M1AFS250-2PQ208I - Fusion FPGA 250K Gates 93 I/O | Microchip
N.º da peça: M1AFS250-2PQ208I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $62.5 | $62,50 |
| 10 | $58.9 | $589,00 |
| 100 | $54.2 | $5.420,00 |
| 500 | $49.8 | $24.900,00 |
| 1.000 | $45.6 | $45.600,00 |
M1AFS250-2PQ208I Visão geral
A field programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks and programmable interconnects that the designer wires together to implement custom digital hardware. Unlike SRAM-based FPGAs, the Fusion family is flash-based, meaning configuration data is stored in on-chip flash memory and loaded instantly at power-up with no external configuration device required. Within the power-management hierarchy of a system, the Fusion family is unusual because it integrates configurable analog circuitry alongside digital logic.
The M1AFS250-2PQ208I is a member of the Actel/Microsemi Fusion family, which monolithically integrates flash-based programmable logic, large flash memory blocks, comprehensive clock generation and management circuitry, and configurable analog blocks such as voltage/temperature monitoring, current monitoring, and an RTC. This mixed-signal integration reduces external component count in space- and power-sensitive systems.
Key characteristics include 250K gates of flash-based programmable logic, 36,864 bits of distributed RAM, 93 user-programmable I/O, industrial temperature range operation (-40C to +85C per the I suffix), and a 1.5V core supply with a 1.425V to 1.575V operating range. The speed grade 2 rating and 130nm flash technology provide deterministic, single-chip configuration with high security and low static power.
Typical applications include industrial automation and motor control, power-supply supervision and system health monitoring, aviation and defense subsystems, and embedded control requiring secure, instant-on programmable logic.
Design consideration: because this is a 208-pin PQFP surface-mount device, plan PCB land patterns and thermal relief carefully, and verify flash endurance limits against your reconfiguration rate.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para M1AFS250-2PQ208I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com M1AFS250-2PQ208I (mesmo formato e footprint) — diferindo em Package, Configuration Memory, RoHS Status, Core Supply Voltage, Clock Management.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
M1AFS250-2PQG208I
✅ Drop-In✓ Em estoque
$49.8 / unidade
Ver ficha técnica →M1AFS250-PQ208I
✅ Drop-In✓ Em estoque
$45.8 / unidade
Ver ficha técnica →M1AFS250-PQ208
✅ Drop-In✓ Em estoque
$28.6 / unidade
Ver ficha técnica →M1AFS250-2PQ208I Classificações máximas e características elétricas
| Family | Fusion (M1AFS) |
| Logic Gates | 250000 gates |
| RAM Bits | 36864 bits |
| User I/O | 93 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Technology | 130 nm flash-based |
| Speed Grade | 2 |
| Encapsulamento | 208-BFQFP (PQFP-208) |
| Tipo de montagem | Surface Mount |
| Configuration Memory | On-chip flash (single-chip, instant-on) |
| Integrated Analog | Yes (configurable analog blocks) |
| Temperatura de operação | -40C to +85C (industrial, I suffix) |
| Max Frequency Rating | 1470.59 MHz (device rating per distributor listing) |
| Terminal Form | Flat (QFF gull-wing) |
| Terminal Count | 208 |
| Status RoHS | RoHS Non-Compliant (contains lead) |
| Lead Free Status | Contains Lead |
Guia de Configuração de Pinos do M1AFS250-2PQ208I 208-bfqfp (pqfp-208)
Configuração de pinos para M1AFS250-2PQ208I (pacote 208-bfqfp (pqfp-208)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para M1AFS250-2PQ208I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
M1AFS250-2PQ208I é adequado para 6 aplicaçãos: Industrial Automation and Motor Control, Power Supply Supervision and System Health Monitoring, Aviation and Defense Subsystems, Embedded Control with Secure Instant-On Logic, Test and Measurement Instrumentation, Telecom and Networking Line-Card Control.
Industrial Automation and Motor Control
In factory automation and motor-drive systems, the M1AFS250-2PQ208I serves as a single-chip integration point for sequencing logic, PWM generation, and supervisory monitoring. Its 250K flash-based gates implement deterministic control state machines while the Fusion family's on-chip analog blocks monitor bus voltage, motor current, and heatsink temperature without external ADCs, reducing BOM count and board area in dense drive enclosures. Flash configuration gives instant-on behavior at power-up, so safety interlock logic is active before a microcontroller finishes booting. The 93 user I/Os in the 208-PQFP interface directly to gate drivers, encoders, and fieldbus transceivers. The industrial -40C to +85C rating of the I-grade part matches unconditioned cabinet environments, though the leaded finish may restrict use in RoHS-regulated consumer-adjacent products.
Recomendado
Power Supply Supervision and System Health Monitoring
The Fusion family's defining feature is monolithic configurable analog: voltage monitors, current monitors, temperature sensors, and a real-time clock sit alongside the programmable fabric. In multi-rail backplanes and telecom power trees, the M1AFS250-2PQ208I continuously supervises rails with programmable thresholds and logs events using the on-chip RTC, then asserts reset or shutdown through its fabric logic - a function that traditionally requires a microcontroller plus external ADCs and supervisors. The 1.5V core with 1.425V to 1.575V tolerance keeps overall power low, and the flash-based fabric holds its monitoring configuration through brownouts and reboots. Place the 208-PQFP on the controlled-impedance analog section of the board and route monitored signals with appropriate scaling networks per the Fusion datasheet analog block guidelines.
Recomendado
Aviation and Defense Subsystems
Flash-based FPGAs are widely deployed in avionics and defense hardware because configuration is stored on-chip in nonvolatile flash, eliminating the external configuration PROM that is a common failure point and data-security exposure. The M1AFS250-2PQ208I provides 250K gates for interface bridging (e.g., legacy bus protocol glue logic, sensor aggregation), instant-on operation required for fast power-up sequencing in flight-critical equipment, and single-chip supply-chain security. The industrial -40C to +85C I-grade covers many unpressurized and external-mount environments. Defense procurement frequently accepts the leaded variant under RoHS exemptions, which is why this non-G SKU remains in demand; legacy-stock sourcing through distributors such as Micro-Semiconductor.com reported 5,244 pieces in stock as of the last verification.
Recomendado
Embedded Control with Secure Instant-On Logic
For embedded controllers that must be operational within milliseconds of power application - access control, metering heads, sensor front ends - the M1AFS250-2PQ208I's flash fabric removes boot-delay and configuration-glitch concerns inherent to SRAM FPGAs. The fabric implements the deterministic control core while the integrated Fusion analog channels digitize board-level voltage and temperature for self-diagnostics, and 36,864 bits of RAM buffer measurement data. Flash cells also provide a higher degree of design IP protection than SRAM bitstreams, since configuration is not exposed on a external bus during boot. The 93 I/O pins support common low-voltage logic standards at 3.3V-per-bank designs. This makes the device a strong fit for low-volume industrial products where a custom ASIC is uneconomical.
Recomendado
Test and Measurement Instrumentation
Bench and rack instruments benefit from the M1AFS250-2PQ208I as flexible glue logic between acquisition front ends and processors: trigger engines, timing generators, counter/timer arrays, and bus interfaces fit comfortably within 250K gates, while the fabric's deterministic timing suits precision trigger distribution. The Fusion analog subsystem can monitor the instrument's own internal supply rails and temperature, enabling self-test routines mandated by calibration procedures. The 208-PQFP's gull-wing leads simplify rework in prototype and low-volume production compared with area-array packages, an advantage for instrument makers building in small batches. The speed grade 2 rating gives timing margin for state machines clocked from the on-chip CCC (clock conditioning circuit) PLLs, so external clock-management chips are often unnecessary.
Recomendado
Telecom and Networking Line-Card Control
On telecom line cards, the M1AFS250-2PQ208I commonly implements board-management functions: power sequencing of high-current rails, hot-swap supervision, LED/alarms, and low-speed serial housekeeping links to the shelf manager. The Fusion analog monitors feed measured rail voltages and board temperature to the fabric, which formats them for the management bus - replacing a discrete supervisor-plus-ADC cluster. Flash configuration ensures the board-management state machine is alive as soon as -48V-derived power appears, which is essential for orderly insertion and removal under live backplanes. The industrial temperature grade suits outdoor plant equipment, and the 208-PQFP can be hand-reworked in the field. Designers should provision JTAG access per Microchip programming guidelines for in-system firmware updates.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para M1AFS250-2PQ208I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | M1AFS250-2PQG208I | M1AFS250-PQ208I | M1AFS250-PQ208 |
|---|---|---|---|---|
| Package | 208-BFQFP (PQFP) | 208-PQFP - same footprint | 208-PQFP - same footprint | 208-PQFP - same footprint |
| Brand | Microsemi (Microchip Technology) | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) |
| Logic Gates | 250000 | 250000 | 250000 | 250000 |
| RAM Bits | 36864 | 36864 | 36864 | 36864 |
| User I/O | 93 | 93 | 93 | 93 |
| Speed Grade | 2 | 2 | Standard | Standard |
| Core Supply Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V (1.425 V - 1.575 V) | 1.5 V (1.425 V - 1.575 V) | 1.5 V (1.425 V - 1.575 V) |
| Temperature Range | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | Commercial (no I suffix) |
| RoHS / Lead Finish | RoHS Non-Compliant (contains lead) | RoHS compliant, lead-free (G) | Contains lead | Contains lead |
| Integrated Analog Blocks | Yes (Fusion mixed-signal) | Yes | Yes | Yes |
Principais diferenciais
- Monolithic mixed-signal integration (vs A3PE600-1PQG208I (ProASIC3))
- Instant-on flash configuration (vs SRAM FPGAs (Xilinx/Intel equivalents))
- Lead-free compliance option on same die (vs M1AFS250-2PQG208I vs this leaded part)
Notas de projeto
Supply the 1.5V core from a regulator with output accuracy inside the 1.425V to 1.575V window; Fusion devices on a 130nm process have tight core tolerances, and out-of-window operation degrades timing or causes configuration failures. Decouple each core and I/O bank supply with bulk capacitance plus 0.1uF ceramics at every power pin pair. I/O bank voltages are set independently, so group banks by voltage domain early in pin planning. Estimated: a 250K-gate fabric at typical utilization draws static flash-based current in the low-milliamp range, but confirm exact figures from the manufacturer datasheet power calculator (SmartPower) rather than treating this as a datasheet spec.
The 208-pin PQFP (0.5mm-pitch-class gull-wing package) requires a land pattern matching the manufacturer's package outline drawing; do not scale generic QFP footprints. Add thermal relief vias under the center of the package where board space permits, and keep the analog block inputs on the Fusion die routed as short, quiet traces away from switching regulators - these pins feed the on-chip monitoring ADCs. Maintain a solid, unbroken ground plane beneath the device. For JTAG programming, include the standard Actel/Microchip header footprint even in production to allow flash reprogramming in the field.
Three frequent mistakes with this SKU: (1) ordering the leaded M1AFS250-2PQ208I for a RoHS-regulated product instead of the pin-identical M1AFS250-2PQG208I; (2) assuming cross-family pin compatibility with ProASIC3 PQG208 parts - the Fusion analog pins are repurposed on ProASIC3, so footprints are NOT interchangeable; (3) confusing speed grades, since M1AFS250-PQ208 (no '2') will not meet -2 timing closure. Always verify the full ordering code against the schematic BOM and re-run timing analysis after any die-speed substitution.
Informações de conformidade
Per digichip datasheet summary: Lead Free Status 'Contains Lead', RoHS Status 'RoHS Non-Compliant'. The M1AFS250-2PQG208I is the lead-free/RoHS-compliant variant of the same die. AEC-Q100 qualification is not stated in the provided data.