NXP Semiconductors

MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

N.º da peça: MCF5329CVM240 ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
1.5 V core / 3.3 V I/O (typical, refer to datasheet) Vdss 256-LBGA (MAPBGA) Package 240 MHz Speed ROMless (external memory bus required) Memory
A partir de $25.6 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-08
Preços por volume
Qtd. Preço unitário Total
1 $38.52 $38,52
10 $35.8 $358,00
100 $32.4 $3.240,00
500 $28.9 $14.450,00
1.000 $25.6 $25.600,00
ℹ️ Todos os preços estão em USD

MCF5329CVM240 Visão geral

The NXP Semiconductors MCF5329CVM240 is a 32-bit ColdFire V3 microprocessor that integrates the first LCD controller on a ColdFire device, running at 240 MHz with 256 KB of on-chip SRAM, in a 256-ball LBGA (MAPBGA) package. According to the NXP MCF532x datasheet, it targets human-machine interface (HMI) and industrial control applications while maintaining rich connectivity and security integration. The integrated LCD controller supports TFT and STN panels directly, eliminating the need for an external graphics controller in many designs.

Key features include the ColdFire Variable-Length RISC (VLRISC) V3 core with a 16-Kbyte unified write-back cache, 32 KB of SRAM, 94 general-purpose I/O lines, an external memory controller for SDRAM, SRAM, and NOR/NAND flash, plus a 10/100 Ethernet MAC and USB 2.0 full-speed OTG controller. The device also integrates a DDR/LCD controller, DMA channels, timers, UARTs, I2C, SPI, and an enhanced JTAG debug interface (BDM/OnCE).

A ColdFire V3 microprocessor is a 32-bit RISC-style processor core optimized for embedded control with code-density advantages over fixed-length architectures. ColdFire sits in the embedded microprocessor hierarchy between 8/16-bit MCUs and high-end application processors, providing deterministic real-time performance with a rich peripheral set and external memory bus for systems that exceed internal memory limits. The MCF532x family extends this with integrated graphics, making it a single-chip solution for HMI panels.

Typical applications include industrial operator-interface panels, point-of-sale (POS) terminals, medical patient monitors, building-automation touch panels, and portable instrumentation with TFT displays. The combination of Ethernet, USB OTG, CAN, and the LCD controller allows a single device to drive the full HMI plus connectivity stack.

When designing with the MCF5329CVM240, ensure the PCB land pattern matches the 256-LBGA (MAPBGA) 17x17 mm footprint and that JTAG/BDM lines are length-matched for reliable boundary-scan debugging. As an NRND (Not Recommended for New Designs) part, evaluate the pin-compatible MCF53281CVM240 family for new product introductions while keeping MCF5329CVM240 as the baseline for legacy systems.

This page synthesizes NXP manufacturer data, distributor pricing, NRND-aware drop-in alternatives within the same 256-LBGA footprint, and practical design notes for engineers maintaining existing HMI designs or planning a migration path.

Alternativas drop-in para MCF5329CVM240 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MCF5329CVM240 (mesmo formato e footprint) — diferindo em Core Architecture, Package, Program Memory Type, Operating Temperature, Debug Interface.

NXP Semiconductors
Package: 208-FQFP (28x28 mm)
Operating Temperature: -40C to +85C
Comparar com MCF5329CVM240 →
NXP Semiconductors
Core Architecture: ColdFire V3 (32-bit RISC, variable-length)
Package: 196-LBGA (MAPBGA) 15x15 mm
Comparar com MCF5329CVM240 →
NXP Semiconductors
Core Architecture: Version 3 ColdFire
Package: 256-MAPBGA (17x17 mm)
Program Memory Type: ROMless (external memory required)
Comparar com MCF5329CVM240 →
NXP Semiconductors
Core Architecture: ColdFire V3 (VLRISC), 32-bit
Program Memory Type: ROMless (external)
Operating Temperature: -40 C to +85 C (industrial)
Comparar com MCF5329CVM240 →
NXP Semiconductors
Core Architecture: ColdFire V3 (Version 3), 32-bit RISC
Package: 256-MAPBGA (17x17 mm)
Program Memory Type: ROMless (external boot memory required)
Comparar com MCF5329CVM240 →
NXP Semiconductors
Core Architecture: ColdFire V3 (Version 3) variable-length RISC
Package: 256-MAPBGA 17 mm × 17 mm, 1.0 mm pitch
Program Memory Type: ROMless (external flash required)
Comparar com MCF5329CVM240 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MCF53281CVM240

✅ Drop-In
NXP Semiconductors
📦 256-LBGA (MAPBGA)
ColdFire V3 (variable-length RISC, 32-bit) · Version 3 ColdFire · 240 MHz · ROMless (external memory required) · None · 32K x 8 (256 Kbit on-chip SRAM) · 94 · 256-MAPBGA (17x17 mm)

✓ Em estoque

$25.2 / unidade

Ver ficha técnica →

MCF5329CVM240J

✅ Drop-In
NXP Semiconductors
📦 256-LBGA (MAPBGA)
ColdFire V3 (Version 3) variable-length RISC · 32 bit · 240 MHz · ROMless (external flash required) · 256-MAPBGA 17 mm × 17 mm, 1.0 mm pitch · Surface Mount (BGA) · Integrated Fast Ethernet MAC (10/100)

✓ Em estoque

$25.95 / unidade

Ver ficha técnica →

MCF5327CVM240

✅ Drop-In ⚠️ Especificações não verificadas
📦 256-LBGA (MAPBGA)
same 256-LBGA footprint, MCF5327 variant without integrated LCD controller vs MCF5329 with LCD

📋 Alternativa de referência (fora do catálogo)

MCF5328CVM240

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 256-LBGA (MAPBGA)
ColdFire V3 (Version 3), 32-bit RISC · 240 MHz · ROMless (external boot memory required) · 32 KB · 94 · 256-MAPBGA (17x17 mm) · External · Yes

✓ Em estoque

$35 / unidade

Ver ficha técnica →

MCF53281CVM240J

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 256-LBGA (MAPBGA)
ColdFire V3 (VLRISC), 32-bit · 240 MHz · Up to 211 MIPS · ROMless (external) · 32 KB (32K x 8) · 16 KB · 94 · 256-MAPBGA (17x17 mm)

✓ Em estoque

$26.85 / unidade

Ver ficha técnica →

MCF5329CVM240 Classificações máximas e características elétricas

Core Architecture ColdFire V3 (VLRISC)
Core Bit Width 32-bit
Frequência máxima de clock 240 MHz
On-chip SRAM 32 KB
Unified Cache 16 KB write-back
Program Memory Type ROMless (external memory bus required)
Number of I/O Lines 94
Encapsulamento 256-LBGA (MAPBGA)
Tipo de montagem Surface Mount
Tensão de alimentação 1.5 V core / 3.3 V I/O (typical, refer to datasheet)
Temperatura de operação -40C to +85C (industrial)
Oscillator Type External
LCD Controller Integrated (TFT/STN, first integrated LCD on ColdFire)
Ethernet 10/100 MAC integrated
USB USB 2.0 Full-Speed OTG
Debug Interface JTAG/BDM/OnCE
Packaging Tray
Status RoHS Compliant

Guia de Configuração de Pinos do MCF5329CVM240 256-lbga (mapbga)

Configuração de pinos para MCF5329CVM240 (pacote 256-lbga (mapbga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 256-lbga (mapbga) para MCF5329CVM240

Nenhum dado detalhado de pinagem disponível para MCF5329CVM240.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

MCF5329CVM240 é adequado para 7 aplicaçãos: Industrial HMI Operator Panels, Point-of-Sale (POS) Terminals, Medical Patient Monitors, Building Automation Touch Panels, Portable Test and Measurement Instruments, Industrial Security and Access Control Panels, Automotive Infotainment HMI (Legacy).

🏭

Industrial HMI Operator Panels

The MCF5329CVM240 is purpose-built for industrial HMI panels as the first ColdFire device with an integrated LCD controller. The 240 MHz ColdFire V3 core, 16 KB cache, and 32 KB SRAM drive TFT/STN panels through the integrated controller while leaving CPU headroom for Ethernet and USB stacks. The 256-LBGA package keeps the design footprint compact enough for 5- to 7-inch panel enclosures. Unlike host-microcontroller-plus-external-LCD-controller designs, the MCF5329CVM240 consolidates graphics, connectivity, and control on a single chip, reducing BOM cost and PCB area for factory-floor operator panels.

📺

Point-of-Sale (POS) Terminals

The MCF5329CVM240 fits POS terminals where a color TFT display, Ethernet connectivity, and USB peripherals must coexist on a small footprint. The integrated LCD controller drives the operator display, the 10/100 Ethernet MAC handles payment-network and back-office traffic, and the USB 2.0 OTG port supports peripherals such as barcode scanners or printers. At 240 MHz the V3 core handles the application stack plus secure input handling without external memory contention. Industrial temperature grade (-40C to +85C) supports kitchen and warehouse deployment environments.

💊

Medical Patient Monitors

The MCF5329CVM240 suits medical patient monitors that combine a graphical waveform display with network connectivity. The integrated LCD controller renders real-time waveforms on a TFT panel, the ColdFire V3 core processes sampled data, and the Ethernet MAC streams data to central monitoring stations. The ROMless architecture plus external memory controller lets the design meet medical certification timelines by separating verified boot ROM from updatable application firmware. Designers should validate against IEC 60601-1 EMI margins given the high-speed external bus.

🧩

Building Automation Touch Panels

The MCF5329CVM240 drives building-automation touch panels for HVAC, lighting, and access-control interfaces. The integrated LCD controller and touch-controller interface replace external display bridges, while the Ethernet MAC links the panel to BACnet or Modbus building networks. Low-power modes allow the panel to dim the display when idle, reducing energy consumption in 24/7 installations. The 256-LBGA package supports slimmer wall-mount enclosures with no need for stacked display modules.

🔧

Portable Test and Measurement Instruments

The MCF5329CVM240 fits portable test instruments such as handheld oscilloscopes, multimeters, and protocol analyzers that need a graphical display plus USB connectivity to a host PC. The integrated LCD controller removes the need for a separate FPGA or graphics controller, reducing BOM and board area. The USB OTG port supports both device mode for PC connectivity and host mode for USB flash drives. Industrial temperature grade allows field deployment, while the ROMless architecture keeps firmware updatable in the field.

🎥

Industrial Security and Access Control Panels

The MCF5329CVM240 drives industrial security panels that show camera feeds, badge-reader status, and access logs on a graphical display. The Ethernet MAC streams IP-camera data while the LCD controller renders the user interface, and the USB host port supports badge readers or fingerprint modules. The 256-LBGA package fits behind compact wall-mount panels, and the ColdFire V3 core runs the protocol stack plus UI without external memory contention. Designers should pair this with a hardware secure element for credential storage.

🚗

Automotive Infotainment HMI (Legacy)

Although the MCF5329CVM240 is industrial-grade rather than AEC-Q100 qualified, it has been used in non-safety automotive HMI designs such as rear-seat entertainment panels and aftermarket infotainment controllers. The integrated LCD controller drives passenger displays, the Ethernet MAC supports MOST or Ethernet AVB bridges, and the USB OTG connects to mobile devices. For new automotive designs, use AEC-Q100-qualified alternatives; the MCF5329CVM240 is only suitable for extending legacy automotive products where the part is already qualified in the BOM.

What is the core architecture and clock speed of the MCF5329CVM240?
The MCF5329CVM240 is built on the ColdFire V3 (VLRISC) 32-bit core running at 240 MHz. According to the NXP MCF532x datasheet, the V3 core combines variable-length RISC encoding for high code density with deterministic real-time performance, plus a 16-Kbyte unified write-back cache. This makes it suitable for HMI panels running graphics stacks and communication protocols on a single chip.
How much on-chip memory does the MCF5329CVM240 have?
The MCF5329CVM240 includes 32 KB of on-chip SRAM and a 16-Kbyte unified write-back cache. The device is ROMless, so program storage must reside on external SDRAM, NOR flash, or NAND flash attached via the external memory controller. This split lets HMI designs keep small working sets in fast on-chip SRAM while using bulk external memory for frame buffers and code.
Is the MCF5329CVM240 still in production or recommended for new designs?
The MCF5329CVM240 is marked NRND (Not Recommended for New Designs) by NXP, as confirmed by the NXP product page status indicator. NRND means the part is still produced and supported for existing customers but NXP encourages new designs to migrate to a successor such as the MCF53281 family. Stock is available at distributors and lead time has historically stretched beyond 52 weeks during shortages.
What is the difference between MCF5329CVM240 and MCF53281CVM240?
The MCF53281CVM240 is a later member of the MCF532x family sharing the same 256-LBGA footprint and ColdFire V3 architecture, with refinements to peripherals and on-chip memory while maintaining pin-to-pin compatibility. Both integrate the LCD controller, Ethernet MAC, and USB OTG. The MCF53281 is the preferred migration target for new designs, while MCF5329CVM240 remains the baseline for existing production.
Does the MCF5329CVM240 integrate an LCD controller?
Yes, the MCF5329CVM240 was the first ColdFire device to integrate an LCD controller, supporting both TFT and STN panels. According to the NXP datasheet, the integrated controller eliminates the need for an external graphics controller in cost-sensitive HMI designs. It works with the on-chip LCD DMA to refresh panels with minimal CPU intervention.
What is the pin count and package of the MCF5329CVM240?
The MCF5329CVM240 ships in a 256-ball LBGA package, also referred to as MAPBGA, measuring approximately 17x17 mm. It provides 94 general-purpose I/O lines plus dedicated pins for Ethernet, USB, SDRAM bus, JTAG/BDM, and the LCD interface. The LBGA footprint is the canonical migration footprint for the MCF532x family.
What peripherals are integrated on the MCF5329CVM240?
The MCF5329CVM240 integrates a 10/100 Ethernet MAC, USB 2.0 full-speed OTG, LCD controller, DMA controllers, multiple UARTs, I2C, SPI, timers, PWM, and an external memory controller for SDRAM and flash. According to the NXP datasheet, this integration targets HMI panels that need connectivity, touch sensing, and graphics on a single chip without external bridges.
What is the operating temperature range of the MCF5329CVM240?
The MCF5329CVM240 is rated for industrial operating temperatures of -40C to +85C. This range covers outdoor enclosures, factory floors, and unheated cabinets. For designs requiring extended ranges, validate against the specific datasheet ordering code since MCF532x variants differ in temperature grade and qualification level.
Where can I download the MCF5329CVM240 datasheet PDF?
The official MCF5329CVM240 datasheet is published by NXP at https://www.nxp.com/docs/en/data-sheet/MCF5329DS.pdf and via the NXP product page at https://www.nxp.com/part/MCF5329CVM240. Mirror copies also appear on third-party sites such as alldatasheet.com, but always cross-check the latest revision on nxp.com to avoid using outdated errata. The datasheet is around 50 pages and includes electrical characteristics, pinout, and programming model.
Where can I buy the MCF5329CVM240 and what is the current price?
The MCF5329CVM240 is available at authorized distributors including Mouser, Newark, DigiKey (via cross-reference), Octopart listings, and Heisener, with distributor pricing around $38.52 per unit at qty 1 as of 2026-10-09. Because the part is NRND, Heisener reported distributor inventory of approximately 6,480 pieces. For bulk pricing or franchised stock, request a quote from NXP authorized channels to avoid counterfeit risk.
What is the lead time for the MCF5329CVM240?
Lead time for the MCF5329CVM240 has historically exceeded 52 weeks during semiconductor shortages, according to NXP community discussions. As of 2026-10-09, distributor stock levels vary and Heisener advertises immediate shipment for in-stock qty, but NXP factory lead time for new orders should be confirmed directly. Engineers planning production should secure safety stock now or migrate to the MCF53281 family.
What is the best drop-in replacement for the MCF5329CVM240?
The best drop-in replacement for the MCF5329CVM240 in the same 256-LBGA footprint is the MCF53281CVM240 from the same MCF532x family. According to NXP family documentation, the MCF53281 maintains the same pinout, peripheral set, and ColdFire V3 core, with incremental improvements. It is the recommended migration target for new designs while keeping MCF5329CVM240 as the baseline for legacy production.
Is the MCF5329CVM240 suitable for a new industrial HMI design?
The MCF5329CVM240 is technically capable for industrial HMI but is NRND, meaning NXP does not recommend it for new designs. For new designs, choose the MCF53281CVM240 in the same 256-LBGA package to secure long-term supply and avoid future requalification. Continue using MCF5329CVM240 only when extending existing field-deployed products where requalification cost outweighs the migration benefit.
Which ColdFire microprocessor should I choose instead of the MCF5329CVM240 for new designs?
For new designs, NXP recommends migrating to the MCF53281CVM240, which shares the same 256-LBGA footprint and ColdFire V3 core. The MCF53281 offers updated peripherals, longer-term NXP support, and continued production commitment while keeping the MCF5329CVM240 software investment compatible. Evaluate the MCF53281 errata against your application before migration to ensure no feature regressions.
Is the MCF5329CVM240 the same as the MCF53281CVM240?
No, the MCF5329CVM240 and MCF53281CVM240 are distinct parts within the MCF532x family, but they share the same 256-LBGA footprint and ColdFire V3 core. The MCF53281 is a later revision with refined peripherals and longer-term NXP support. The MCF5329CVM240 is the baseline part and is currently NRND, while MCF53281 is the recommended successor.
What are the key specifications of the MCF5329CVM240 that engineers should know?
The MCF5329CVM240 is a 32-bit ColdFire V3 microprocessor at 240 MHz with 32 KB SRAM, 16 KB cache, integrated TFT/STN LCD controller, 10/100 Ethernet MAC, USB 2.0 full-speed OTG, 94 GPIO, and external SDRAM/NOR/NAND memory controller, in a 256-LBGA package. According to the NXP datasheet, it was the first ColdFire with an integrated LCD controller, targeting HMI panels. The part is NRND as of 2026-10-09 and shares footprint with the successor MCF53281CVM240.

Dados de referência de engenharia para MCF5329CVM240 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MCF5329CVM240 only when extending existing field-deployed HMI products where requalification cost outweighs the migration benefit. For new designs, choose the MCF53281CVM240 in the same 256-LBGA footprint - it shares the ColdFire V3 core, integrated LCD controller, Ethernet MAC, and USB OTG while remaining in active production. The MCF5327CVM240 is a lower-cost alternative within the same 256-LBGA footprint if the integrated LCD controller is not needed and an external bridge is acceptable. The MCF5329CVM240J is a J-grade temperature variant for designs that require a specific ordering code. All alternatives remain brand-locked to NXP because no cross-brand drop-in exists in the 256-LBGA footprint.

Comparação com alternativas

Parâmetro Este produto MCF53281CVM240 MCF5329CVM240J MCF5327CVM240 MCF5328CVM240 MCF53281CVM240J
Package 256-LBGA (MAPBGA) 256-LBGA (MAPBGA) - same 256-LBGA (MAPBGA) - same 256-LBGA (MAPBGA) - same 256-LBGA (MAPBGA) - same 256-LBGA (MAPBGA) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture ColdFire V3 (32-bit) ColdFire V3 (32-bit) ColdFire V3 (32-bit) ColdFire V3 (32-bit) ColdFire V3 (32-bit) ColdFire V3 (32-bit)
Clock Frequency 240 MHz 240 MHz 240 MHz 240 MHz 240 MHz 240 MHz
On-chip SRAM 32 KB 32 KB 32 KB 32 KB 32 KB 32 KB
Integrated LCD Controller Yes (TFT/STN) Yes (TFT/STN) Yes (TFT/STN) No Yes (variant) Yes (TFT/STN)
Ethernet MAC 10/100 integrated 10/100 integrated 10/100 integrated 10/100 integrated 10/100 integrated 10/100 integrated
Lifecycle Status NRND Active NRND NRND NRND Active

Principais diferenciais

  • First ColdFire device with integrated LCD controller (vs MCF5327CVM240)
  • Pin-compatible successor available with active lifecycle (vs MCF53281CVM240)
  • Same-brand family migration path without PCB rework (vs MCF5329CVM240J)

Notas de projeto

The 256-LBGA (MAPBGA) package requires a 17x17 mm PCB land pattern with microvia or laser-drilled vias for the BGA ball array. Use at least 4 PCB layers with a continuous ground plane under the BGA to provide thermal spreading and return-path control for the high-speed external memory bus. Length-match SDRAM DQ/DQS traces within 25 mils to meet ColdFire V3 timing margins. Place decoupling capacitors on the BGA's opposite side within 100 mils of each supply ball, using 100 nF X7R ceramics in parallel with 4.7 uF bulk caps.

The MCF5329CVM240 is ROMless and boots from external flash or serial memory, so the reset and boot-mode strapping pins must be tied correctly at power-up. Failing to assert the proper reset configuration will leave the core in JTAG-only mode. JTAG/BDM signals must be length-matched and series-terminated near the MCF5329 to avoid boundary-scan failures on long debug cables. The integrated LCD controller requires the panel data bus to be routed with controlled impedance (typically 50 ohm single-ended) and isolated from the SDRAM bus to prevent crosstalk during DMA refresh.

Because the MCF5329CVM240 is NRND, new designs should migrate to the pin-compatible MCF53281CVM240 in the same 256-LBGA footprint. For existing production, place a final-time-buy order before NXP issues the last shipment notice, and qualify a second source from the same MCF532x family. Cross-brand alternatives in the same 256-LBGA footprint do not exist, so the migration path is brand-locked to NXP. Validate the MCF53281 errata against your firmware before formal migration.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS compliant per NXP product page. Not AEC-Q100 qualified - not suitable for new automotive safety designs. Lifecycle status: NRND per NXP product page.

Dados verificados em: 2026-10-09 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

NXP Semiconductors Freescale Semiconductor MCF5329CVM240 MCF53281CVM240 MCF5327CVM240 MCF5328CVM240 ColdFire V3 ColdFire VLRISC 32-bit microprocessor MPU LCD controller TFT panel STN panel 256-LBGA MAPBGA 10/100 Ethernet MAC USB 2.0 OTG DDR memory controller JTAG BDM OnCE human-machine interface industrial HMI AEC-Q100 RoHS
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