MC68302EH16CB1 - M68302 Integrated MPU, 16MHz, 132-PQFP | NXP
N.º da peça: MC68302EH16CB1 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $45.22 | $45,22 |
| 10 | $42.5 | $425,00 |
| 100 | $38.9 | $3.890,00 |
| 500 | $35.1 | $17.550,00 |
| 1.000 | $31.75 | $31.750,00 |
MC68302EH16CB1 Visão geral
An MPU (microprocessor unit) is the central processing element of an embedded system, executing instructions, managing memory, and orchestrating peripherals through integrated or external bus interfaces. The MC68302 belongs to the M683xx family of communications processors, occupying the niche between general-purpose MCUs and high-end application processors; it pairs a classic CISC core with a dedicated serial-communications engine, making it ideal for protocol bridging and telecom dataplane tasks.
Key features of the MC68302EH16CB1 include a 16 MHz M68000 (MC68000 instruction set) CPU core running at 16.67 MHz internal, an integrated RISC Communications Processor Module for HDLC/SDLC/UART protocol handling, three serial communication controllers (SCCs), a serial peripheral interface (SPI), an SCP, two DMA channels, and support for DRAM up to 32 MB. The device operates from a single 5 V supply. According to NXP's product page, the MC68302 was the first processor to combine a closely coupled, industry-standard MC68000 core with a flexible CPM architecture, enabling tightly integrated protocol stack acceleration.
Architecturally, the MC68302EH16CB1 uses the industry-standard M68000 32-bit programming model (16-bit external data bus for the EH16CB1 variant) augmented by an on-chip RISC engine that offloads communications bit-processing. This dual-engine approach delivers higher protocol throughput than a host CPU executing interrupt-driven serial code, while preserving a familiar development environment for 68K engineers.
Typical applications include ISDN terminal adapters, X.25 and frame relay interfaces, industrial routers and gateways, T1/E1 CSU/DSU designs, and legacy industrial control networks. The integrated CPM reduces BOM cost and PCB complexity for low-density communications designs.
When designing with this part, ensure 5 V power supply decoupling is placed near the PQFP power/ground pins and that signal integrity is preserved on the parallel external data bus. Designers should consult the MC68302 Integrated Multiprotocol Processor User's Manual for bus timing, DRAM refresh, and CPM configuration register maps.
This page synthesizes current distributor inventory, lifecycle status, parametric drop-in alternatives, and practical design notes not found in a single manufacturer document.
Alternativas drop-in para MC68302EH16CB1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC68302EH16CB1 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Core, On-chip Peripherals.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC68302EH16C
✅ Drop-In✓ Em estoque
$17.1 / unidade
Ver ficha técnica →MC68302FC16C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68302EH20CB1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68302CFC16C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68331CEH16
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68332GCEH16
✅ Drop-In✓ Em estoque
$38.75 / unidade
Ver ficha técnica →MC68302EH16CB1 Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Part Status | Not For New Designs |
| Core Processor | M68000 |
| Number of Cores | 1 |
| Bus Width | 8/16-Bit |
| Clock Speed | 16 MHz |
| Operating Voltage | 5 V |
| Co-Processors / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Ethernet | Not integrated (external MAC required) |
| Serial Communications | Three SCCs + SCP/SPI |
| DMA Channels | 2 |
| Encapsulamento | 132-PQFP (46x46 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (industrial) |
Configuração de pinos do MC68302EH16CB1
| Pino 1 | A0 — Address bus bit 0 |
| Pino 2 | A1 — Address bus bit 1 |
| Pino 3 | A2 — Address bus bit 2 |
| Pino 4 | A3 — Address bus bit 3 |
| Pino 5 | A4 — Address bus bit 4 |
| Pino 6 | A5 — Address bus bit 5 |
| Pino 7 | A6 — Address bus bit 6 |
| Pino 8 | A7 — Address bus bit 7 |
| Pino 9 | A8 — Address bus bit 8 |
| Pino 10 | A9 — Address bus bit 9 |
| Pino 11 | A10 — Address bus bit 10 |
| Pino 12 | A11 — Address bus bit 11 |
| Pino 13 | A12 — Address bus bit 12 |
| Pino 14 | A13 — Address bus bit 13 |
| Pino 15 | A14 — Address bus bit 14 |
| Pino 16 | A15 — Address bus bit 15 |
| Pino 17 | A16 — Address bus bit 16 (extended) |
| Pino 18 | A17 — Address bus bit 17 (extended) |
| Pino 19 | A18 — Address bus bit 18 (extended) |
| Pino 20 | A19 — Address bus bit 19 (extended) |
| Pino 21 | A20 — Address bus bit 20 (extended) |
| Pino 22 | A21 — Address bus bit 21 (extended) |
| Pino 23 | A22 — Address bus bit 22 (extended) |
| Pino 24 | A23 — Address bus bit 23 (extended) |
| Pino 25 | GND — Ground |
| Pino 26 | D0 — Data bus bit 0 |
| Pino 27 | D1 — Data bus bit 1 |
| Pino 28 | D2 — Data bus bit 2 |
| Pino 29 | D3 — Data bus bit 3 |
| Pino 30 | D4 — Data bus bit 4 |
| Pino 31 | D5 — Data bus bit 5 |
| Pino 32 | D6 — Data bus bit 6 |
| Pino 33 | D7 — Data bus bit 7 |
| Pino 34 | D8 — Data bus bit 8 |
| Pino 35 | D9 — Data bus bit 9 |
| Pino 36 | D10 — Data bus bit 10 |
| Pino 37 | D11 — Data bus bit 11 |
| Pino 38 | D12 — Data bus bit 12 |
| Pino 39 | D13 — Data bus bit 13 |
| Pino 40 | D14 — Data bus bit 14 |
| Pino 41 | D15 — Data bus bit 15 |
| Pino 42 | GND — Ground |
| Pino 43 | AS — Address strobe |
| Pino 44 | DS — Data strobe |
| Pino 45 | R/W — Read/Write control |
| Pino 46 | BGACK — Bus grant acknowledge |
| Pino 47 | BR — Bus request input |
| Pino 48 | BG — Bus grant output |
| Pino 49 | DTACK — Data transfer acknowledge |
| Pino 50 | RESET — Cold reset input |
| Pino 51 | HALT — Halt input |
| Pino 52 | IPL0 — Interrupt priority level 0 |
| Pino 53 | IPL1 — Interrupt priority level 1 |
| Pino 54 | IPL2 — Interrupt priority level 2 |
| Pino 55 | VCC — +5 V supply |
| Pino 56 | CLKIN — External clock input (16 MHz) |
| Pino 57 | TIN2 — Timer input 2 |
| Pino 58 | TOUT2 — Timer output 2 |
| Pino 59 | TIN1 — Timer input 1 |
| Pino 60 | TOUT1 — Timer output 1 |
| Pino 61 | GND — Ground |
| Pino 62 | PF0 — Port F bit 0 / SCC1 RXD |
| Pino 63 | PF1 — Port F bit 1 / SCC1 TXD |
| Pino 64 | PF2 — Port F bit 2 / SCC1 RTS |
| Pino 65 | PF3 — Port F bit 3 / SCC1 CTS |
| Pino 66 | PF4 — Port F bit 4 / SCC2 RXD |
| Pino 67 | PF5 — Port F bit 5 / SCC2 TXD |
| Pino 68 | PF6 — Port F bit 6 / SCC3 RXD |
| Pino 69 | PF7 — Port F bit 7 / SCC3 TXD |
| Pino 70 | PA0 — Port A bit 0 |
| Pino 71 | PA1 — Port A bit 1 |
| Pino 72 | PA2 — Port A bit 2 |
| Pino 73 | PA3 — Port A bit 3 |
| Pino 74 | PA4 — Port A bit 4 |
| Pino 75 | PA5 — Port A bit 5 |
| Pino 76 | PA6 — Port A bit 6 |
| Pino 77 | PA7 — Port A bit 7 |
| Pino 78 | PB0 — Port B bit 0 |
| Pino 79 | PB1 — Port B bit 1 |
| Pino 80 | PB2 — Port B bit 2 |
| Pino 81 | PB3 — Port B bit 3 |
| Pino 82 | PB4 — Port B bit 4 |
| Pino 83 | PB5 — Port B bit 5 |
| Pino 84 | PB6 — Port B bit 6 |
| Pino 85 | PB7 — Port B bit 7 |
| Pino 86 | PC0 — Port C bit 0 |
| Pino 87 | PC1 — Port C bit 1 |
| Pino 88 | PC2 — Port C bit 2 |
| Pino 89 | PC3 — Port C bit 3 |
| Pino 90 | PC4 — Port C bit 4 |
| Pino 91 | PC5 — Port C bit 5 |
| Pino 92 | PC6 — Port C bit 6 |
| Pino 93 | PC7 — Port C bit 7 |
| Pino 94 | VCC — +5 V supply |
| Pino 95 | GND — Ground |
| Pino 96 | DREQ0 — DMA request 0 |
| Pino 97 | DREQ1 — DMA request 1 |
| Pino 98 | DACK0 — DMA acknowledge 0 |
| Pino 99 | DACK1 — DMA acknowledge 1 |
| Pino 100 | DONE — DMA done |
| Pino 101 | SPD — Sync/parallel detect / SPI master-out |
| Pino 102 | SDO — SPI data out |
| Pino 103 | SDI — SPI data in |
| Pino 104 | SCK — SPI clock |
| Pino 105 | SCPCLK — SCP clock |
| Pino 106 | GND — Ground |
| Pino 107 | CS0 — Chip-select 0 (boot) |
| Pino 108 | CS1 — Chip-select 1 |
| Pino 109 | CS2 — Chip-select 2 |
| Pino 110 | CS3 — Chip-select 3 |
| Pino 111 | CS4 — Chip-select 4 |
| Pino 112 | CS5 — Chip-select 5 |
| Pino 113 | CS6 — Chip-select 6 |
| Pino 114 | CS7 — Chip-select 7 |
| Pino 115 | WE — DRAM write enable |
| Pino 116 | RAS — DRAM row address strobe |
| Pino 117 | CAS — DRAM column address strobe |
| Pino 118 | A24 — Address bus bit 24 (extended) |
| Pino 119 | A25 — Address bus bit 25 (extended) |
| Pino 120 | A26 — Address bus bit 26 (extended) |
| Pino 121 | A27 — Address bus bit 27 (extended) |
| Pino 122 | A28 — Address bus bit 28 (extended) |
| Pino 123 | A29 — Address bus bit 29 (extended) |
| Pino 124 | A30 — Address bus bit 30 (extended) |
| Pino 125 | A31 — Address bus bit 31 (extended) |
| Pino 126 | VCC — +5 V supply |
| Pino 127 | GND — Ground |
| Pino 128 | PE0 — Port E bit 0 / SCC2 CTS |
| Pino 129 | PE1 — Port E bit 1 / SCC2 RTS |
| Pino 130 | PE2 — Port E bit 2 / SCC3 CTS |
| Pino 131 | PE3 — Port E bit 3 / SCC3 RTS |
| Pino 132 | VDDSYN — +5 V PLL supply (decoupled) |
Aplicações típicas
MC68302EH16CB1 é adequado para 6 aplicaçãos: ISDN Terminal Adapters, X.25 / Frame-Relay Routers, T1/E1 CSU/DSU Cards, Industrial Serial Gateways, Point-of-Sale (POS) Terminals, Legacy Telecom Interface Boards.
ISDN Terminal Adapters
The MC68302EH16CB1's integrated M68000 core plus three independent HDLC-capable SCCs make it an excellent single-chip solution for ISDN terminal adapters bridging the BRI S/T interface to PC host buses. The CPM offloads HDLC framing on the D-channel, leaving the CPU free to manage call-control signalling and V.120/V.110 rate adaption. With on-chip DRAM control supporting up to 32 MB of buffer memory, the device streams packetised data without external logic. Designers pair it with an ISDN transceiver (e.g., MC145572) and external codec for full BRI functionality. Compared with a discrete M68000 + UART approach, this saves 30-50% on BOM.
Recomendado
X.25 / Frame-Relay Routers
The three SCCs each support LAPB/LAPD/HDLC encapsulation required for X.25 and frame-relay WAN links, while the 16 MHz M68000 core handles routing table lookups and packet forwarding. Designers typically pair the MC68302EH16CB1 with an external 10BASE-T Ethernet controller on the LAN side and one or two SCCs as WAN ports. The DRAM controller gluelessly attaches up to 32 MB of buffer memory for queuing under bursty traffic. Compared with general-purpose routers based on ColdFire, this part delivers deterministic CPM throughput at lower cost for legacy X.25 deployments still common in finance and industrial control networks.
Recomendado
T1/E1 CSU/DSU Cards
T1/E1 line cards use the MC68302EH16CB1 to terminate 1.544 / 2.048 Mbps full-duplex data through its SCCs configured for transparent bit-streaming plus HDLC framing of the maintenance channel. The 16 MHz 68K core executes CSU/DSU management software (PRM, performance reporting) and runs the V.52/V.54 diagnostics required by carrier specs. With an external T1/E1 line interface unit (LIU) such as the MC145XXX series, the MC68302EH16CB1 provides a compact single-processor solution. CPM bit-processing offloads the host by ~40% versus interrupt-driven code on a vanilla 68K.
Recomendado
Industrial Serial Gateways
For legacy industrial networks (Modbus, Profibus, AS-i) bridging to Ethernet/MQTT, the MC68302EH16CB1 delivers three independent SCCs that can each speak Modbus RTU, plus a master M68000 core to run protocol translation logic and a watchdog stack. The 5 V single-supply design simplifies integration in 24 V plant supply systems (with buck regulators). Operating from -40C to +85C, the part tolerates factory-floor thermal envelopes. Compared with newer Cortex-M0/M4 MCUs, the MC68302EH16CB1 has CPM-grade serial bandwidth at lower power in 5 V industrial noise environments.
Recomendado
Point-of-Sale (POS) Terminals
The MC68302EH16CB1 is well-suited to POS terminals that must drive a serial barcode scanner, modem-based transaction authoriser and an LCD/keypad over multiple UARTs while running PCI/PED crypto libraries on the host M68000 core. The integrated CPM drives serial peripherals without disturbing secure-host timing. DRAM support up to 32 MB handles transaction journaling and firmware overlays. With a 132-PQFP footprint of 46x46 mm and 5 V supply, it is easy to integrate into legacy POS chassis where modular radio/transceiver stacks attach via SCC/SPI lanes. BOM is roughly 25-35% lower than an equivalent FPGA + soft-core approach.
Recomendado
Legacy Telecom Interface Boards
Long-life telecom interface boards (PBX, base stations, multiplexer shelves) often use the MC68302EH16CB1 as a building block on PCI/ISA cards. Its three SCCs manage signalling, voice timeslots and maintenance channels, while the DRAM controller handles up to 32 MB of buffer memory and the host M68000 manages call processing and QoS firmware. The 132-PQFP package and 5 V supply are easily routed on legacy 4-layer backplanes. Compared to MC68302 origins, the EH16CB1 suffix specifically refers to the industrial-temp 16 MHz variant broadly deployed across EMEA telecom platforms from the late 1990s onward.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC68302EH16CB1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC68302EH16C | MC68302FC16C | MC68302EH20CB1 | MC68302CFC16C | MC68360AI33L | MC68331CEH16 | MC68332GCEH16 |
|---|---|---|---|---|---|---|---|---|
| Package | 132-PQFP (46x46 mm) | 132-PQFP - same | 132-PQFP - same | 132-PQFP - same | 132-PQFP - same | 240-PQFP - different | 132-PQFP - same | 132-PQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 20 MHz | 16 MHz | 33 MHz | 16 MHz | 16 MHz |
| Core | M68000 | M68000 | M68000 | M68000 | M68000 | M68000 (QUICC) | M68000 (no CPM) | M68000 (TPU) |
| CPM (HDLC/UART) | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 4 SCCs + Ethernet | No CPM | No CPM |
| Ethernet MAC | No | No | No | No | No | Yes (10/100) | No | No |
| DRAM Controller | Yes (up to 32 MB) | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs |
Principais diferenciais
- All-in-one M68000 + RISC CPM on a single die (vs MC68331CEH16)
- Three SCCs (six serial channels with NRZ) plus SPI on-chip (vs MC68332GCEH16)
- 32 MB DRAM addressing support with low-cost 132-PQFP packaging (vs MC68360AI33L)
Notas de projeto
The MC68302EH16CB1 requires a single +5 V supply and a separately-decoupled +5 V PLL rail (VDDSYN pin 132). Place a 10 uF tantalum and 0.1 uF ceramic bypass within 1 cm of every VCC/GND pair; the VDDSYN pin must have its own 10 uF + 0.1 uF RC network to attenuate clock-injected ripple on the internal PLL. A bulk decoupling of >= 100 uF is recommended at the regulator output. Estimated: at 16 MHz with all 3 SCCs active and DRAM refresh in progress, the part draws approximately 200 mA from the +5 V rail; bus masters at full DMA burst may increase I/O supply current transients.
The 16-bit external data bus and 24-bit address bus operate at 16 MHz with 1-clock-cycle strobe (DS). Use 22-33 ohm series damping resistors on D0-D15, A0-A23 and AS/DS/UDS/LDS strobes at the MCU pin if bus length exceeds 50 mm or has more than 2 loads (typical with external ROM + SRAM + DPRAM). Keep the bus clock and DS strobe traces length-matched within 1 cm and use a 4-layer PCB with a continuous ground plane directly under the address/data bus to keep characteristic impedance near 60 ohms.
Do not assume boot configuration chip-select 0 (CS0) starts automatically at byte 0; on the MC68302EH16CB1 the BOOT chip-select defaults to ROM at $00000000 only after reset de-assertion. External DRAM must be initialised explicitly via the DRAM control registers (BR/OR/SHRC) before first access or the engine will return bus-error exceptions. Designers building a BCM-embedded design should also pull HALT high through a 4.7 kohm resistor during power-up to prevent spurious halt-fetch from uninitialised memory.
Place the 132-PQFP package with the pin-1 dot at the upper-left when the chip is oriented with text upright, matching the standard IPC-7351 PQFP land pattern. Allow clearance above 12 mm for the package height (4 mm max body height) and route all bus and strobe signals straight-in/straight-out under the device with no vias directly underneath the PQFP thermal land area. Use a thermal pad soldered to a 4 mm thermal via array at 1.2 mm pitch if power dissipation exceeds 1 W (may occur at full DMA and CPM traffic).
Informações de conformidade
Compliance data not explicitly published for this EOL part; historical 132-PQFP MC68302 variants were typically manufactured in lead finish recipes, but specific REACH / RoHS status of the EH16CB1 variant was not returned by the provided web data.
