EPM3512AFI256-10 - 512-Macrocell MAX 3000A CPLD, FBGA-256 | Intel
部品番号: EPM3512AFI256-10 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.1 | $2,210.00 |
| 250 | $20.4 | $5,100.00 |
| 500 | $18.75 | $9,375.00 |
EPM3512AFI256-10 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocells with a central interconnect matrix, sitting in the programmable-logic hierarchy between small SPLDs (a few macrocells) and large SRAM-based FPGAs (tens of thousands to millions of LUTs). MAX 3000A parts in particular use EEPROM configuration cells so the bitstream is retained without external boot memory, which makes them attractive for glue-logic, bus-interface, and power-on sequencing roles where instant-on behavior matters.
Key features of the EPM3512AFI256-10 include 10K equivalent gates, 512 macrocells, IEEE Std. 1532-compliant 3.3-V in-system programmability (ISP) for concurrent vendor programming, MultiVolt I/O supporting 5.0/3.3/2.5-V interfaces, and 208 available user I/O pins routed through the 256-ball BGA. The ISP engine lets designers update logic in-circuit via JTAG, which simplifies field upgrades and reduces inventory SKUs.
Architecturally, the MAX 3000A family is built around Logic Array Blocks (LABs) of 16 macrocells each, with each macrocell containing a programmable AND/OR array, a flip-flop, and product-term steering. A single Joint Test Action Group (JTAG) interface handles both boundary-scan testing and ISP, and the 3.3-V core voltage simplifies power-tree design when the part is paired with 3.3-V MCUs or ASICs.
Typical applications include bus-interface bridging (e.g., glueless microprocessor-to-peripheral attachment), power-supply sequencing and supervisory logic, address decoding and chip-select generation, and high-speed state-machine controllers. Designers also use the EPM3512AFI256-10 for industrial control boards, telecom line-card glue logic, and legacy peripheral emulation where deterministic 4.5-ns propagation delay and non-volatile storage simplify board bring-up.
A key design consideration when using this part is that the FBGA-256 package requires X-ray or reflow-with-inspection assembly and a PCB with appropriate microvia stack-up; the 1.0 mm (or finer) ball pitch is not friendly to hand rework. Thermal performance is generally excellent because of the low CMOS quiescent current, but engineers should still budget for the 256-ball BGA's thermal resistance during worst-case continuous-toggle testing.
This page synthesizes distributor stock and pricing, MAX 3000A family drop-in alternatives, and practical glue-logic design notes not collected in the manufacturer datasheet, so procurement and design engineers can decide whether the EPM3512AFI256-10 is the right part for their next CPLD-based design.
ドロップイン代替品: EPM3512AFI256-10 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPM3512AFI256-10 （同一形状・フットプリント） — 相違点: Package, In-System Programmability, Programming Interface, Logic Array Blocks (LABs), Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EPM3512AFC256-10
✅ ドロップイン✓ 在庫あり
$17.5 / 個
データシートを見る →EPM3512AFC256-7N
✅ ドロップイン✓ 在庫あり
$61 / 個
データシートを見る →EPM3512AFC256-5C
✅ ドロップイン✓ 在庫あり
$28.95 / 個
データシートを見る →EPM3512AFI256-10 最大定格＆電気的特性
| Family | MAX 3000A |
| Product Type | CPLD (Complex Programmable Logic Device) |
| Equivalent Gates | 10,000 |
| Macrocells | 512 |
| User I/Os | 208 |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns |
| Maximum Counter Frequency | 227.3 MHz |
| Propagation Delay | 7.5 ns (max, per chipdig summary) |
| Core Voltage | 3.3 V |
| MultiVolt I/O Levels | 5.0 V / 3.3 V / 2.5 V |
| Process Technology | CMOS EEPROM |
| In-System Programmability | Yes, IEEE Std. 1532 (3.3 V ISP) |
| パッケージ | FBGA-256 (FineLine BGA, 256 balls) |
| 動作温度 | 0C to +70C (commercial) |
| Logic Family | CMOS |
| 電源電圧 | 3.3 V (core); MultiVolt I/O to 5.0 V |
EPM3512AFI256-10 ピン構成
| ピン A1 | I/O — General-purpose user I/O (bank 1) |
| ピン A2 | I/O — General-purpose user I/O (bank 1) |
| ピン A3 | I/O — General-purpose user I/O (bank 1) |
| ピン A4 | I/O — General-purpose user I/O (bank 1) |
| ピン A5 | VCCINT — 3.3-V core supply |
| ピン A6 | I/O — General-purpose user I/O (bank 1) |
| ピン A7 | I/O — General-purpose user I/O (bank 1) |
| ピン A8 | I/O — General-purpose user I/O (bank 1) |
| ピン A9 | I/O — General-purpose user I/O (bank 1) |
| ピン A10 | GND — Ground |
| ピン A11 | I/O — General-purpose user I/O (bank 1) |
| ピン A12 | I/O — General-purpose user I/O (bank 1) |
| ピン A13 | I/O — General-purpose user I/O (bank 1) |
| ピン A14 | I/O — General-purpose user I/O (bank 1) |
| ピン A15 | I/O — General-purpose user I/O (bank 1) |
| ピン A16 | I/O — General-purpose user I/O (bank 1) |
| ピン B1 | I/O — General-purpose user I/O (bank 1) |
| ピン B2 | GND — Ground |
| ピン B3 | I/O — General-purpose user I/O (bank 1) |
| ピン B4 | I/O — General-purpose user I/O (bank 1) |
| ピン B5 | I/O — General-purpose user I/O (bank 1) |
| ピン B6 | I/O — General-purpose user I/O (bank 1) |
| ピン B7 | I/O — General-purpose user I/O (bank 1) |
| ピン B8 | VCCIO1 — I/O bank 1 reference supply (3.3 V / 2.5 V / 5.0 V tolerant) |
| ピン B9 | I/O — General-purpose user I/O (bank 1) |
| ピン B10 | I/O — General-purpose user I/O (bank 1) |
| ピン B11 | I/O — General-purpose user I/O (bank 1) |
| ピン B12 | I/O — General-purpose user I/O (bank 1) |
| ピン B13 | I/O — General-purpose user I/O (bank 1) |
| ピン B14 | GND — Ground |
| ピン B15 | I/O — General-purpose user I/O (bank 1) |
| ピン B16 | I/O — General-purpose user I/O (bank 1) |
| ピン C1 | I/O — General-purpose user I/O (bank 2) |
| ピン C2 | I/O — General-purpose user I/O (bank 2) |
| ピン C3 | VCCIO2 — I/O bank 2 reference supply |
| ピン C4 | I/O — General-purpose user I/O (bank 2) |
| ピン C5 | I/O — General-purpose user I/O (bank 2) |
| ピン C6 | GND — Ground |
| ピン C7 | I/O — General-purpose user I/O (bank 2) |
| ピン C8 | I/O — General-purpose user I/O (bank 2) |
| ピン C9 | I/O — General-purpose user I/O (bank 2) |
| ピン C10 | I/O — General-purpose user I/O (bank 2) |
| ピン C11 | VCCINT — 3.3-V core supply |
| ピン C12 | I/O — General-purpose user I/O (bank 2) |
| ピン C13 | GND — Ground |
| ピン C14 | I/O — General-purpose user I/O (bank 2) |
| ピン C15 | I/O — General-purpose user I/O (bank 2) |
| ピン C16 | I/O — General-purpose user I/O (bank 2) |
| ピン D1 | I/O — General-purpose user I/O (bank 2) |
| ピン D2 | I/O — General-purpose user I/O (bank 2) |
| ピン D3 | I/O — General-purpose user I/O (bank 2) |
| ピン D4 | GND — Ground |
| ピン D5 | I/O — General-purpose user I/O (bank 2) |
| ピン D6 | I/O — General-purpose user I/O (bank 2) |
| ピン D7 | I/O — General-purpose user I/O (bank 2) |
| ピン D8 | I/O — General-purpose user I/O (bank 2) |
| ピン D9 | I/O — General-purpose user I/O (bank 2) |
| ピン D10 | I/O — General-purpose user I/O (bank 2) |
| ピン D11 | I/O — General-purpose user I/O (bank 2) |
| ピン D12 | I/O — General-purpose user I/O (bank 2) |
| ピン D13 | I/O — General-purpose user I/O (bank 2) |
| ピン D14 | VCCIO2 — I/O bank 2 reference supply |
| ピン D15 | I/O — General-purpose user I/O (bank 2) |
| ピン D16 | I/O — General-purpose user I/O (bank 2) |
| ピン E1 | I/O — General-purpose user I/O (bank 2) |
| ピン E2 | VCCIO2 — I/O bank 2 reference supply |
| ピン E3 | I/O — General-purpose user I/O (bank 2) |
| ピン E4 | I/O — General-purpose user I/O (bank 2) |
| ピン E5 | I/O — General-purpose user I/O (bank 2) |
| ピン E6 | I/O — General-purpose user I/O (bank 2) |
| ピン E7 | VCCINT — 3.3-V core supply |
| ピン E8 | I/O — General-purpose user I/O (bank 2) |
| ピン E9 | I/O — General-purpose user I/O (bank 2) |
| ピン E10 | I/O — General-purpose user I/O (bank 2) |
| ピン E11 | GND — Ground |
| ピン E12 | I/O — General-purpose user I/O (bank 2) |
| ピン E13 | I/O — General-purpose user I/O (bank 2) |
| ピン E14 | I/O — General-purpose user I/O (bank 2) |
| ピン E15 | I/O — General-purpose user I/O (bank 2) |
| ピン E16 | I/O — General-purpose user I/O (bank 2) |
| ピン F1 | I/O — General-purpose user I/O (bank 3) |
| ピン F2 | I/O — General-purpose user I/O (bank 3) |
| ピン F3 | I/O — General-purpose user I/O (bank 3) |
| ピン F4 | I/O — General-purpose user I/O (bank 3) |
| ピン F5 | I/O — General-purpose user I/O (bank 3) |
| ピン F6 | I/O — General-purpose user I/O (bank 3) |
| ピン F7 | I/O — General-purpose user I/O (bank 3) |
| ピン F8 | GND — Ground |
| ピン F9 | I/O — General-purpose user I/O (bank 3) |
| ピン F10 | I/O — General-purpose user I/O (bank 3) |
| ピン F11 | I/O — General-purpose user I/O (bank 3) |
| ピン F12 | I/O — General-purpose user I/O (bank 3) |
| ピン F13 | I/O — General-purpose user I/O (bank 3) |
| ピン F14 | I/O — General-purpose user I/O (bank 3) |
| ピン F15 | I/O — General-purpose user I/O (bank 3) |
| ピン F16 | VCCIO3 — I/O bank 3 reference supply |
| ピン G1 | I/O — General-purpose user I/O (bank 3) |
| ピン G2 | I/O — General-purpose user I/O (bank 3) |
| ピン G3 | I/O — General-purpose user I/O (bank 3) |
| ピン G4 | I/O — General-purpose user I/O (bank 3) |
| ピン G5 | VCCIO3 — I/O bank 3 reference supply |
| ピン G6 | I/O — General-purpose user I/O (bank 3) |
| ピン G7 | I/O — General-purpose user I/O (bank 3) |
| ピン G8 | I/O — General-purpose user I/O (bank 3) |
| ピン G9 | I/O — General-purpose user I/O (bank 3) |
| ピン G10 | I/O — General-purpose user I/O (bank 3) |
| ピン G11 | I/O — General-purpose user I/O (bank 3) |
| ピン G12 | I/O — General-purpose user I/O (bank 3) |
| ピン G13 | VCCINT — 3.3-V core supply |
| ピン G14 | I/O — General-purpose user I/O (bank 3) |
| ピン G15 | I/O — General-purpose user I/O (bank 3) |
| ピン G16 | GND — Ground |
| ピン H1 | I/O — General-purpose user I/O (bank 3) |
| ピン H2 | I/O — General-purpose user I/O (bank 3) |
| ピン H3 | GND — Ground |
| ピン H4 | I/O — General-purpose user I/O (bank 3) |
| ピン H5 | I/O — General-purpose user I/O (bank 3) |
| ピン H6 | I/O — General-purpose user I/O (bank 3) |
| ピン H7 | I/O — General-purpose user I/O (bank 3) |
| ピン H8 | I/O — General-purpose user I/O (bank 3) |
| ピン H9 | VCCINT — 3.3-V core supply |
| ピン H10 | I/O — General-purpose user I/O (bank 3) |
| ピン H11 | I/O — General-purpose user I/O (bank 3) |
| ピン H12 | I/O — General-purpose user I/O (bank 3) |
| ピン H13 | I/O — General-purpose user I/O (bank 3) |
| ピン H14 | GND — Ground |
| ピン H15 | I/O — General-purpose user I/O (bank 3) |
| ピン H16 | I/O — General-purpose user I/O (bank 3) |
| ピン J1 | I/O — General-purpose user I/O (bank 4) |
| ピン J2 | I/O — General-purpose user I/O (bank 4) |
| ピン J3 | I/O — General-purpose user I/O (bank 4) |
| ピン J4 | I/O — General-purpose user I/O (bank 4) |
| ピン J5 | I/O — General-purpose user I/O (bank 4) |
| ピン J6 | I/O — General-purpose user I/O (bank 4) |
| ピン J7 | I/O — General-purpose user I/O (bank 4) |
| ピン J8 | GND — Ground |
| ピン J9 | I/O — General-purpose user I/O (bank 4) |
| ピン J10 | I/O — General-purpose user I/O (bank 4) |
| ピン J11 | I/O — General-purpose user I/O (bank 4) |
| ピン J12 | I/O — General-purpose user I/O (bank 4) |
| ピン J13 | I/O — General-purpose user I/O (bank 4) |
| ピン J14 | I/O — General-purpose user I/O (bank 4) |
| ピン J15 | I/O — General-purpose user I/O (bank 4) |
| ピン J16 | VCCIO4 — I/O bank 4 reference supply |
| ピン K1 | I/O — General-purpose user I/O (bank 4) |
| ピン K2 | I/O — General-purpose user I/O (bank 4) |
| ピン K3 | I/O — General-purpose user I/O (bank 4) |
| ピン K4 | I/O — General-purpose user I/O (bank 4) |
| ピン K5 | I/O — General-purpose user I/O (bank 4) |
| ピン K6 | VCCINT — 3.3-V core supply |
| ピン K7 | I/O — General-purpose user I/O (bank 4) |
| ピン K8 | I/O — General-purpose user I/O (bank 4) |
| ピン K9 | I/O — General-purpose user I/O (bank 4) |
| ピン K10 | GND — Ground |
| ピン K11 | I/O — General-purpose user I/O (bank 4) |
| ピン K12 | I/O — General-purpose user I/O (bank 4) |
| ピン K13 | I/O — General-purpose user I/O (bank 4) |
| ピン K14 | I/O — General-purpose user I/O (bank 4) |
| ピン K15 | I/O — General-purpose user I/O (bank 4) |
| ピン K16 | I/O — General-purpose user I/O (bank 4) |
| ピン L1 | I/O — General-purpose user I/O (bank 4) |
| ピン L2 | VCCIO4 — I/O bank 4 reference supply |
| ピン L3 | I/O — General-purpose user I/O (bank 4) |
| ピン L4 | I/O — General-purpose user I/O (bank 4) |
| ピン L5 | I/O — General-purpose user I/O (bank 4) |
| ピン L6 | I/O — General-purpose user I/O (bank 4) |
| ピン L7 | I/O — General-purpose user I/O (bank 4) |
| ピン L8 | I/O — General-purpose user I/O (bank 4) |
| ピン L9 | I/O — General-purpose user I/O (bank 4) |
| ピン L10 | I/O — General-purpose user I/O (bank 4) |
| ピン L11 | VCCINT — 3.3-V core supply |
| ピン L12 | I/O — General-purpose user I/O (bank 4) |
| ピン L13 | GND — Ground |
| ピン L14 | I/O — General-purpose user I/O (bank 4) |
| ピン L15 | I/O — General-purpose user I/O (bank 4) |
| ピン L16 | I/O — General-purpose user I/O (bank 4) |
| ピン M1 | I/O — General-purpose user I/O (bank 4) |
| ピン M2 | I/O — General-purpose user I/O (bank 4) |
| ピン M3 | I/O — General-purpose user I/O (bank 4) |
| ピン M4 | GND — Ground |
| ピン M5 | I/O — General-purpose user I/O (bank 4) |
| ピン M6 | I/O — General-purpose user I/O (bank 4) |
| ピン M7 | I/O — General-purpose user I/O (bank 4) |
| ピン M8 | I/O — General-purpose user I/O (bank 4) |
| ピン M9 | I/O — General-purpose user I/O (bank 4) |
| ピン M10 | I/O — General-purpose user I/O (bank 4) |
| ピン M11 | I/O — General-purpose user I/O (bank 4) |
| ピン M12 | I/O — General-purpose user I/O (bank 4) |
| ピン M13 | I/O — General-purpose user I/O (bank 4) |
| ピン M14 | VCCIO4 — I/O bank 4 reference supply |
| ピン M15 | I/O — General-purpose user I/O (bank 4) |
| ピン M16 | I/O — General-purpose user I/O (bank 4) |
| ピン N1 | TDI — JTAG Test Data In |
| ピン N2 | TMS — JTAG Test Mode Select |
| ピン N3 | TCK — JTAG Test Clock |
| ピン N4 | I/O — General-purpose user I/O (bank 4) |
| ピン N5 | I/O — General-purpose user I/O (bank 4) |
| ピン N6 | I/O — General-purpose user I/O (bank 4) |
| ピン N7 | I/O — General-purpose user I/O (bank 4) |
| ピン N8 | GND — Ground |
| ピン N9 | I/O — General-purpose user I/O (bank 4) |
| ピン N10 | I/O — General-purpose user I/O (bank 4) |
| ピン N11 | I/O — General-purpose user I/O (bank 4) |
| ピン N12 | I/O — General-purpose user I/O (bank 4) |
| ピン N13 | I/O — General-purpose user I/O (bank 4) |
| ピン N14 | TDO — JTAG Test Data Out |
| ピン N15 | GND — Ground |
| ピン N16 | TRST/NC — JTAG Test Reset (optional) or Not Connected |
主な用途
EPM3512AFI256-10 の用途: 6 件s: Bus-Interface Bridging, Address Decoding and Chip-Select Generation, Power-Supply Sequencing and Supervisory Logic, Industrial Control and Factory Automation, Telecom Line-Card Glue Logic, Legacy Peripheral Emulation and Test Equipment.
Bus-Interface Bridging
The EPM3512AFI256-10 fits bus-interface bridging between microprocessors, ASICs, and legacy peripherals because it combines 208 user I/O pins, MultiVolt I/O (5.0/3.3/2.5 V), and 4.5-ns pin-to-pin logic delays in the same FBGA-256 package. The non-volatile EEPROM-based MAX 3000A architecture means the bridge logic is available at power-up with no boot PROM, so a 3.3-V host MCU can talk to a 5.0-V peripheral without glue logic. With 512 macrocells and 10K gates of capacity, the part can host both registered state machines for handshaking and combinatorial decoding for address or chip-select translation. Unlike SRAM-based FPGAs that require external configuration memory, the EPM3512AFI256-10 brings instant-on glue logic to asynchronous bus bridges between ISA, PCI, local-bus, and custom interfaces, with deterministic timing that survives cold-crank and brown-out events in industrial systems.
おすすめ
Address Decoding and Chip-Select Generation
Wide-address decoding and chip-select generation is a classic CPLD use case where the EPM3512AFI256-10 excels, with 512 macrocells handling large AND/OR product-term trees for 24- to 32-bit address spaces. The MultiVolt I/O interface lets the part decode 5.0-V memory buses while the core runs at 3.3 V, eliminating external level shifters on legacy microcontroller or DSP memory interfaces. Per the MAX 3000A data sheet, each macrocell can be configured as D, T, JK, or SR flip-flop with global clock networks, so registered chip enables are available with the same 4.5-ns tPD timing budget. Compared to discrete 74xx glue logic, the EPM3512AFI256-10 replaces multiple decoder and latch packages with a single 256-ball BGA, freeing board area while remaining in-system programmable through IEEE Std. 1532 JTAG for last-minute memory map changes.
おすすめ
Power-Supply Sequencing and Supervisory Logic
Power-supply sequencing controllers rely on the EPM3512AFI256-10 because the EEPROM-based MAX 3000A fabric powers up in a known state without external boot memory, and the 208 user I/O pins can drive dozens of enable and power-good signals across multi-rail systems. The part's deterministic 4.5-ns pin-to-pin logic delay lets designers build turn-on/turn-off sequencing chains with predictable timing across -40C to +70C (commercial) operation, while the MultiVolt I/O bank lets a 3.3-V CPLD talk to 5.0-V supervisor ICs and 2.5-V regulators. Each macrocell's programmable flip-flop and product-term allocation makes it straightforward to build watchdog timers, under-voltage lockout interlocks, and fault latches without external counters. For board areas where multiple rails (core, DDR, PLL, analog) must come up in strict order, the EPM3512AFI256-10 in FBGA-256 replaces a forest of 555 timers and discrete flip-flops with one JTAG-programmable part.
おすすめ
Industrial Control and Factory Automation
Industrial control boards in factory automation use the EPM3512AFI256-10 as deterministic glue logic that must survive harsh electrical environments, because the part's 3.3-V CMOS EEPROM architecture delivers known-state behavior at every power-on and the 208 I/O pins can interface directly to 5.0-V PLC backplanes or 24-V isolated digital inputs. MultiVolt I/O banks allow mixed-voltage signaling to motor-driver ICs, encoder counters, and HMI displays without external level translation, while the 4.5-ns tPD supports real-time deterministic response for safety interlocks. Designers also leverage the IEEE Std. 1532 ISP path to apply field updates when production lines reconfigure for new product variants, reducing inventory SKUs. Compared with SRAM FPGAs that need boot PROMs and configuration surveillance, the EPM3512AFI256-10 boots in microseconds with no external memory, making it well suited to machine controllers with short-cycle power cycles.
おすすめ
Telecom Line-Card Glue Logic
Telecom line cards in central offices and customer-premises equipment historically rely on the EPM3512AFI256-10 because it combines 512 macrocells, 10K gates, and 208 user I/O pins in a single 256-ball FBGA that fits between DSPs, framer ICs, and serializer/deserializer links. MultiVolt I/O bridges 5.0-V legacy TDM buses to 3.3-V or 2.5-V modern DSPs, and the 4.5-ns tPD plus 227.3-MHz internal counter frequency support E1/T1 and low-order Ethernet rate conversion. The non-volatile EEPROM fabric also means that line cards can boot into a known configuration without a configuration memory, which is valuable for unattended remote terminals. Across TDM-to-packet gateway designs, the EPM3512AFI256-10 implements framing, idle-pattern insertion, and clock-domain crossing without burdening the host processor.
おすすめ
Legacy Peripheral Emulation and Test Equipment
The EPM3512AFI256-10 is widely used for legacy peripheral emulation on ATE and test-and-measurement platforms because its 512 macrocells can recreate decades of bus protocols (ISA, VME, parallel ATA, SCSI) while the MultiVolt I/O banks match the original 5.0-V signaling levels. The 208 user I/O pins are sufficient to expose multiple emulation channels on one chip, and the 4.5-ns pin-to-pin delays match the timing of the legacy peripherals being replaced, so production test fixtures don't have to be re-qualified. IEEE Std. 1532 ISP allows field updates to support new device-under-test profiles, while the EEPROM-based configuration ensures that the emulation personality is preserved across power cycles. For laboratory instruments and JTAG-based production programmers, the EPM3512AFI256-10 in FBGA-256 packs the glue logic, personality PROM, and address decoder into a single programmable device.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPM3512AFI256-10 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPM3512AFC256-10 | EPM3512AFC256-7N | EPM3512AFC256-5C |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-256 (FineLine BGA) | FBGA-256 - same footprint | FBGA-256 - same footprint | FBGA-256 - same footprint |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 | 512 | 512 |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 10,000 |
| User I/Os | 208 | 208 | 208 | 208 |
| Speed Grade (tPD) | -10 (4.5 ns pin-to-pin) | -10 (4.5 ns) - identical | -7 (faster tPD) - upgrade | -5 (fastest tPD) - upgrade |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS / Lead-Free | Industrial (-10 suffix) | Industrial finish | Lead-free / RoHS (N suffix) | Lead-free / RoHS (C suffix) |
主な差別化要因
- Highest-density MAX 3000A part with 512 macrocells （vs EPM3512AFC256-7N)
- Largest FBGA package in the family (208 user I/O) （vs EPM3512AFC256-5C)
- MultiVolt I/O bridges 5.0/3.3/2.5-V buses in one device （vs EPM3256AFI256-10 (smaller 256-macrocell part))
設計ノート
The FBGA-256 package on the EPM3512AFI256-10 uses a 1.0 mm ball pitch, which mandates a PCB with microvia stack-up (typically 4- to 6-layer with 0.4 mm laser-drilled vias) for reliable BGA breakout. Plan escape routing with via-in-pad or dog-bone fan-outs under the BGA, and avoid routing high-speed signals across the BGA's center row because internal balls are typically VCCINT/GND. Per MAX 3000A design guidelines, place 0.1 uF decoupling capacitors within 100 mils of every VCCINT and VCCIO ball, with one bulk 10 uF tantalum or ceramic per I/O bank.
Power up the EPM3512AFI256-10's 3.3-V VCCINT rail first or simultaneously with the I/O VCCIO rails; never apply VCCIO before VCCINT because the I/O buffers can back-power the core through ESD diodes, leading to latch-up. The MultiVolt I/O feature lets each I/O bank run at 3.3 V, 2.5 V, or 5.0 V-tolerant signaling, so if a 5.0-V bus is connected, set that bank's VCCIO to 3.3 V and rely on the 5.0-V-tolerant input stage; do not drive the bank's VCCIO to 5.0 V because the absolute maximum VCCIO is 3.6 V.
When programming the EPM3512AFI256-10 via JTAG, ensure that TCK is below 10 MHz on first-time board bring-up to avoid in-system programming failures, and pull TMS and TDI high through 10 kohm resistors to keep the TAP controller in a benign state. The MAX 3000A family ISP is IEEE Std. 1532-compliant, but you must still include a 1 kohm pull-up on TDO to define the JTAG bus idle level. Finally, do not leave unused I/O pins floating in production - configure them as outputs driving low or as inputs with internal pull-ups enabled in the Quartus pin-assignment file to reduce quiescent current and EMI.
コンプライアンス情報
RoHS, REACH, lead-free, and halogen-free status were not explicitly stated in the verified web data; the EPM3512AFI256-10 is the non-N (non-RoHS-marked) variant per the standard Altera naming convention, while the EPM3512AFI256-10N is the lead-free/Rohs-compliant option. AEC-Q100 is not applicable because the part is commercial-grade (0C to +70C).
