to minimize transient current.
Informações de conformidade
Lead-free MBGA-100 package per part marking. RoHS compliance inferred from Intel/Altera MAX II family product page. AEC-Q100 automotive qualification is not claimed on MAX II; for automotive applications refer to MAX 10 or Cyclone families.
