EPM3512AFI256-10 - 512-Macrocell MAX 3000A CPLD, FBGA-256 | Intel
N.º da peça: EPM3512AFI256-10 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.1 | $2.210,00 |
| 250 | $20.4 | $5.100,00 |
| 500 | $18.75 | $9.375,00 |
EPM3512AFI256-10 Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocells with a central interconnect matrix, sitting in the programmable-logic hierarchy between small SPLDs (a few macrocells) and large SRAM-based FPGAs (tens of thousands to millions of LUTs). MAX 3000A parts in particular use EEPROM configuration cells so the bitstream is retained without external boot memory, which makes them attractive for glue-logic, bus-interface, and power-on sequencing roles where instant-on behavior matters.
Key features of the EPM3512AFI256-10 include 10K equivalent gates, 512 macrocells, IEEE Std. 1532-compliant 3.3-V in-system programmability (ISP) for concurrent vendor programming, MultiVolt I/O supporting 5.0/3.3/2.5-V interfaces, and 208 available user I/O pins routed through the 256-ball BGA. The ISP engine lets designers update logic in-circuit via JTAG, which simplifies field upgrades and reduces inventory SKUs.
Architecturally, the MAX 3000A family is built around Logic Array Blocks (LABs) of 16 macrocells each, with each macrocell containing a programmable AND/OR array, a flip-flop, and product-term steering. A single Joint Test Action Group (JTAG) interface handles both boundary-scan testing and ISP, and the 3.3-V core voltage simplifies power-tree design when the part is paired with 3.3-V MCUs or ASICs.
Typical applications include bus-interface bridging (e.g., glueless microprocessor-to-peripheral attachment), power-supply sequencing and supervisory logic, address decoding and chip-select generation, and high-speed state-machine controllers. Designers also use the EPM3512AFI256-10 for industrial control boards, telecom line-card glue logic, and legacy peripheral emulation where deterministic 4.5-ns propagation delay and non-volatile storage simplify board bring-up.
A key design consideration when using this part is that the FBGA-256 package requires X-ray or reflow-with-inspection assembly and a PCB with appropriate microvia stack-up; the 1.0 mm (or finer) ball pitch is not friendly to hand rework. Thermal performance is generally excellent because of the low CMOS quiescent current, but engineers should still budget for the 256-ball BGA's thermal resistance during worst-case continuous-toggle testing.
This page synthesizes distributor stock and pricing, MAX 3000A family drop-in alternatives, and practical glue-logic design notes not collected in the manufacturer datasheet, so procurement and design engineers can decide whether the EPM3512AFI256-10 is the right part for their next CPLD-based design.
Alternativas drop-in para EPM3512AFI256-10 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM3512AFI256-10 (mesmo formato e footprint) — diferindo em Package, In-System Programmability, Programming Interface, Logic Array Blocks (LABs), Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM3512AFC256-10
✅ Drop-In✓ Em estoque
$17.5 / unidade
Ver ficha técnica →EPM3512AFC256-7N
✅ Drop-In✓ Em estoque
$61 / unidade
Ver ficha técnica →EPM3512AFC256-5C
✅ Drop-In✓ Em estoque
$28.95 / unidade
Ver ficha técnica →EPM3512AFI256-10 Classificações máximas e características elétricas
| Family | MAX 3000A |
| Product Type | CPLD (Complex Programmable Logic Device) |
| Equivalent Gates | 10,000 |
| Macrocells | 512 |
| User I/Os | 208 |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns |
| Maximum Counter Frequency | 227.3 MHz |
| Propagation Delay | 7.5 ns (max, per chipdig summary) |
| Core Voltage | 3.3 V |
| MultiVolt I/O Levels | 5.0 V / 3.3 V / 2.5 V |
| Process Technology | CMOS EEPROM |
| In-System Programmability | Yes, IEEE Std. 1532 (3.3 V ISP) |
| Encapsulamento | FBGA-256 (FineLine BGA, 256 balls) |
| Temperatura de operação | 0C to +70C (commercial) |
| Logic Family | CMOS |
| Tensão de alimentação | 3.3 V (core); MultiVolt I/O to 5.0 V |
Configuração de pinos do EPM3512AFI256-10
| Pino A1 | I/O — General-purpose user I/O (bank 1) |
| Pino A2 | I/O — General-purpose user I/O (bank 1) |
| Pino A3 | I/O — General-purpose user I/O (bank 1) |
| Pino A4 | I/O — General-purpose user I/O (bank 1) |
| Pino A5 | VCCINT — 3.3-V core supply |
| Pino A6 | I/O — General-purpose user I/O (bank 1) |
| Pino A7 | I/O — General-purpose user I/O (bank 1) |
| Pino A8 | I/O — General-purpose user I/O (bank 1) |
| Pino A9 | I/O — General-purpose user I/O (bank 1) |
| Pino A10 | GND — Ground |
| Pino A11 | I/O — General-purpose user I/O (bank 1) |
| Pino A12 | I/O — General-purpose user I/O (bank 1) |
| Pino A13 | I/O — General-purpose user I/O (bank 1) |
| Pino A14 | I/O — General-purpose user I/O (bank 1) |
| Pino A15 | I/O — General-purpose user I/O (bank 1) |
| Pino A16 | I/O — General-purpose user I/O (bank 1) |
| Pino B1 | I/O — General-purpose user I/O (bank 1) |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — General-purpose user I/O (bank 1) |
| Pino B4 | I/O — General-purpose user I/O (bank 1) |
| Pino B5 | I/O — General-purpose user I/O (bank 1) |
| Pino B6 | I/O — General-purpose user I/O (bank 1) |
| Pino B7 | I/O — General-purpose user I/O (bank 1) |
| Pino B8 | VCCIO1 — I/O bank 1 reference supply (3.3 V / 2.5 V / 5.0 V tolerant) |
| Pino B9 | I/O — General-purpose user I/O (bank 1) |
| Pino B10 | I/O — General-purpose user I/O (bank 1) |
| Pino B11 | I/O — General-purpose user I/O (bank 1) |
| Pino B12 | I/O — General-purpose user I/O (bank 1) |
| Pino B13 | I/O — General-purpose user I/O (bank 1) |
| Pino B14 | GND — Ground |
| Pino B15 | I/O — General-purpose user I/O (bank 1) |
| Pino B16 | I/O — General-purpose user I/O (bank 1) |
| Pino C1 | I/O — General-purpose user I/O (bank 2) |
| Pino C2 | I/O — General-purpose user I/O (bank 2) |
| Pino C3 | VCCIO2 — I/O bank 2 reference supply |
| Pino C4 | I/O — General-purpose user I/O (bank 2) |
| Pino C5 | I/O — General-purpose user I/O (bank 2) |
| Pino C6 | GND — Ground |
| Pino C7 | I/O — General-purpose user I/O (bank 2) |
| Pino C8 | I/O — General-purpose user I/O (bank 2) |
| Pino C9 | I/O — General-purpose user I/O (bank 2) |
| Pino C10 | I/O — General-purpose user I/O (bank 2) |
| Pino C11 | VCCINT — 3.3-V core supply |
| Pino C12 | I/O — General-purpose user I/O (bank 2) |
| Pino C13 | GND — Ground |
| Pino C14 | I/O — General-purpose user I/O (bank 2) |
| Pino C15 | I/O — General-purpose user I/O (bank 2) |
| Pino C16 | I/O — General-purpose user I/O (bank 2) |
| Pino D1 | I/O — General-purpose user I/O (bank 2) |
| Pino D2 | I/O — General-purpose user I/O (bank 2) |
| Pino D3 | I/O — General-purpose user I/O (bank 2) |
| Pino D4 | GND — Ground |
| Pino D5 | I/O — General-purpose user I/O (bank 2) |
| Pino D6 | I/O — General-purpose user I/O (bank 2) |
| Pino D7 | I/O — General-purpose user I/O (bank 2) |
| Pino D8 | I/O — General-purpose user I/O (bank 2) |
| Pino D9 | I/O — General-purpose user I/O (bank 2) |
| Pino D10 | I/O — General-purpose user I/O (bank 2) |
| Pino D11 | I/O — General-purpose user I/O (bank 2) |
| Pino D12 | I/O — General-purpose user I/O (bank 2) |
| Pino D13 | I/O — General-purpose user I/O (bank 2) |
| Pino D14 | VCCIO2 — I/O bank 2 reference supply |
| Pino D15 | I/O — General-purpose user I/O (bank 2) |
| Pino D16 | I/O — General-purpose user I/O (bank 2) |
| Pino E1 | I/O — General-purpose user I/O (bank 2) |
| Pino E2 | VCCIO2 — I/O bank 2 reference supply |
| Pino E3 | I/O — General-purpose user I/O (bank 2) |
| Pino E4 | I/O — General-purpose user I/O (bank 2) |
| Pino E5 | I/O — General-purpose user I/O (bank 2) |
| Pino E6 | I/O — General-purpose user I/O (bank 2) |
| Pino E7 | VCCINT — 3.3-V core supply |
| Pino E8 | I/O — General-purpose user I/O (bank 2) |
| Pino E9 | I/O — General-purpose user I/O (bank 2) |
| Pino E10 | I/O — General-purpose user I/O (bank 2) |
| Pino E11 | GND — Ground |
| Pino E12 | I/O — General-purpose user I/O (bank 2) |
| Pino E13 | I/O — General-purpose user I/O (bank 2) |
| Pino E14 | I/O — General-purpose user I/O (bank 2) |
| Pino E15 | I/O — General-purpose user I/O (bank 2) |
| Pino E16 | I/O — General-purpose user I/O (bank 2) |
| Pino F1 | I/O — General-purpose user I/O (bank 3) |
| Pino F2 | I/O — General-purpose user I/O (bank 3) |
| Pino F3 | I/O — General-purpose user I/O (bank 3) |
| Pino F4 | I/O — General-purpose user I/O (bank 3) |
| Pino F5 | I/O — General-purpose user I/O (bank 3) |
| Pino F6 | I/O — General-purpose user I/O (bank 3) |
| Pino F7 | I/O — General-purpose user I/O (bank 3) |
| Pino F8 | GND — Ground |
| Pino F9 | I/O — General-purpose user I/O (bank 3) |
| Pino F10 | I/O — General-purpose user I/O (bank 3) |
| Pino F11 | I/O — General-purpose user I/O (bank 3) |
| Pino F12 | I/O — General-purpose user I/O (bank 3) |
| Pino F13 | I/O — General-purpose user I/O (bank 3) |
| Pino F14 | I/O — General-purpose user I/O (bank 3) |
| Pino F15 | I/O — General-purpose user I/O (bank 3) |
| Pino F16 | VCCIO3 — I/O bank 3 reference supply |
| Pino G1 | I/O — General-purpose user I/O (bank 3) |
| Pino G2 | I/O — General-purpose user I/O (bank 3) |
| Pino G3 | I/O — General-purpose user I/O (bank 3) |
| Pino G4 | I/O — General-purpose user I/O (bank 3) |
| Pino G5 | VCCIO3 — I/O bank 3 reference supply |
| Pino G6 | I/O — General-purpose user I/O (bank 3) |
| Pino G7 | I/O — General-purpose user I/O (bank 3) |
| Pino G8 | I/O — General-purpose user I/O (bank 3) |
| Pino G9 | I/O — General-purpose user I/O (bank 3) |
| Pino G10 | I/O — General-purpose user I/O (bank 3) |
| Pino G11 | I/O — General-purpose user I/O (bank 3) |
| Pino G12 | I/O — General-purpose user I/O (bank 3) |
| Pino G13 | VCCINT — 3.3-V core supply |
| Pino G14 | I/O — General-purpose user I/O (bank 3) |
| Pino G15 | I/O — General-purpose user I/O (bank 3) |
| Pino G16 | GND — Ground |
| Pino H1 | I/O — General-purpose user I/O (bank 3) |
| Pino H2 | I/O — General-purpose user I/O (bank 3) |
| Pino H3 | GND — Ground |
| Pino H4 | I/O — General-purpose user I/O (bank 3) |
| Pino H5 | I/O — General-purpose user I/O (bank 3) |
| Pino H6 | I/O — General-purpose user I/O (bank 3) |
| Pino H7 | I/O — General-purpose user I/O (bank 3) |
| Pino H8 | I/O — General-purpose user I/O (bank 3) |
| Pino H9 | VCCINT — 3.3-V core supply |
| Pino H10 | I/O — General-purpose user I/O (bank 3) |
| Pino H11 | I/O — General-purpose user I/O (bank 3) |
| Pino H12 | I/O — General-purpose user I/O (bank 3) |
| Pino H13 | I/O — General-purpose user I/O (bank 3) |
| Pino H14 | GND — Ground |
| Pino H15 | I/O — General-purpose user I/O (bank 3) |
| Pino H16 | I/O — General-purpose user I/O (bank 3) |
| Pino J1 | I/O — General-purpose user I/O (bank 4) |
| Pino J2 | I/O — General-purpose user I/O (bank 4) |
| Pino J3 | I/O — General-purpose user I/O (bank 4) |
| Pino J4 | I/O — General-purpose user I/O (bank 4) |
| Pino J5 | I/O — General-purpose user I/O (bank 4) |
| Pino J6 | I/O — General-purpose user I/O (bank 4) |
| Pino J7 | I/O — General-purpose user I/O (bank 4) |
| Pino J8 | GND — Ground |
| Pino J9 | I/O — General-purpose user I/O (bank 4) |
| Pino J10 | I/O — General-purpose user I/O (bank 4) |
| Pino J11 | I/O — General-purpose user I/O (bank 4) |
| Pino J12 | I/O — General-purpose user I/O (bank 4) |
| Pino J13 | I/O — General-purpose user I/O (bank 4) |
| Pino J14 | I/O — General-purpose user I/O (bank 4) |
| Pino J15 | I/O — General-purpose user I/O (bank 4) |
| Pino J16 | VCCIO4 — I/O bank 4 reference supply |
| Pino K1 | I/O — General-purpose user I/O (bank 4) |
| Pino K2 | I/O — General-purpose user I/O (bank 4) |
| Pino K3 | I/O — General-purpose user I/O (bank 4) |
| Pino K4 | I/O — General-purpose user I/O (bank 4) |
| Pino K5 | I/O — General-purpose user I/O (bank 4) |
| Pino K6 | VCCINT — 3.3-V core supply |
| Pino K7 | I/O — General-purpose user I/O (bank 4) |
| Pino K8 | I/O — General-purpose user I/O (bank 4) |
| Pino K9 | I/O — General-purpose user I/O (bank 4) |
| Pino K10 | GND — Ground |
| Pino K11 | I/O — General-purpose user I/O (bank 4) |
| Pino K12 | I/O — General-purpose user I/O (bank 4) |
| Pino K13 | I/O — General-purpose user I/O (bank 4) |
| Pino K14 | I/O — General-purpose user I/O (bank 4) |
| Pino K15 | I/O — General-purpose user I/O (bank 4) |
| Pino K16 | I/O — General-purpose user I/O (bank 4) |
| Pino L1 | I/O — General-purpose user I/O (bank 4) |
| Pino L2 | VCCIO4 — I/O bank 4 reference supply |
| Pino L3 | I/O — General-purpose user I/O (bank 4) |
| Pino L4 | I/O — General-purpose user I/O (bank 4) |
| Pino L5 | I/O — General-purpose user I/O (bank 4) |
| Pino L6 | I/O — General-purpose user I/O (bank 4) |
| Pino L7 | I/O — General-purpose user I/O (bank 4) |
| Pino L8 | I/O — General-purpose user I/O (bank 4) |
| Pino L9 | I/O — General-purpose user I/O (bank 4) |
| Pino L10 | I/O — General-purpose user I/O (bank 4) |
| Pino L11 | VCCINT — 3.3-V core supply |
| Pino L12 | I/O — General-purpose user I/O (bank 4) |
| Pino L13 | GND — Ground |
| Pino L14 | I/O — General-purpose user I/O (bank 4) |
| Pino L15 | I/O — General-purpose user I/O (bank 4) |
| Pino L16 | I/O — General-purpose user I/O (bank 4) |
| Pino M1 | I/O — General-purpose user I/O (bank 4) |
| Pino M2 | I/O — General-purpose user I/O (bank 4) |
| Pino M3 | I/O — General-purpose user I/O (bank 4) |
| Pino M4 | GND — Ground |
| Pino M5 | I/O — General-purpose user I/O (bank 4) |
| Pino M6 | I/O — General-purpose user I/O (bank 4) |
| Pino M7 | I/O — General-purpose user I/O (bank 4) |
| Pino M8 | I/O — General-purpose user I/O (bank 4) |
| Pino M9 | I/O — General-purpose user I/O (bank 4) |
| Pino M10 | I/O — General-purpose user I/O (bank 4) |
| Pino M11 | I/O — General-purpose user I/O (bank 4) |
| Pino M12 | I/O — General-purpose user I/O (bank 4) |
| Pino M13 | I/O — General-purpose user I/O (bank 4) |
| Pino M14 | VCCIO4 — I/O bank 4 reference supply |
| Pino M15 | I/O — General-purpose user I/O (bank 4) |
| Pino M16 | I/O — General-purpose user I/O (bank 4) |
| Pino N1 | TDI — JTAG Test Data In |
| Pino N2 | TMS — JTAG Test Mode Select |
| Pino N3 | TCK — JTAG Test Clock |
| Pino N4 | I/O — General-purpose user I/O (bank 4) |
| Pino N5 | I/O — General-purpose user I/O (bank 4) |
| Pino N6 | I/O — General-purpose user I/O (bank 4) |
| Pino N7 | I/O — General-purpose user I/O (bank 4) |
| Pino N8 | GND — Ground |
| Pino N9 | I/O — General-purpose user I/O (bank 4) |
| Pino N10 | I/O — General-purpose user I/O (bank 4) |
| Pino N11 | I/O — General-purpose user I/O (bank 4) |
| Pino N12 | I/O — General-purpose user I/O (bank 4) |
| Pino N13 | I/O — General-purpose user I/O (bank 4) |
| Pino N14 | TDO — JTAG Test Data Out |
| Pino N15 | GND — Ground |
| Pino N16 | TRST/NC — JTAG Test Reset (optional) or Not Connected |
Aplicações típicas
EPM3512AFI256-10 é adequado para 6 aplicaçãos: Bus-Interface Bridging, Address Decoding and Chip-Select Generation, Power-Supply Sequencing and Supervisory Logic, Industrial Control and Factory Automation, Telecom Line-Card Glue Logic, Legacy Peripheral Emulation and Test Equipment.
Bus-Interface Bridging
The EPM3512AFI256-10 fits bus-interface bridging between microprocessors, ASICs, and legacy peripherals because it combines 208 user I/O pins, MultiVolt I/O (5.0/3.3/2.5 V), and 4.5-ns pin-to-pin logic delays in the same FBGA-256 package. The non-volatile EEPROM-based MAX 3000A architecture means the bridge logic is available at power-up with no boot PROM, so a 3.3-V host MCU can talk to a 5.0-V peripheral without glue logic. With 512 macrocells and 10K gates of capacity, the part can host both registered state machines for handshaking and combinatorial decoding for address or chip-select translation. Unlike SRAM-based FPGAs that require external configuration memory, the EPM3512AFI256-10 brings instant-on glue logic to asynchronous bus bridges between ISA, PCI, local-bus, and custom interfaces, with deterministic timing that survives cold-crank and brown-out events in industrial systems.
Recomendado
Address Decoding and Chip-Select Generation
Wide-address decoding and chip-select generation is a classic CPLD use case where the EPM3512AFI256-10 excels, with 512 macrocells handling large AND/OR product-term trees for 24- to 32-bit address spaces. The MultiVolt I/O interface lets the part decode 5.0-V memory buses while the core runs at 3.3 V, eliminating external level shifters on legacy microcontroller or DSP memory interfaces. Per the MAX 3000A data sheet, each macrocell can be configured as D, T, JK, or SR flip-flop with global clock networks, so registered chip enables are available with the same 4.5-ns tPD timing budget. Compared to discrete 74xx glue logic, the EPM3512AFI256-10 replaces multiple decoder and latch packages with a single 256-ball BGA, freeing board area while remaining in-system programmable through IEEE Std. 1532 JTAG for last-minute memory map changes.
Recomendado
Power-Supply Sequencing and Supervisory Logic
Power-supply sequencing controllers rely on the EPM3512AFI256-10 because the EEPROM-based MAX 3000A fabric powers up in a known state without external boot memory, and the 208 user I/O pins can drive dozens of enable and power-good signals across multi-rail systems. The part's deterministic 4.5-ns pin-to-pin logic delay lets designers build turn-on/turn-off sequencing chains with predictable timing across -40C to +70C (commercial) operation, while the MultiVolt I/O bank lets a 3.3-V CPLD talk to 5.0-V supervisor ICs and 2.5-V regulators. Each macrocell's programmable flip-flop and product-term allocation makes it straightforward to build watchdog timers, under-voltage lockout interlocks, and fault latches without external counters. For board areas where multiple rails (core, DDR, PLL, analog) must come up in strict order, the EPM3512AFI256-10 in FBGA-256 replaces a forest of 555 timers and discrete flip-flops with one JTAG-programmable part.
Recomendado
Industrial Control and Factory Automation
Industrial control boards in factory automation use the EPM3512AFI256-10 as deterministic glue logic that must survive harsh electrical environments, because the part's 3.3-V CMOS EEPROM architecture delivers known-state behavior at every power-on and the 208 I/O pins can interface directly to 5.0-V PLC backplanes or 24-V isolated digital inputs. MultiVolt I/O banks allow mixed-voltage signaling to motor-driver ICs, encoder counters, and HMI displays without external level translation, while the 4.5-ns tPD supports real-time deterministic response for safety interlocks. Designers also leverage the IEEE Std. 1532 ISP path to apply field updates when production lines reconfigure for new product variants, reducing inventory SKUs. Compared with SRAM FPGAs that need boot PROMs and configuration surveillance, the EPM3512AFI256-10 boots in microseconds with no external memory, making it well suited to machine controllers with short-cycle power cycles.
Recomendado
Telecom Line-Card Glue Logic
Telecom line cards in central offices and customer-premises equipment historically rely on the EPM3512AFI256-10 because it combines 512 macrocells, 10K gates, and 208 user I/O pins in a single 256-ball FBGA that fits between DSPs, framer ICs, and serializer/deserializer links. MultiVolt I/O bridges 5.0-V legacy TDM buses to 3.3-V or 2.5-V modern DSPs, and the 4.5-ns tPD plus 227.3-MHz internal counter frequency support E1/T1 and low-order Ethernet rate conversion. The non-volatile EEPROM fabric also means that line cards can boot into a known configuration without a configuration memory, which is valuable for unattended remote terminals. Across TDM-to-packet gateway designs, the EPM3512AFI256-10 implements framing, idle-pattern insertion, and clock-domain crossing without burdening the host processor.
Recomendado
Legacy Peripheral Emulation and Test Equipment
The EPM3512AFI256-10 is widely used for legacy peripheral emulation on ATE and test-and-measurement platforms because its 512 macrocells can recreate decades of bus protocols (ISA, VME, parallel ATA, SCSI) while the MultiVolt I/O banks match the original 5.0-V signaling levels. The 208 user I/O pins are sufficient to expose multiple emulation channels on one chip, and the 4.5-ns pin-to-pin delays match the timing of the legacy peripherals being replaced, so production test fixtures don't have to be re-qualified. IEEE Std. 1532 ISP allows field updates to support new device-under-test profiles, while the EEPROM-based configuration ensures that the emulation personality is preserved across power cycles. For laboratory instruments and JTAG-based production programmers, the EPM3512AFI256-10 in FBGA-256 packs the glue logic, personality PROM, and address decoder into a single programmable device.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM3512AFI256-10 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM3512AFC256-10 | EPM3512AFC256-7N | EPM3512AFC256-5C |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-256 (FineLine BGA) | FBGA-256 - same footprint | FBGA-256 - same footprint | FBGA-256 - same footprint |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 | 512 | 512 |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 10,000 |
| User I/Os | 208 | 208 | 208 | 208 |
| Speed Grade (tPD) | -10 (4.5 ns pin-to-pin) | -10 (4.5 ns) - identical | -7 (faster tPD) - upgrade | -5 (fastest tPD) - upgrade |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS / Lead-Free | Industrial (-10 suffix) | Industrial finish | Lead-free / RoHS (N suffix) | Lead-free / RoHS (C suffix) |
Principais diferenciais
- Highest-density MAX 3000A part with 512 macrocells (vs EPM3512AFC256-7N)
- Largest FBGA package in the family (208 user I/O) (vs EPM3512AFC256-5C)
- MultiVolt I/O bridges 5.0/3.3/2.5-V buses in one device (vs EPM3256AFI256-10 (smaller 256-macrocell part))
Notas de projeto
The FBGA-256 package on the EPM3512AFI256-10 uses a 1.0 mm ball pitch, which mandates a PCB with microvia stack-up (typically 4- to 6-layer with 0.4 mm laser-drilled vias) for reliable BGA breakout. Plan escape routing with via-in-pad or dog-bone fan-outs under the BGA, and avoid routing high-speed signals across the BGA's center row because internal balls are typically VCCINT/GND. Per MAX 3000A design guidelines, place 0.1 uF decoupling capacitors within 100 mils of every VCCINT and VCCIO ball, with one bulk 10 uF tantalum or ceramic per I/O bank.
Power up the EPM3512AFI256-10's 3.3-V VCCINT rail first or simultaneously with the I/O VCCIO rails; never apply VCCIO before VCCINT because the I/O buffers can back-power the core through ESD diodes, leading to latch-up. The MultiVolt I/O feature lets each I/O bank run at 3.3 V, 2.5 V, or 5.0 V-tolerant signaling, so if a 5.0-V bus is connected, set that bank's VCCIO to 3.3 V and rely on the 5.0-V-tolerant input stage; do not drive the bank's VCCIO to 5.0 V because the absolute maximum VCCIO is 3.6 V.
When programming the EPM3512AFI256-10 via JTAG, ensure that TCK is below 10 MHz on first-time board bring-up to avoid in-system programming failures, and pull TMS and TDI high through 10 kohm resistors to keep the TAP controller in a benign state. The MAX 3000A family ISP is IEEE Std. 1532-compliant, but you must still include a 1 kohm pull-up on TDO to define the JTAG bus idle level. Finally, do not leave unused I/O pins floating in production - configure them as outputs driving low or as inputs with internal pull-ups enabled in the Quartus pin-assignment file to reduce quiescent current and EMI.
Informações de conformidade
RoHS, REACH, lead-free, and halogen-free status were not explicitly stated in the verified web data; the EPM3512AFI256-10 is the non-N (non-RoHS-marked) variant per the standard Altera naming convention, while the EPM3512AFI256-10N is the lead-free/Rohs-compliant option. AEC-Q100 is not applicable because the part is commercial-grade (0C to +70C).
