MC9S08AW32VFUE - HCS08 8-bit MCU, 32KB Flash, 40MHz, 64-QFP
N.º da peça: MC9S08AW32VFUE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.8 | $9,80 |
| 10 | $8.85 | $88,50 |
| 100 | $7.95 | $795,00 |
| 500 | $7.1 | $3.550,00 |
| 1.000 | $6.4 | $6.400,00 |
MC9S08AW32VFUE Visão geral
An 8-bit MCU is a programmable computing engine that fetches and executes instructions from on-chip memory; the HCS08 core is a Von Neumann architecture with a 16-bit address space and an enhanced instruction set targeting low-power, deterministic embedded control. Within the broader taxonomy, this part is an MCU -> microcontroller -> embedded processor -> semiconductor device. The S08 family is widely adopted in industrial and automotive subsystems where deterministic real-time response and on-chip analog integration outweigh raw compute throughput.
Key features of the MC9S08AW32VFUE include 32KB of Flash program memory, 2KB of RAM, an internal clock synthesizer supporting bus rates up to 20 MHz, an integrated 10-bit ADC with up to 12 input channels, multiple PWM-capable timers, an SPI module, two SCI (UART) modules, and an I2C module. Operation from 2.7V to 5.5V supply allows direct compatibility with both 3.3V and 5V systems.
The S08 core uses a Harvard-style instruction pipeline and supports background debug mode (BDM) via a single-wire interface, enabling in-circuit programming and non-intrusive debug. The peripheral set includes a real-time counter (RTC), a computer operating properly (COP) watchdog, low-voltage detect (LVD) with reset, and multiple general-purpose I/O ports. The Flash controller supports in-application reprogramming with built-in security for code protection.
Typical applications include industrial control, automotive body and chassis modules, consumer appliances, sensor signal conditioning, and motor control (PWM-driven). The integrated ADC and timers make it suitable for closed-loop temperature, pressure, and flow regulation.
When designing with this MCU, allocate ground and supply decoupling close to every VDD/VSS pair (typically 100 nF + bulk capacitor) and keep the BDM pin accessible for production programming. For automotive deployments, observe NXP's EMC and ESD guidelines for body electronics.
This page synthesizes NXP S08AW family datasheet parameters, distributor pricing, drop-in alternatives within the same family, and PCB-level design notes not consolidated in the manufacturer datasheet alone.
Alternativas drop-in para MC9S08AW32VFUE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08AW32VFUE (mesmo formato e footprint) — diferindo em Package, Core, Debug Interface, I/O Ports, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08AW32CFUE
✅ Drop-In✓ Em estoque
$7.18 / unidade
Ver ficha técnica →MC9S08AW48CFGER
✅ Drop-In✓ Em estoque
$4.05 / unidade
Ver ficha técnica →MC9S08AW60CFUE
✅ Drop-In✓ Em estoque
$8.1029 / unidade
Ver ficha técnica →MC9S08AW60CFGER
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
S9S08AW8AE0MLC
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08AW32VFUE Classificações máximas e características elétricas
| Core | HCS08 (S08 CISC) |
| Largura do barramento de dados | 8-bit |
| Frequência máxima de clock | 40 MHz |
| Program Memory Size | 32 KB Flash |
| RAM Size | 2 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| ADC | 10-bit, up to 12 channels |
| Timers | TPM1, TPM2 (PWM), RTI, PIT |
| Communication Interfaces | 1x SPI, 2x SCI (UART), 1x I2C |
| I/O Pins | 54 general-purpose I/O |
| Encapsulamento | 64-QFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +105 C |
| Debug Interface | Background Debug Mode (BDM) |
| Status RoHS | Compliant |
Configuração de pinos do MC9S08AW32VFUE
| Pino 1 | PTD5/TxD2 — Port D5 / SCI2 transmit (VFUE package pinout per family datasheet) |
| Pino 2 | PTD4/RxD2 — Port D4 / SCI2 receive |
| Pino 3 | PTD3/SS1 — Port D3 / SPI1 slave select |
| Pino 4 | VDD1 — Power supply pin 1 |
| Pino 5 | VSS1 — Ground pin 1 |
| Pino 6 | PTD2/MISO1 — Port D2 / SPI1 MISO |
| Pino 7 | PTD1/MOSI1 — Port D1 / SPI1 MOSI |
| Pino 8 | PTD0/SPSCK1 — Port D0 / SPI1 clock |
| Pino 9 | PTE7/TxD1 — Port E7 / SCI1 transmit |
| Pino 10 | PTE6/RxD1 — Port E6 / SCI1 receive |
| Pino 11 | PTE5 — Port E5 general I/O |
| Pino 12 | PTE4 — Port E4 general I/O |
| Pino 13 | BKGD — Background Debug Mode pin |
| Pino 14 | RESET — External reset, active low |
| Pino 15 | PTG0 — Port G0 general I/O |
| Pino 16 | PTH0 — Port H0 general I/O |
| Pino 17 | VDD2 — Power supply pin 2 |
| Pino 18 | VSS2 — Ground pin 2 |
| Pino 19 | PTF7/ADC7 — Port F7 / ADC channel 7 |
| Pino 20 | PTF6/ADC6 — Port F6 / ADC channel 6 |
| Pino 21 | PTF5/ADC5 — Port F5 / ADC channel 5 |
| Pino 22 | PTF4/ADC4 — Port F4 / ADC channel 4 |
| Pino 23 | PTF3/ADC3 — Port F3 / ADC channel 3 |
| Pino 24 | PTF2/ADC2 — Port F2 / ADC channel 2 |
| Pino 25 | PTF1/ADC1 — Port F1 / ADC channel 1 |
| Pino 26 | PTF0/ADC0 — Port F0 / ADC channel 0 |
| Pino 27 | VREFH — ADC high reference |
| Pino 28 | VREFL — ADC low reference |
| Pino 29 | PTB7/AD15 — Port B7 / ADC channel 15 |
| Pino 30 | PTB6/AD14 — Port B6 / ADC channel 14 |
| Pino 31 | PTB5/AD13 — Port B5 / ADC channel 13 |
| Pino 32 | PTB4/AD12 — Port B4 / ADC channel 12 |
| Pino 33 | PTC3 — Port C3 general I/O |
| Pino 34 | PTC2 — Port C2 general I/O |
| Pino 35 | PTC1 — Port C1 general I/O |
| Pino 36 | PTC0 — Port C0 general I/O |
| Pino 37 | PTA7/TPM2CH3 — Port A7 / TPM2 channel 3 |
| Pino 38 | PTA6/TPM2CH2 — Port A6 / TPM2 channel 2 |
| Pino 39 | PTA5/TPM2CH1 — Port A5 / TPM2 channel 1 |
| Pino 40 | PTA4/TPM2CH0 — Port A4 / TPM2 channel 0 |
| Pino 41 | PTA3/TPM1CH3 — Port A3 / TPM1 channel 3 |
| Pino 42 | PTA2/TPM1CH2 — Port A2 / TPM1 channel 2 |
| Pino 43 | PTA1/TPM1CH1 — Port A1 / TPM1 channel 1 |
| Pino 44 | PTA0/TPM1CH0 — Port A0 / TPM1 channel 0 |
| Pino 45 | PTB3/AD11 — Port B3 / ADC channel 11 |
| Pino 46 | PTB2/AD10 — Port B2 / ADC channel 10 |
| Pino 47 | PTB1/AD9 — Port B1 / ADC channel 9 |
| Pino 48 | PTB0/AD8 — Port B0 / ADC channel 8 |
| Pino 49 | PTG7 — Port G7 general I/O |
| Pino 50 | PTG6 — Port G6 general I/O |
| Pino 51 | PTG5 — Port G5 general I/O |
| Pino 52 | PTG4 — Port G4 general I/O |
| Pino 53 | PTG3 — Port G3 general I/O |
| Pino 54 | PTG2 — Port G2 general I/O |
| Pino 55 | PTG1 — Port G1 general I/O |
| Pino 56 | PTH1 — Port H1 general I/O |
| Pino 57 | PTH2 — Port H2 general I/O |
| Pino 58 | PTH3 — Port H3 general I/O |
| Pino 59 | PTH4 — Port H4 general I/O |
| Pino 60 | PTH5 — Port H5 general I/O |
| Pino 61 | PTH6 — Port H6 general I/O |
| Pino 62 | PTH7 — Port H7 general I/O |
| Pino 63 | VDD3 — Power supply pin 3 |
| Pino 64 | VSS3 — Ground pin 3 |
Aplicações típicas
MC9S08AW32VFUE é adequado para 6 aplicaçãos: Industrial Control Modules, Automotive Body Electronics, Consumer Appliance Control, Sensor Signal Conditioning, Motor Control (PWM-Driven), Battery Charging / Power Management Controllers.
Industrial Control Modules
Why the MC9S08AW32VFUE fits: Industrial modules demand deterministic 8-bit processing, robust peripheral integration, and wide supply tolerance - the S08AW delivers 40 MHz core, 32 KB Flash for control firmware, 2 KB RAM for stack/buffers, and a 10-bit ADC with 12 channels for sensor conditioning across 2.7-5.5 V. How it is used: Typically placed on a 4-layer industrial backplane, paired with a 100 nF decoupling per VDD pin and a 10 uF bulk capacitor. The COP watchdog and LVD reset deliver the supervisory chain required for IEC 61131-3 industrial PLC I/O cards and process controllers.
Recomendado
Automotive Body Electronics
Why the MC9S08AW32VFUE fits: The -40 C to +105 C operating range covers cabin and body-domain ECUs (RKE, BCM, seat controllers, HVAC). The 40 MHz S08 core and dual PWM timers drive small DC motors for mirror/glass adjustment, and the 10-bit ADC reads temperature, current, and switch inputs. How it is used: Usually sits behind a 12 V TVS-protected supply and a CAN/sci bridge, with capacitor-backed LVD reset handling engine cranking transients. The HCS08 peripheral set is well-documented for AEC-regulated automotive subsystems.
Recomendado
Consumer Appliance Control
Why the MC9S08AW32VFUE fits: White goods (washing machines, dishwashers, HVAC thermostats) need reliable keypad/LED drivers, motor PWM, and serial supervisory links - all present on the S08AW. The 32 KB Flash holds the user interface and PI control loops, while the 2 KB SRAM holds timing variables without external memory. How it is used: Often paired with a triac/relay driver board; the MCU's two TPM modules generate zero-cross PWM and the SCI is used for diagnostic/UART connectivity to a service tool during field repair.
Recomendado
Sensor Signal Conditioning
Why the MC9S08AW32VFUE fits: The 10-bit ADC with up to 12 channels lets designers digitize thermistor bridges, pressure sensors, and analog encoder signals directly; the S08 core supports linearization and digital filtering in firmware. 32 KB Flash provides ample memory for lookup tables. How it is used: Placed adjacent to a low-noise LDO and an instrumentation preamp, the MCU issues periodic ADC reads, applies compensation, and outputs the cleaned value over SPI or UART to a host PLC.
Recomendado
Motor Control (PWM-Driven)
Why the MC9S08AW32VFUE fits: Two TPM channels deliver complementary or center-aligned PWM to drive brushed DC, stepper, or small BLDC motors; the 40 MHz core leaves headroom for space-vector modulation or trapezoidal commutation. Current sensing via the 10-bit ADC closes the torque loop. How it is used: Typically inserted between a half-bridge driver (such as MC33931) and the H-bridge stage. Speed command received via UART or potentiometer input, with firmware filtering on the ADC line.
Recomendado
Battery Charging / Power Management Controllers
Why the MC9S08AW32VFUE fits: Smart charging subsystems (e-bike BMS, telecom backup float chargers) require accurate ADC sampling and deterministic PWM - the S08AW integrates both with the COP watchdog supervising the charging state machine. 32 KB Flash holds multi-stage charge profiles. How it is used: Placed across the shunt resistor of the battery stack, with a Hall-effect current sensor for total current. The SCI reports telemetry to a fuel-gauge host. The wide 2.7-5.5 V supply allows direct operation from battery-pack tap points.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08AW32VFUE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08AW32CFUE | MC9S08AW48CFGER | MC9S08AW60CFUE | MC9S08AW60CFGER | S9S08AW8AE0MLC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-QFP (14x14 mm) | 64-LQFP (14x14 mm) | 64-LQFP (14x14 mm) | 64-LQFP (14x14 mm) | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | S08 8-bit |
| Clock Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 20 MHz |
| Flash Memory | 32 KB | 32 KB | 48 KB | 60 KB | 60 KB | 8 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Operating Temperature | -40 C to +105 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C |
| Lifecycle Status | NRND | Active | Active | Active | Active | NRND |
Principais diferenciais
- Highest Flash density in NXP's S08AW fielded line (vs S9S08AW8AE0MLC)
- Wider operating temperature for automotive body ECUs (vs MC9S08AW32CFUE)
- Drop-in upgrade path to 60 KB Flash on same family (vs MC9S08AW60CFUE)
Notas de projeto
Estimated: The S08AW has three VDD/VSS pairs (Vpp=5V). Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD/VSS pair, plus a single 10 uF bulk capacitor on the board. Decoupling path inductance matters more than absolute capacitance above 40 MHz core speed. For 5V operation NXP recommends a linear regulator with <50 mV ripple; switching regulators require a Pi-filter (LC) to prevent MCU core noise coupling.
Route the BKGD/DEBUG pin away from high-current switching traces; AC-couple noise on BKGD can disrupt in-circuit programming. Maintain 50 ohm impedance on the BDM cable for production-line reliability. The 64-QFP at 14x14 mm has 0.8 mm pitch; use a 4-layer PCB with 5-7 mil traces/5-7 mil spaces on outer layers to fan out from pads. Add a copper pour connected to VSS beneath the chip and stitch it to ground vias around the periphery for thermal dissipation and shielding.
Do not leave the RESET pin floating: tie to VDD through a 10 kohm resistor with a 100 nF capacitor to ground for noise immunity, OR drive it with a dedicated supervisor. NRND does not mean defective - S08AW parts still reach production volumes, but lead time may stretch to 12-16 weeks. Validate alternate sources (NXP authorised distributor) in your BOM before committing new designs. Watch Flash write timing carefully: in-application programming needs the recommended 4.5 V min VDD for guaranteed writes below 0 C.
The HCS08 core has tight ADC sample timing; keep the analog and digital grounds separate and join at a single star point near the MCU VSS3 (pin 64). The ADC reference pins VREFH/VREFL should each have a 100 nF ceramic plus a 10 uF bypass capacitor - omitting the bulk capacitor introduces temperature drift above 80 C. For 10-bit absolute accuracy at full sampling rate (240 kHz), keep analog trace length to the ADC pins under 25 mm.
Informações de conformidade
RoHS compliant per NXP product page and supplier documentation. Not AEC-Q100 qualified (industrial and body-domain only); for powertrain-grade automotive use, select Kinetis or S12 family.