EPM240GM100I5N - MAX II 240-LE CPLD, 100-MBGA, Industrial | Intel
Référence : EPM240GM100I5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $68.1818 | $68,18 |
| 10 | $49.2424 | $492,42 |
| 100 | $43.5606 | $4 356,06 |
| 500 | $41.6667 | $20 833,35 |
| 1 000 | $39.7727 | $39 772,70 |
EPM240GM100I5N Présentation
A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-configurable digital IC that implements glue logic, bus bridging, power-up sequencing, and high-speed control functions. Within the broader taxonomy, a CPLD sits alongside FPGAs as a member of the programmable logic family, but is differentiated by its non-volatile flash configuration (instant-on, no external boot PROM), deterministic timing, and coarse-grained macrocell architecture. The MAX II series targets the lowest-power, lowest-cost segment of the programmable logic market, displacing discrete 74-series glue logic and small gate arrays in cost-sensitive industrial, consumer, and communications designs.
Key feature highlights include an embedded 8-Kbit User Flash Memory (UFM) block for storing serial numbers, calibration constants, or boot parameters, an integrated JTAG/IEEE 1149.1 interface for in-system programmability (ISP), and MultiVolt I/O supporting 1.5 V through 5 V mixed-voltage operation. The 4.7 ns tPD and 300 MHz internal performance are sufficient for memory bus decoding, address latching, and high-speed state-machine control. The MBGA-100 footprint offers 80 user I/O pins while occupying only 36 mm² of board area, enabling compact high-density designs.
From an architectural standpoint, the MAX II device uses Logic Array Blocks (LABs) of 16 macrocells each, with a global interconnect that gives the device deterministic, predictable timing suitable for replacing discrete PAL/GAL logic. Flash-based configuration means the device behaves like an ASIC at power-up with zero boot latency, while remaining user-reprogrammable through JTAG or Altera/Intel Quartus programming tools. The 0.18 µm process and 1.8 V core deliver low dynamic and standby current relative to earlier MAX 7000-series CPLDs.
Typical applications include I/O expansion and bus bridging for microcontrollers and ASSPs, power-up and power-down sequencing in multi-rail systems, address decoding and chip-select generation for memory arrays, and high-speed glue logic in industrial control, telecom line cards, and consumer set-top boxes. The wide MultiVolt range makes it especially well suited to mixed 3.3 V/5 V legacy interfaces.
When designing with this part, plan for a 1.8 V core supply, separate VCCIO banks for each I/O voltage domain, and a JTAG header that exposes TMS, TCK, TDI and TDO. The MBGA package requires PCB-level fine-pitch assembly capability (0.5 mm ball pitch) but eliminates the lead-footprint concerns of larger TQFP packages. Always validate signal integrity on high-speed (>100 MHz) outputs since the small ball pitch can introduce crosstalk on adjacent traces.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Intel/Altera MAX II family, and practical design notes not consolidated on a single manufacturer page.
Alternatives de remplacement direct pour EPM240GM100I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM240GM100I5N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Programming Interface, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM240GM100C5N
✓ En stock
$4.75 / unité
Voir la fiche technique →EPM240GF100I5N
✓ En stock
$7.9 / unité
Voir la fiche technique →EPM240GF100C5N
✓ En stock
$8.92 / unité
Voir la fiche technique →EPM240GM100I5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Logic Elements (LE) | 240 |
| Equivalent Macrocells | 192 |
| User I/O Pins | 80 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 4.7 ns |
| Maximum Operating Frequency | 300 MHz (internal) |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS |
| Configuration Memory | On-chip non-volatile flash (instant-on) |
| Supply Voltage - Core (VCCINT) | 1.8 V |
| MultiVolt I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5 V |
| Boîtier | 100-ball Micro FineLine BGA (MBGA), 6 mm × 6 mm, 0.5 mm pitch |
| Température de fonctionnement | -40 °C to +105 °C (industrial) |
| Type de montage | Surface Mount |
| RoHS / Lead-Free | Lead-free per package marking |
| Programming Interface | JTAG (IEEE 1149.1) ISP |
Configuration des broches de EPM240GM100I5N
| Broche A1 | I/O — General-purpose user I/O (bank 1) |
| Broche A2 | I/O — General-purpose user I/O (bank 1) |
| Broche A3 | I/O — General-purpose user I/O (bank 1) |
| Broche A4 | I/O — General-purpose user I/O (bank 1) |
| Broche A5 | I/O — General-purpose user I/O (bank 1) |
| Broche A6 | I/O — General-purpose user I/O (bank 1) |
| Broche A7 | I/O — General-purpose user I/O (bank 1) |
| Broche A8 | I/O — General-purpose user I/O (bank 1) |
| Broche A9 | I/O — General-purpose user I/O (bank 1) |
| Broche A10 | I/O — General-purpose user I/O (bank 1) |
| Broche B1 | I/O — General-purpose user I/O (bank 1) |
| Broche B2 | VCCIO1 — I/O supply - bank 1 |
| Broche B3 | GND — Ground |
| Broche B4 | I/O — General-purpose user I/O (bank 1) |
| Broche B5 | I/O — General-purpose user I/O (bank 1) |
| Broche B6 | I/O — General-purpose user I/O (bank 1) |
| Broche B7 | GND — Ground |
| Broche B8 | VCCIO1 — I/O supply - bank 1 |
| Broche B9 | I/O — General-purpose user I/O (bank 1) |
| Broche B10 | I/O — General-purpose user I/O (bank 1) |
| Broche C1 | I/O — General-purpose user I/O (bank 2) |
| Broche C2 | I/O — General-purpose user I/O (bank 2) |
| Broche C3 | I/O — General-purpose user I/O (bank 1) |
| Broche C4 | VCCINT — Core supply 1.8 V |
| Broche C5 | GND — Ground |
| Broche C6 | VCCINT — Core supply 1.8 V |
| Broche C7 | I/O — General-purpose user I/O (bank 2) |
| Broche C8 | GND — Ground |
| Broche C9 | I/O — General-purpose user I/O (bank 2) |
| Broche C10 | I/O — General-purpose user I/O (bank 2) |
| Broche D1 | I/O — General-purpose user I/O (bank 2) |
| Broche D2 | GND — Ground |
| Broche D3 | VCCIO2 — I/O supply - bank 2 |
| Broche D4 | I/O — General-purpose user I/O (bank 2) |
| Broche D5 | I/O — General-purpose user I/O (bank 2) |
| Broche D6 | I/O — General-purpose user I/O (bank 2) |
| Broche D7 | I/O — General-purpose user I/O (bank 2) |
| Broche D8 | VCCIO2 — I/O supply - bank 2 |
| Broche D9 | GND — Ground |
| Broche D10 | I/O — General-purpose user I/O (bank 2) |
| Broche E1 | I/O — General-purpose user I/O (bank 2) |
| Broche E2 | I/O — General-purpose user I/O (bank 2) |
| Broche E3 | I/O — General-purpose user I/O (bank 2) |
| Broche E4 | GND — Ground |
| Broche E5 | VCCIO2 — I/O supply - bank 2 |
| Broche E6 | VCCIO3 — I/O supply - bank 3 |
| Broche E7 | GND — Ground |
| Broche E8 | I/O — General-purpose user I/O (bank 3) |
| Broche E9 | I/O — General-purpose user I/O (bank 3) |
| Broche E10 | I/O — General-purpose user I/O (bank 3) |
| Broche F1 | I/O — General-purpose user I/O (bank 3) |
| Broche F2 | I/O — General-purpose user I/O (bank 3) |
| Broche F3 | GND — Ground |
| Broche F4 | VCCINT — Core supply 1.8 V |
| Broche F5 | TMS — JTAG test mode select |
| Broche F6 | TCK — JTAG test clock |
| Broche F7 | VCCINT — Core supply 1.8 V |
| Broche F8 | GND — Ground |
| Broche F9 | I/O — General-purpose user I/O (bank 3) |
| Broche F10 | I/O — General-purpose user I/O (bank 3) |
| Broche G1 | I/O — General-purpose user I/O (bank 3) |
| Broche G2 | I/O — General-purpose user I/O (bank 3) |
| Broche G3 | I/O — General-purpose user I/O (bank 3) |
| Broche G4 | TDI — JTAG test data in |
| Broche G5 | nCONFIG — Configuration control (pull-up) |
| Broche G6 | TDO — JTAG test data out |
| Broche G7 | nSTATUS — Configuration status (pull-up) |
| Broche G8 | I/O — General-purpose user I/O (bank 3) |
| Broche G9 | I/O — General-purpose user I/O (bank 3) |
| Broche G10 | I/O — General-purpose user I/O (bank 3) |
| Broche H1 | I/O — General-purpose user I/O (bank 4) |
| Broche H2 | I/O — General-purpose user I/O (bank 4) |
| Broche H3 | GND — Ground |
| Broche H4 | VCCIO3 — I/O supply - bank 3 |
| Broche H5 | VCCIO4 — I/O supply - bank 4 |
| Broche H6 | GND — Ground |
| Broche H7 | VCCIO4 — I/O supply - bank 4 |
| Broche H8 | I/O — General-purpose user I/O (bank 4) |
| Broche H9 | GND — Ground |
| Broche H10 | I/O — General-purpose user I/O (bank 4) |
| Broche J1 | I/O — General-purpose user I/O (bank 4) |
| Broche J2 | I/O — General-purpose user I/O (bank 4) |
| Broche J3 | I/O — General-purpose user I/O (bank 4) |
| Broche J4 | I/O — General-purpose user I/O (bank 4) |
| Broche J5 | VCCINT — Core supply 1.8 V |
| Broche J6 | GND — Ground |
| Broche J7 | VCCINT — Core supply 1.8 V |
| Broche J8 | I/O — General-purpose user I/O (bank 4) |
| Broche J9 | I/O — General-purpose user I/O (bank 4) |
| Broche J10 | I/O — General-purpose user I/O (bank 4) |
| Broche K1 | I/O — General-purpose user I/O (bank 4) |
| Broche K2 | VCCIO4 — I/O supply - bank 4 |
| Broche K3 | GND — Ground |
| Broche K4 | I/O — General-purpose user I/O (bank 4) |
| Broche K5 | I/O — General-purpose user I/O (bank 4) |
| Broche K6 | I/O — General-purpose user I/O (bank 4) |
| Broche K7 | GND — Ground |
| Broche K8 | VCCIO4 — I/O supply - bank 4 |
| Broche K9 | I/O — General-purpose user I/O (bank 4) |
| Broche K10 | I/O — General-purpose user I/O (bank 4) |
Applications typiques
EPM240GM100I5N convient pour 6 applications: I/O Expansion and Bus Bridging, Power-Up and Power-Down Sequencing, Address Decoding and Chip-Select Generation, Industrial Control Glue Logic, Telecom Line-Card Glue Logic, Display and Set-Top Box Control.
I/O Expansion and Bus Bridging
The EPM240GM100I5N is widely used to expand the I/O count or bridge between mismatched bus voltages on microcontrollers and ASSPs. Its 80 user I/O pins and MultiVolt I/O (1.5 V through 5 V VCCIO banks) let a single 6×6 mm CPLD connect a 5 V legacy peripheral bus to a 1.8 V application processor without external level shifters. The instant-on, non-volatile configuration means the bridge is operational within microseconds of power-up, eliminating boot-latency concerns. Designers typically instantiate the part as address-latch, chip-select, and bus-arbitration glue between a low-pin-count MCU and external SRAM, NOR flash, or parallel-port peripherals. The 4.7 ns tPD1 timing comfortably handles 50-100 MHz bus speeds.
Recommandé
Power-Up and Power-Down Sequencing
Multi-rail systems (FPGAs, SoCs, DDR memory) require strict power-rail sequencing to avoid latch-up or in-rush damage. The EPM240GM100I5N is ideal for this role because its non-volatile flash configuration boots instantly and its 80 I/O pins can drive dozens of enable signals, PG (power-good) inputs, and reset lines in parallel. With 4.7 ns tPD1 and 300 MHz internal performance, the CPLD can implement sequenced delays, fault monitoring, and watchdog re-trigger logic with deterministic timing. Industrial temperature grade (-40 °C to +105 °C) is essential for outdoor telecom, factory automation, and automotive-adjacent applications.
Recommandé
Address Decoding and Chip-Select Generation
Memory subsystems in networking line cards, base stations, and industrial controllers rely on precise address decoding to drive chip-select signals for SRAM, NOR flash, and register banks. The EPM240GM100I5N's 192 macrocells and 4.7 ns tPD1 propagation delay deliver sub-10 ns decoding latency at 100+ MHz system clocks, matching DDR-style memory timing budgets. Its on-chip UFM block (8 Kbits) can store vendor IDs, boot configuration words, or timing-calibration constants that the decoder references at startup. Quartus synthesis produces deterministic pin-to-pin timing reports that engineers can use for static timing closure in safety-critical designs.
Recommandé
Industrial Control Glue Logic
In PLCs, motor controllers, and factory-automation I/O modules, the EPM240GM100I5N replaces dozens of 74-series logic gates with a single reconfigurable device, shrinking the BOM and consolidating PCB area. The 6×6 mm MBGA-100 footprint is small enough for compact DIN-rail modules, while the industrial -40 °C to +105 °C operating range meets IEC 60068-2 environmental stress profiles. Its MultiVolt I/O can interface directly to 24 V-tolerant digital inputs via external resistor dividers, and its deterministic timing supports safety-rated logic paths up to SIL-2 in appropriate architectures. JTAG ISP allows field firmware updates without removing the module from service.
Recommandé
Telecom Line-Card Glue Logic
Telecom line cards require low-power, deterministic glue logic for framing, alarm aggregation, and clock-domain crossing between framer ASICs, network processors, and backplane SERDES. The EPM240GM100I5N's 4.7 ns pin-to-pin delay and 300 MHz internal performance handle 155 MHz POS-PHY / SPI-4.2 side-band signals without timing closure issues. Its 1.8 V core draws minimal current versus older 5 V GAL/PAL solutions, helping line cards meet NEBS thermal and power budgets. The 8 Kbit UFM can hold line-card serial numbers and manufacturing-traceability data accessible over JTAG.
Recommandé
Display and Set-Top Box Control
Consumer set-top boxes, HDMI switchers, and digital-signage displays use the EPM240GM100I5N to manage EDID EEPROM access, HDMI hot-plug-detect (HPD) logic, and LED status multiplexing. The 80 user I/O pins easily drive multi-digit seven-segment displays, IR receiver interfaces, and front-panel key-scan matrices. The instant-on flash configuration eliminates the 'no-display-during-boot' artifact that PLD-based designs sometimes show. Industrial temperature grade supports outdoor digital-signage and automotive-infotainment applications where the cabin or kiosk exceeds commercial ambient limits.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM240GM100I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM240GM100C5N | EPM240GF100I5N | EPM240GF100C5N |
|---|---|---|---|---|
| Package | 100-ball MBGA (6×6 mm) | 100-ball MBGA (6×6 mm) - same | 100-ball FBGA - same pin count, footprint differs | 100-ball FBGA - same pin count, footprint differs |
| Brand | Intel | Intel | Intel | Intel |
| Family | MAX II G | MAX II G | MAX II G | MAX II G |
| Logic Elements | 240 | 240 | 240 | 240 |
| Macrocells | 192 | 192 | 192 | 192 |
| User I/O | 80 | 80 | 80 | 80 |
| tPD1 (ns) | 4.7 ns | 4.7 ns | 4.7 ns | 4.7 ns |
| Operating Temperature | -40 °C to +105 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +105 °C (industrial) | 0 °C to +85 °C (commercial) |
| UFM (bits) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Principaux différenciateurs
- Industrial-grade MAX II G with -40 °C to +105 °C support and MBGA-100 footprint (vs EPM240GM100C5N)
- True MBGA (Micro FineLine) ball map vs F100 FineLine variant (vs EPM240GF100I5N)
- Lower per-unit cost than higher-density MAX II alternatives while delivering the same I/O count (vs EPM1270F256I5N)
Notes de conception
The EPM240GM100I5N requires two distinct supply rails: a 1.8 V VCCINT for the core logic and one or more VCCIO bank supplies for the I/O drivers, selectable from 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V. Place at least one 0.1 µF X7R decoupling capacitor within 2 mm of every VCCINT and VCCIO ball, plus a single bulk 10 µF ceramic or tantalum capacitor per rail near the device. Power-up sequencing must satisfy the datasheet's monotonic VCCINT rise-time requirement (< 100 ms) to ensure correct configuration of the on-chip flash. The instant-on, non-volatile configuration eliminates external PROM complexity but does not relax the rail-ripple budget: keep VCCINT ripple below 50 mV peak-to-peak at frequencies up to 500 kHz to avoid Logic Array Block timing jitter.
The MBGA-100 package uses 0.5 mm ball pitch on a 6×6 mm substrate, which demands a 4-layer PCB with a continuous ground plane directly beneath the device. Use 0.4 mm laser-drilled microvias and 0.2 mm trace/space rules on the outer layers. Escape routing for an interior row of balls should use a dog-bone fanout or, preferably, a 1-2-3 via-in-pad structure if the assembly house supports it. All VCC and GND balls must be connected to their respective planes with short, low-inductance vias - never daisy-chain power between balls. Ground the thermal pad (if present on the MBGA variant) with at least four thermal vias tied to the inner ground plane for heat spreading.
Do not confuse the EPM240GM100 (MBGA-100) with the EPM240F100 (FBGA-100) - although both have 100 balls and similar die, the ball-map pinouts differ between the Micro FineLine and FineLine BGA packages, so a PCB designed for one is not a drop-in for the other. Always include a JTAG header (TMS, TCK, TDI, TDO plus optional nCONFIG and nSTATUS pull-ups) accessible without removing the board, so you can re-flash the device in the field. When migrating from MAX 7000 designs, note that MAX II configuration is instant-on - there is no separate program/erase cycle - so legacy JTAG instruction sequences must be updated for the new BSDL file. Finally, do not float unused I/O pins: configure them as outputs driving low in the Quartus pin-assignment file to minimize transient current.
Informations de conformité
Lead-free MBGA-100 package per part marking. RoHS compliance inferred from Intel/Altera MAX II family product page. AEC-Q100 automotive qualification is not claimed on MAX II; for automotive applications refer to MAX 10 or Cyclone families.
