EPM3512AFC256-5C - MAX 3000A CPLD, 512 Macrocells, 256-BGA | Altera
N.º da peça: EPM3512AFC256-5C ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $45 | $45,00 |
| 10 | $41.5 | $415,00 |
| 100 | $36.8 | $3.680,00 |
| 500 | $32.2 | $16.100,00 |
| 1.000 | $28.95 | $28.950,00 |
EPM3512AFC256-5C Visão geral
A CPLD is a non-volatile programmable logic device that sits architecturally between discrete glue logic and an FPGA. Within the broader semiconductor taxonomy, a CPLD is a programmable logic device, which is a subset of logic ICs, which fall under digital integrated circuits. The MAX 3000A family uses a classic EEPEOM-based macrocell fabric with a single, central interconnect (the Logic Array Block, or LAB) backbone, which is distinct from the SRAM-based distributed architecture used in FPGAs. The macrocell fabric is ideal for wide combinational and registered logic because every macrocell connects to a global interconnect that yields predictable, deterministic tPD (pin-to-pin delay) timing, even at full utilization.
Key features of the EPM3512AFC256-5C include in-system programmability via IEEE Std. 1532, multi-volt I/O (MVIO) support allowing mixed-voltage interfacing without external level shifters, JTAG boundary-scan testability, and pin-to-pin delays (tPD) as low as 5 ns. The speed grade "-5" designates a 5 ns tPD / 95.2 MHz fCNT performance bin, while the "C" suffix indicates the commercial operating temperature range of 0 °C to +70 °C. The 256-ball FBGA package measures 17 mm × 17 mm with a 1.0 mm ball pitch, providing high board-density integration while supporting up to 212 user I/O pins.
Typical applications include bus-interface bridging, address decoding, peripheral glue logic, power-up sequencing controllers, and legacy system maintenance designs that require drop-in replacement for discontinued parallel-logic ICs. The MAX 3000A device is also well-suited to low-volume industrial controllers, I/O expansion, and ASIC prototyping where deterministic timing and non-volatile configuration simplify system bring-up.
When designing with the EPM3512AFC256-5C, observe the MultiVolt I/O bank configuration rules so that each VCCIO bank matches the voltage of the devices it drives. The in-system programming circuitry requires the IEEE 1532-compliant 4-wire JTAG chain to be accessible after board assembly for field updates, and unused pins must be set per the datasheet to avoid leakage.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the standalone datasheet, giving engineers a faster path from selection to production bring-up of MAX 3000A designs.
Alternativas drop-in para EPM3512AFC256-5C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM3512AFC256-5C (mesmo formato e footprint) — diferindo em Package, In-System Programmability, Operating Temperature, Programming Interface, Usable Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM3512AFC256-3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$23.4 / unidade
Ver ficha técnica →EPM3512AFC256-2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$25.8 / unidade
Ver ficha técnica →EPM3512AFC256-10N
✅ Drop-In✓ Em estoque
$43.22 / unidade
Ver ficha técnica →EPM3512AFC256-10
✅ Drop-In✓ Em estoque
$17.5 / unidade
Ver ficha técnica →EPM3256AFC256-10
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$19.95 / unidade
Ver ficha técnica →EPM2210GF256C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$11.2 / unidade
Ver ficha técnica →EPM3512AFC256-5C Classificações máximas e características elétricas
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| Maximum Operating Frequency | 95.2 MHz |
| Pin-to-Pin Delay (tPD) | 5 ns |
| Supply Voltage - Core (VCCINT) | 3.3 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (banked MultiVolt I/O) |
| User I/O Pins | 212 (max) |
| Encapsulamento | 256-ball FBGA, 17 mm × 17 mm, 1.0 mm pitch |
| Temperatura de operação | 0 °C to +70 °C (commercial, "C" grade) |
| Programming Interface | IEEE Std. 1532 / JTAG (4-wire) in-system programmable |
| Tipo de montagem | Surface Mount |
| Technology | EEPROM-based macrocell, non-volatile |
Guia de Configuração de Pinos do EPM3512AFC256-5C 256-ball fbga, 17 mm × 17 mm, 1.0 mm pitch
Configuração de pinos para EPM3512AFC256-5C (pacote 256-ball fbga, 17 mm × 17 mm, 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM3512AFC256-5C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM3512AFC256-5C é adequado para 6 aplicaçãos: Bus Interface Bridging, Address Decoding and Chip-Select Generation, Power-Up Sequencing Controllers, ASIC and ASSP Glue Logic Replacement, Legacy System Maintenance and Field Replacement, State-Machine and Control Logic.
Bus Interface Bridging
The EPM3512AFC256-5C's 5 ns pin-to-pin delay and 212 user I/O make it well suited to bus-bridging between microprocessors, memory, and peripheral ICs running at different voltages. Its MultiVolt I/O banks natively support 5.0 V, 3.3 V, and 2.5 V signaling, so the part can interface a 5 V legacy bus to a 3.3 V processor without external level shifters. The 95.2 MHz fCNT allows safe operation of pipelined address and data buses at modern CPU clock rates. In a typical design the CPLD sits between the host CPU and an SDRAM/DDR controller, registering chip-selects and decoding memory-mapped regions with deterministic timing. Engineers should use the Quartus II / MAX+PLUS II fitter to balance setup/hold across both bus edges.
Recomendado
Address Decoding and Chip-Select Generation
Wide address decoding of large memory maps is a classic CPLD use case, and the EPM3512AFC256-5C delivers 512 macrocells to handle complex decode trees without timing penalty. Each macrocell supports product-term logic that maps directly to gate-level address comparisons, avoiding the long combinational paths typical of discrete 74-series decoders. Designers typically implement 8- or 16-bank chip-select decoding and integrate wait-state generators within a single device. The 256-ball FBGA package exposes enough I/O for address + chip-select + handshake lines. The 3.3 V VCCINT plus MultiVolt I/O means it can be powered from the same rail as the host processor while driving 5 V peripherals. Locking the design into a single non-volatile device simplifies board layout and BOM.
Recomendado
Power-Up Sequencing Controllers
The EPM3512AFC256-5C's non-volatile, instant-on configuration allows it to act as a power-sequencer at board bring-up before any MCU or ASIC begins executing code. The 512 macrocells can implement multi-rail sequencers with PG (power-good) feedback, watchdog re-tries, and programmable delays using the device's internal logic. Because the part is in-system programmable via IEEE 1532 JTAG, sequencing firmware can be updated in the field without replacing the board. The 5 ns tPD enables tight feedback loops that protect downstream regulators from inrush events. A typical schematic uses the CPLD to gate each regulator's ENABLE pin and to combine the regulator PG outputs into a system-wide RESET.
Recomendado
ASIC and ASSP Glue Logic Replacement
Engineers often use the EPM3512AFC256-5C to replace 5-15 discrete 74-series glue-logic ICs with a single programmable device, simplifying PCB layout and reducing BOM cost. The 512 macrocells can absorb multiple latches, muxes, and shifters while the 212 user I/O eliminate the need for external bus expanders. The MultiVolt I/O banks let the same CPLD talk to 5 V, 3.3 V, and 2.5 V devices in mixed-signal systems. The 256-ball FBGA package is footprint-compatible with several MAX 3000A density points and the MAX II EPM2210, so a single PCB can host density growth without re-spin. Designers can iterate the glue-logic netlist in software without reworking the board.
Recomendado
Legacy System Maintenance and Field Replacement
Many industrial and telecom boards originally built around the MAX 3000A family remain in service for 10-20+ years, and the EPM3512AFC256-5C is a direct replacement for the original assembly. Because the 256-ball FBGA ball map is shared with other speed grades and temperature grades, a maintenance shop can stock a single footprint-compatible family and route replacements by speed/temp. The non-volatile EEPROM configuration means the part comes up in the correct logic state on every power cycle without an external configuration PROM, matching the original BOM. This is critical for field-replaceable units that must restore operation without external tools. Verified Web Data confirms the part remains in demand through the secondary and broker market as of 2026-09-12.
Recomendado
State-Machine and Control Logic
The EPM3512AFC256-5C is well suited to complex state machines, where its 512 macrocells with dedicated flip-flops support 30+ state FSMs while preserving deterministic tPD. The 95.2 MHz fCNT allows state transitions at the speed of a fast microcontroller or ASIC handshake, which is essential in motor control, protocol bridging, and industrial automation. The non-volatile configuration lets the state machine wake in a known state, eliminating boot-time races. Designers can use one CPLD to consolidate multiple state machines from discrete HC/AC logic into a single, testable device. MultiVolt I/O means the same part can handshake 5 V sensors and 3.3 V controllers on the same board. This application is one of the highest-leverage MAX 3000A use cases.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM3512AFC256-5C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM3512AFC256-3N | EPM3512AFC256-10N | EPM3256AFC256-10 | EPM2210GF256C5N |
|---|---|---|---|---|---|
| Package | 256-ball FBGA, 17×17 mm, 1.0 mm pitch | 256-ball FBGA, 17×17 mm, 1.0 mm pitch (same) | 256-ball FBGA, 17×17 mm, 1.0 mm pitch (same) | 256-ball FBGA, 17×17 mm, 1.0 mm pitch (same) | 256-ball FBGA, 17×17 mm, 1.0 mm pitch (same) |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX II |
| Macrocells / Logic Elements | 512 macrocells | 512 macrocells | 512 macrocells | 256 macrocells (-50%) | 2210 logic elements (MAX II LE) |
| Pin-to-Pin Delay (tPD) | 5 ns | 3 ns (faster) | 10 ns (slower) | 10 ns (slower) | ~5-7 ns (MAX II tPD) |
| Maximum Frequency (fCNT) | 95.2 MHz | Higher (faster speed grade) | Lower (slower speed grade) | Lower (slower speed grade) | Comparable (MAX II fCNT) |
| Operating Temperature | 0 °C to +70 °C (commercial "C") | -40 °C to +85 °C (industrial "N") | -40 °C to +85 °C (industrial "N") | 0 °C to +70 °C (commercial) | 0 °C to +85 °C (commercial "C") |
| Lifecycle Status | Obsolete (legacy maintenance) | Obsolete (legacy maintenance) | Obsolete (legacy maintenance) | Obsolete (legacy maintenance) | Active (MAX II in production) |
Principais diferenciais
- 5 ns tPD is faster than 10 ns speed grade at same capacity (vs EPM3512AFC256-10N)
- Commercial 0-70 °C range is narrower than industrial -3N / -10N (vs EPM3512AFC256-3N)
- Active-lifecycle MAX II successor is the recommended migration path (vs EPM2210GF256C5N)
Notas de projeto
The EPM3512AFC256-5C requires a clean 3.3 V VCCINT rail and one or more VCCIO rails (2.5 V, 3.3 V, or 5.0 V) selected per MultiVolt I/O bank. Each VCCINT/VCCIO pin pair should be decoupled with a 0.1 µF X7R ceramic placed within 100 mils of the ball, plus a bulk 10 µF tantalum or ceramic per bank. Power-up sequencing is not strictly required, but a monotonic VCCINT ramp avoids in-rush into the EEPROM charge pump. Estimated: typical ICCINT at 95 MHz is in the 50-150 mA range; confirm with the family datasheet for the exact fitter output and junction temperature.
The 256-ball FBGA at 1.0 mm pitch demands a 4- or 6-layer PCB with microvia or via-in-pad construction. Use a continuous GND plane on layer 2 directly under the BGA to provide a low-impedance return for the high-speed JTAG and I/O signals. Fan-out all inner balls to buried vias before routing escape traces, and length-match the JTAG TCK/TMS/TDO/TDI nets within 500 mils to keep the IEEE 1532 programming chain reliable. Place the JTAG header on the same board edge as the test pins to simplify ISP access during board bring-up.
Estimated: A common pitfall is mixing MultiVolt I/O banks without a common GND reference - every VCCIO bank must share the same board ground as the devices it drives, or input thresholds will shift. Another pitfall is leaving unused user I/O floating; per the MAX 3000A datasheet, unused I/O should be configured as outputs driving ground (or set as inputs with the internal weak pull-up enabled) to avoid extra supply current. Finally, the IEEE 1532 ISP chain must be terminated or stubbed correctly to prevent TCK ringing during in-field updates, which can corrupt the EEPROM configuration.
Informações de conformidade
Compliance data not provided in the verified web data; RoHS/REACH/lead-free status should be confirmed from the manufacturer datasheet or via distributor environmental compliance documents before placing production orders. The MAX 3000A family was launched prior to the wide rollout of RoHS in the early 2000s, so older date-code lots may be non-RoHS.
