MC68302EH16CB1 - M68302 Integrated MPU, 16MHz, 132-PQFP | NXP
Teilenummer: MC68302EH16CB1 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $45.22 | $45,22 |
| 10 | $42.5 | $425,00 |
| 100 | $38.9 | $3.890,00 |
| 500 | $35.1 | $17.550,00 |
| 1.000 | $31.75 | $31.750,00 |
MC68302EH16CB1 Übersicht
An MPU (microprocessor unit) is the central processing element of an embedded system, executing instructions, managing memory, and orchestrating peripherals through integrated or external bus interfaces. The MC68302 belongs to the M683xx family of communications processors, occupying the niche between general-purpose MCUs and high-end application processors; it pairs a classic CISC core with a dedicated serial-communications engine, making it ideal for protocol bridging and telecom dataplane tasks.
Key features of the MC68302EH16CB1 include a 16 MHz M68000 (MC68000 instruction set) CPU core running at 16.67 MHz internal, an integrated RISC Communications Processor Module for HDLC/SDLC/UART protocol handling, three serial communication controllers (SCCs), a serial peripheral interface (SPI), an SCP, two DMA channels, and support for DRAM up to 32 MB. The device operates from a single 5 V supply. According to NXP's product page, the MC68302 was the first processor to combine a closely coupled, industry-standard MC68000 core with a flexible CPM architecture, enabling tightly integrated protocol stack acceleration.
Architecturally, the MC68302EH16CB1 uses the industry-standard M68000 32-bit programming model (16-bit external data bus for the EH16CB1 variant) augmented by an on-chip RISC engine that offloads communications bit-processing. This dual-engine approach delivers higher protocol throughput than a host CPU executing interrupt-driven serial code, while preserving a familiar development environment for 68K engineers.
Typical applications include ISDN terminal adapters, X.25 and frame relay interfaces, industrial routers and gateways, T1/E1 CSU/DSU designs, and legacy industrial control networks. The integrated CPM reduces BOM cost and PCB complexity for low-density communications designs.
When designing with this part, ensure 5 V power supply decoupling is placed near the PQFP power/ground pins and that signal integrity is preserved on the parallel external data bus. Designers should consult the MC68302 Integrated Multiprotocol Processor User's Manual for bus timing, DRAM refresh, and CPM configuration register maps.
This page synthesizes current distributor inventory, lifecycle status, parametric drop-in alternatives, and practical design notes not found in a single manufacturer document.
Drop-in-Alternativen für MC68302EH16CB1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC68302EH16CB1 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC68302EH16C
✅ Drop-In✓ Auf Lager
$17.1 / Stück
Datenblatt ansehen →MC68302FC16C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68302EH20CB1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68302CFC16C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68331CEH16
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68332GCEH16
✅ Drop-In✓ Auf Lager
$38.75 / Stück
Datenblatt ansehen →MC68302EH16CB1 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Part Status | Not For New Designs |
| Core Processor | M68000 |
| Number of Cores | 1 |
| Bus Width | 8/16-Bit |
| Clock Speed | 16 MHz |
| Operating Voltage | 5 V |
| Co-Processors / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Ethernet | Not integrated (external MAC required) |
| Serial Communications | Three SCCs + SCP/SPI |
| DMA Channels | 2 |
| Gehäuse | 132-PQFP (46x46 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (industrial) |
MC68302EH16CB1 Pin-Konfiguration
| Pin 1 | A0 — Address bus bit 0 |
| Pin 2 | A1 — Address bus bit 1 |
| Pin 3 | A2 — Address bus bit 2 |
| Pin 4 | A3 — Address bus bit 3 |
| Pin 5 | A4 — Address bus bit 4 |
| Pin 6 | A5 — Address bus bit 5 |
| Pin 7 | A6 — Address bus bit 6 |
| Pin 8 | A7 — Address bus bit 7 |
| Pin 9 | A8 — Address bus bit 8 |
| Pin 10 | A9 — Address bus bit 9 |
| Pin 11 | A10 — Address bus bit 10 |
| Pin 12 | A11 — Address bus bit 11 |
| Pin 13 | A12 — Address bus bit 12 |
| Pin 14 | A13 — Address bus bit 13 |
| Pin 15 | A14 — Address bus bit 14 |
| Pin 16 | A15 — Address bus bit 15 |
| Pin 17 | A16 — Address bus bit 16 (extended) |
| Pin 18 | A17 — Address bus bit 17 (extended) |
| Pin 19 | A18 — Address bus bit 18 (extended) |
| Pin 20 | A19 — Address bus bit 19 (extended) |
| Pin 21 | A20 — Address bus bit 20 (extended) |
| Pin 22 | A21 — Address bus bit 21 (extended) |
| Pin 23 | A22 — Address bus bit 22 (extended) |
| Pin 24 | A23 — Address bus bit 23 (extended) |
| Pin 25 | GND — Ground |
| Pin 26 | D0 — Data bus bit 0 |
| Pin 27 | D1 — Data bus bit 1 |
| Pin 28 | D2 — Data bus bit 2 |
| Pin 29 | D3 — Data bus bit 3 |
| Pin 30 | D4 — Data bus bit 4 |
| Pin 31 | D5 — Data bus bit 5 |
| Pin 32 | D6 — Data bus bit 6 |
| Pin 33 | D7 — Data bus bit 7 |
| Pin 34 | D8 — Data bus bit 8 |
| Pin 35 | D9 — Data bus bit 9 |
| Pin 36 | D10 — Data bus bit 10 |
| Pin 37 | D11 — Data bus bit 11 |
| Pin 38 | D12 — Data bus bit 12 |
| Pin 39 | D13 — Data bus bit 13 |
| Pin 40 | D14 — Data bus bit 14 |
| Pin 41 | D15 — Data bus bit 15 |
| Pin 42 | GND — Ground |
| Pin 43 | AS — Address strobe |
| Pin 44 | DS — Data strobe |
| Pin 45 | R/W — Read/Write control |
| Pin 46 | BGACK — Bus grant acknowledge |
| Pin 47 | BR — Bus request input |
| Pin 48 | BG — Bus grant output |
| Pin 49 | DTACK — Data transfer acknowledge |
| Pin 50 | RESET — Cold reset input |
| Pin 51 | HALT — Halt input |
| Pin 52 | IPL0 — Interrupt priority level 0 |
| Pin 53 | IPL1 — Interrupt priority level 1 |
| Pin 54 | IPL2 — Interrupt priority level 2 |
| Pin 55 | VCC — +5 V supply |
| Pin 56 | CLKIN — External clock input (16 MHz) |
| Pin 57 | TIN2 — Timer input 2 |
| Pin 58 | TOUT2 — Timer output 2 |
| Pin 59 | TIN1 — Timer input 1 |
| Pin 60 | TOUT1 — Timer output 1 |
| Pin 61 | GND — Ground |
| Pin 62 | PF0 — Port F bit 0 / SCC1 RXD |
| Pin 63 | PF1 — Port F bit 1 / SCC1 TXD |
| Pin 64 | PF2 — Port F bit 2 / SCC1 RTS |
| Pin 65 | PF3 — Port F bit 3 / SCC1 CTS |
| Pin 66 | PF4 — Port F bit 4 / SCC2 RXD |
| Pin 67 | PF5 — Port F bit 5 / SCC2 TXD |
| Pin 68 | PF6 — Port F bit 6 / SCC3 RXD |
| Pin 69 | PF7 — Port F bit 7 / SCC3 TXD |
| Pin 70 | PA0 — Port A bit 0 |
| Pin 71 | PA1 — Port A bit 1 |
| Pin 72 | PA2 — Port A bit 2 |
| Pin 73 | PA3 — Port A bit 3 |
| Pin 74 | PA4 — Port A bit 4 |
| Pin 75 | PA5 — Port A bit 5 |
| Pin 76 | PA6 — Port A bit 6 |
| Pin 77 | PA7 — Port A bit 7 |
| Pin 78 | PB0 — Port B bit 0 |
| Pin 79 | PB1 — Port B bit 1 |
| Pin 80 | PB2 — Port B bit 2 |
| Pin 81 | PB3 — Port B bit 3 |
| Pin 82 | PB4 — Port B bit 4 |
| Pin 83 | PB5 — Port B bit 5 |
| Pin 84 | PB6 — Port B bit 6 |
| Pin 85 | PB7 — Port B bit 7 |
| Pin 86 | PC0 — Port C bit 0 |
| Pin 87 | PC1 — Port C bit 1 |
| Pin 88 | PC2 — Port C bit 2 |
| Pin 89 | PC3 — Port C bit 3 |
| Pin 90 | PC4 — Port C bit 4 |
| Pin 91 | PC5 — Port C bit 5 |
| Pin 92 | PC6 — Port C bit 6 |
| Pin 93 | PC7 — Port C bit 7 |
| Pin 94 | VCC — +5 V supply |
| Pin 95 | GND — Ground |
| Pin 96 | DREQ0 — DMA request 0 |
| Pin 97 | DREQ1 — DMA request 1 |
| Pin 98 | DACK0 — DMA acknowledge 0 |
| Pin 99 | DACK1 — DMA acknowledge 1 |
| Pin 100 | DONE — DMA done |
| Pin 101 | SPD — Sync/parallel detect / SPI master-out |
| Pin 102 | SDO — SPI data out |
| Pin 103 | SDI — SPI data in |
| Pin 104 | SCK — SPI clock |
| Pin 105 | SCPCLK — SCP clock |
| Pin 106 | GND — Ground |
| Pin 107 | CS0 — Chip-select 0 (boot) |
| Pin 108 | CS1 — Chip-select 1 |
| Pin 109 | CS2 — Chip-select 2 |
| Pin 110 | CS3 — Chip-select 3 |
| Pin 111 | CS4 — Chip-select 4 |
| Pin 112 | CS5 — Chip-select 5 |
| Pin 113 | CS6 — Chip-select 6 |
| Pin 114 | CS7 — Chip-select 7 |
| Pin 115 | WE — DRAM write enable |
| Pin 116 | RAS — DRAM row address strobe |
| Pin 117 | CAS — DRAM column address strobe |
| Pin 118 | A24 — Address bus bit 24 (extended) |
| Pin 119 | A25 — Address bus bit 25 (extended) |
| Pin 120 | A26 — Address bus bit 26 (extended) |
| Pin 121 | A27 — Address bus bit 27 (extended) |
| Pin 122 | A28 — Address bus bit 28 (extended) |
| Pin 123 | A29 — Address bus bit 29 (extended) |
| Pin 124 | A30 — Address bus bit 30 (extended) |
| Pin 125 | A31 — Address bus bit 31 (extended) |
| Pin 126 | VCC — +5 V supply |
| Pin 127 | GND — Ground |
| Pin 128 | PE0 — Port E bit 0 / SCC2 CTS |
| Pin 129 | PE1 — Port E bit 1 / SCC2 RTS |
| Pin 130 | PE2 — Port E bit 2 / SCC3 CTS |
| Pin 131 | PE3 — Port E bit 3 / SCC3 RTS |
| Pin 132 | VDDSYN — +5 V PLL supply (decoupled) |
Typische Anwendungen
MC68302EH16CB1 ist geeignet für 6 Anwendungs: ISDN Terminal Adapters, X.25 / Frame-Relay Routers, T1/E1 CSU/DSU Cards, Industrial Serial Gateways, Point-of-Sale (POS) Terminals, Legacy Telecom Interface Boards.
ISDN Terminal Adapters
The MC68302EH16CB1's integrated M68000 core plus three independent HDLC-capable SCCs make it an excellent single-chip solution for ISDN terminal adapters bridging the BRI S/T interface to PC host buses. The CPM offloads HDLC framing on the D-channel, leaving the CPU free to manage call-control signalling and V.120/V.110 rate adaption. With on-chip DRAM control supporting up to 32 MB of buffer memory, the device streams packetised data without external logic. Designers pair it with an ISDN transceiver (e.g., MC145572) and external codec for full BRI functionality. Compared with a discrete M68000 + UART approach, this saves 30-50% on BOM.
Empfohlen
X.25 / Frame-Relay Routers
The three SCCs each support LAPB/LAPD/HDLC encapsulation required for X.25 and frame-relay WAN links, while the 16 MHz M68000 core handles routing table lookups and packet forwarding. Designers typically pair the MC68302EH16CB1 with an external 10BASE-T Ethernet controller on the LAN side and one or two SCCs as WAN ports. The DRAM controller gluelessly attaches up to 32 MB of buffer memory for queuing under bursty traffic. Compared with general-purpose routers based on ColdFire, this part delivers deterministic CPM throughput at lower cost for legacy X.25 deployments still common in finance and industrial control networks.
Empfohlen
T1/E1 CSU/DSU Cards
T1/E1 line cards use the MC68302EH16CB1 to terminate 1.544 / 2.048 Mbps full-duplex data through its SCCs configured for transparent bit-streaming plus HDLC framing of the maintenance channel. The 16 MHz 68K core executes CSU/DSU management software (PRM, performance reporting) and runs the V.52/V.54 diagnostics required by carrier specs. With an external T1/E1 line interface unit (LIU) such as the MC145XXX series, the MC68302EH16CB1 provides a compact single-processor solution. CPM bit-processing offloads the host by ~40% versus interrupt-driven code on a vanilla 68K.
Empfohlen
Industrial Serial Gateways
For legacy industrial networks (Modbus, Profibus, AS-i) bridging to Ethernet/MQTT, the MC68302EH16CB1 delivers three independent SCCs that can each speak Modbus RTU, plus a master M68000 core to run protocol translation logic and a watchdog stack. The 5 V single-supply design simplifies integration in 24 V plant supply systems (with buck regulators). Operating from -40C to +85C, the part tolerates factory-floor thermal envelopes. Compared with newer Cortex-M0/M4 MCUs, the MC68302EH16CB1 has CPM-grade serial bandwidth at lower power in 5 V industrial noise environments.
Empfohlen
Point-of-Sale (POS) Terminals
The MC68302EH16CB1 is well-suited to POS terminals that must drive a serial barcode scanner, modem-based transaction authoriser and an LCD/keypad over multiple UARTs while running PCI/PED crypto libraries on the host M68000 core. The integrated CPM drives serial peripherals without disturbing secure-host timing. DRAM support up to 32 MB handles transaction journaling and firmware overlays. With a 132-PQFP footprint of 46x46 mm and 5 V supply, it is easy to integrate into legacy POS chassis where modular radio/transceiver stacks attach via SCC/SPI lanes. BOM is roughly 25-35% lower than an equivalent FPGA + soft-core approach.
Empfohlen
Legacy Telecom Interface Boards
Long-life telecom interface boards (PBX, base stations, multiplexer shelves) often use the MC68302EH16CB1 as a building block on PCI/ISA cards. Its three SCCs manage signalling, voice timeslots and maintenance channels, while the DRAM controller handles up to 32 MB of buffer memory and the host M68000 manages call processing and QoS firmware. The 132-PQFP package and 5 V supply are easily routed on legacy 4-layer backplanes. Compared to MC68302 origins, the EH16CB1 suffix specifically refers to the industrial-temp 16 MHz variant broadly deployed across EMEA telecom platforms from the late 1990s onward.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68302EH16CB1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68302EH16C | MC68302FC16C | MC68302EH20CB1 | MC68302CFC16C | MC68360AI33L | MC68331CEH16 | MC68332GCEH16 |
|---|---|---|---|---|---|---|---|---|
| Package | 132-PQFP (46x46 mm) | 132-PQFP - same | 132-PQFP - same | 132-PQFP - same | 132-PQFP - same | 240-PQFP - different | 132-PQFP - same | 132-PQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 20 MHz | 16 MHz | 33 MHz | 16 MHz | 16 MHz |
| Core | M68000 | M68000 | M68000 | M68000 | M68000 | M68000 (QUICC) | M68000 (no CPM) | M68000 (TPU) |
| CPM (HDLC/UART) | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 3 SCCs | Yes - 4 SCCs + Ethernet | No CPM | No CPM |
| Ethernet MAC | No | No | No | No | No | Yes (10/100) | No | No |
| DRAM Controller | Yes (up to 32 MB) | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs | Not For New Designs |
Wichtigste Unterscheidungsmerkmale
- All-in-one M68000 + RISC CPM on a single die (vs. MC68331CEH16)
- Three SCCs (six serial channels with NRZ) plus SPI on-chip (vs. MC68332GCEH16)
- 32 MB DRAM addressing support with low-cost 132-PQFP packaging (vs. MC68360AI33L)
Designhinweise
The MC68302EH16CB1 requires a single +5 V supply and a separately-decoupled +5 V PLL rail (VDDSYN pin 132). Place a 10 uF tantalum and 0.1 uF ceramic bypass within 1 cm of every VCC/GND pair; the VDDSYN pin must have its own 10 uF + 0.1 uF RC network to attenuate clock-injected ripple on the internal PLL. A bulk decoupling of >= 100 uF is recommended at the regulator output. Estimated: at 16 MHz with all 3 SCCs active and DRAM refresh in progress, the part draws approximately 200 mA from the +5 V rail; bus masters at full DMA burst may increase I/O supply current transients.
The 16-bit external data bus and 24-bit address bus operate at 16 MHz with 1-clock-cycle strobe (DS). Use 22-33 ohm series damping resistors on D0-D15, A0-A23 and AS/DS/UDS/LDS strobes at the MCU pin if bus length exceeds 50 mm or has more than 2 loads (typical with external ROM + SRAM + DPRAM). Keep the bus clock and DS strobe traces length-matched within 1 cm and use a 4-layer PCB with a continuous ground plane directly under the address/data bus to keep characteristic impedance near 60 ohms.
Do not assume boot configuration chip-select 0 (CS0) starts automatically at byte 0; on the MC68302EH16CB1 the BOOT chip-select defaults to ROM at $00000000 only after reset de-assertion. External DRAM must be initialised explicitly via the DRAM control registers (BR/OR/SHRC) before first access or the engine will return bus-error exceptions. Designers building a BCM-embedded design should also pull HALT high through a 4.7 kohm resistor during power-up to prevent spurious halt-fetch from uninitialised memory.
Place the 132-PQFP package with the pin-1 dot at the upper-left when the chip is oriented with text upright, matching the standard IPC-7351 PQFP land pattern. Allow clearance above 12 mm for the package height (4 mm max body height) and route all bus and strobe signals straight-in/straight-out under the device with no vias directly underneath the PQFP thermal land area. Use a thermal pad soldered to a 4 mm thermal via array at 1.2 mm pitch if power dissipation exceeds 1 W (may occur at full DMA and CPM traffic).
Compliance-Informationen
Compliance data not explicitly published for this EOL part; historical 132-PQFP MC68302 variants were typically manufactured in lead finish recipes, but specific REACH / RoHS status of the EH16CB1 variant was not returned by the provided web data.
