LFE3-35EA-7FTN256I - 33K LUTs ECP3 FPGA, 256-FTBGA | Lattice
N.º da peça: LFE3-35EA-7FTN256I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $58.4 | $58,40 |
| 10 | $52.1 | $521,00 |
| 100 | $46.85 | $4.685,00 |
| 500 | $41.2 | $20.600,00 |
| 1.000 | $36.5 | $36.500,00 |
LFE3-35EA-7FTN256I Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured by the end user after manufacture. Within the broader semiconductor hierarchy, an FPGA is a programmable logic device, sitting alongside CPLDs as the two main categories of user-configurable digital ICs, both of which fall under the larger umbrella of Application-Specific Standard Products (ASSPs) and digital ASICs. The LatticeECP3 family specifically targets bridging, video, and low-cost communication designs, positioning this MPN between small CPLDs and high-end FPGAs such as Xilinx Virtex or Intel (Altera) Stratix families.
Key features of the LFE3-35EA-7FTN256I include 33.3K LUTs with embedded sysDSP-style multipliers, 133 user I/O supporting multiple I/O standards (LVCMOS, LVTTL, LVDS, SSTL, HSTL), integrated SERDES channels rated up to 3.2 Gbps for protocols such as PCIe Gen1, SGMII, SATA, and 8b/10b-encoded links, and a typical internal fabric operating frequency sufficient for high-speed control and data-path logic. The -7 speed grade indicates the second-fastest commercial bin within the ECP3 family, and the I-suffix indicates the industrial temperature range.
The LFE3-35EA-7FTN256I is built on a 65 nm CMOS process, which provides a favorable performance-per-watt ratio for embedded bridging, video processing, and machine-to-machine communication designs. The device integrates 1,358,848 system gates and 6.69 Mbits of embedded memory (EBR) for FIFO and buffer applications. Power-aware design flow via Lattice Diamond or ispLEVER Classic, combined with on-chip PLLs and clock-management tiles, lets designers hit timing closure at multi-hundred-megahertz Fmax while staying within a tight power envelope.
Typical applications for the LFE3-35EA-7FTN256I include low-cost video bridging (HDMI, DisplayPort, MIPI converters), industrial Ethernet / SERDES bridges, motor-control and factory-automation controllers, surveillance and machine-vision front-ends, and consumer-connectivity products such as docking stations and high-speed hubs. Industrial-grade temperature support and integrated 3.2 Gbps SERDES make it a common choice when designers need a hot-swappable, multi-protocol interconnect front-end.
When designing with this FPGA, ensure that the 256-ball FTBGA PCB footprint uses the manufacturer-recommended land pattern, including proper microvia stacking and a continuous ground plane under the BGA for signal-integrity and thermal relief. Plan clock trees around the on-chip PLLs and use the Lattice Diamond toolchain for synthesis, place-and-route, and SERDES configuration. For high-speed SERDES channels, follow the reference schematics for AC-coupling capacitor selection, 100-ohm differential routing, and pre-emphasis / de-emphasis settings as documented in the LatticeECP3 family data sheet.
This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, comparison parameters, and practical design notes that go beyond the bare Lattice ECP3 datasheet, helping procurement and engineering teams make informed component decisions.
Alternativas drop-in para LFE3-35EA-7FTN256I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LFE3-35EA-7FTN256I (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LFE3-35EA-6FTN256I
✅ Drop-In✓ Em estoque
$30.1 / unidade
Ver ficha técnica →LFE3-35EA-8FTN256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE3-70EA-7FTN256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE3-35EA-7FTN256C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE3-35EA-7FTG256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE3-35EA-7FTN256I Classificações máximas e características elétricas
| Product Type | FPGA (Field-Programmable Gate Array) |
| Series | LatticeECP3 (EConomy Plus 3) |
| Logic Cells / LUTs | 33,000 (33.3K LUTs) |
| System Gates | 1,358,848 |
| User I/O | 133 |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm CMOS |
| SERDES Data Rate | 150 Mbps to 3.2 Gbps |
| SERDES Protocol Support | PCIe Gen1, SGMII, SATA, 8b/10b, 10-bit SERDES |
| Speed Grade | -7 (second-fastest ECP3 bin) |
| Temperatura de operação | -40 C to +100 C (Industrial, I-suffix) |
| Encapsulamento | 256-ball FTBGA (FT = 17 x 17 mm, 1.0 mm pitch) |
| Tipo de montagem | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| Configuration Memory | SRAM-based (external configuration flash required) |
Guia de Configuração de Pinos do LFE3-35EA-7FTN256I 256-ball ftbga (ft = 17 x 17 mm, 1.0 mm pitch)
Configuração de pinos para LFE3-35EA-7FTN256I (pacote 256-ball ftbga (ft = 17 x 17 mm, 1.0 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LFE3-35EA-7FTN256I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LFE3-35EA-7FTN256I é adequado para 6 aplicaçãos: Video Bridge / Display Converter, Industrial Ethernet / Fieldbus Bridge, Surveillance / Machine Vision Front-End, Medical Imaging / Diagnostic Equipment, Automotive Infotainment / Telematics, Docking Station / Multi-Protocol Hub.
Video Bridge / Display Converter
The LFE3-35EA-7FTN256I is well suited for video bridge applications converting HDMI, DisplayPort, MIPI DSI, or LVDS to other formats, thanks to its 33K LUTs of logic capacity, 133 user I/O supporting LVCMOS/LVDS/SSTL standards, and 3.2 Gbps SERDES channels that handle TMDS, DisplayPort 1.1, and HD-SDI link rates. The 1.2 V core supply and 65 nm process keep power below 1.5 W typical for active video pipelines, which is critical for compact adapter dongles and docking stations. The industrial temperature grade allows operation in harsh in-cabin automotive and outdoor signage environments without thermal derating. The -7 speed grade provides sufficient timing margin for 148.5 MHz pixel clocks common in 1080p60 video paths.
Recomendado
Industrial Ethernet / Fieldbus Bridge
Industrial Ethernet and fieldbus bridge designs use the LFE3-35EA-7FTN256I to translate between protocols such as PROFINET, EtherCAT, SERCOS III, Modbus TCP, and CC-Link IE, leveraging its 3.2 Gbps SERDES for SGMII 1 Gbps Ethernet PHYs and its 33K LUT fabric for protocol stack processing. The industrial temperature range of -40 C to +100 C matches the requirements of factory-floor PLCs, motor drives, and remote I/O blocks. On-chip PLLs provide the precise clocking needed for IEEE 1588 timing synchronization, and the SRAM-based configuration allows field firmware updates via standard SPI flash. The 1.0 mm pitch 256-FTBGA package suits space-constrained DIN-rail modules.
Recomendado
Surveillance / Machine Vision Front-End
Surveillance IP cameras and machine-vision front-ends benefit from the LFE3-35EA-7FTN256I's combination of high-speed SERDES for image-sensor interfacing, sufficient LUTs for image preprocessing pipelines (debayer, gamma, edge detection), and 133 I/O to drive parallel sensor buses, DDR2/DDR3 memory controllers, and HDMI outputs. The industrial temperature grade and 65 nm low-power process allow fanless enclosure designs. The device's ability to bridge MIPI CSI-2 to USB 3.0 or GigE Vision makes it a flexible hub for vision integrators. A typical 2-megapixel 60 fps pipeline fits comfortably within 33K LUTs at the -7 speed grade.
Recomendado
Medical Imaging / Diagnostic Equipment
Medical imaging subsystems, including portable ultrasound, patient-monitoring displays, and endoscopy video processors, use the LFE3-35EA-7FTN256I to aggregate high-speed image data from sensor arrays and present it on LCD panels over LVDS or HDMI links. The 3.2 Gbps SERDES supports HD-SDI and HDMI 1.4 TMDS rates, and the 33K LUTs handle real-time image-pipeline algorithms. The industrial temperature range, low EMI from 1.2 V operation, and small 17 x 17 mm FTBGA footprint suit handheld and bedside medical devices. Lattice's long-term product longevity program supports medical certification cycles that demand 10+ year component availability.
Recomendado
Automotive Infotainment / Telematics
In automotive infotainment head units, telematics control units, and rear-seat entertainment, the LFE3-35EA-7FTN256I serves as a flexible video and connectivity bridge between camera inputs, head-unit displays, MOST or Ethernet backbones, and external USB or HDMI ports. Its industrial temperature grade and 65 nm process meet typical in-cabin automotive environmental requirements. The 3.2 Gbps SERDES supports MOST150 and automotive Ethernet PHYs, while 133 I/O drive LVDS display panels and touch controllers. The same 256-FTBGA footprint across ECP3 density options enables easy migration from 33K to 70K LUTs as feature sets grow.
Recomendado
Docking Station / Multi-Protocol Hub
USB Type-C docking stations, multi-protocol hubs, and Thunderbolt accessory boards use the LFE3-35EA-7FTN256I to bridge USB 3.0, DisplayPort, HDMI, SATA, and PCIe signals through its 3.2 Gbps SERDES channels. The 33K LUTs accommodate protocol mux/demux logic and PD (Power Delivery) negotiation controllers, and the 133 user I/O handle USB 2.0 sideband, I2C, SPI, and GPIO connections. The compact 256-FTBGA package fits the slim form factor of modern docking stations. The LFE3-35EA-7FTN256I's combination of cost, density, and SERDES integration lets designers replace multiple ASSP bridge ICs with one programmable device.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LFE3-35EA-7FTN256I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LFE3-35EA-6FTN256I | LFE3-35EA-8FTN256I | LFE3-70EA-7FTN256I | LFE3-35EA-7FTN256C | LFE3-35EA-7FTG256I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-FTBGA (17x17 mm) | 256-FTBGA (17x17 mm) - same | 256-FTBGA (17x17 mm) - same | 256-FTBGA (17x17 mm) - same | 256-FTBGA (17x17 mm) - same | 256-FTBGA - same |
| Family | LatticeECP3 | LatticeECP3 | LatticeECP3 | LatticeECP3 | LatticeECP3 | LatticeECP3 |
| Logic Cells / LUTs | 33,000 LUTs | 33,000 LUTs | 33,000 LUTs | 70,000 LUTs (+112%) | 33,000 LUTs | 33,000 LUTs |
| Speed Grade | -7 (2nd fastest bin) | -6 (slower) | -8 (fastest) | -7 (same as this part) | -7 (same as this part) | -7 (same as this part) |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial | Industrial | Industrial | Commercial (0 to +85 C) | Industrial |
| SERDES Max Rate | 3.2 Gbps | 3.2 Gbps | 3.2 Gbps | 3.2 Gbps | 3.2 Gbps | 3.2 Gbps |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Approx. 1k Price (USD) | $36.50 | lower (cost-down option) | higher (premium speed) | higher (more density) | similar | similar |
Principais diferenciais
- Same-package upgrade path within Lattice ECP3 family (vs LFE3-35EA-6FTN256I)
- Lower price vs higher-density ECP3 option (vs LFE3-70EA-7FTN256I)
- Industrial vs commercial temperature grade option (vs LFE3-35EA-7FTN256C)
Notas de projeto
The 256-ball FTBGA package uses a 1.0 mm ball pitch on a 17 x 17 mm body, which requires 4-layer or 6-layer PCB stackup with microvias for breakout. Use a continuous ground plane on the layer directly beneath the BGA, and follow Lattice's recommended land pattern with NSMD (non-solder mask defined) pads for best assembly yield. Decoupling: place 0.1 uF X7R ceramic bypass capacitors on every VCC and VCCAUX pin within 2-3 mm, and add 10 uF bulk caps near the package perimeter. SERDES power pins require an additional pi-filter (ferrite bead + capacitor) to isolate from noisy digital rails.
For 3.2 Gbps SERDES channels, follow 100-ohm differential routing with intra-pair skew under 1 ps and length matching to within 5 mil across the entire channel. Use AC-coupling capacitors (0.1 uF X7R 0402) on each differential pair as close to the receiver pins as possible. Reference the LatticeECP3 SERDES user guide (UG62) for pre-emphasis, de-emphasis, and equalization settings. Estimated: at 3.2 Gbps a 1 ps intra-pair skew corresponds to approximately 320 mV of eye asymmetry on a typical PRBS-7 pattern, so controlled-impedance routing is essential.
The 1.2 V core supply must be sequenced after the 2.5 V VCCAUX supply to prevent latch-up at power-up. Use a power-supply sequencer IC or a simple RC delay on the PG (power-good) input. Estimated: a typical video-bridge design running at 100 MHz fabric clock and 1 lane of 3.2 Gbps SERDES consumes approximately 0.8-1.2 W from the 1.2 V rail. Choose an LDO or DC-DC converter rated for at least 1.5 A continuous current to maintain regulation during SERDES bursts.
Do not use the LFE3-35EA-7FTN256I as a drop-in replacement for non-Lattice FPGAs (such as Xilinx Spartan-6 or Altera Cyclone IV) because the BGA ball map, configuration mode, and bitstream format are completely different. The SRAM-based configuration means the device needs an external SPI flash; design the flash footprint and programming interface (JTAG or Slave SPI) into the PCB. Common mistake: leaving JTAG TDI/TDO/TMS/TCK unconnected - the device will fail to configure if JTAG is not properly terminated to VCCIO via 4.7 kohm pull-ups.
Informações de conformidade
RoHS compliant and lead-free per Lattice product page and distributor listings. Not AEC-Q100 qualified; the I-suffix is industrial temperature grade, not automotive-qualified. For AEC-Q100 work, contact Lattice about Q-grade variants.
