EPM570ZM256I8N - MAX II 440 Macrocell CPLD, 256-MBGA | Intel
N.º da peça: EPM570ZM256I8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42.8 | $428,00 |
| 100 | $36.75 | $3.675,00 |
| 500 | $31.2 | $15.600,00 |
| 1.000 | $27.9 | $27.900,00 |
EPM570ZM256I8N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines multiple PAL/GAL-style macrocell arrays with a central interconnect matrix. CPLDs sit between small discrete logic gates (74-series) and larger FPGAs in the programmable logic hierarchy. Within that hierarchy, the MAX II family is positioned as the lowest-power, lowest-cost instant-on tier from Intel/Altera, optimized for glue logic, I/O expansion, bus bridging, and power-sequencing tasks rather than DSP-intensive workloads. The 'Z' suffix denotes the zero-power (ultra-low static current) variant, which uses a 1.8 V internal core supply and is intended for battery- and thermally-constrained designs.
Key features include in-system programmability via IEEE 1149.1 JTAG, MultiVolt I/O supporting 1.5 V / 1.8 V / 2.5 V / 3.3 V interfaces on the same die, four global clock networks with eight clocks per logic array block, and a 1.6 Kbit user flash memory block. The 256-MBGA package exposes 212 user I/O pins, supporting high-density I/O expansion in a compact 11 mm x 11 mm footprint.
Internally, the EPM570Z uses a 0.18 micrometer, 6-layer-metal flash process and a non-volatile configuration cell, which keeps the device permanently configured without external boot storage. Each Logic Array Block (LAB) contains 16 macrocells, and the central interconnect matrix routes signals across LABs with predictable, deterministic timing that simplifies static-timing closure compared with SRAM-based FPGAs.
Typical applications include I/O expansion for microcontrollers, voltage-level translation between mismatched logic domains, power-supply sequencing and supervisory logic, glue logic replacement for discrete 74-series gates, bus-interface bridging (for example, SPI-to-Parallel or I2C-to-GPIO expansion), and LED driving or keypad scanning in industrial and consumer products. Designers also use the EPM570Z as a companion CPLD to an FPGA, offloading boot configuration, clock conditioning, and reset distribution.
When designing with this device, budget for the 1.71 V to 1.89 V core supply rail (typically derived from a 3.3 V LDO) and respect the JTAG chain requirements if multiple devices share the same TMS/TCK lines. The MultiVolt I/O banks allow direct connection to 3.3 V, 2.5 V, 1.8 V, or 1.5 V domains without external level shifters, but unused I/O pins should be configured as outputs driving low or tri-stated with weak pull-up to minimize in-rush current.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same MAX II Z family, and practical design notes not collected in the manufacturer datasheet alone.
Alternativas drop-in para EPM570ZM256I8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570ZM256I8N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Series, User Flash Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570ZM256C7N
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →EPM570ZM256C6N
✅ Drop-In✓ Em estoque
$24.1 / unidade
Ver ficha técnica →EPM570ZM256I8N Classificações máximas e características elétricas
| Series | MAX II |
| Family | MAX II Z (zero-power, 1.8 V core) |
| Macro Cells | 440 |
| Logic Elements | 570 |
| Maximum Internal Frequency | 118.3 MHz |
| Process Technology | 0.18 micrometer, 6-layer-metal flash |
| User Flash Memory | 8 Kbit |
| Number of Logic Array Blocks (LABs) | 57 |
| Macrocells per LAB | 16 |
| Number of Global Clocks | 4 |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| MultiVolt I/O Bank Supply | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programmable Type | In System Programmable (ISP) via JTAG |
| User I/O Pins (max) | 212 |
| Propagation Delay (tPD1) | 9.9 ns |
| Encapsulamento | 256-MBGA (Micro FBGA), 11 mm x 11 mm |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +100 C (Industrial) |
| Status RoHS | Compliant |
Configuração de pinos do EPM570ZM256I8N
| Pino A1 | I/O — User I/O bank 1 |
| Pino A2 | I/O — User I/O bank 1 |
| Pino A3 | I/O — User I/O bank 1 |
| Pino A4 | VCCIO1 — I/O bank 1 supply |
| Pino B1 | I/O — User I/O bank 1 |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — User I/O bank 1 |
| Pino B4 | I/O — User I/O bank 1 |
| Pino C1 | I/O — User I/O bank 1 |
| Pino C2 | I/O — User I/O bank 1 |
| Pino C3 | TDI — JTAG test data in |
| Pino C4 | TMS — JTAG test mode select |
| Pino D1 | I/O — User I/O bank 2 |
| Pino D2 | TCK — JTAG test clock |
| Pino D3 | TDO — JTAG test data out |
| Pino D4 | VCCINT — Core supply 1.71 V to 1.89 V |
| Pino E1 | I/O — User I/O bank 2 |
| Pino E2 | I/O — User I/O bank 2 |
| Pino E3 | I/O — User I/O bank 2 |
| Pino E4 | VCCIO2 — I/O bank 2 supply |
Aplicações típicas
EPM570ZM256I8N é adequado para 6 aplicaçãos: Microcontroller I/O Expansion, Bus Interface Bridging, Power Supply Sequencing and Supervisory Logic, Glue Logic Replacement, FPGA Configuration and Boot Management, Industrial Control and Factory Automation.
Microcontroller I/O Expansion
The EPM570ZM256I8N is frequently used as a GPIO expander for microcontrollers that have too few native pins. Its 212 user I/Os distributed across four MultiVolt banks let a single CPLD add SPI-to-Parallel, I2C-to-GPIO, or UART-to-keypad/LED-matrix bridging without external level shifters. The 1.71 V to 1.89 V VCCINT core and instant-on flash configuration keep quiescent current low, suiting battery-backed industrial sensors. Pin compatibility with the EPM570ZM256C7N means the same PCB can be built for both commercial and industrial SKUs. Quartus II primitives make it straightforward to map each MCU peripheral to a dedicated CPLD pin.
Recomendado
Bus Interface Bridging
Designers use the EPM570ZM256I8N to bridge between mismatched bus standards such as SPI to Parallel, I2C to 8/16-bit data buses, or legacy 5 V-tolerant peripherals to 3.3 V MCUs. Its 118.3 MHz fMAX and 9.9 ns tPD handle UART and SPI throughput up to several megabits per second without becoming the bottleneck. The four MultiVolt I/O banks mean a 1.8 V MCU, a 2.5 V FPGA, and a 3.3 V peripheral can all share one CPLD, removing discrete level-shift ICs. Non-volatile instant-on configuration means the bus bridge is live within microseconds of VCCINT ramp.
Recomendado
Power Supply Sequencing and Supervisory Logic
The EPM570ZM256I8N is widely deployed as a multi-rail sequencer that controls the order and timing of voltage rails for an FPGA, ASIC, or SoC. Its non-volatile configuration boots in microseconds, so power-good and reset signals are valid before any downstream device releases its reset. With up to 212 I/Os, a single EPM570Z can sequence 8-12 rails plus generate watchdog pulses, fault aggregation, and brown-out logic. The 1.8 V core and low static current make it suitable for always-on supervisory functions in telecom and server boards.
Recomendado
Glue Logic Replacement
Replacing 74-series discrete gates with the EPM570ZM256I8N reduces board area, BOM count, and signal-trace complexity for complex glue logic. Up to 570 logic elements absorb dozens of AND/OR/flip-flop combinations plus state machines into one BGA. The deterministic, fixed timing of CPLD interconnect (unlike SRAM FPGA) gives predictable worst-case propagation, which simplifies timing closure. JTAG-based in-system programmability allows late-stage PCB respins without reworking the BOM.
Recomendado
FPGA Configuration and Boot Management
When paired with a larger SRAM FPGA, the EPM570ZM256I8N acts as a configuration manager: it stores the FPGA bitstream in 8 Kbit user flash, sequences the FPGA's PROG_B, DONE, and INIT_B signals, and monitors configuration status. The CPLD boots faster than the FPGA's typical 50-200 ms configuration time, so reset and watchdog logic is ready before the FPGA. After configuration, spare CPLD macrocells can run glue logic for the FPGA application, increasing overall board integration.
Recomendado
Industrial Control and Factory Automation
In factory automation, the EPM570ZM256I8N implements deterministic state machines for conveyor control, motor-driver interfacing, and isolated digital I/O aggregation over SPI. Its industrial -40 C to +100 C temperature range matches IEC 60068-2 cold and hot-soak requirements for factory-floor enclosures. MultiVolt I/O banks interface directly to 24 V-tolerant digital input modules after external resistive dividers. Non-volatile configuration survives brown-outs and ESD events common in motor-drive cabinets, eliminating the need for external boot PROMs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570ZM256I8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570ZM256C7N | EPM570ZM256C6N | EPM570ZM100I8N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-MBGA (11x11) | 256-MBGA (11x11) | 256-MBGA (11x11) | 100-MBGA (different footprint) |
| Macro Cells | 440 | 440 | 440 | 440 |
| Logic Elements | 570 | 570 | 570 | 570 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| User I/O (max) | 212 | 212 | 212 | 76 |
| User Flash | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
Principais diferenciais
- Highest-density MAX II Z device in 256-MBGA (vs EPM570ZM256C7N)
- Maximum 212 user I/O for high-density board designs (vs EPM570ZM100I8N)
- 1.8 V zero-power core for low-static-current applications (vs EPM570F256I5N)
Notas de projeto
The EPM570ZM256I8N requires a clean 1.71 V to 1.89 V (1.8 V nominal) VCCINT supply and one or more VCCIO rails at 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on which I/O banks are enabled. Place 100 nF decoupling capacitors as close as possible to every VCCINT and VCCIO ball, plus a bulk 10 uF tantalum or ceramic near the package. Power-on ramp should follow the datasheet monotonic VCCINT requirement of 1 ms minimum rise time to ensure clean configuration.
Use a four-layer or six-layer PCB with a dedicated ground plane under the 256-MBGA footprint. Fan-out the BGA with microvias on a 0.5 mm or 0.8 mm pitch; ensure that breakout traces do not cross between layers without reference-plane stitching vias within 1 mm of the transition. Place the JTAG header (TDI/TDO/TMS/TCK) within 50 mm of the device to keep the programming cable stub short and reliable.
Avoid powering the EPM570ZM256I8N from a shared 1.8 V rail that also feeds sensitive analog blocks, since in-rush current during configuration can corrupt ADC references. Always include the JTAG chain in the board-level test fixture, even for production units, because ISP is the only practical way to update post-assembly if a logic bug is found. Do not leave unused I/O pins floating; configure them in Quartus II as outputs driving low or as inputs with weak pull-up to avoid spurious leakage.
Informações de conformidade
RoHS and REACH compliant per Intel/Altera product page. Industrial temperature grade only, not AEC-Q100 qualified (CPLDs are not automotive-grade parts unless explicitly listed).
