EPM3512AFI256-10 - 512-Macrocell MAX 3000A CPLD, FBGA-256 | Intel
Référence : EPM3512AFI256-10 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.1 | $2 210,00 |
| 250 | $20.4 | $5 100,00 |
| 500 | $18.75 | $9 375,00 |
EPM3512AFI256-10 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocells with a central interconnect matrix, sitting in the programmable-logic hierarchy between small SPLDs (a few macrocells) and large SRAM-based FPGAs (tens of thousands to millions of LUTs). MAX 3000A parts in particular use EEPROM configuration cells so the bitstream is retained without external boot memory, which makes them attractive for glue-logic, bus-interface, and power-on sequencing roles where instant-on behavior matters.
Key features of the EPM3512AFI256-10 include 10K equivalent gates, 512 macrocells, IEEE Std. 1532-compliant 3.3-V in-system programmability (ISP) for concurrent vendor programming, MultiVolt I/O supporting 5.0/3.3/2.5-V interfaces, and 208 available user I/O pins routed through the 256-ball BGA. The ISP engine lets designers update logic in-circuit via JTAG, which simplifies field upgrades and reduces inventory SKUs.
Architecturally, the MAX 3000A family is built around Logic Array Blocks (LABs) of 16 macrocells each, with each macrocell containing a programmable AND/OR array, a flip-flop, and product-term steering. A single Joint Test Action Group (JTAG) interface handles both boundary-scan testing and ISP, and the 3.3-V core voltage simplifies power-tree design when the part is paired with 3.3-V MCUs or ASICs.
Typical applications include bus-interface bridging (e.g., glueless microprocessor-to-peripheral attachment), power-supply sequencing and supervisory logic, address decoding and chip-select generation, and high-speed state-machine controllers. Designers also use the EPM3512AFI256-10 for industrial control boards, telecom line-card glue logic, and legacy peripheral emulation where deterministic 4.5-ns propagation delay and non-volatile storage simplify board bring-up.
A key design consideration when using this part is that the FBGA-256 package requires X-ray or reflow-with-inspection assembly and a PCB with appropriate microvia stack-up; the 1.0 mm (or finer) ball pitch is not friendly to hand rework. Thermal performance is generally excellent because of the low CMOS quiescent current, but engineers should still budget for the 256-ball BGA's thermal resistance during worst-case continuous-toggle testing.
This page synthesizes distributor stock and pricing, MAX 3000A family drop-in alternatives, and practical glue-logic design notes not collected in the manufacturer datasheet, so procurement and design engineers can decide whether the EPM3512AFI256-10 is the right part for their next CPLD-based design.
Alternatives de remplacement direct pour EPM3512AFI256-10 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM3512AFI256-10 (même facteur de forme et même empreinte) — différant par Package, In-System Programmability, Programming Interface, Logic Array Blocks (LABs), Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM3512AFC256-10
✅ Remplacement direct✓ En stock
$17.5 / unité
Voir la fiche technique →EPM3512AFC256-7N
✅ Remplacement direct✓ En stock
$61 / unité
Voir la fiche technique →EPM3512AFC256-5C
✅ Remplacement direct✓ En stock
$28.95 / unité
Voir la fiche technique →EPM3512AFI256-10 Valeurs maximales et caractéristiques électriques
| Family | MAX 3000A |
| Product Type | CPLD (Complex Programmable Logic Device) |
| Equivalent Gates | 10,000 |
| Macrocells | 512 |
| User I/Os | 208 |
| Pin-to-Pin Logic Delay (tPD) | 4.5 ns |
| Maximum Counter Frequency | 227.3 MHz |
| Propagation Delay | 7.5 ns (max, per chipdig summary) |
| Core Voltage | 3.3 V |
| MultiVolt I/O Levels | 5.0 V / 3.3 V / 2.5 V |
| Process Technology | CMOS EEPROM |
| In-System Programmability | Yes, IEEE Std. 1532 (3.3 V ISP) |
| Boîtier | FBGA-256 (FineLine BGA, 256 balls) |
| Température de fonctionnement | 0C to +70C (commercial) |
| Logic Family | CMOS |
| Tension d'alimentation | 3.3 V (core); MultiVolt I/O to 5.0 V |
Configuration des broches de EPM3512AFI256-10
| Broche A1 | I/O — General-purpose user I/O (bank 1) |
| Broche A2 | I/O — General-purpose user I/O (bank 1) |
| Broche A3 | I/O — General-purpose user I/O (bank 1) |
| Broche A4 | I/O — General-purpose user I/O (bank 1) |
| Broche A5 | VCCINT — 3.3-V core supply |
| Broche A6 | I/O — General-purpose user I/O (bank 1) |
| Broche A7 | I/O — General-purpose user I/O (bank 1) |
| Broche A8 | I/O — General-purpose user I/O (bank 1) |
| Broche A9 | I/O — General-purpose user I/O (bank 1) |
| Broche A10 | GND — Ground |
| Broche A11 | I/O — General-purpose user I/O (bank 1) |
| Broche A12 | I/O — General-purpose user I/O (bank 1) |
| Broche A13 | I/O — General-purpose user I/O (bank 1) |
| Broche A14 | I/O — General-purpose user I/O (bank 1) |
| Broche A15 | I/O — General-purpose user I/O (bank 1) |
| Broche A16 | I/O — General-purpose user I/O (bank 1) |
| Broche B1 | I/O — General-purpose user I/O (bank 1) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — General-purpose user I/O (bank 1) |
| Broche B4 | I/O — General-purpose user I/O (bank 1) |
| Broche B5 | I/O — General-purpose user I/O (bank 1) |
| Broche B6 | I/O — General-purpose user I/O (bank 1) |
| Broche B7 | I/O — General-purpose user I/O (bank 1) |
| Broche B8 | VCCIO1 — I/O bank 1 reference supply (3.3 V / 2.5 V / 5.0 V tolerant) |
| Broche B9 | I/O — General-purpose user I/O (bank 1) |
| Broche B10 | I/O — General-purpose user I/O (bank 1) |
| Broche B11 | I/O — General-purpose user I/O (bank 1) |
| Broche B12 | I/O — General-purpose user I/O (bank 1) |
| Broche B13 | I/O — General-purpose user I/O (bank 1) |
| Broche B14 | GND — Ground |
| Broche B15 | I/O — General-purpose user I/O (bank 1) |
| Broche B16 | I/O — General-purpose user I/O (bank 1) |
| Broche C1 | I/O — General-purpose user I/O (bank 2) |
| Broche C2 | I/O — General-purpose user I/O (bank 2) |
| Broche C3 | VCCIO2 — I/O bank 2 reference supply |
| Broche C4 | I/O — General-purpose user I/O (bank 2) |
| Broche C5 | I/O — General-purpose user I/O (bank 2) |
| Broche C6 | GND — Ground |
| Broche C7 | I/O — General-purpose user I/O (bank 2) |
| Broche C8 | I/O — General-purpose user I/O (bank 2) |
| Broche C9 | I/O — General-purpose user I/O (bank 2) |
| Broche C10 | I/O — General-purpose user I/O (bank 2) |
| Broche C11 | VCCINT — 3.3-V core supply |
| Broche C12 | I/O — General-purpose user I/O (bank 2) |
| Broche C13 | GND — Ground |
| Broche C14 | I/O — General-purpose user I/O (bank 2) |
| Broche C15 | I/O — General-purpose user I/O (bank 2) |
| Broche C16 | I/O — General-purpose user I/O (bank 2) |
| Broche D1 | I/O — General-purpose user I/O (bank 2) |
| Broche D2 | I/O — General-purpose user I/O (bank 2) |
| Broche D3 | I/O — General-purpose user I/O (bank 2) |
| Broche D4 | GND — Ground |
| Broche D5 | I/O — General-purpose user I/O (bank 2) |
| Broche D6 | I/O — General-purpose user I/O (bank 2) |
| Broche D7 | I/O — General-purpose user I/O (bank 2) |
| Broche D8 | I/O — General-purpose user I/O (bank 2) |
| Broche D9 | I/O — General-purpose user I/O (bank 2) |
| Broche D10 | I/O — General-purpose user I/O (bank 2) |
| Broche D11 | I/O — General-purpose user I/O (bank 2) |
| Broche D12 | I/O — General-purpose user I/O (bank 2) |
| Broche D13 | I/O — General-purpose user I/O (bank 2) |
| Broche D14 | VCCIO2 — I/O bank 2 reference supply |
| Broche D15 | I/O — General-purpose user I/O (bank 2) |
| Broche D16 | I/O — General-purpose user I/O (bank 2) |
| Broche E1 | I/O — General-purpose user I/O (bank 2) |
| Broche E2 | VCCIO2 — I/O bank 2 reference supply |
| Broche E3 | I/O — General-purpose user I/O (bank 2) |
| Broche E4 | I/O — General-purpose user I/O (bank 2) |
| Broche E5 | I/O — General-purpose user I/O (bank 2) |
| Broche E6 | I/O — General-purpose user I/O (bank 2) |
| Broche E7 | VCCINT — 3.3-V core supply |
| Broche E8 | I/O — General-purpose user I/O (bank 2) |
| Broche E9 | I/O — General-purpose user I/O (bank 2) |
| Broche E10 | I/O — General-purpose user I/O (bank 2) |
| Broche E11 | GND — Ground |
| Broche E12 | I/O — General-purpose user I/O (bank 2) |
| Broche E13 | I/O — General-purpose user I/O (bank 2) |
| Broche E14 | I/O — General-purpose user I/O (bank 2) |
| Broche E15 | I/O — General-purpose user I/O (bank 2) |
| Broche E16 | I/O — General-purpose user I/O (bank 2) |
| Broche F1 | I/O — General-purpose user I/O (bank 3) |
| Broche F2 | I/O — General-purpose user I/O (bank 3) |
| Broche F3 | I/O — General-purpose user I/O (bank 3) |
| Broche F4 | I/O — General-purpose user I/O (bank 3) |
| Broche F5 | I/O — General-purpose user I/O (bank 3) |
| Broche F6 | I/O — General-purpose user I/O (bank 3) |
| Broche F7 | I/O — General-purpose user I/O (bank 3) |
| Broche F8 | GND — Ground |
| Broche F9 | I/O — General-purpose user I/O (bank 3) |
| Broche F10 | I/O — General-purpose user I/O (bank 3) |
| Broche F11 | I/O — General-purpose user I/O (bank 3) |
| Broche F12 | I/O — General-purpose user I/O (bank 3) |
| Broche F13 | I/O — General-purpose user I/O (bank 3) |
| Broche F14 | I/O — General-purpose user I/O (bank 3) |
| Broche F15 | I/O — General-purpose user I/O (bank 3) |
| Broche F16 | VCCIO3 — I/O bank 3 reference supply |
| Broche G1 | I/O — General-purpose user I/O (bank 3) |
| Broche G2 | I/O — General-purpose user I/O (bank 3) |
| Broche G3 | I/O — General-purpose user I/O (bank 3) |
| Broche G4 | I/O — General-purpose user I/O (bank 3) |
| Broche G5 | VCCIO3 — I/O bank 3 reference supply |
| Broche G6 | I/O — General-purpose user I/O (bank 3) |
| Broche G7 | I/O — General-purpose user I/O (bank 3) |
| Broche G8 | I/O — General-purpose user I/O (bank 3) |
| Broche G9 | I/O — General-purpose user I/O (bank 3) |
| Broche G10 | I/O — General-purpose user I/O (bank 3) |
| Broche G11 | I/O — General-purpose user I/O (bank 3) |
| Broche G12 | I/O — General-purpose user I/O (bank 3) |
| Broche G13 | VCCINT — 3.3-V core supply |
| Broche G14 | I/O — General-purpose user I/O (bank 3) |
| Broche G15 | I/O — General-purpose user I/O (bank 3) |
| Broche G16 | GND — Ground |
| Broche H1 | I/O — General-purpose user I/O (bank 3) |
| Broche H2 | I/O — General-purpose user I/O (bank 3) |
| Broche H3 | GND — Ground |
| Broche H4 | I/O — General-purpose user I/O (bank 3) |
| Broche H5 | I/O — General-purpose user I/O (bank 3) |
| Broche H6 | I/O — General-purpose user I/O (bank 3) |
| Broche H7 | I/O — General-purpose user I/O (bank 3) |
| Broche H8 | I/O — General-purpose user I/O (bank 3) |
| Broche H9 | VCCINT — 3.3-V core supply |
| Broche H10 | I/O — General-purpose user I/O (bank 3) |
| Broche H11 | I/O — General-purpose user I/O (bank 3) |
| Broche H12 | I/O — General-purpose user I/O (bank 3) |
| Broche H13 | I/O — General-purpose user I/O (bank 3) |
| Broche H14 | GND — Ground |
| Broche H15 | I/O — General-purpose user I/O (bank 3) |
| Broche H16 | I/O — General-purpose user I/O (bank 3) |
| Broche J1 | I/O — General-purpose user I/O (bank 4) |
| Broche J2 | I/O — General-purpose user I/O (bank 4) |
| Broche J3 | I/O — General-purpose user I/O (bank 4) |
| Broche J4 | I/O — General-purpose user I/O (bank 4) |
| Broche J5 | I/O — General-purpose user I/O (bank 4) |
| Broche J6 | I/O — General-purpose user I/O (bank 4) |
| Broche J7 | I/O — General-purpose user I/O (bank 4) |
| Broche J8 | GND — Ground |
| Broche J9 | I/O — General-purpose user I/O (bank 4) |
| Broche J10 | I/O — General-purpose user I/O (bank 4) |
| Broche J11 | I/O — General-purpose user I/O (bank 4) |
| Broche J12 | I/O — General-purpose user I/O (bank 4) |
| Broche J13 | I/O — General-purpose user I/O (bank 4) |
| Broche J14 | I/O — General-purpose user I/O (bank 4) |
| Broche J15 | I/O — General-purpose user I/O (bank 4) |
| Broche J16 | VCCIO4 — I/O bank 4 reference supply |
| Broche K1 | I/O — General-purpose user I/O (bank 4) |
| Broche K2 | I/O — General-purpose user I/O (bank 4) |
| Broche K3 | I/O — General-purpose user I/O (bank 4) |
| Broche K4 | I/O — General-purpose user I/O (bank 4) |
| Broche K5 | I/O — General-purpose user I/O (bank 4) |
| Broche K6 | VCCINT — 3.3-V core supply |
| Broche K7 | I/O — General-purpose user I/O (bank 4) |
| Broche K8 | I/O — General-purpose user I/O (bank 4) |
| Broche K9 | I/O — General-purpose user I/O (bank 4) |
| Broche K10 | GND — Ground |
| Broche K11 | I/O — General-purpose user I/O (bank 4) |
| Broche K12 | I/O — General-purpose user I/O (bank 4) |
| Broche K13 | I/O — General-purpose user I/O (bank 4) |
| Broche K14 | I/O — General-purpose user I/O (bank 4) |
| Broche K15 | I/O — General-purpose user I/O (bank 4) |
| Broche K16 | I/O — General-purpose user I/O (bank 4) |
| Broche L1 | I/O — General-purpose user I/O (bank 4) |
| Broche L2 | VCCIO4 — I/O bank 4 reference supply |
| Broche L3 | I/O — General-purpose user I/O (bank 4) |
| Broche L4 | I/O — General-purpose user I/O (bank 4) |
| Broche L5 | I/O — General-purpose user I/O (bank 4) |
| Broche L6 | I/O — General-purpose user I/O (bank 4) |
| Broche L7 | I/O — General-purpose user I/O (bank 4) |
| Broche L8 | I/O — General-purpose user I/O (bank 4) |
| Broche L9 | I/O — General-purpose user I/O (bank 4) |
| Broche L10 | I/O — General-purpose user I/O (bank 4) |
| Broche L11 | VCCINT — 3.3-V core supply |
| Broche L12 | I/O — General-purpose user I/O (bank 4) |
| Broche L13 | GND — Ground |
| Broche L14 | I/O — General-purpose user I/O (bank 4) |
| Broche L15 | I/O — General-purpose user I/O (bank 4) |
| Broche L16 | I/O — General-purpose user I/O (bank 4) |
| Broche M1 | I/O — General-purpose user I/O (bank 4) |
| Broche M2 | I/O — General-purpose user I/O (bank 4) |
| Broche M3 | I/O — General-purpose user I/O (bank 4) |
| Broche M4 | GND — Ground |
| Broche M5 | I/O — General-purpose user I/O (bank 4) |
| Broche M6 | I/O — General-purpose user I/O (bank 4) |
| Broche M7 | I/O — General-purpose user I/O (bank 4) |
| Broche M8 | I/O — General-purpose user I/O (bank 4) |
| Broche M9 | I/O — General-purpose user I/O (bank 4) |
| Broche M10 | I/O — General-purpose user I/O (bank 4) |
| Broche M11 | I/O — General-purpose user I/O (bank 4) |
| Broche M12 | I/O — General-purpose user I/O (bank 4) |
| Broche M13 | I/O — General-purpose user I/O (bank 4) |
| Broche M14 | VCCIO4 — I/O bank 4 reference supply |
| Broche M15 | I/O — General-purpose user I/O (bank 4) |
| Broche M16 | I/O — General-purpose user I/O (bank 4) |
| Broche N1 | TDI — JTAG Test Data In |
| Broche N2 | TMS — JTAG Test Mode Select |
| Broche N3 | TCK — JTAG Test Clock |
| Broche N4 | I/O — General-purpose user I/O (bank 4) |
| Broche N5 | I/O — General-purpose user I/O (bank 4) |
| Broche N6 | I/O — General-purpose user I/O (bank 4) |
| Broche N7 | I/O — General-purpose user I/O (bank 4) |
| Broche N8 | GND — Ground |
| Broche N9 | I/O — General-purpose user I/O (bank 4) |
| Broche N10 | I/O — General-purpose user I/O (bank 4) |
| Broche N11 | I/O — General-purpose user I/O (bank 4) |
| Broche N12 | I/O — General-purpose user I/O (bank 4) |
| Broche N13 | I/O — General-purpose user I/O (bank 4) |
| Broche N14 | TDO — JTAG Test Data Out |
| Broche N15 | GND — Ground |
| Broche N16 | TRST/NC — JTAG Test Reset (optional) or Not Connected |
Applications typiques
EPM3512AFI256-10 convient pour 6 applications: Bus-Interface Bridging, Address Decoding and Chip-Select Generation, Power-Supply Sequencing and Supervisory Logic, Industrial Control and Factory Automation, Telecom Line-Card Glue Logic, Legacy Peripheral Emulation and Test Equipment.
Bus-Interface Bridging
The EPM3512AFI256-10 fits bus-interface bridging between microprocessors, ASICs, and legacy peripherals because it combines 208 user I/O pins, MultiVolt I/O (5.0/3.3/2.5 V), and 4.5-ns pin-to-pin logic delays in the same FBGA-256 package. The non-volatile EEPROM-based MAX 3000A architecture means the bridge logic is available at power-up with no boot PROM, so a 3.3-V host MCU can talk to a 5.0-V peripheral without glue logic. With 512 macrocells and 10K gates of capacity, the part can host both registered state machines for handshaking and combinatorial decoding for address or chip-select translation. Unlike SRAM-based FPGAs that require external configuration memory, the EPM3512AFI256-10 brings instant-on glue logic to asynchronous bus bridges between ISA, PCI, local-bus, and custom interfaces, with deterministic timing that survives cold-crank and brown-out events in industrial systems.
Recommandé
Address Decoding and Chip-Select Generation
Wide-address decoding and chip-select generation is a classic CPLD use case where the EPM3512AFI256-10 excels, with 512 macrocells handling large AND/OR product-term trees for 24- to 32-bit address spaces. The MultiVolt I/O interface lets the part decode 5.0-V memory buses while the core runs at 3.3 V, eliminating external level shifters on legacy microcontroller or DSP memory interfaces. Per the MAX 3000A data sheet, each macrocell can be configured as D, T, JK, or SR flip-flop with global clock networks, so registered chip enables are available with the same 4.5-ns tPD timing budget. Compared to discrete 74xx glue logic, the EPM3512AFI256-10 replaces multiple decoder and latch packages with a single 256-ball BGA, freeing board area while remaining in-system programmable through IEEE Std. 1532 JTAG for last-minute memory map changes.
Recommandé
Power-Supply Sequencing and Supervisory Logic
Power-supply sequencing controllers rely on the EPM3512AFI256-10 because the EEPROM-based MAX 3000A fabric powers up in a known state without external boot memory, and the 208 user I/O pins can drive dozens of enable and power-good signals across multi-rail systems. The part's deterministic 4.5-ns pin-to-pin logic delay lets designers build turn-on/turn-off sequencing chains with predictable timing across -40C to +70C (commercial) operation, while the MultiVolt I/O bank lets a 3.3-V CPLD talk to 5.0-V supervisor ICs and 2.5-V regulators. Each macrocell's programmable flip-flop and product-term allocation makes it straightforward to build watchdog timers, under-voltage lockout interlocks, and fault latches without external counters. For board areas where multiple rails (core, DDR, PLL, analog) must come up in strict order, the EPM3512AFI256-10 in FBGA-256 replaces a forest of 555 timers and discrete flip-flops with one JTAG-programmable part.
Recommandé
Industrial Control and Factory Automation
Industrial control boards in factory automation use the EPM3512AFI256-10 as deterministic glue logic that must survive harsh electrical environments, because the part's 3.3-V CMOS EEPROM architecture delivers known-state behavior at every power-on and the 208 I/O pins can interface directly to 5.0-V PLC backplanes or 24-V isolated digital inputs. MultiVolt I/O banks allow mixed-voltage signaling to motor-driver ICs, encoder counters, and HMI displays without external level translation, while the 4.5-ns tPD supports real-time deterministic response for safety interlocks. Designers also leverage the IEEE Std. 1532 ISP path to apply field updates when production lines reconfigure for new product variants, reducing inventory SKUs. Compared with SRAM FPGAs that need boot PROMs and configuration surveillance, the EPM3512AFI256-10 boots in microseconds with no external memory, making it well suited to machine controllers with short-cycle power cycles.
Recommandé
Telecom Line-Card Glue Logic
Telecom line cards in central offices and customer-premises equipment historically rely on the EPM3512AFI256-10 because it combines 512 macrocells, 10K gates, and 208 user I/O pins in a single 256-ball FBGA that fits between DSPs, framer ICs, and serializer/deserializer links. MultiVolt I/O bridges 5.0-V legacy TDM buses to 3.3-V or 2.5-V modern DSPs, and the 4.5-ns tPD plus 227.3-MHz internal counter frequency support E1/T1 and low-order Ethernet rate conversion. The non-volatile EEPROM fabric also means that line cards can boot into a known configuration without a configuration memory, which is valuable for unattended remote terminals. Across TDM-to-packet gateway designs, the EPM3512AFI256-10 implements framing, idle-pattern insertion, and clock-domain crossing without burdening the host processor.
Recommandé
Legacy Peripheral Emulation and Test Equipment
The EPM3512AFI256-10 is widely used for legacy peripheral emulation on ATE and test-and-measurement platforms because its 512 macrocells can recreate decades of bus protocols (ISA, VME, parallel ATA, SCSI) while the MultiVolt I/O banks match the original 5.0-V signaling levels. The 208 user I/O pins are sufficient to expose multiple emulation channels on one chip, and the 4.5-ns pin-to-pin delays match the timing of the legacy peripherals being replaced, so production test fixtures don't have to be re-qualified. IEEE Std. 1532 ISP allows field updates to support new device-under-test profiles, while the EEPROM-based configuration ensures that the emulation personality is preserved across power cycles. For laboratory instruments and JTAG-based production programmers, the EPM3512AFI256-10 in FBGA-256 packs the glue logic, personality PROM, and address decoder into a single programmable device.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM3512AFI256-10 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM3512AFC256-10 | EPM3512AFC256-7N | EPM3512AFC256-5C |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-256 (FineLine BGA) | FBGA-256 - same footprint | FBGA-256 - same footprint | FBGA-256 - same footprint |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 | 512 | 512 |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 10,000 |
| User I/Os | 208 | 208 | 208 | 208 |
| Speed Grade (tPD) | -10 (4.5 ns pin-to-pin) | -10 (4.5 ns) - identical | -7 (faster tPD) - upgrade | -5 (fastest tPD) - upgrade |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS / Lead-Free | Industrial (-10 suffix) | Industrial finish | Lead-free / RoHS (N suffix) | Lead-free / RoHS (C suffix) |
Principaux différenciateurs
- Highest-density MAX 3000A part with 512 macrocells (vs EPM3512AFC256-7N)
- Largest FBGA package in the family (208 user I/O) (vs EPM3512AFC256-5C)
- MultiVolt I/O bridges 5.0/3.3/2.5-V buses in one device (vs EPM3256AFI256-10 (smaller 256-macrocell part))
Notes de conception
The FBGA-256 package on the EPM3512AFI256-10 uses a 1.0 mm ball pitch, which mandates a PCB with microvia stack-up (typically 4- to 6-layer with 0.4 mm laser-drilled vias) for reliable BGA breakout. Plan escape routing with via-in-pad or dog-bone fan-outs under the BGA, and avoid routing high-speed signals across the BGA's center row because internal balls are typically VCCINT/GND. Per MAX 3000A design guidelines, place 0.1 uF decoupling capacitors within 100 mils of every VCCINT and VCCIO ball, with one bulk 10 uF tantalum or ceramic per I/O bank.
Power up the EPM3512AFI256-10's 3.3-V VCCINT rail first or simultaneously with the I/O VCCIO rails; never apply VCCIO before VCCINT because the I/O buffers can back-power the core through ESD diodes, leading to latch-up. The MultiVolt I/O feature lets each I/O bank run at 3.3 V, 2.5 V, or 5.0 V-tolerant signaling, so if a 5.0-V bus is connected, set that bank's VCCIO to 3.3 V and rely on the 5.0-V-tolerant input stage; do not drive the bank's VCCIO to 5.0 V because the absolute maximum VCCIO is 3.6 V.
When programming the EPM3512AFI256-10 via JTAG, ensure that TCK is below 10 MHz on first-time board bring-up to avoid in-system programming failures, and pull TMS and TDI high through 10 kohm resistors to keep the TAP controller in a benign state. The MAX 3000A family ISP is IEEE Std. 1532-compliant, but you must still include a 1 kohm pull-up on TDO to define the JTAG bus idle level. Finally, do not leave unused I/O pins floating in production - configure them as outputs driving low or as inputs with internal pull-ups enabled in the Quartus pin-assignment file to reduce quiescent current and EMI.
Informations de conformité
RoHS, REACH, lead-free, and halogen-free status were not explicitly stated in the verified web data; the EPM3512AFI256-10 is the non-N (non-RoHS-marked) variant per the standard Altera naming convention, while the EPM3512AFI256-10N is the lead-free/Rohs-compliant option. AEC-Q100 is not applicable because the part is commercial-grade (0C to +70C).
