MK52DN512ZCMD10 - 100MHz Cortex-M4 MCU 512KB Flash | NXP
N.º da peça: MK52DN512ZCMD10 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.9 | $8,90 |
| 10 | $8.1 | $81,00 |
| 100 | $7.35 | $735,00 |
| 500 | $6.7 | $3.350,00 |
| 1.000 | $6.15 | $6.150,00 |
MK52DN512ZCMD10 Visão geral
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, sitting at the heart of embedded systems. Within the hierarchy of embedded processors, an MCU is more integrated than an MPU (microprocessor unit) and less powerful than an applications processor; the Kinetis K5x family belongs to NXP's Kinetis portfolio of Arm Cortex-M based MCUs used across industrial, medical, and consumer electronics.
Key features of the MK52DN512ZCMD10 include the 100 MHz Cortex-M4 core with DSP instructions and a hardware floating-point unit, 512 KB of flash for program storage, and 128 KB of SRAM for data and stack. As a K52 sub-family member of the analog-measurement-focused K50 family, it integrates operational amplifiers and trans-impedance amplifiers alongside high-resolution ADC and DAC modules, reducing external component count in precision measurement signal chains.
The device also provides USB and Ethernet connectivity per its NXP product page, making it suitable for networked instrumentation nodes. Peripherals are clocked from a flexible clock architecture supporting multiple clock sources and a phase-locked loop for core and bus clock generation. Security capabilities noted by NXP support protected code and data handling in industrial deployments.
Typical applications include medical measurement devices such as glucose meters and patient monitoring front ends, industrial metering and data acquisition, and test-and-measurement equipment that benefits from the integrated analog engine. The Ethernet MAC supports connected field devices, while USB enables direct host or device interfaces.
A key design consideration: the 144-ball MAPBGA requires careful PCB stack-up and fanout planning; ball-map routing with via-in-pad or dog-bone fanout on at least four layers is typical, and power integrity for the analog measurement modules demands dedicated clean supplies and solid ground planes.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet alone, with all specifications traced to NXP and distributor data as of 2026-10-18.
Alternativas drop-in para MK52DN512ZCMD10 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MK52DN512ZCMD10 (mesmo formato e footprint) — diferindo em Package, Core Processor, Series, Supply Voltage, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MK52DN512CMD10
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MK52DX512ZCMD10
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MK53DN512ZCMD10
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.2 / unidade
Ver ficha técnica →MK51DN512ZCMD10
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MK40DN512ZVMD10
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$8.38 / unidade
Ver ficha técnica →MK52DN512ZCMD10 Classificações máximas e características elétricas
| Core Processor | Arm Cortex-M4 |
| Core Size | 32-bit |
| Frequência máxima de clock | 100 MHz |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Series | Kinetis K50 (K52 sub-family) |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 144-MAPBGA (13 x 13 mm) |
| Package Code | LFBGA, square, 144 balls |
| Tipo de montagem | Surface Mount |
| Terminal Form | Ball |
| Number of Terminals | 144 |
| Temperature Grade | Industrial |
| USB | Yes |
| Ethernet | Yes (MAC) |
| Integrated Analog Engine | Op-amps, trans-impedance amplifiers, high-resolution ADC and DAC modules (K50 family) |
| Security Capabilities | Yes |
Guia de Configuração de Pinos do MK52DN512ZCMD10 lfbga, square, 144 balls
Configuração de pinos para MK52DN512ZCMD10 (pacote lfbga, square, 144 balls). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MK52DN512ZCMD10.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MK52DN512ZCMD10 é adequado para 6 aplicaçãos: Medical Measurement Devices, Industrial Data Acquisition, Networked Instrumentation with Ethernet, Portable and USB-Connected Instruments, Precision Analog Signal Conditioning, Test and Measurement Equipment.
Medical Measurement Devices
The MK52DN512ZCMD10 fits medical measurement front ends because NXP designed the K50 100 MHz family specifically as an analog measurement engine: integrated operational amplifiers, trans-impedance amplifiers, and high-resolution ADC and DAC modules sit on the same die as the 100 MHz Cortex-M4. In a glucose meter or patient-monitoring sensor board, the MCU's on-chip op-amps condition photodiode or electrode signals directly, and the trans-impedance amplifier converts sensor current to voltage without external discrete amplifiers. The 512 KB flash and 128 KB SRAM host signal-processing firmware and calibration tables, while USB provides data offload to a host PC. Using the integrated engine reduces component count and board area in portable, battery-powered medical instruments.
Recomendado
Industrial Data Acquisition
In industrial data-acquisition nodes, the MK52DN512ZCMD10's combination of a 100 MHz Cortex-M4 with DSP instructions and the K50 analog measurement engine allows signal conditioning, digitization, and processing on one chip. The on-chip high-resolution ADC modules digitize 4-20 mA or bridge-sensor inputs conditioned by the integrated op-amps, and the 512 KB flash stores multi-channel calibration and logging data. Industrial-grade temperature rating supports panel and factory-floor environments. The USB and Ethernet MAC interfaces let the node stream acquired data to SCADA or local HMIs. Because conditioning, conversion, and processing are integrated, designers save board space and avoid inter-chip analog noise pickup common in discrete front-end designs.
Recomendado
Networked Instrumentation with Ethernet
The MK52DN512ZCMD10 includes an Ethernet MAC, making it a strong fit for networked instrumentation such as remote sensor gateways and bench-instrument control modules. Paired with an external Ethernet PHY, the MCU serves embedded web pages or streams measurement data over TCP/IP while the 100 MHz Cortex-M4 handles protocol stacks alongside measurement tasks. The 128 KB SRAM provides headroom for socket buffers and the 512 KB flash hosts the stack plus application firmware. The integrated analog measurement engine can simultaneously acquire sensor data, so one chip implements a complete networked measurement endpoint. Compared with discrete MCU-plus-controller designs, this reduces BOM cost and firmware integration effort.
Recomendado
Portable and USB-Connected Instruments
The USB peripheral on the MK52DN512ZCMD10 enables direct host or device connectivity, which suits portable instruments that charge, configure, or offload data via a USB port. The 100 MHz Cortex-M4 core with hardware floating point performs FFTs and filtering on acquired waveforms, while the K52 analog engine captures signals through its high-resolution ADC. With 512 KB flash, the firmware can support USB device classes (CDC, MSC, HID) plus application code without external memory. Operating from a 3.3 V supply with the Kinetis low-power modes, the device fits battery-operated handheld meters where USB doubles as both the power and communication path, simplifying the power architecture.
Recomendado
Precision Analog Signal Conditioning
Designs that previously used discrete operational amplifiers and trans-impedance front ends can consolidate them into the MK52DN512ZCMD10. The K52 sub-family's integrated op-amps and trans-impedance amplifiers interface directly to photodiodes, current-loop sensors, and electrode inputs, feeding the on-chip high-resolution ADC. This integration shortens the analog signal path, reducing noise pickup and PCB area. The 100 MHz Cortex-M4 with DSP instructions applies digital filtering and linearization in firmware, and the 12-bit-class DAC modules close control loops or generate stimulus signals for impedance-measurement applications. The result is a compact, single-chip analog measurement system with firmware-configurable gain and filtering.
Recomendado
Test and Measurement Equipment
Bench and portable test instruments benefit from the MK52DN512ZCMD10's blend of processing power and integrated analog capability. The Cortex-M4's DSP extensions execute windowing and spectral analysis on signals captured by the high-resolution ADC modules, while op-amps on the die scale input signals to ADC range. USB and Ethernet allow the instrument to communicate with host software or networked test setups, and 512 KB flash accommodates a rich command interpreter plus calibration firmware. The 13 x 13 mm 144-MAPBGA package keeps the controller footprint small in dense instrument main boards. Industrial temperature grade suits lab and field test environments alike.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MK52DN512ZCMD10 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MK52DN512CMD10 | MK52DX512ZCMD10 | MK53DN512ZCMD10 | MK51DN512ZCMD10 | MK40DN512ZVMD10 |
|---|---|---|---|---|---|---|
| Package | 144-MAPBGA (13 x 13 mm) | 144-MAPBGA (13 x 13 mm) - same footprint | 144-MAPBGA (13 x 13 mm) - same | 144-MAPBGA (13 x 13 mm) - same | 144-MAPBGA (13 x 13 mm) - same | 144-MAPBGA (13 x 13 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | Arm Cortex-M4 @ 100 MHz | Arm Cortex-M4 @ 100 MHz | Arm Cortex-M4 @ 100 MHz | Arm Cortex-M4 @ 100 MHz | Arm Cortex-M4 @ 100 MHz | Arm Cortex-M4 @ 100 MHz |
| Flash | 512 KB | 512 KB | 512 KB (+ FlexMemory) | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Analog Measurement Engine | Yes (op-amps, TIA, high-resolution ADC/DAC) | Yes | Yes | Yes | Partial (K51 configuration) | No (segment LCD instead) |
| Ethernet MAC | Yes | Yes | Yes | Yes | Yes | Yes |
| USB | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Integrated analog measurement engine (vs MK10DN512ZVMC10)
- Same silicon without the Z-package suffix (vs MK52DN512CMD10)
- FlexMemory option in same footprint (vs MK52DX512ZCMD10)
Notas de projeto
The 144-ball MAPBGA (13 x 13 mm, 0.8 mm ball pitch class) requires a multilayer PCB - four layers minimum, six preferred - to fan out 144 signals plus power. Use dog-bone or via-in-pad fanout patterns and keep the two inner layers as solid ground and power planes. Escape routing should follow the ball grid diagonals to avoid crosstalk between adjacent traces. Define the BGA land pattern per the package dimensions chapter of the K52 Sub-Family Data Sheet on nxp.com, not from generic footprint libraries.
Supply the MK52DN512ZCMD10 from a clean 3.3 V rail per distributor specifications. Because the K52 integrates analog op-amps, TIAs, and high-resolution ADCs, isolate the analog supply domain with an LC filter or ferrite bead from the digital rail, and follow the datasheet's recommended decoupling: bulk capacitance at each supply ball plus 100 nF ceramics placed as close as possible to the power/ground ball pairs. Poor analog supply isolation shows up as reduced ADC effective resolution - verify ENOB during bring-up.
Pin multiplexing is the most common Kinetis K5x pitfall: most of the 144 balls serve multiple functions (Ethernet RMII, USB, op-amp inputs, timers), so conflicts surface late in design. Build the pin assignment in NXP's pins tooling before committing the schematic. Also confirm the exact ordering suffix - the Z in MK52DN512ZCMD10 selects the 144-MAPBGA; ordering the non-Z MK52DN512CMD10 will deliver a different footprint. Subscribe to NXP PCNs for this part to catch package or die revisions.
Informações de conformidade
Compliance data was not included in the provided verified web data. Consult the NXP product page Quality/Environmental section for MK52DN512ZCMD10 RoHS/REACH declarations.
