EPM570ZM256C6N - MAX II 570 LE CPLD, 256-MBGA | Altera (Intel)
MPN: EPM570ZM256C6N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $39.13 | $39.13 |
| 10 | $36.5 | $365.00 |
| 100 | $31.2 | $3,120.00 |
| 500 | $27.4 | $13,700.00 |
| 1,000 | $24.1 | $24,100.00 |
Drop-in alternatives for EPM570ZM256C6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM1270ZM256C6N
β Drop-Inπ Reference alternative (not in catalog)
EPM2210ZM256C6N
β Drop-Inπ Reference alternative (not in catalog)
EPM570ZM256I6N
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EPM570ZM256C7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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View Datasheet βEPM570GM256C5N
β Drop-Inβ In Stock
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View Datasheet βEPM570ZM256C6N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 160 |
| User Flash Memory | 8 Kbits |
| Package | 256-MBGA (FineLine BGA) 11x11 mm |
| Pin/Pitch | 256 balls, 0.5 mm pitch (Heisener description) |
| Internal Core Voltage | 1.71 V to 1.89 V (1.8 V typical) |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant |
| Propagation Delay (tPD) | 9 ns (per Heisener listing for Z speed grade) |
| Programmable Type | In System Programmable (Flash, non-volatile) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | 0.18 micron CMOS, 6-layer-metal flash |
| RoHS Status | Lead-free (per Heisener listing) |
EPM570ZM256C6N 256-mbga (fineline bga) 11x11 mm Pin Configuration Guide
Complete pinout information for EPM570ZM256C6N (256-mbga (fineline bga) 11x11 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570ZM256C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570ZM256C6N is suitable for 6 applications: Microcontroller I/O Expansion and Bus Bridging, Industrial Control Glue Logic Replacement, Telecommunications Line-Card Interface Glue, LED Display and Signage Control, Multi-Rail Power Sequencing and Supervisor Networks, Consumer Peripheral Hub and Interface Aggregator.
Microcontroller I/O Expansion and Bus Bridging
The EPM570ZM256C6N's 160 user I/Os and 570 LEs make it a strong fit as an I/O expander for resource-constrained microcontrollers that lack sufficient GPIO, UART, or peripheral count. Designers route address/data buses, PWM channels, and interrupt lines through the CPLD, gaining deterministic 9 ns pin-to-pin timing that simplifies real-time control firmware. MultiVolt I/O supports 1.8 V SoCs alongside legacy 5 V peripherals in the same design without level shifters. The 256-MBGA package enables dense placement beneath or beside the host MCU, while the on-chip 8 Kbit user flash provides non-volatile configuration storage for bridge-side defaults.
Recommended
Industrial Control Glue Logic Replacement
As a drop-in replacement for multiple 74-series glue-logic packages (latches, decoders, multiplexers, bus switches), the EPM570ZM256C6N consolidates board area and reduces BOM complexity in industrial PLCs, motor controllers, and process-instrumentation front ends. The 9 ns propagation delay suits control-plane timing budgets where microsecond-level determinism matters more than nanosecond DSP throughput. Wide 0C to +85C commercial operating temperature and 5 V-tolerant I/Os interface directly to industrial sensor front-ends, optocouplers, and legacy 24 V-interface logic through external translators. Designers program the device once via JTAG; subsequent field updates reuse the same in-system-programming chain.
Recommended
Telecommunications Line-Card Interface Glue
Telecom line cards and access-network equipment rely on the EPM570ZM256C6N for TDM bus multiplexing, framer-to-SERDES bridging, clock-domain crossing, and LED-status display driving. The 160 I/Os in a compact 256-MBGA footprint accommodate the dense back-panel connector count typical of compactPCI and ATCA cards. MultiVolt I/O banks interface directly to 1.8 V SERDES, 2.5 V framers, 3.3 V DSPs, and 5 V legacy glue from a single device. Non-volatile instant-on boot eliminates external configuration PROM, reducing board cost and boot-time risk in central-office deployments where deterministic power-up sequencing is mandatory.
Recommended
LED Display and Signage Control
Large LED-matrix displays and electronic-signage controllers use the EPM570ZM256C6N for row/column scanning, PWM dimming, and high-speed multiplexing of shift-register chains. The 570 LE capacity drives dozens of PWM channels simultaneously while 160 I/Os address wide data buses to LED-driver ICs without external mux chips. The 9 ns tPD allows refresh rates above 1 kHz even for high-resolution panels, eliminating visible flicker. Non-volatile configuration means the display controller starts producing the boot pattern within microseconds of power-up, which is critical for unattended signage that must display information immediately after power restoration.
Recommended
Multi-Rail Power Sequencing and Supervisor Networks
Power-supply designers integrate the EPM570ZM256C6N as a programmable power-sequencer for multi-rail ASIC, FPGA, and SoC boards, replacing discrete CD4013 / CD4538 timing chains with a single re-programmable device. Designers implement enable/disable logic, fault-propagation, and timing-delay chains in Verilog or VHDL, then load via JTAG; field updates re-sequence rails without PCB rework. The 8 Kbit user flash stores non-volatile trim and rail-margining profiles alongside configuration data. Wide 5 V-tolerant I/O drives external MOSFET gate-driver inputs directly, while 1.8 V core minimizes quiescent power in always-on supervisory paths.
Recommended
Consumer Peripheral Hub and Interface Aggregator
Consumer-electronics motherboards for set-top boxes, gaming consoles, and home gateways deploy the EPM570ZM256C6N as a peripheral-aggregation hub that multiplexes USB, HDMI CEC, IR, keypad, and audio-control signals onto the main SoC. The 160 I/Os consolidate dozens of discrete logic functions into a single IC, lowering BOM cost and PCB area. Non-volatile instant-on boot enables ultra-fast wake-from-standby behavior because the hub logic is already configured by the time the SoC completes its own boot sequence. 5 V-tolerant I/Os interface directly to legacy IR receivers and keypad matrices, simplifying mixed-voltage consumer designs.
Recommended
Recommended Products Summary
Engineering reference data for EPM570ZM256C6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM1270ZM256C6N | EPM2210ZM256C6N | EPM570ZM256I6N | EPM570ZM256C7N | EPM570GM256C5N |
|---|---|---|---|---|---|---|
| Package | 256-MBGA (FineLine BGA) 11x11 mm | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements (LEs) | 570 | 1270 | 2210 | 570 | 570 | 570 |
| Macrocells | 440 | 980 | 1700 | 440 | 440 | 440 |
| User I/Os | 160 | 212 | 212 | 160 | 160 | 160 |
| Speed Grade (tPD) | Z6 (~9 ns) | Z6 (~9 ns) | Z6 (~9 ns) | Z6 (~9 ns) | C7 (~7 ns) | G5 (~5.5 ns) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Vertical Migration Compatible | N/A (base part) | Yes - direct upgrade | Yes - direct upgrade | Yes - temp-grade variant | Yes - speed-grade variant | Yes - speed-grade variant |
Key Differentiators
- Highest I/O density in MAX II 256-MBGA family at base 570 LE density (vs EPM570T144C5N)
- Direct vertical migration path to higher densities in same footprint (vs EPM1270ZM256C6N)
- 8 Kbit user flash for non-volatile configuration storage (vs Discrete 74-series glue logic)
Design Notes
The 256-MBGA package uses 0.5 mm ball pitch on an 11x11 mm substrate, which requires laser-drilled or micro-via PCB stack-ups for breakout routing. Use 4-layer FR-4 minimum with a dedicated ground plane directly under the BGA to control return-path impedance. Place 0.1 microfarad X7R decoupling capacitors within 2 mm of every VCCIO bank, plus 10 microfarad bulk tantalum or ceramic on each supply rail. Plan BGA fanout using dogbone or via-in-pad techniques depending on PCB fabricator capability.
Do not assume JTAG chain access is optional: in-system programmability requires dedicated TCK, TMS, TDI, TDO pins brought to a test header or boundary-scan connector. Forgetting JTAG access forces board rework if configuration updates are needed. Also note that the 1.8 V internal core is generated by an internal regulator from the VCCINT supply; the user only needs to supply 1.8 V externally on VCCINT pins, while VCCIO accepts 1.5/1.8/2.5/3.3 V per bank. Mixing VCCIO voltages across banks is permitted but requires careful bank-by-bank pin assignment in the Quartus Pin Planner.
Estimated: At maximum LE utilization (~90%) and 100 MHz toggle rate on 80 I/Os, dynamic power dissipation is approximately 200-300 mW with VCCIO at 3.3 V. The 256-MBGA package has a typical theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board, yielding a junction-to-ambient rise of 5-9 C above ambient - well within the 0C to +85C commercial range. No external heatsink is required; designers should still ensure adequate PCB copper for thermal spreading, especially if VCCIO banks run at 3.3 V with high switching activity.
Compliance Information
Lead-free per Heisener listing. RoHS compliance verified via distributor product pages. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Industrial temperature variant EPM570ZM256I6N available for -40C to +100C operation.
