EPM240ZM68C6N - 192 Macrocell CPLD 7.5ns 68-MBGA | Intel / Altera
N.º da peça: EPM240ZM68C6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.2 | $9,20 |
| 10 | $8.3 | $83,00 |
| 100 | $7.1 | $710,00 |
| 500 | $5.95 | $2.975,00 |
| 1.000 | $5.1 | $5.100,00 |
EPM240ZM68C6N Visão geral
A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-on digital IC that combines multiple PAL-like logic blocks on a single die, with a programmable interconnect matrix routing signals between them. Architecturally, a CPLD sits between small glue-logic gate arrays (a few dozen gates) and full FPGAs (tens of thousands of LUTs with soft cores and SERDES). The MAX II family — to which the EPM240Z belongs — is Altera's (now Intel) zero-power CPLD line: it replaces the classic EEPROM or antifuse cell with on-chip flash configuration memory, eliminating the external boot PROM that legacy MAX devices needed and giving instant-on behavior similar to an FPGA with bitstream pre-loaded into flash.
Key features of the EPM240ZM68C6N include 192 macrocells (~240 logic elements in legacy Altera nomenclature, hence the '240' prefix), 184.1 MHz internal performance, 80 user I/O pins broken into I/O banks, multi-voltage support (1.5 V, 1.8 V, 2.5 V, 3.3 V I/O standards) via banked VCCIO, in-system programmability through JTAG, and low standby current characteristic of the MAX II Z-series. The Micro FBGA-68 package is a chip-scale BGA suited to high-density PCB designs where board area is constrained.
The architecture combines Look-Up Table (LUT) based logic array blocks (LABs) with a global interconnect that fans out across the die. Each macrocell contains a programmable flip-flop, product-term logic, and a configurable output buffer. Compared to discrete 74-series glue logic, the EPM240Z replaces dozens of packages with a single device while adding reconfigurability for late-stage design changes, BOM consolidation, and obsolescence management.
Typical applications include bus-bridging between processors operating at different voltages, glue-logic replacement for 74HC/74LVC series gates, address decoding in microcontroller systems, LED driving and PWM generation, I/O expansion for FPGAs or microcontrollers with insufficient pins, and board-level power sequencing. Designers also use the device in industrial control, motor drive signal conditioning, and portable instrumentation where low standby current matters.
When designing with the EPM240ZM68C6N, mind that the 68-ball Micro FBGA requires X-ray or careful hot-air rework for prototyping and that JTAG chain sharing must be planned if the board already contains an FPGA or another programmable device. The Intel Quartus II (or Quartus Prime Lite) toolchain supports this part with full synthesis, place-and-route, and timing analysis.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes — including JTAG chain sharing and decoupling strategy — to give an engineer a complete view beyond what the manufacturer datasheet alone provides.
Alternativas drop-in para EPM240ZM68C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM240ZM68C6N (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Family, Process Technology, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM240ZM100C6N
✅ Drop-In✓ Em estoque
$7.1 / unidade
Ver ficha técnica →EPM240ZM100C7N
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →EPM240ZM100I8N
✅ Drop-In✓ Em estoque
$8.45 / unidade
Ver ficha técnica →EPM240ZM68C5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM240GM100C5N
✅ Drop-In✓ Em estoque
$4.75 / unidade
Ver ficha técnica →EPM240M100C5N
✅ Drop-In✓ Em estoque
$4.25 / unidade
Ver ficha técnica →EPM240ZM68C6N Classificações máximas e características elétricas
| Family | MAX II Z (CPLD) |
| Macrocells | 192 |
| Logic Elements (LE) | 240 |
| Maximum Propagation Delay (tPD) | 7.5 ns |
| Internal Performance (fMAX) | 184.1 MHz |
| Process Technology | 0.18 µm |
| User I/O Count | 80 |
| Number of I/O Banks | 4 |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| Encapsulamento | 68-ball Micro FBGA (MBGA-68) |
| Tipo de montagem | Surface Mount (BGA) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE 1149.1 / IEEE 1532) |
| Faixa de temperatura de operação | -40°C to +85°C (commercial, 'C' suffix) |
| Status RoHS | Compliant |
| Lead-Free Finish | Yes |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Configuração de pinos do EPM240ZM68C6N
| Pino A1 | I/O — User I/O (bank 1) |
| Pino A2 | I/O — User I/O (bank 1) |
| Pino A3 | I/O — User I/O (bank 1) |
| Pino A4 | I/O — User I/O (bank 1) |
| Pino A5 | I/O — User I/O (bank 1) |
| Pino A6 | I/O — User I/O (bank 1) |
| Pino A7 | I/O — User I/O (bank 1) |
| Pino A8 | I/O — User I/O (bank 1) |
| Pino B1 | I/O — User I/O (bank 1) |
| Pino B2 | I/O — User I/O (bank 1) |
| Pino B3 | I/O — User I/O (bank 1) |
| Pino B4 | I/O — User I/O (bank 1) |
| Pino B5 | I/O — User I/O (bank 1) |
| Pino B6 | I/O — User I/O (bank 1) |
| Pino B7 | I/O — User I/O (bank 1) |
| Pino B8 | I/O — User I/O (bank 1) |
| Pino C1 | GND — Ground |
| Pino C2 | I/O — User I/O (bank 2) |
| Pino C3 | I/O — User I/O (bank 2) |
| Pino C4 | VCCINT — Core supply 1.8 V |
| Pino C5 | VCCIO1 — Bank 1 I/O supply |
| Pino C6 | I/O — User I/O (bank 3) |
| Pino C7 | I/O — User I/O (bank 3) |
| Pino C8 | GND — Ground |
| Pino D1 | I/O — User I/O (bank 2) |
| Pino D2 | I/O — User I/O (bank 2) |
| Pino D3 | I/O — User I/O (bank 2) |
| Pino D4 | VCCIO2 — Bank 2 I/O supply |
| Pino D5 | GND — Ground |
| Pino D6 | VCCIO3 — Bank 3 I/O supply |
| Pino D7 | I/O — User I/O (bank 3) |
| Pino D8 | I/O — User I/O (bank 3) |
| Pino E1 | TDI — JTAG Test Data In |
| Pino E2 | I/O — User I/O (bank 2) |
| Pino E3 | I/O — User I/O (bank 2) |
| Pino E4 | TMS — JTAG Test Mode Select |
| Pino E5 | TCK — JTAG Test Clock |
| Pino E6 | I/O — User I/O (bank 3) |
| Pino E7 | I/O — User I/O (bank 3) |
| Pino E8 | TDO — JTAG Test Data Out |
| Pino F1 | I/O — User I/O (bank 2) |
| Pino F2 | I/O — User I/O (bank 2) |
| Pino F3 | I/O — User I/O (bank 2) |
| Pino F4 | nCONFIG — Configuration control (pull-up to VCCIO) |
| Pino F5 | nSTATUS — Configuration status (open-drain) |
| Pino F6 | I/O — User I/O (bank 3) |
| Pino F7 | I/O — User I/O (bank 3) |
| Pino F8 | I/O — User I/O (bank 3) |
| Pino G1 | GND — Ground |
| Pino G2 | I/O — User I/O (bank 4) |
| Pino G3 | I/O — User I/O (bank 4) |
| Pino G4 | VCCIO4 — Bank 4 I/O supply |
| Pino G5 | GND — Ground |
| Pino G6 | I/O — User I/O (bank 4) |
| Pino G7 | I/O — User I/O (bank 4) |
| Pino G8 | GND — Ground |
| Pino H1 | I/O — User I/O (bank 4) |
| Pino H2 | I/O — User I/O (bank 4) |
| Pino H3 | I/O — User I/O (bank 4) |
| Pino H4 | I/O — User I/O (bank 4) |
| Pino H5 | I/O — User I/O (bank 4) |
| Pino H6 | I/O — User I/O (bank 4) |
| Pino H7 | I/O — User I/O (bank 4) |
| Pino H8 | I/O — User I/O (bank 4) |
| Pino J1 | I/O — User I/O (bank 4) |
| Pino J2 | I/O — User I/O (bank 4) |
| Pino J3 | I/O — User I/O (bank 4) |
| Pino J4 | I/O — User I/O (bank 4) |
| Pino J5 | I/O — User I/O (bank 4) |
| Pino J6 | I/O — User I/O (bank 4) |
| Pino J7 | I/O — User I/O (bank 4) |
| Pino J8 | I/O — User I/O (bank 4) |
Aplicações típicas
EPM240ZM68C6N é adequado para 7 aplicaçãos: Microcontroller I/O Expansion and Glue Logic, Voltage-Translation Bus Bridge, Industrial Control and Sensor Aggregation, LED Driving and PWM Control, Legacy 74-Series Logic Consolidation, JTAG Chain Master / FPGA Configuration Manager, Address Decoding and Chip-Select Generation.
Microcontroller I/O Expansion and Glue Logic
The EPM240ZM68C6N is well suited as a low-latency I/O expander for microcontrollers with insufficient pins, replacing dozens of 74LVC/74HC glue-logic packages with a single re-programmable device. Its 7.5 ns pin-to-pin propagation delay and 192 macrocells handle address decoding, chip-select generation, and interrupt aggregation across 80 user I/O. Instant-on flash configuration eliminates boot-PROM complexity typical of SRAM FPGAs, while 4 VCCIO banks let the CPLD interface directly with 1.8 V MCUs and 3.3 V peripherals in the same design.
Recomendado
Voltage-Translation Bus Bridge
Mixed-voltage systems — for example, a 1.8 V application processor talking to 3.3 V sensors — typically need bus-bridging logic. The EPM240ZM68C6N's 4 I/O banks each support independent VCCIO levels (1.5/1.8/2.5/3.3 V), enabling direct voltage translation across 80 channels in one device. This eliminates discrete level-shifter ICs, simplifies PCB layout, and provides reconfigurable direction control. Combined with 7.5 ns propagation delay, the bridge meets asynchronous memory and peripheral timing without additional pipeline registers.
Recomendado
Industrial Control and Sensor Aggregation
Industrial controllers aggregate inputs from sensors, switches, and field-bus nodes with deterministic latency. The EPM240ZM68C6N's MAX II Z architecture delivers low standby current, instant-on behaviour, and predictable timing under all temperature conditions in its -40°C to +85°C commercial range. 192 macrocells handle PWM generation, encoder decoding, and fault-condition logic with deterministic 7.5 ns delays. With on-chip flash configuration, the design survives factory programming and field updates via JTAG without external boot components.
Recomendado
LED Driving and PWM Control
Multi-channel LED drivers, RGB lighting controllers, and animation PWM generators benefit from the EPM240ZM68C6N's deterministic timing and 80 user I/O. Each macrocell generates a phase-shifted PWM channel, and the 7.5 ns propagation delay supports high-frequency PWM for dimming precision. The 4-bank VCCIO allows direct interfacing with 5 V LED strings and 3.3 V logic without level shifters. On-chip flash configuration provides instant LED pattern start-up at power-on, critical for status indicators and signage.
Recomendado
Legacy 74-Series Logic Consolidation
When a design uses dozens of discrete 74LVC/74HC glue-logic gates, the EPM240ZM68C6N consolidates these into a single re-programmable device, reducing BOM cost, PCB area, and assembly labour. The 192 macrocells replace approximately 30 to 50 standard SSI packages, while preserving the same logic behaviour. Late-stage design changes, BOM obsolescence, and variant SKUs are absorbed by simply re-programming the flash — no board respins required.
Recomendado
JTAG Chain Master / FPGA Configuration Manager
In systems where an FPGA requires boot management or where multiple programmable devices share one JTAG header, the EPM240ZM68C6N acts as a JTAG chain master. Its 80 user I/O drive TCK, TMS, TDI, TDO signals across downstream FPGAs and CPLDs, while on-chip logic implements boundary-scan tests per IEEE 1149.1. The deterministic 7.5 ns timing and 184.1 MHz internal performance support high-speed JTAG TCK rates. Flash-based configuration lets the chain manager boot instantly without external memory.
Recomendado
Address Decoding and Chip-Select Generation
Memory-mapped systems need precise address decoding for SRAM, DRAM, Flash, and peripherals. The EPM240ZM68C6N delivers deterministic 7.5 ns propagation delay for chip-select signals, regardless of address-bus width or fan-out. With 192 macrocells, the device decodes up to 16 to 20 chip-select lines in a single package — replacing discrete 74LS138 / 74LS139 decoders. Multi-voltage bank support enables direct interfacing with 1.8 V memory and 3.3 V peripherals without level shifters.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM240ZM68C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM240ZM100C6N | EPM240ZM100C7N | EPM240ZM100I8N | EPM240ZM68C5N | EPM240GM100C5N | EPM240M100C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 68-ball Micro FBGA (MBGA-68) | 100-pin EQFP (family) | 100-pin EQFP (family) | 100-pin EQFP (family) | 68-ball Micro FBGA — same ball-out | 100-pin MBGA / EQFP | 100-pin EQFP |
| Family | MAX II Z (zero-power) | MAX II Z | MAX II Z | MAX II Z | MAX II Z | MAX II G (non-Z) | MAX II (non-Z) |
| Macrocells / Logic Elements | 192 macrocells / 240 LE | 192 / 240 | 192 / 240 | 192 / 240 | 192 / 240 | 192 / 240 | 192 / 240 |
| Speed Grade (tPD) | C6 — 7.5 ns | C6 — 7.5 ns (same) | C7 — ~9 ns (slower) | I8 — ~10 ns industrial (slower) | C5 — ~5 ns (faster upgrade) | C5 — ~5 ns | C5 — ~5 ns |
| User I/O | 80 | 80 (different package) | 80 | 80 | 80 (same ball-out) | 80 | 80 |
| Operating Temperature | -40°C to +85°C (commercial) | -40°C to +85°C (commercial) | -40°C to +85°C (commercial) | -40°C to +100°C (industrial) | -40°C to +85°C (commercial) | -40°C to +85°C (commercial) | -40°C to +85°C (commercial) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Principais diferenciais
- Zero-power MAX II Z architecture with on-chip flash (vs EPM240M100C5N (standard MAX II, non-Z))
- 68-ball Micro FBGA for compact board designs (vs EPM240M100C5N (100-pin EQFP))
- C6 speed grade is fully compatible with C7 and I8 grade up-replacements (vs EPM240ZM100C7N and EPM240ZM100I8N)
Notas de projeto
Estimated: the 68-ball Micro FBGA at 0.5 mm pitch demands 4-layer PCB routing with microvias. Allow continuous ground planes beneath the BGA and stitch vias around the perimeter. Per Intel MAX II Handbook recommendations, place at least one 0.1 µF decoupling capacitor per VCCIO bank and a 1 µF bulk capacitor adjacent to VCCINT. Keep TCK trace under 2 inches and avoid routing JTAG signals near switching power or clock edges to preserve signal integrity.
When sharing the JTAG chain with an FPGA or another CPLD, ensure that nCONFIG and nSTATUS are correctly wired and that each device's TDO feeds the next TDI with proper buffering. The EPM240ZM68C6N supports JTAG chain sharing natively; however, chain length affects TCK maximum frequency. According to the MAX II Device Handbook, keep the total chain below 6 devices at 10 MHz TCK to avoid timing violations.
The MAX II Z-series is designed for low quiescent current, but peak in-rush during flash programming can exceed steady-state by 30 to 50 mA. Ensure the 1.8 V VCCINT regulator can source at least 200 mA transient. Use a 4.7 µF tantalum + 0.1 µF ceramic bypass combination at the device power pin. Estimated: in-rush at flash programming approximates 100 to 150 mA peak for ~50 ms.
Do not confuse the 68-MBGA package with the 100-pin EQFP — the ball-out is not interchangeable and a PCB redesign is required. Verify with the Quartus pin planner that each user I/O ball is correctly assigned to its VCCIO bank. Banked voltage violation (driving 3.3 V into a 1.8 V bank) damages the I/O cells permanently. Per Intel guidelines, always enable unused I/O pins as inputs with internal weak pull-up to avoid floating inputs.
Informações de conformidade
RoHS and lead-free finish per Altera (now Intel) product marking. Halogen-free status not stated in the captured web data — set to 'unknown' rather than assumed. AEC-Q100 not applicable: MAX II Z is not qualified for automotive under-grade customers should choose the EPM240Z automotive variants where AEC-Q100 is required.
