H5ANAG8NCR-RDC - DDR4 SDRAM 16Gb 2Gx8 1.2V | SK hynix
N.º da peça: H5ANAG8NCR-RDC ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1 | $1,00 |
| 10 | $1 | $10,00 |
| 100 | $1 | $100,00 |
| 500 | $1 | $500,00 |
| 1.000 | $1 | $1.000,00 |
H5ANAG8NCR-RDC Visão geral
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random Access Memory) is the fourth generation of the DDR memory standard and sits within the broader DRAM -> synchronous DRAM -> volatile memory hierarchy. Compared to DDR3, DDR4 reduces operating voltage by roughly 20% (from 1.5V to 1.2V), increases bank count, and enables higher data rates per device, which is why it became the dominant main memory for servers, workstations, and networking equipment.
Key characteristics of the H5ANAG8N family include the 16Gb single-die density, x8 organization enabling ECC-based server architectures (8 of 9 chips plus ECC parity on RDIMM designs), 1.2V VDD operation for reduced power, and a JEDEC-standard 78-ball FBGA footprint for drop-in board-level compatibility across speed grades. The -RDC suffix identifies a specific speed bin and operating-temperature rating within the family.
Architecturally, the device is fully synchronous: addresses, commands, and control inputs are registered on clock edges, and internal bank-group parallelism sustains high effective bandwidth. SK hynix states its 16Gb DDR4 delivers up to 3200 MT/s while consuming 20% less operating voltage than DDR3.
Typical applications include server DIMM modules (RDIMM/LRDIMM x8 population with ECC), networking and telecom line cards, industrial embedded controllers, and storage systems that still source DDR4 components for stable long-term supply.
Design consideration: DRAM speed-bin suffixes (e.g., -RDC versus -VKC versus -XNC) define maximum data rate and AC timing; verify the memory controller supports the target speed bin and that termination and trace-length matching follow the DDR4 routing guidelines.
This page synthesizes distributor data, same-family drop-in alternatives, and application guidance beyond the raw datasheet.
Alternativas drop-in para H5ANAG8NCR-RDC — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com H5ANAG8NCR-RDC (mesmo formato e footprint) — diferindo em Package, Data Rate, Interface, RoHS Status, Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
H5ANAG8NCJR-XNC
✅ Drop-In✓ Em estoque
$65.625 / unidade
Ver ficha técnica →H5ANAG8NCMR-VKC
✅ Drop-In✓ Em estoque
$8.05 / unidade
Ver ficha técnica →H5ANAG8NAMR-UHC
✅ Drop-In✓ Em estoque
$2.15 / unidade
Ver ficha técnica →H5ANAG8NBJR-RDC
✅ Drop-In✓ Em estoque
$3.55 / unidade
Ver ficha técnica →H5ANAG8NCMR-RDC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
H5ANAG8NCR-RDC Classificações máximas e características elétricas
| Tipo de memória | DDR4 SDRAM |
| Density | 16 Gbit |
| Organização da memória | 2G x 8 |
| Supply Voltage (VDD) | 1.2 V |
| Encapsulamento | 78-ball FBGA |
| Tipo de montagem | Surface Mount |
| Interface | DDR4 (fully synchronous, both clock edges) |
| Family | H5ANAG8N 16Gb DDR4 |
| Application Segment | Main memory (server, networking, industrial, embedded) |
Guia de Configuração de Pinos do H5ANAG8NCR-RDC 78-ball fbga
Configuração de pinos para H5ANAG8NCR-RDC (pacote 78-ball fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para H5ANAG8NCR-RDC.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
H5ANAG8NCR-RDC é adequado para 6 aplicaçãos: Server RDIMM Main Memory, Networking and Telecom Line Cards, Industrial Embedded Controllers, Storage Systems and SSD Controllers, Test and Measurement Instruments, Aerospace and Rugged Embedded Computing.
Server RDIMM Main Memory
The H5ANAG8NCR-RDC's 16Gb density and x8 organization make it a primary building block for ECC-protected server memory modules. RDIMM designs populate x8 DDR4 chips alongside registered clock drivers and data buffers, so 2G x 8 parts map directly onto standard module topologies. At 1.2V, power per bit drops roughly 20% versus DDR3 at equal workloads, reducing thermal load in dense 1U/2U servers. Designers must match the -RDC speed bin to the memory controller's supported data rate and validate refresh and ZQ calibration timing per the SK hynix datasheet.
Recomendado
Networking and Telecom Line Cards
Switch, router, and telecom line cards use x8 DDR4 components such as the H5ANAG8NCR-RDC for packet buffering, flow tables, and control-plane memory. The 16Gb single-die density allows high buffer capacity with fewer devices, simplifying routing on high-layer-count boards. Fully synchronous operation on both clock edges sustains the bandwidth these platforms require. Because the 78-ball FBGA footprint is common across SK hynix 16Gb DDR4 speed grades, designers can dual-source within the family by adjusting only speed-bin constraints and controller training parameters.
Recomendado
Industrial Embedded Controllers
Industrial PCs, motion controllers, and machine-vision systems that still specify DDR4 use the H5ANAG8NCR-RDC where main memory density and a stable long-term supply matter more than absolute latest-generation performance. SK hynix positions its 16Gb DDR4 explicitly for industrial and embedded platforms. The 1.2V rail integrates easily with standard industrial power trees, and the -RDC temperature rating supports industrial environments. Engineers should pre-position inventory and validate at least one same-family alternate suffix given DDR4's phase-out trajectory.
Recomendado
Storage Systems and SSD Controllers
Enterprise storage arrays and high-end SSD controllers use 16Gb DDR4 DRAM such as the H5ANAG8NCR-RDC for mapping tables, write caches, and metadata. The 2G x 8 organization fits 64-bit-plus-ECC bus topologies typical of storage ASICs, and 16Gb density reduces component count versus stacking lower-density dies. Latency consistency and refresh behavior defined in the SK hynix datasheet are the key validation points, since storage firmware often depends on bounded worst-case DRAM access timing.
Recomendado
Test and Measurement Instruments
Oscilloscopes, logic analyzers, and signal generators require deep capture memory with predictable latency; 16Gb DDR4 components like the H5ANAG8NCR-RDC provide that depth at 1.2V power levels compatible with instrument thermal budgets. The JEDEC-standard 78-ball FBGA footprint simplifies second-sourcing across SK hynix die revisions, and the family's 3200 MT/s-class bandwidth supports high-throughput streaming acquisition engines. Calibration routines should account for the -RDC speed bin's AC parameters as documented by SK hynix.
Recomendado
Aerospace and Rugged Embedded Computing
Rugged embedded and aerospace compute modules use DDR4 components for main memory where supply continuity and documented revision control are critical. The H5ANAG8NCR-RDC's commodity JEDEC footprint allows standard memory-controller integration while its family structure supports lock-down on a single die revision for qualification. Thermal derating per the -RDC temperature rating must be verified against the enclosure's conduction-cooled design. Buyers in this segment typically secure last-time-buy inventory of 16Gb DDR4 as the industry transitions to DDR5.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para H5ANAG8NCR-RDC — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | H5ANAG8NCJR-XNC | H5ANAG8NCMR-VKC | H5ANAG8NAMR-UHC | H5ANAG8NBJR-RDC |
|---|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Density | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit |
| Organization | 2G x 8 | 2G x 8 | 2G x 8 | 2G x 8 | 2G x 8 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Die Revision | C family (RDC suffix) | C family, XNC bin | CM die revision, VKC bin | AM die revision, UHC bin | BJ die revision, RDC bin |
Principais diferenciais
- 16Gb single-die density reduces component count (vs H5ANAG8NAMR-UHC)
- x8 organization enables ECC server topologies (vs H5ANAG6NCJR-XNC)
- 1.2V DDR4 operation cuts power vs DDR3 (vs H5ANAG8NCMR-VKC)
Notas de projeto
DDR4 fly-by routing requires careful trace-length matching across address/command lines and per-byte length matching for DQ/DQS pairs. Follow the SK hynix DDR4 design guide and your memory controller's layout checklist: maintain controlled impedance, use on-die termination (ODT) settings from the datasheet's timing tables for the -RDC speed bin, and simulate eye diagrams at the target data rate before committing the board.
The H5ANAG8NCR-RDC runs from a 1.2V VDD rail with separate VPP requirements typical of DDR4. Size VTT termination regulators for peak termination current across all populated ranks, and decouple each FBGA power ball with low-ESR ceramics placed close to the device. Estimated: dynamic current scales with data rate, so verify rail droop during simultaneous read/write burst patterns at the maximum controller speed.
Die revisions within the H5ANAG8N family (AM, BJ, CM, C) can differ in AC timing margins and refresh details even at the same suffix. When qualifying a board, lock the approved die revision or re-run memory training and burn-in whenever a substitution occurs. Also verify the -RDC bin against your controller's supported speed list; mixing speed bins across ranks on one channel forces the entire channel to the slower bin.
Informações de conformidade
Compliance status was not stated in the verified web data; confirm via SK hynix product page or distributor compliance documents.