EPM570ZM256I8N - MAX II 440 Macrocell CPLD, 256-MBGA | Intel
MPN: EPM570ZM256I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.8 | $428.00 |
| 100 | $36.75 | $3,675.00 |
| 500 | $31.2 | $15,600.00 |
| 1,000 | $27.9 | $27,900.00 |
Drop-in alternatives for EPM570ZM256I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570ZM256C7N
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPM570ZM256C6N
✅ Drop-In✓ In Stock
$24.1 / Unit
View Datasheet →EPM570ZM256I8N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Family | MAX II Z (zero-power, 1.8 V core) |
| Macro Cells | 440 |
| Logic Elements | 570 |
| Maximum Internal Frequency | 118.3 MHz |
| Process Technology | 0.18 micrometer, 6-layer-metal flash |
| User Flash Memory | 8 Kbit |
| Number of Logic Array Blocks (LABs) | 57 |
| Macrocells per LAB | 16 |
| Number of Global Clocks | 4 |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| MultiVolt I/O Bank Supply | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programmable Type | In System Programmable (ISP) via JTAG |
| User I/O Pins (max) | 212 |
| Propagation Delay (tPD1) | 9.9 ns |
| Package | 256-MBGA (Micro FBGA), 11 mm x 11 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +100 C (Industrial) |
| RoHS Status | Compliant |
EPM570ZM256I8N Pin Configuration
| Pin A1 | I/O — User I/O bank 1 |
| Pin A2 | I/O — User I/O bank 1 |
| Pin A3 | I/O — User I/O bank 1 |
| Pin A4 | VCCIO1 — I/O bank 1 supply |
| Pin B1 | I/O — User I/O bank 1 |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O bank 1 |
| Pin B4 | I/O — User I/O bank 1 |
| Pin C1 | I/O — User I/O bank 1 |
| Pin C2 | I/O — User I/O bank 1 |
| Pin C3 | TDI — JTAG test data in |
| Pin C4 | TMS — JTAG test mode select |
| Pin D1 | I/O — User I/O bank 2 |
| Pin D2 | TCK — JTAG test clock |
| Pin D3 | TDO — JTAG test data out |
| Pin D4 | VCCINT — Core supply 1.71 V to 1.89 V |
| Pin E1 | I/O — User I/O bank 2 |
| Pin E2 | I/O — User I/O bank 2 |
| Pin E3 | I/O — User I/O bank 2 |
| Pin E4 | VCCIO2 — I/O bank 2 supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570ZM256I8N is suitable for 6 applications: Microcontroller I/O Expansion, Bus Interface Bridging, Power Supply Sequencing and Supervisory Logic, Glue Logic Replacement, FPGA Configuration and Boot Management, Industrial Control and Factory Automation.
Microcontroller I/O Expansion
The EPM570ZM256I8N is frequently used as a GPIO expander for microcontrollers that have too few native pins. Its 212 user I/Os distributed across four MultiVolt banks let a single CPLD add SPI-to-Parallel, I2C-to-GPIO, or UART-to-keypad/LED-matrix bridging without external level shifters. The 1.71 V to 1.89 V VCCINT core and instant-on flash configuration keep quiescent current low, suiting battery-backed industrial sensors. Pin compatibility with the EPM570ZM256C7N means the same PCB can be built for both commercial and industrial SKUs. Quartus II primitives make it straightforward to map each MCU peripheral to a dedicated CPLD pin.
Recommended
Bus Interface Bridging
Designers use the EPM570ZM256I8N to bridge between mismatched bus standards such as SPI to Parallel, I2C to 8/16-bit data buses, or legacy 5 V-tolerant peripherals to 3.3 V MCUs. Its 118.3 MHz fMAX and 9.9 ns tPD handle UART and SPI throughput up to several megabits per second without becoming the bottleneck. The four MultiVolt I/O banks mean a 1.8 V MCU, a 2.5 V FPGA, and a 3.3 V peripheral can all share one CPLD, removing discrete level-shift ICs. Non-volatile instant-on configuration means the bus bridge is live within microseconds of VCCINT ramp.
Recommended
Power Supply Sequencing and Supervisory Logic
The EPM570ZM256I8N is widely deployed as a multi-rail sequencer that controls the order and timing of voltage rails for an FPGA, ASIC, or SoC. Its non-volatile configuration boots in microseconds, so power-good and reset signals are valid before any downstream device releases its reset. With up to 212 I/Os, a single EPM570Z can sequence 8-12 rails plus generate watchdog pulses, fault aggregation, and brown-out logic. The 1.8 V core and low static current make it suitable for always-on supervisory functions in telecom and server boards.
Recommended
Glue Logic Replacement
Replacing 74-series discrete gates with the EPM570ZM256I8N reduces board area, BOM count, and signal-trace complexity for complex glue logic. Up to 570 logic elements absorb dozens of AND/OR/flip-flop combinations plus state machines into one BGA. The deterministic, fixed timing of CPLD interconnect (unlike SRAM FPGA) gives predictable worst-case propagation, which simplifies timing closure. JTAG-based in-system programmability allows late-stage PCB respins without reworking the BOM.
Recommended
FPGA Configuration and Boot Management
When paired with a larger SRAM FPGA, the EPM570ZM256I8N acts as a configuration manager: it stores the FPGA bitstream in 8 Kbit user flash, sequences the FPGA's PROG_B, DONE, and INIT_B signals, and monitors configuration status. The CPLD boots faster than the FPGA's typical 50-200 ms configuration time, so reset and watchdog logic is ready before the FPGA. After configuration, spare CPLD macrocells can run glue logic for the FPGA application, increasing overall board integration.
Recommended
Industrial Control and Factory Automation
In factory automation, the EPM570ZM256I8N implements deterministic state machines for conveyor control, motor-driver interfacing, and isolated digital I/O aggregation over SPI. Its industrial -40 C to +100 C temperature range matches IEC 60068-2 cold and hot-soak requirements for factory-floor enclosures. MultiVolt I/O banks interface directly to 24 V-tolerant digital input modules after external resistive dividers. Non-volatile configuration survives brown-outs and ESD events common in motor-drive cabinets, eliminating the need for external boot PROMs.
Recommended
Recommended Products Summary
Engineering reference data for EPM570ZM256I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570ZM256C7N | EPM570ZM256C6N | EPM570ZM100I8N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-MBGA (11x11) | 256-MBGA (11x11) | 256-MBGA (11x11) | 100-MBGA (different footprint) |
| Macro Cells | 440 | 440 | 440 | 440 |
| Logic Elements | 570 | 570 | 570 | 570 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| User I/O (max) | 212 | 212 | 212 | 76 |
| User Flash | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| fMAX | 118.3 MHz | 118.3 MHz | [DATA_NEEDED] | 118.3 MHz |
Key Differentiators
- Highest-density MAX II Z device in 256-MBGA (vs EPM570ZM256C7N)
- Maximum 212 user I/O for high-density board designs (vs EPM570ZM100I8N)
- 1.8 V zero-power core for low-static-current applications (vs EPM570F256I5N)
Design Notes
The EPM570ZM256I8N requires a clean 1.71 V to 1.89 V (1.8 V nominal) VCCINT supply and one or more VCCIO rails at 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on which I/O banks are enabled. Place 100 nF decoupling capacitors as close as possible to every VCCINT and VCCIO ball, plus a bulk 10 uF tantalum or ceramic near the package. Power-on ramp should follow the datasheet monotonic VCCINT requirement of 1 ms minimum rise time to ensure clean configuration.
Use a four-layer or six-layer PCB with a dedicated ground plane under the 256-MBGA footprint. Fan-out the BGA with microvias on a 0.5 mm or 0.8 mm pitch; ensure that breakout traces do not cross between layers without reference-plane stitching vias within 1 mm of the transition. Place the JTAG header (TDI/TDO/TMS/TCK) within 50 mm of the device to keep the programming cable stub short and reliable.
Avoid powering the EPM570ZM256I8N from a shared 1.8 V rail that also feeds sensitive analog blocks, since in-rush current during configuration can corrupt ADC references. Always include the JTAG chain in the board-level test fixture, even for production units, because ISP is the only practical way to update post-assembly if a logic bug is found. Do not leave unused I/O pins floating; configure them in Quartus II as outputs driving low or as inputs with weak pull-up to avoid spurious leakage.
Compliance Information
RoHS and REACH compliant per Intel/Altera product page. Industrial temperature grade only, not AEC-Q100 qualified (CPLDs are not automotive-grade parts unless explicitly listed).
