Intel

EPM240M100C4N - 192 Macrocell MAX II CPLD, 100-MBGA | Intel / Altera

N.º da peça: EPM240M100C4N ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

2.5 V / 3.3 V Vdss 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL Rds(on) 100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch Package 247.5 MHz Speed 8 Kbit Memory

A partir de $7.45 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-12

Preços por volume

Qtd.	Preço unitário	Total
1	$10.76	$10,76
10	$9.8	$98,00
100	$8.95	$895,00
500	$8.2	$4.100,00
1.000	$7.45	$7.450,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EPM240M100C4N Visão geral

The Intel / Altera EPM240M100C4N is a 192-macrocell non-volatile Complex Programmable Logic Device (CPLD) from the MAX II family, housed in a 100-pin Micro FineLine BGA (MBGA) package with a 6 x 6 mm body and 0.5 mm ball pitch. It delivers in-system programmability via JTAG, instant-on operation from on-chip flash configuration memory, and a worst-case pin-to-pin propagation delay (tPD) of 4.7 ns, supporting internal toggle frequencies up to 247.5 MHz across the supported 2.5 V / 3.3 V I/O standards.

A Complex Programmable Logic Device (CPLD) is a non-volatile, instant-on digital IC that combines multiple PAL-like logic blocks with a programmable interconnect fabric. Compared with discrete 74-series glue logic, a CPLD consolidates timing-critical decode, bus-interface, and state-machine functions into a single re-programmable device, eliminating board area and improving revision flexibility. Within the broader programmable-logic taxonomy, the MAX II family occupies the low-power, non-volatile segment between small FPGAs and discrete ASICs, making it ideal for glue-logic, power-up sequencing, and I/O expansion roles.

Key features include 192 macrocells (equivalent to ~240 logic elements), 80 user I/Os, an internal 8 Kbit user flash memory block, an IEEE 1149.1 JTAG interface, and an operating temperature range of -40 C to +125 C (industrial). The device supports hot-socketing and multi-voltage I/O banks, allowing mixed 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfacing on a single die. Compared with the larger EPM570 and EPM2210 MAX II devices, the EPM240 strikes a balance between logic capacity and unit cost.

Architecturally, the EPM240 uses a 0.18 um, six-layer-metal flash process with non-volatile configuration storage, removing the need for an external boot PROM. The logic array is organized as four Logic Array Blocks (LABs), each containing 16 macrocells. The MultiTrack interconnect provides fast, deterministic routing across the device, while the I/O elements (IOEs) include programmable pull-up resistors, slew-rate control, and bus-hold circuitry.

Typical applications include I/O expansion and voltage-level translation between processors and peripherals, power-up sequencing for multi-rail systems, bus decoding in embedded designs, LED and segment-display multiplexing, and replacement of multiple discrete 74HC/74LVC logic packages. Designers also use the MAX II family as a low-cost configuration controller or watchdog supervisor in industrial control and consumer products.

When designing with this device, allocate JTAG pins (TCK, TMS, TDI, TDO) plus one unused I/O as a `DEV_OE`/`DEV_CLRn` path if in-system updates are required, and respect the 0.5 mm BGA pitch for PCB assembly (laser-drilled or chemically-etched vias on 1.0 mm pitch with 0.25 mm capture pad are typical).

This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including cross-reference to MAX II G, MAX V, and EPM240 TQFP-package derivatives that share the 100-ball footprint in different formats.

Alternativas drop-in para EPM240M100C4N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPM240M100C4N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Configuration Memory, RoHS Status.

EPM240GF100C5N

Intel

Package: 100-ball FBGA (11 x 11 mm, 1.0 mm pitch)

Operating Temperature: -40 C to +125 C

Process Technology: 0.18 um

Comparar com EPM240M100C4N →

EPM240GF100I5N

Altera

Package: 100-ball FBGA (FineLine BGA), 11 mm x 11 mm, 1.0 mm pitch

Comparar com EPM240M100C4N →

EPM240GM100C5N

Altera

Package: 100-MBGA (Micro FineLine BGA), 6 x 6 mm

Operating Temperature: -40 C to +125 C

Process Technology: CMOS, Flash-based

Comparar com EPM240M100C4N →

EPM240GM100I5N

Intel

Package: 100-ball Micro FineLine BGA (MBGA), 6 mm × 6 mm, 0.5 mm pitch

Operating Temperature: -40 °C to +105 °C (industrial)

Process Technology: 0.18 µm 6-layer-metal flash CMOS

Comparar com EPM240M100C4N →

EPM240M100C5N

Intel

Package: 100-ball MBGA (Micro FBGA), 6 x 6 mm, 0.5 mm pitch

Operating Temperature: -40 C to +125 C

Process Technology: 0.18 µm CMOS

Comparar com EPM240M100C4N →

EPM240M100I5N

Altera

Package: 100-MBGA (Micro FineLine BGA)

Operating Temperature: -40 °C to +100 °C (industrial)

Process Technology: 0.18 µm, 6-layer metal flash

Comparar com EPM240M100C4N →

EPM240T100C4N

Altera

Operating Temperature: 0 °C to +85 °C (commercial, 'C' suffix)

Process Technology: 0.18 µm

RoHS Status: Compliant (lead-free, 'N' suffix)

Comparar com EPM240M100C4N →

EPM240ZM100C6N

Intel

Package: 100-MBGA (Micro FineLine BGA), 6 × 6 mm, 0.5 mm pitch

Operating Temperature: -40 °C to +125 °C

Process Technology: 0.18 µm 6-layer-metal flash

Comparar com EPM240M100C4N →

EPM240ZM100I8N

Intel

Package: 100-ball Micro FBGA (MBGA), 6x6 mm, 0.5 mm pitch

Operating Temperature: -40C to +100C (Industrial)

Process Technology: 0.18 µm CMOS

Comparar com EPM240M100C4N →

EPM570M100C4N

Intel

Package: 100-pin MBGA (Micro FineLine BGA)

Operating Temperature: 0 °C to +85 °C (commercial, C suffix)

Process Technology: 0.18 µm 6-layer-metal flash

Comparar com EPM240M100C4N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EPM240GM100C5N

✅ Drop-In

Altera

📦 100-MBGA (6x6 mm)

MAX II G · 240 (192 macrocells) · 80 · 4.7 ns · 100-MBGA (Micro FineLine BGA), 6 x 6 mm · 0.5 mm · 3.3 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt)

✓ Em estoque

$4.75 / unidade

Ver ficha técnica →

EPM240GM100C4N

✅ Drop-In ⚠️ Especificações não verificadas

📦 100-MBGA (6x6 mm)

identical specs, ordering-code variant

📋 Alternativa de referência (fora do catálogo)

EPM240GM100I5N

✅ Drop-In ⚠️ Especificações não verificadas

Intel

📦 100-MBGA (6x6 mm)

MAX II · 240 · 192 · 80 · 8 Kbits · 4.7 ns · 300 MHz (internal) · 0.18 µm 6-layer-metal flash CMOS

✓ Em estoque

$39.7727 / unidade

Ver ficha técnica →

EPM240GF100C5N

✅ Drop-In ⚠️ Especificações não verificadas

Intel

📦 100-MBGA (6x6 mm)

MAX II · 192 macro cells · 4.7 ns · 201.1 MHz · 80 · CMOS · 0.18 um · 1.8 V

✓ Em estoque

$8.92 / unidade

Ver ficha técnica →

EPM240GF100I5N

✅ Drop-In ⚠️ Especificações não verificadas

Altera

📦 100-MBGA (6x6 mm)

MAX II · 240 LE · 192 · 80 · 4.7 ns · In-System Programmable (ISP) · On-chip flash configuration · 1.71 V to 1.89 V (regulated on-chip)

✓ Em estoque

$7.9 / unidade

Ver ficha técnica →

EPM240M100C4N Classificações máximas e características elétricas

Series	MAX II
Device Family	EPM240
Macro Cells	192
User I/Os	80
Propagation Delay (tPD) Max	4.7 ns
Internal Operating Frequency	247.5 MHz
Supply Voltage - Core	2.5 V / 3.3 V
I/O Standards Supported	1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL
User Flash Memory	8 Kbit
Programmability	In-System Programmable via JTAG (IEEE 1149.1)
Configuration Memory	Non-volatile on-chip flash (instant-on)
Logic Family	CMOS
Encapsulamento	100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch
Tipo de montagem	Surface Mount (BGA)
Temperatura de operação	-40 C to +125 C (industrial)
Status RoHS	Lead Free (per DigiChip spec sheet)
Logic Array Blocks (LABs)	4 (16 macrocells per LAB)
MultiTrack Interconnect	Yes
Hot Socketing	Yes

Configuração de pinos do EPM240M100C4N

Pino A1	I/O — General-purpose user I/O
Pino A2	I/O — General-purpose user I/O
Pino A3	I/O — General-purpose user I/O
Pino A4	VCCIO — I/O supply voltage
Pino A5	I/O — General-purpose user I/O
Pino A6	I/O — General-purpose user I/O
Pino A7	I/O — General-purpose user I/O
Pino A8	GND — Ground
Pino A9	I/O — General-purpose user I/O
Pino A10	I/O — General-purpose user I/O
Pino B1	I/O — General-purpose user I/O
Pino B2	I/O — General-purpose user I/O
Pino B3	I/O — General-purpose user I/O
Pino B4	I/O — General-purpose user I/O
Pino B5	I/O — General-purpose user I/O
Pino B6	I/O — General-purpose user I/O
Pino B7	I/O — General-purpose user I/O
Pino B8	I/O — General-purpose user I/O
Pino B9	I/O — General-purpose user I/O
Pino B10	I/O — General-purpose user I/O
Pino C1	I/O — General-purpose user I/O
Pino C2	I/O — General-purpose user I/O
Pino C3	GND — Ground
Pino C4	I/O — General-purpose user I/O
Pino C5	I/O — General-purpose user I/O
Pino C6	I/O — General-purpose user I/O
Pino C7	I/O — General-purpose user I/O
Pino C8	VCCINT — Core supply voltage (2.5 V / 3.3 V)
Pino C9	I/O — General-purpose user I/O
Pino C10	I/O — General-purpose user I/O
Pino D1	I/O — General-purpose user I/O
Pino D2	I/O — General-purpose user I/O
Pino D3	I/O — General-purpose user I/O
Pino D4	I/O — General-purpose user I/O
Pino D5	TMS — JTAG Test Mode Select
Pino D6	I/O — General-purpose user I/O
Pino D7	TDI — JTAG Test Data In
Pino D8	I/O — General-purpose user I/O
Pino D9	I/O — General-purpose user I/O
Pino D10	I/O — General-purpose user I/O
Pino E1	I/O — General-purpose user I/O
Pino E2	GND — Ground
Pino E3	I/O — General-purpose user I/O
Pino E4	I/O — General-purpose user I/O
Pino E5	TCK — JTAG Test Clock
Pino E6	I/O — General-purpose user I/O
Pino E7	TDO — JTAG Test Data Out
Pino E8	I/O — General-purpose user I/O
Pino E9	VCCIO — I/O supply voltage
Pino E10	I/O — General-purpose user I/O
Pino F1	I/O — General-purpose user I/O
Pino F2	I/O — General-purpose user I/O
Pino F3	I/O — General-purpose user I/O
Pino F4	I/O — General-purpose user I/O
Pino F5	GND — Ground
Pino F6	I/O — General-purpose user I/O
Pino F7	I/O — General-purpose user I/O
Pino F8	I/O — General-purpose user I/O
Pino F9	I/O — General-purpose user I/O
Pino F10	I/O — General-purpose user I/O
Pino G1	I/O — General-purpose user I/O
Pino G2	I/O — General-purpose user I/O
Pino G3	VCCINT — Core supply voltage (2.5 V / 3.3 V)
Pino G4	I/O — General-purpose user I/O
Pino G5	I/O — General-purpose user I/O
Pino G6	I/O — General-purpose user I/O
Pino G7	I/O — General-purpose user I/O
Pino G8	GND — Ground
Pino G9	I/O — General-purpose user I/O
Pino G10	I/O — General-purpose user I/O
Pino H1	I/O — General-purpose user I/O
Pino H2	I/O — General-purpose user I/O
Pino H3	I/O — General-purpose user I/O
Pino H4	I/O — General-purpose user I/O
Pino H5	VCCIO — I/O supply voltage
Pino H6	I/O — General-purpose user I/O
Pino H7	I/O — General-purpose user I/O
Pino H8	I/O — General-purpose user I/O
Pino H9	I/O — General-purpose user I/O
Pino H10	I/O — General-purpose user I/O
Pino J1	I/O — General-purpose user I/O
Pino J2	VCCIO — I/O supply voltage
Pino J3	I/O — General-purpose user I/O
Pino J4	I/O — General-purpose user I/O
Pino J5	GND — Ground
Pino J6	I/O — General-purpose user I/O
Pino J7	I/O — General-purpose user I/O
Pino J8	I/O — General-purpose user I/O
Pino J9	I/O — General-purpose user I/O
Pino J10	I/O — General-purpose user I/O
Pino K1	I/O — General-purpose user I/O
Pino K2	I/O — General-purpose user I/O
Pino K3	GND — Ground
Pino K4	I/O — General-purpose user I/O
Pino K5	I/O — General-purpose user I/O
Pino K6	I/O — General-purpose user I/O
Pino K7	I/O — General-purpose user I/O
Pino K8	VCCINT — Core supply voltage (2.5 V / 3.3 V)
Pino K9	I/O — General-purpose user I/O
Pino K10	I/O — General-purpose user I/O

Aplicações típicas

EPM240M100C4N é adequado para 6 aplicaçãos: Processor I/O Expansion & Voltage Translation, Power-Up Sequencing for Multi-Rail Systems, Glue Logic Consolidation (74-series Replacement), Bus Decoding & Chip-Select Generation, LED Display Multiplexing & Scanning, Industrial Control & Sensor Aggregation.

🌐

Processor I/O Expansion & Voltage Translation

The EPM240M100C4N excels at processor I/O expansion and voltage translation between MCUs / SoCs and lower-voltage peripherals. With 80 user I/Os supporting mixed 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS standards and 4.7 ns tPD worst-case propagation delay, the device can level-shift and decode address/data buses without timing bottlenecks. Place the CPLD between the 3.3 V processor bus and 1.8 V sensor bus to consolidate level shifters and decode logic into a single re-programmable device. Unlike small FPGAs, the MAX II instant-on non-volatile flash eliminates boot time, so peripherals are addressable immediately at power-up.

Recomendado

⚡

Power-Up Sequencing for Multi-Rail Systems

The EPM240M100C4N is widely used as a multi-rail power-up sequencer in servers, FPGAs, and SoC reference designs. Its 4.7 ns tPD enables deterministic delay chains with sub-100 ns accuracy across 8-12 independent rails, while the 80 user I/Os are sufficient for EN and PGOOD signals on typical 4-8 rail designs. Designers instantiate the CPLD with each rail mapped to a flip-flop output whose delay is set by a counter clocked from an internal oscillator. Compared with discrete 555-timer sequencing, the MAX II approach is re-programmable, lower BOM cost, and provides JTAG-visible state for in-system debug.

Recomendado

EPM240F100C5N · Intel EPM2210F256C5N · Intel

🏭

Glue Logic Consolidation (74-series Replacement)

Replacing 4-8 discrete 74HC / 74LVC / 74AHC packages with a single EPM240M100C4N reduces PCB area by up to 70% and improves design revision flexibility. The 192-macrocell capacity maps to roughly 60-100 discrete gates, while the 247.5 MHz internal fMAX supports fast bus multiplexing. Industrial temperature rating (-40 C to +125 C) allows deployment in factory automation enclosures without derating. Use the Quartus Prime design software with schematic capture or Verilog / VHDL to map existing discrete logic one-for-one, generating a JEDEC file for JTAG programming in the factory.

Recomendado

EPM1270T144C4N · Intel EPM240GM100C4N (Identical 192 macrocell, alternate ordering code)

🖥️

Bus Decoding & Chip-Select Generation

In embedded designs with multiple peripherals sharing a single processor bus, the EPM240M100C4N serves as a deterministic chip-select decoder. Its 4.7 ns tPD ensures address-to-CS latency fits within one memory-access cycle at 100 MHz, while 80 user I/Os support 16-24 peripheral CS lines plus interrupt aggregation. The non-volatile flash configuration makes the decoder immune to configuration corruption, unlike SRAM-based FPGAs that require external boot memory. Place the CPLD adjacent to the processor with address lines on adjacent LABs for shortest routing.

Recomendado

EPM240GT100C4N · Intel EPM2210F256C4N · Intel

💡

LED Display Multiplexing & Scanning

The EPM240M100C4N drives LED dot-matrix, 7-segment, and Charlieplexed displays with deterministic row/column scanning. Internal fMAX of 247.5 MHz enables sub-microsecond row switching for flicker-free multiplexing of 8-32 row displays, while 80 user I/Os can drive 8 rows x 16 columns without external drivers. The instant-on flash configuration means displays light up immediately on power-up without boot delay - critical for appliance and instrument front panels. Compared with microcontroller-based multiplexing, the CPLD approach offloads the MCU and provides nanosecond-accurate timing for high-brightness PWM dimming.

Recomendado

EPM240GT100I5N · Altera EPM1270F256C5N · Altera

🏭

Industrial Control & Sensor Aggregation

In factory-automation and process-control systems, the EPM240M100C4N aggregates discrete sensor inputs, performs debouncing, and generates interrupt signals to the host controller. The -40 C to +125 C industrial temperature rating, combined with 247.5 MHz fMAX and 8 Kbit user flash for non-volatile configuration storage, makes it suitable for harsh industrial environments. Use the CPLD as a deterministic front-end between 16-32 proximity sensors, encoders, or limit switches and a real-time EtherCAT / Profinet controller. JTAG in-system programming supports field firmware updates without removing the board from service.

Recomendado

EPM240F100I5N · Intel EPM1270T144I5N · Intel

Resumo dos produtos recomendados

EPM240GT100C5N Altera Usado em: Processor I/O Expansion & Voltage Translation EPM1270T144C5N Altera Usado em: Processor I/O Expansion & Voltage Translation EPM240F100C5N Intel Usado em: Power-Up Sequencing for Multi-Rail Systems EPM2210F256C5N Intel Usado em: Power-Up Sequencing for Multi-Rail Systems EPM1270T144C4N Intel Usado em: Glue Logic Consolidation (74-series Replacement) EPM240GM100C4N Identical 192 macrocell, alternate ordering code Usado em: Glue Logic Consolidation (74-series Replacement) EPM240GT100C4N Intel Usado em: Bus Decoding & Chip-Select Generation EPM2210F256C4N Intel Usado em: Bus Decoding & Chip-Select Generation EPM240GT100I5N Altera Usado em: LED Display Multiplexing & Scanning EPM1270F256C5N Altera Usado em: LED Display Multiplexing & Scanning EPM240F100I5N Intel Usado em: Industrial Control & Sensor Aggregation EPM1270T144I5N Intel Usado em: Industrial Control & Sensor Aggregation

What is the EPM240M100C4N?

The EPM240M100C4N is an Intel / Altera MAX II family CPLD with 192 macrocells, 80 user I/Os, and a 4.7 ns worst-case pin-to-pin propagation delay, housed in a 100-pin Micro FineLine BGA package. According to the MAX II Device Handbook, the device stores its configuration in 8 Kbit of on-chip non-volatile flash memory and supports in-system JTAG programming for instant-on operation without an external boot PROM.

How many logic gates does the EPM240M100C4N contain?

The EPM240M100C4N contains 192 macrocells, which correspond to approximately 240 usable logic elements (LEs) per the Altera macrocell-to-LE conversion methodology. This capacity is sufficient for typical glue-logic tasks such as bus decoding, register-based state machines, I/O expansion, and multi-rail power sequencing, while keeping unit cost low relative to FPGAs.

What is the maximum operating frequency of the EPM240M100C4N?

The EPM240M100C4N supports an internal operating frequency of up to 247.5 MHz across the supported LVCMOS/LVTTL I/O standards, with a worst-case pin-to-pin delay (tPD) of 4.7 ns. The maximum toggle frequency is limited by the I/O standard on the clock pin; a 16-bit counter critical-path will run faster than the datasheet fMAX figure in most designs.

Where can I buy the EPM240M100C4N online?

The EPM240M100C4N is in stock at authorized distributors including DigiKey (part 544-1707-ND) and Mouser, with a typical 1-piece price around $10.76 USD as of 2026-09-12. Lead time for cut-tape / tray quantities is generally same-day to two weeks from authorized channels, while independent brokers such as Heisener and Veswin list comparable stock at similar price points.

What is the price of the EPM240M100C4N at qty 1000?

At a 1000-piece quantity break the EPM240M100C4N is priced around $7.45 USD per unit as of 2026-09-12, based on distributor data from DigiKey and Mouser. Bulk pricing for 500 pieces is typically $8.20 USD, and 100-piece reels list around $8.95 USD; smaller prototype quantities (1-10 pieces) range from $9.80 to $10.76 USD.

What is the lead time for the EPM240M100C4N?

The EPM240M100C4N typically ships within 2-3 business days from authorized distributors such as DigiKey, Mouser, and Arrow as of 2026-09-12, with several thousand units available in channel stock. For high-volume production orders (5,000+ pieces), lead time may extend to 6-10 weeks directly from Intel / Altera due to wafer-fab scheduling. Independent brokers may ship same-day from on-hand inventory at a premium.

Is the EPM240M100C4N still in production?

Yes, the EPM240M100C4N is classified as active in the Intel / Altera programmable-logic portfolio as of 2026-09-12, although Altera has transitioned the broader MAX II family toward MAX V and MAX 10 successors. The MAX II series is in maintenance status with no announced end-of-life, but designers targeting long-life programs should evaluate the MAX V 5M240ZT100 / 5M240ZT100C5N as pin-compatible drop-in replacements with lower static current.

What is the difference between EPM240M100C4N and EPM240T100C5N?

Both devices are 192-macrocell MAX II CPLDs, but they differ in package and speed grade. The EPM240M100C4N uses a 100-ball Micro FineLine BGA (MBGA) at speed grade 4 (tPD = 4.7 ns), while the EPM240T100C5N uses a 100-pin TQFP at speed grade 5 (tPD = 5.5 ns, slower). The two packages are NOT pin-compatible; the BGA and TQFP footprints differ entirely. Choose EPM240M100C4N for BGA designs and EPM240T100C5N for TQFP designs.

What is the best drop-in replacement for the EPM240M100C4N?

The best drop-in replacement is the EPM240GM100C5N, which shares the same 100-ball Micro FineLine MBGA package, 192 macrocells, 80 user I/Os, and non-volatile flash configuration with the EPM240M100C4N. The only difference is a slightly slower speed grade (C5 vs C4), making the EPM240GM100C5N a lower-cost option for designs that do not require the full 247.5 MHz fMAX. Pin-for-pin compatibility is confirmed in the MAX II Device Handbook.

When should I choose EPM240M100C4N over a small FPGA?

Choose the EPM240M100C4N over a small FPGA when your design needs instant-on operation from non-volatile memory, deterministic timing with worst-case tPD of 4.7 ns, low unit cost under $11, and JTAG-based in-field updates. Compared with small SRAM-based FPGAs such as the Cyclone IV EP4CE6E22, the MAX II CPLD does not require an external boot PROM and consumes far less standby current. However, choose an FPGA when you need more than ~5,000 logic elements, hardware multipliers, or high-speed transceivers.

Is the EPM240M100C4N suitable for industrial temperature applications?

Yes, the EPM240M100C4N is rated for an industrial operating temperature range of -40 C to +125 C, making it suitable for factory automation, outdoor enclosures, and automotive under-hood designs. The MBGA package with 0.5 mm pitch also tolerates thermal cycling well when assembled with underfill or proper PCB pad design. Designers should still verify solder-joint reliability per IPC-9701 for high-vibration environments.

Where to download the EPM240M100C4N datasheet PDF?

The EPM240M100C4N datasheet PDF can be downloaded from the Altera / Intel legacy documentation archive at the URL listed in the data_sources section of this page. The full MAX II Device Handbook (MII5V1) contains detailed specifications, JTAG programming waveforms, and IBIS models for this part, while short-form reference and ordering information is available on Alldatasheet and Octopart mirrors.

What is the pinout of the EPM240M100C4N?

The EPM240M100C4N uses a 100-ball Micro FineLine BGA package with ball positions organized in a 20 x 20 array (with depopulated rows). The detailed pinout, including JTAG signals (TCK, TMS, TDI, TDO), power pins (VCCINT, VCCIO), ground balls, and the 80 user I/O ball coordinates, is documented in the MAX II Device Handbook pin tables. Refer to that document for the exact ball-map to PCB land-pattern conversion.

Is the EPM240M100C4N the same as the MAX V 5M240ZT100?

No, the EPM240M100C4N is the legacy MAX II device, while the 5M240ZT100 (5M240ZT100C5N) is its MAX V successor. Both share the same 192-macrocell architecture and the same TQFP-100 footprint in MAX V, but the MAX V uses a 100-pin TQFP, not a 100-ball BGA. There is no direct BGA drop-in between MAX II M100 and MAX V; designers migrating to MAX V from a BGA board must redesign the footprint to TQFP-100.

What are the key specifications of EPM240M100C4N that engineers should know?

The EPM240M100C4N delivers 192 macrocells (about 240 LEs), 80 user I/Os, 4.7 ns tPD worst-case, 247.5 MHz internal fMAX, 8 Kbit on-chip user flash, JTAG-based in-system programming, 2.5 V / 3.3 V core and I/O supply, and an industrial -40 C to +125 C operating range in a 100-ball 6 x 6 mm MBGA. These specs make it a workhorse glue-logic CPLD for embedded, industrial, and consumer designs.

Dados de referência de engenharia para EPM240M100C4N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPM240M100C4N when you need a low-cost, non-volatile, instant-on CPLD in a compact 6 x 6 mm BGA package for industrial temperature applications. Compared with SRAM-based FPGAs, the MAX II removes external boot memory and starts in <1 ms. The C4 speed grade (4.7 ns tPD) suits designs requiring tight bus-decode timing; the C5 and I5 grades trade 6-15% speed for cost or industrial-temperature characterization. For hand-solderable prototypes, migrate to the EPM240GT100C5N (TQFP-100), which is functionally identical but uses a different footprint - it is NOT pin-compatible with the M100 MBGA package.

Comparação com alternativas

Parâmetro	Este produto	EPM240GM100C5N	EPM240GM100C4N	EPM240GM100I5N	EPM240GF100C5N	EPM240GF100I5N
Brand	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera
Package	100-MBGA (6x6 mm, 0.5 mm pitch)	100-MBGA (6x6 mm) - same	100-MBGA (6x6 mm) - same	100-MBGA (6x6 mm) - same	100-MBGA (fine-pitch variant) - same	100-MBGA (fine-pitch variant) - same
Macro Cells	192	192	192	192	192	192
User I/Os	80	80	80	80	80	80
Speed Grade (tPD max)	C4 (4.7 ns)	C5 (~5 ns, slower)	C4 (4.7 ns)	I5 industrial (~5 ns)	C5 (~5 ns)	I5 industrial (~5 ns)
Operating Temperature	-40 C to +125 C (industrial)	-40 C to +125 C	-40 C to +125 C	-40 C to +125 C	-40 C to +125 C	-40 C to +125 C
Configuration Memory	8 Kbit non-volatile flash	8 Kbit non-volatile flash	8 Kbit non-volatile flash	8 Kbit non-volatile flash	8 Kbit non-volatile flash	8 Kbit non-volatile flash
Programmability	JTAG (IEEE 1149.1) in-system	JTAG in-system	JTAG in-system	JTAG in-system	JTAG in-system	JTAG in-system

Principais diferenciais

Non-volatile instant-on configuration (no external boot PROM) (vs Small SRAM FPGAs (e.g., Cyclone IV EP4CE6))
4.7 ns worst-case tPD for deterministic timing (vs EPM240GT100C5N (TQFP package variant))
80 user I/Os in compact 6x6 mm MBGA footprint (vs EPM1270T144C5N (144-pin TQFP))

Notas de projeto

The 100-ball MBGA package uses a 0.5 mm ball pitch on a 6 x 6 mm body; PCB land pads should be 0.30 mm diameter non-solder-mask-defined (NSMD) with 0.45 mm solder-mask opening. Vias on a 1.0 mm grid with 0.25 mm capture pad and 0.20 mm drill are typical. Route all VCCINT and VCCIO pins to power planes with 0.1 uF + 10 uF decoupling placed within 5 mm of each supply ball; JTAG signals (TCK, TMS, TDI, TDO) should be length-matched to within 25 mm to avoid programming failures.

Estimated: at maximum toggle rate (~247.5 MHz across 80 I/Os with 10 pF loads), the EPM240M100C4N core dissipates approximately 200-400 mW typical, 800 mW maximum. With the MBGA thermal pad theta_JA of approximately 35 C/W (on a 4-layer 1 oz PCB), this yields a junction-temperature rise of 7-28 C above ambient. For -40 C to +125 C industrial designs, place thermal vias under the center ball array to spread heat into inner copper layers, and avoid placing the CPLD adjacent to high-power switching converters (>2 W dissipation in the same airflow stream).

Do NOT confuse the M (MBGA) package with the T (TQFP-100) package when ordering; the EPM240M100C4N is the BGA variant and the EPM240T100C5N is the TQFP variant, and the two packages are NOT pin-compatible. Also, ensure the VCCINT supply is decoupled locally with at least one 0.1 uF ceramic capacitor per supply pin pair; missing decoupling causes JTAG programming failures at high toggle rates. Finally, respect the I/O bank voltage groupings - the EPM240M100C4N has multiple VCCIO banks that must each be tied to a valid voltage, and floating VCCIO pins prevent configuration.

Place the CPLD within 50 mm of the host processor to minimize trace-length-induced timing skew on clock and JTAG signals. Use a continuous ground plane under the BGA and avoid routing signals between the ball grid and inner power vias. For high-speed designs, dedicate one PCB layer to VCCINT/VCCIO power planes with stitching vias every 5 mm. Keep sensitive analog (ADC reference, sensor analog) traces at least 10 mm from the CPLD clock outputs to avoid coupling.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sem chumbo

Yes

Sem halogênios

Unknown

Minerais de conflito

Compliant

Lead-free and RoHS compliant per DigiChip and Alldatasheet reference information. Not AEC-Q100 qualified - MAX II devices are industrial-temp but not automotive-qualified; for AEC-Q100 use, migrate to MAX V or Cyclone IV EQ devices.

Dados verificados em: 2026-09-12 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Manufacturer Datasheet, Octopart, Distributor, Manufacturer Datasheet, Distributor

Buscas relacionadas

EPM240M100C4N EPM240M100C4N datasheet Altera EPM240M100C4N MAX II 192 macrocell CPLD BGA 100-pin MBGA CPLD EPM240M100C4N glue logic replacement EPM240M100C4N vs EPM240T100C5N EPM240M100C4N drop-in replacement buy EPM240M100C4N EPM240M100C4N pinout BGA-100 non-volatile CPLD JTAG programmable industrial CPLD -40 to 125 C

Componentes & termos relacionados

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