A3PE600-1PQG208I - 600K-Gate ProASIC3E Flash FPGA | Microsemi
MPN: A3PE600-1PQG208I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.8 | $5,580.00 |
| 500 | $49.9 | $24,950.00 |
| 1,000 | $44.6 | $44,600.00 |
Drop-in alternatives for A3PE600-1PQG208I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE600-2PQG208I
✅ Drop-In✓ In Stock
$45.2 / Unit
View Datasheet →A3PE600-1PQG208
✅ Drop-In✓ In Stock
$32.1 / Unit
View Datasheet →A3PE600-1PQ208
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE1500-1PQG208I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$29.4 / Unit
View Datasheet →A3P600-1PQG208I
✅ Drop-In✓ In Stock
$68 / Unit
View Datasheet →A3P600-PQG208I
✅ Drop-In✓ In Stock
$68.08 / Unit
View Datasheet →A3PE600-1PQG208I Maximum Ratings & Electrical Characteristics
| Manufacturer | Microsemi Corporation (Microchip Technology) |
| Family | ProASIC3E |
| Number of Gates | 600000 |
| Total RAM Bits | 110592 |
| Number of User I/O | 147 |
| Maximum System Frequency | 272 MHz |
| Supply Voltage | 1.425 V to 1.575 V |
| Core Voltage (Nominal) | 1.5 V |
| Process Technology | 130 nm flash |
| Package | 208-BFQFP / 208-PQFP (28x28 mm) |
| Speed Grade | -1 |
| Operating Temperature | -40C to +100C (TJ) |
| Temperature Grade Suffix | I (Industrial) |
| Configuration Memory | On-chip flash (non-volatile, single-chip) |
| Mounting Style | Surface Mount |
| Programming Support | Reprogrammable, in-system |
A3PE600-1PQG208I 208-bfqfp / 208-pqfp (28x28 mm) Pin Configuration Guide
Complete pinout information for A3PE600-1PQG208I (208-bfqfp / 208-pqfp (28x28 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-1PQG208I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-1PQG208I is suitable for 6 applications: Industrial Control and Automation, Networking and Communications Line Cards, Avionics and Secure Systems, ASIC Replacement and Prototyping, Test and Measurement Instrumentation, Computing and Embedded Board Legacy Redesign.
Industrial Control and Automation
The A3PE600-1PQG208I fits industrial control boards that need flexible glue logic, motor sequencing, and protocol bridging in one flash device. Its 600K gates and 147 user I/O absorb multiple legacy PLDs, while 110,592 RAM bits implement FIFOs between fieldbus interfaces and the backplane. The industrial -40C to +100C TJ rating covers cabinet environments, and instant-on flash configuration means I/O is deterministic at power-up, which matters for interlocks and safety-adjacent sequencing. Compared with SRAM FPGAs, no external configuration device is needed on the PCB, reducing BOM cost and a failure point. The 1.5V core (1.425V-1.575V) keeps dynamic power moderate at the 272 MHz performance ceiling.
Recommended
Networking and Communications Line Cards
In networking and communications equipment, the A3PE600-1PQG208I bridges and formats data between PHYs, framers, and backplane interfaces. The ProASIC3E family datasheet explicitly names networking/communications as a target market. Its 272 MHz system performance in the -1 speed grade covers 8-bit/10-bit parallel paths at OC-3-class and Gigabit-adjacent data rates, while the 110,592-bit embedded RAM implements packet FIFOs and small buffer pools. The 147 user I/O in the 208-PQFP support mixed-voltage I/O banks, allowing 3.3V, 2.5V, and 1.8V interfaces on one device. Flash configuration removes the boot-time gap that SRAM FPGAs impose on hot-swap line cards, and the single-chip solution reduces configuration-memory reliability concerns.
Recommended
Avionics and Secure Systems
The A3PE600-1PQG208I suits avionics and security-critical platforms because its on-chip flash configuration is non-volatile and inherently more tamper-resistant than external SRAM configuration images. Microchip/Microsemi targets the ProASIC3E family at avionics markets in the official datasheet. The -40C to +100C TJ industrial rating covers most cockpit and equipment-bay ambient ranges, and instant-on behavior lets the FPGA participate in power-on self-test from the first clock cycle. The 600K-gate fabric implements sensor interface, ARINC-style bus bridging, and built-in-test logic, while 147 I/O handle discrete and serial signals. Designers should still perform program-specific qualification and review SEU mitigation guidance in the manufacturer reliability documentation.
Recommended
ASIC Replacement and Prototyping
Microchip positions ProASIC3E as a cost-effective ASIC replacement, and the A3PE600-1PQG208I is the mid-density entry point for that use case. A 600K-gate fabric absorbs typical gate-array netlists, and 110,592 RAM bits replace small SRAM macro instances. Flash reprogrammability lets teams iterate RTL without new mask charges, cutting NRE to effectively zero at prototype volumes. The 208-PQFP (28x28 mm) package is hand-solderable and socketable for bench bring-up, unlike fine-pitch BGA ASIC packages, and its 147 I/O support legacy 5V-tolerant-style mixed banks common in ASIC replacement contexts. Low total cost of ownership comes from eliminating the external configuration device used by SRAM FPGAs.
Recommended
Test and Measurement Instrumentation
Bench and rack instruments benefit from the A3PE600-1PQG208I as timing, sequencing, and interface glue logic. The -1 speed grade supports state-machine and trigger logic at up to 272 MHz, adequate for counter/timer front ends and pattern generators at moderate rates, while embedded RAM (110,592 bits) buffers captured data between the acquisition fabric and a host interface. Instant-on flash configuration is valuable in instruments that must be ready within milliseconds of power application, and the industrial temperature rating suits uncooled rack environments. The 208-PQFP footprint simplifies rework during instrument development, and 147 I/O drive front-panel discretes, relays, and serial buses from one device.
Recommended
Computing and Embedded Board Legacy Redesign
When refreshing legacy computing boards that used discontinued PLDs or ASICs, the A3PE600-1PQG208I consolidates address decoding, bus interfaces, and housekeeping logic into one reprogrammable flash FPGA. The family datasheet lists computing among its target markets. Its 1.425V-1.575V core supply integrates with modern 1.5V rails common on embedded boards, while I/O banks tolerate legacy 3.3V and 2.5V signals from peripherals. The 208-PQFP, at 28x28 mm with 0.5 mm-class lead pitch, drops onto revised PCBs without BGA assembly capability, supporting low-volume motherboard and backplane builds. In-field firmware-like updates are possible because the flash fabric is reprogrammable in system via JTAG.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-1PQG208I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-2PQG208I | A3PE600-1PQG208 | A3PE1500-1PQG208I | A3P600-1PQG208I | A3P600-PQG208I |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP / 208-PQFP (28x28 mm) | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microsemi (Microchip Technology) | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| Gate Density | 600000 | 600000 | 600000 | 1500000 | 600000 | 600000 |
| Total RAM Bits | 110592 | 110592 | 110592 | 294912 | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O | 147 | 147 | 147 | 196 | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -1 | -2 (faster) | -1 | -1 | -1 | base |
| Temperature Range | -40C to +100C (TJ), Industrial | Industrial (I suffix) | Commercial | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) |
| Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
Key Differentiators
- Single-chip non-volatile flash configuration (vs XC7VX690T (Xilinx))
- Faster speed-grade drop-in option exists (vs A3PE600-2PQG208I)
- Pin-compatible capacity scaling (vs A3PE1500-1PQG208I)
Design Notes
Power the core from a 1.5V rail held within 1.425V-1.575V (roughly +/-5%). A 130nm flash FPGA draws both static and dynamic core current; size the regulator using Libero SoC power estimation for your netlist, and budget extra margin for inrush during flash read at power-up. ProASIC3E is single-chip, so unlike SRAM FPGAs there is no second power-rail sequencing dependency for a configuration device, but I/O bank rails should still come up before or with the core per the manufacturer power-up guidelines.
The 208-PQFP is a perimeter-pin package: route high-speed or many-transition signals on layers adjacent to the top layer to minimize stubs, and dedicate at least one solid ground plane under the die. Provide a thermal relief via array under the center of the package (estimates: a 28x28 mm PQFP over a 4x4 via field measurably lowers die-side temperature versus a bare pad). Decouple each VCC pin with 0.1uF plus bulk 10uF per rail; with 208 pins, distribute capacitor groups around the perimeter rather than clustering them.
Do not assume cross-brand interchangeability: the Xilinx XC7VX690T mentioned in some directories as an 'alternative' is not pin compatible. When substituting, only the same-footprint Microsemi parts listed here are drop-in. Also confirm the exact ordering-code attributes: the 'I' suffix and 'G' (green) modifier matter for temperature and RoHS-bound builds, and the -1 speed grade caps timing at up to 272 MHz, so check static timing in Libero SoC before locking the design.
With 147 user I/O in a 0.5 mm-pitch PQFP, group fast-switching outputs on opposite package sides from sensitive inputs, assign series termination (typically 22-33 ohm estimates, verify per IBIS) on lines longer than a few inches, and reference I/O bank assignments to the fixed PQFP pinout early in Libero SoC. Mixed-voltage banking in a fixed-pinout package is the most common source of late-stage pin rework on ProASIC3E designs.
Compliance Information
The 'G' in PQG208 typically denotes Microsemi's green/RoHS package variant, but explicit compliance declarations were not present in the provided data; verify on the official Microchip product compliance page.
