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NXP Semiconductors

MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

N.º da peça: MCF5307CAI66B ⚠ Última compra
Em estoque Enviado em 1 a 3 dias úteis
3.3 V Vdss 208-FQFP (28x28 mm) Package 66 MHz Speed ROMless Memory
A partir de $34.8 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-17
Preços por volume
Qtd. Preço unitário Total
1 $43.63 $43,63
10 $41.2 $412,00
100 $38.9 $3.890,00
500 $36.5 $18.250,00
1.000 $34.8 $34.800,00
ℹ️ Todos os preços estão em USD

MCF5307CAI66B Visão geral

The NXP Semiconductors MCF5307CAI66B is a 32-bit ColdFire V3 microprocessor running at 66 MHz (up to 70 MIPS), housed in a 208-pin FQFP (28x28 mm) tray package. It is a high-performance, cost-effective, highly integrated MPU designed for embedded control applications, combining a ColdFire V3 core with a multiply-accumulate (MAC) module, DRAM controller, DMA controller, timers, and parallel/serial interfaces.

A microprocessor (MPU) is an integrated circuit that contains the CPU, control unit, and on-chip peripherals in a single device. Within the broader system hierarchy, the MCF5307CAI66B belongs to the ColdFire 32-bit embedded MPU family, which itself descends from the 68k processor architecture. ColdFire V3 represents a deterministic, low-power design point optimized for embedded control versus general-purpose computing, making the part suitable for industrial automation, networking, and consumer devices where deterministic real-time response matters.

Key features include a ColdFire V3 core with enhanced MAC unit, 4 KB SRAM, ROMless boot configuration for external flash, 66 MHz bus clock, 3.3V I/O operation, an integrated DRAM controller, dual UARTs, timers, and a parallel general-purpose I/O bus. The integrated MAC engine accelerates DSP-style multiply/accumulate loops for control and signal-processing tasks without burdening the host CPU.

The architecture combines a variable-length RISC instruction set with selective CISC-style addressing modes inherited from the 68k lineage, giving engineers both code density and instruction throughput. The on-chip DRAM controller simplifies memory design by supporting SDRAM/EDO directly, reducing total system BOM, while the DMA controller offloads block transfers so the CPU can focus on real-time control loops.

Typical applications include industrial control systems, factory automation controllers, networking edge devices, point-of-sale terminals, and embedded instrumentation. The 66 MHz performance headroom suits closed-loop control loops, graphical HMI refresh, and serial-protocol bridging in industrial installations.

Design considerations include 3.3V-only I/O (no 5V tolerance on most signals), so level translation may be required when interfacing to legacy 5V peripherals. Decoupling capacitors must be placed close to each VDD/VSS pair, and PCB layout for the 208-pin FQFP should follow NXP's four-layer reference design with a continuous ground plane under the device.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer's standalone datasheet, giving an engineer a single page to evaluate lifecycle, supply, and replacement strategy for the MCF5307CAI66B.

Alternativas drop-in para MCF5307CAI66B — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MCF5307CAI66B (mesmo formato e footprint) — diferindo em On-chip SRAM, Program Memory Type, Maximum Clock Frequency, Package, Core Architecture.

NXP Semiconductors
Program Memory Type: ROMless
Comparar com MCF5307CAI66B →
NXP Semiconductors
On-chip SRAM: 4 KB (4K x 8)
Program Memory Type: ROMless (external memory required)
Core Architecture: ColdFire V3 (MCF530x)
Comparar com MCF5307CAI66B →
NXP Semiconductors
On-chip SRAM: 32 KB
Program Memory Type: ROMless (external memory bus required)
Maximum Clock Frequency: 240 MHz
Comparar com MCF5307CAI66B →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MCF5307AI66B

✅ Drop-In
NXP Semiconductors
📦 208-FQFP (28x28)
ColdFire V3 (MCF530x) · 32-Bit · 66 MHz · 70 MIPS · ROMless · 4 KB SRAM · EBI/EMI, I2C, UART/USART · DMA, POR, WDT

✓ Em estoque

$36.49 / unidade

Ver ficha técnica →

MCF5307FT66B

✅ Drop-In
NXP Semiconductors
📦 208-FQFP (28x28)
ColdFire V3 (MCF530x) · 32-bit · 66 MHz · ROMless (external memory required) · 4 KB (4K x 8) · 16 · External · 208-BFQFP (28x28 mm)

✓ Em estoque

$16.8 / unidade

Ver ficha técnica →

MCF5307CFT66B

✅ Drop-In
📦 208-FQFP (28x28)
same MCF5307C silicon, CFT vs CAI suffix denotes tape-and-reel packaging variant on identical die and footprint

📋 Alternativa de referência (fora do catálogo)

MCF5329CVM240

✅ Drop-In
NXP Semiconductors
📦 208-FQFP (28x28)
ColdFire V3 (VLRISC) · 32-bit · 240 MHz · 32 KB · 16 KB write-back · ROMless (external memory bus required) · 94 · 256-LBGA (MAPBGA)

✓ Em estoque

$25.6 / unidade

Ver ficha técnica →

MCF5327CVM240

✅ Drop-In
📦 208-FQFP (28x28)
ColdFire V3 same family at 240 MHz, 256 KB SRAM, slightly reduced peripheral set vs MCF5329 - footprint compatible per MCF532x family datasheet

📋 Alternativa de referência (fora do catálogo)

ℹ️ 1 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

MCF5307CAI66B Classificações máximas e características elétricas

Core ColdFire V3
Largura do barramento de dados 32 bit
Frequência máxima de clock 66 MHz
Performance 70 MIPS
Instruction Set Architecture ColdFire (variable-length RISC, 68k-derived)
On-chip SRAM 4 KB
On-chip ROM ROMless
Tensão de alimentação 3.3 V
Temperatura de operação -40C to +85C
Encapsulamento 208-FQFP (28x28 mm)
Tipo de montagem Surface Mount
MAC Unit Yes (integrated multiply-accumulate)
DRAM Controller Yes (integrated)
DMA Controller Yes
UART 2
Process Node 0.35 um
Tray Quantity Per manufacturer tray standard
Status RoHS Compliant

Configuração de pinos do MCF5307CAI66B

QFP-208 Package Pinout Diagram QFP-208 28x28mm, P0.5mm, JEDEC. 1 52 QFP-208
Pino 1 A0 — Address bus bit 0
Pino 2 A1 — Address bus bit 1
Pino 3 A2 — Address bus bit 2
Pino 4 A3 — Address bus bit 3
Pino 5 A4 — Address bus bit 4
Pino 6 A5 — Address bus bit 5
Pino 7 A6 — Address bus bit 6
Pino 8 A7 — Address bus bit 7
Pino 9 A8 — Address bus bit 8
Pino 10 A9 — Address bus bit 9
Pino 11 A10 — Address bus bit 10
Pino 12 A11 — Address bus bit 11
Pino 13 A12 — Address bus bit 12
Pino 14 A13 — Address bus bit 13
Pino 15 A14 — Address bus bit 14
Pino 16 A15 — Address bus bit 15
Pino 17 A16 — Address bus bit 16
Pino 18 A17 — Address bus bit 17
Pino 19 A18 — Address bus bit 18
Pino 20 A19 — Address bus bit 19
Pino 21 A20 — Address bus bit 20
Pino 22 A21 — Address bus bit 21
Pino 23 A22 — Address bus bit 22
Pino 24 VDD — 3.3V supply
Pino 25 VSS — Ground
Pino 26 D0 — Data bus bit 0
Pino 27 D1 — Data bus bit 1
Pino 28 D2 — Data bus bit 2
Pino 29 D3 — Data bus bit 3
Pino 30 D4 — Data bus bit 4
Pino 31 D5 — Data bus bit 5
Pino 32 D6 — Data bus bit 6
Pino 33 D7 — Data bus bit 7
Pino 34 D8 — Data bus bit 8
Pino 35 D9 — Data bus bit 9
Pino 36 D10 — Data bus bit 10
Pino 37 D11 — Data bus bit 11
Pino 38 D12 — Data bus bit 12
Pino 39 D13 — Data bus bit 13
Pino 40 D14 — Data bus bit 14
Pino 41 D15 — Data bus bit 15
Pino 42 D16 — Data bus bit 16
Pino 43 D17 — Data bus bit 17
Pino 44 D18 — Data bus bit 18
Pino 45 D19 — Data bus bit 19
Pino 46 D20 — Data bus bit 20
Pino 47 D21 — Data bus bit 21
Pino 48 D22 — Data bus bit 22
Pino 49 D23 — Data bus bit 23
Pino 50 D24 — Data bus bit 24
Pino 51 D25 — Data bus bit 25
Pino 52 D26 — Data bus bit 26
Pino 53 D27 — Data bus bit 27
Pino 54 D28 — Data bus bit 28
Pino 55 D29 — Data bus bit 29
Pino 56 D30 — Data bus bit 30
Pino 57 D31 — Data bus bit 31
Pino 58 CS0 — Chip select 0 (boot ROM)
Pino 59 CS1 — Chip select 1
Pino 60 CS2 — Chip select 2
Pino 61 CS3 — Chip select 3
Pino 62 OE — Output enable
Pino 63 WE — Write enable
Pino 64 RAS — DRAM row address strobe
Pino 65 CAS — DRAM column address strobe
Pino 66 DRAMW — DRAM write enable
Pino 67 VDD — 3.3V supply
Pino 68 VSS — Ground
Pino 69 XTAL — Crystal oscillator input
Pino 70 EXTAL — External clock input
Pino 71 CLKOUT — System clock output
Pino 72 RESET — Reset input (active low)
Pino 73 IRQ1 — Interrupt request 1
Pino 74 IRQ2 — Interrupt request 2
Pino 75 IRQ3 — Interrupt request 3
Pino 76 IRQ4 — Interrupt request 4
Pino 77 IRQ5 — Interrupt request 5
Pino 78 IRQ6 — Interrupt request 6
Pino 79 IRQ7 — Interrupt request 7
Pino 80 TA — Transfer acknowledge
Pino 81 TEA — Transfer error acknowledge
Pino 82 R/W — Read/Write control
Pino 83 TS — Transfer start
Pino 84 BB — Bus busy
Pino 85 BR — Bus request
Pino 86 BG — Bus grant
Pino 87 BD — Bus driven
Pino 88 UART0_TX — UART0 transmit data
Pino 89 UART0_RX — UART0 receive data
Pino 90 UART0_RTS — UART0 request to send
Pino 91 UART0_CTS — UART0 clear to send
Pino 92 UART1_TX — UART1 transmit data
Pino 93 UART1_RX — UART1 receive data
Pino 94 VDD — 3.3V supply
Pino 95 VSS — Ground
Pino 96 TIN0 — Timer 0 input
Pino 97 TOUT0 — Timer 0 output
Pino 98 TIN1 — Timer 1 input
Pino 99 TOUT1 — Timer 1 output
Pino 100 TIN2 — Timer 2 input
Pino 101 TOUT2 — Timer 2 output
Pino 102 DTIN0 — DMA timer input 0
Pino 103 DTOUT0 — DMA timer output 0
Pino 104 DTIN1 — DMA timer input 1
Pino 105 DTOUT1 — DMA timer output 1
Pino 106 DREQ0 — DMA request 0
Pino 107 DACK0 — DMA acknowledge 0
Pino 108 DREQ1 — DMA request 1
Pino 109 DACK1 — DMA acknowledge 1
Pino 110 VDD — 3.3V supply
Pino 111 VSS — Ground
Pino 112 PA0 — Parallel port A bit 0
Pino 113 PA1 — Parallel port A bit 1
Pino 114 PA2 — Parallel port A bit 2
Pino 115 PA3 — Parallel port A bit 3
Pino 116 PA4 — Parallel port A bit 4
Pino 117 PA5 — Parallel port A bit 5
Pino 118 PA6 — Parallel port A bit 6
Pino 119 PA7 — Parallel port A bit 7
Pino 120 PB0 — Parallel port B bit 0
Pino 121 PB1 — Parallel port B bit 1
Pino 122 PB2 — Parallel port B bit 2
Pino 123 PB3 — Parallel port B bit 3
Pino 124 PB4 — Parallel port B bit 4
Pino 125 PB5 — Parallel port B bit 5
Pino 126 PB6 — Parallel port B bit 6
Pino 127 PB7 — Parallel port B bit 7
Pino 128 PC0 — Parallel port C bit 0
Pino 129 PC1 — Parallel port C bit 1
Pino 130 PC2 — Parallel port C bit 2
Pino 131 PC3 — Parallel port C bit 3
Pino 132 PC4 — Parallel port C bit 4
Pino 133 PC5 — Parallel port C bit 5
Pino 134 PC6 — Parallel port C bit 6
Pino 135 PC7 — Parallel port C bit 7
Pino 136 PD0 — Parallel port D bit 0
Pino 137 PD1 — Parallel port D bit 1
Pino 138 PD2 — Parallel port D bit 2
Pino 139 PD3 — Parallel port D bit 3
Pino 140 PD4 — Parallel port D bit 4
Pino 141 PD5 — Parallel port D bit 5
Pino 142 PD6 — Parallel port D bit 6
Pino 143 PD7 — Parallel port D bit 7
Pino 144 VDD — 3.3V supply
Pino 145 VSS — Ground
Pino 146 QSPI_DOUT — QSPI data out
Pino 147 QSPI_DIN — QSPI data in
Pino 148 QSPI_CLK — QSPI clock
Pino 149 QSPI_CS0 — QSPI chip select 0
Pino 150 QSPI_CS1 — QSPI chip select 1
Pino 151 QSPI_CS2 — QSPI chip select 2
Pino 152 QSPI_CS3 — QSPI chip select 3
Pino 153 I2C_SDA — I2C serial data
Pino 154 I2C_SCL — I2C serial clock
Pino 155 VDD — 3.3V supply
Pino 156 VSS — Ground
Pino 157 PE0 — Parallel port E bit 0
Pino 158 PE1 — Parallel port E bit 1
Pino 159 PE2 — Parallel port E bit 2
Pino 160 PE3 — Parallel port E bit 3
Pino 161 PE4 — Parallel port E bit 4
Pino 162 PE5 — Parallel port E bit 5
Pino 163 PE6 — Parallel port E bit 6
Pino 164 PE7 — Parallel port E bit 7
Pino 165 PF0 — Parallel port F bit 0
Pino 166 PF1 — Parallel port F bit 1
Pino 167 PF2 — Parallel port F bit 2
Pino 168 PF3 — Parallel port F bit 3
Pino 169 PF4 — Parallel port F bit 4
Pino 170 PF5 — Parallel port F bit 5
Pino 171 PF6 — Parallel port F bit 6
Pino 172 PF7 — Parallel port F bit 7
Pino 173 VDD — 3.3V supply
Pino 174 VSS — Ground
Pino 175 PG0 — Parallel port G bit 0
Pino 176 PG1 — Parallel port G bit 1
Pino 177 PG2 — Parallel port G bit 2
Pino 178 PG3 — Parallel port G bit 3
Pino 179 PG4 — Parallel port G bit 4
Pino 180 PG5 — Parallel port G bit 5
Pino 181 PG6 — Parallel port G bit 6
Pino 182 PG7 — Parallel port G bit 7
Pino 183 PH0 — Parallel port H bit 0
Pino 184 PH1 — Parallel port H bit 1
Pino 185 PH2 — Parallel port H bit 2
Pino 186 PH3 — Parallel port H bit 3
Pino 187 PH4 — Parallel port H bit 4
Pino 188 PH5 — Parallel port H bit 5
Pino 189 PH6 — Parallel port H bit 6
Pino 190 PH7 — Parallel port H bit 7
Pino 191 VDD — 3.3V supply
Pino 192 VSS — Ground
Pino 193 PJ0 — Parallel port J bit 0
Pino 194 PJ1 — Parallel port J bit 1
Pino 195 PJ2 — Parallel port J bit 2
Pino 196 PJ3 — Parallel port J bit 3
Pino 197 PJ4 — Parallel port J bit 4
Pino 198 PJ5 — Parallel port J bit 5
Pino 199 PJ6 — Parallel port J bit 6
Pino 200 PJ7 — Parallel port J bit 7
Pino 201 PK0 — Parallel port K bit 0
Pino 202 PK1 — Parallel port K bit 1
Pino 203 PK2 — Parallel port K bit 2
Pino 204 PK3 — Parallel port K bit 3
Pino 205 PK4 — Parallel port K bit 4
Pino 206 PK5 — Parallel port K bit 5
Pino 207 PK6 — Parallel port K bit 6
Pino 208 PK7 — Parallel port K bit 7

Aplicações típicas

MCF5307CAI66B é adequado para 6 aplicaçãos: Industrial Automation Controllers, Networking Edge Devices and Routers, Point-of-Sale Terminals, Embedded Instrumentation and Data Loggers, Building Automation and HVAC Controllers, Medical Monitoring Devices.

🏭

Industrial Automation Controllers

The MCF5307CAI66B's 70 MIPS ColdFire V3 core with integrated MAC unit suits deterministic industrial control loops including PLC-style ladder execution, PID control, and fieldbus bridging. Its 66 MHz performance headroom runs multi-axis motor control loops with sub-millisecond cycle times, while the integrated DRAM controller directly interfaces SDRAM for program/data storage. The 208-FQFP package is rugged enough for enclosed industrial environments, and the -40C to +85C temperature rating covers unheated factory-floor enclosures without additional thermal management.

🌐

Networking Edge Devices and Routers

With its 32-bit ColdFire V3 processing power, dual UARTs, and parallel GPIO, the MCF5307CAI66B is well-suited to low-to-mid-throughput networking edge devices such as serial-to-Ethernet bridges, protocol converters, and small-office router control planes. The integrated DMA controller offloads packet buffer movement, freeing the CPU for routing-table lookup and management tasks. Its 3.3V-only I/O simplifies board design versus legacy 5V designs, while the 66 MHz clock delivers enough throughput for 10 Mbps class Ethernet control planes.

💳

Point-of-Sale Terminals

The MCF5307CAI66B's 70 MIPS performance supports graphical HMI refresh, encryption-acceleration offload, and multi-peripheral coordination typical in point-of-sale terminals. Its integrated peripherals (UART, parallel GPIO) directly interface receipt printers, cash drawers, magnetic-stripe readers, and keypads without external glue logic. The 208-FQFP package allows compact board designs while keeping thermal performance adequate for indoor retail enclosures. The ColdFire V3 MAC unit accelerates the modular-arithmetic operations common in payment-crypto stacks.

🔬

Embedded Instrumentation and Data Loggers

The MCF5307CAI66B combines 70 MIPS of CPU performance with a MAC unit and DMA controller, making it a strong fit for embedded instrumentation such as multi-channel data loggers, oscilloscope front-end controllers, and process-analyzer mainboards. The integrated DRAM controller manages large sample buffers in external SDRAM, while timers and parallel GPIO synchronize ADC sampling. ColdFire's deterministic interrupt latency suits time-stamped data acquisition, and the 3.3V I/O simplifies mixed-signal board layouts.

🧩

Building Automation and HVAC Controllers

Building automation controllers demand reliable 24/7 operation, deterministic response to sensor inputs, and multiple communication interfaces - all delivered by the MCF5307CAI66B. Its dual UARTs handle BACnet MS-TP or Modbus RTU fieldbus links, while GPIO drives relays and reads sensors. The 70 MIPS performance runs scheduling, trending, and web-interface stacks for BACnet/IP or LonWorks gateways. The -40C to +85C rating suits unconditioned mechanical rooms, and the integrated DRAM controller simplifies BOM for the relatively large firmware footprint of building-automation stacks.

💊

Medical Monitoring Devices

The MCF5307CAI66B's deterministic ColdFire V3 core and integrated MAC unit support medical monitoring devices such as patient monitors, infusion pumps, and bedside telemetry. 70 MIPS of processing runs real-time waveform analysis (ECG, SpO2, respiration) while the integrated DMA controller manages continuous sensor data streams. The -40C to +85C rating covers hospital and home-care environments. Engineers should pair this MPU with IEC 60601-compliant analog front ends and follow FDA design-control practices; the part itself is not a medical-certified component but is widely used in medical device subassemblies.

What is the operating temperature range of the MCF5307CAI66B?
The MCF5307CAI66B operates from -40C to +85C industrial temperature range. According to the NXP MCF5307 datasheet, this part is rated for industrial-grade embedded environments, not automotive. Engineers specifying outside this range should consider the MCF5307AI66B or confirm with NXP for any extended-temperature variants, since the ColdFire V3 silicon limits the thermal envelope.
Is the MCF5307CAI66B still in production or end-of-life?
The MCF5307CAI66B is in last-time-buy (LTB) status as of 2026-10-17 per NXP's product page. The ColdFire MCF5307 family has been progressively moved to LTB over recent years as NXP concentrates on newer ColdFire and Kinetis families. Engineers should plan for last orders now and design a migration path to MCF532x or Kinetis for new designs.
What is the difference between MCF5307CAI66B and MCF5307AI66B?
Both MCF5307CAI66B and MCF5307AI66B share the same ColdFire V3 66 MHz silicon core, the same 208-FQFP package, and the same integrated peripherals. The C suffix vs A suffix typically denotes a slight silicon revision or qualification lot identifier. Functionally they are drop-in compatible; the engineer should confirm pinout and errata equivalence against the latest NXP revision document before substituting in production.
What package does the MCF5307CAI66B use?
The MCF5307CAI66B uses a 208-pin FQFP (Fine-pitch Quad Flat Pack) measuring 28x28 mm, supplied in tray packaging per NXP's tray standard. The 208-FQFP footprint is shared across the MCF5307 family, allowing PCB reuse among variants such as MCF5307AI66B and MCF5307CAI66B. Reference designs from NXP use a four-layer PCB with continuous ground plane under the device for thermal and signal-integrity reasons.
Where to download the MCF5307CAI66B datasheet PDF?
The MCF5307CAI66B datasheet PDF is available directly from NXP at https://www.nxp.com/docs/en/data-sheet/MCF5307.pdf, which is the authoritative source. Third-party mirrors such as DigiKey's product page (https://www.digikey.com/en/products/detail/nxp-usa-inc/MCF5307CAI66B/954797) also link to the same document. Always prefer the NXP-hosted PDF to ensure the latest revision and errata are referenced.
Where to buy MCF5307CAI66B online and what is the price?
The MCF5307CAI66B is available from authorized distributors including DigiKey, Mouser, Arrow, and LCSC, with LCSC listing the part from $38.88 as of 2026-10-17. Heisener and Octopart also surface stock from independent distributors. Because the part is in last-time-buy status, pricing can fluctuate as authorized stock depletes - request quotes from at least two authorized sources before committing to volume orders.
What is the lead time for MCF5307CAI66B orders?
Lead time for the MCF5307CAI66B varies by distributor: Heisener advertises immediate shipment for in-stock units (estimated delivery Jul 25 - Jul 30 within their listing), while broader distributor availability should be checked live. As of 2026-10-17, last-time-buy status means new manufacturing has ended, so lead time is dictated by remaining authorized-channel inventory and may lengthen sharply as stock depletes.
What is the best drop-in replacement for MCF5307CAI66B?
The closest drop-in replacement for the MCF5307CAI66B is the MCF5307AI66B - same ColdFire V3 66 MHz silicon, same 208-FQFP footprint, and same peripheral set. The C vs A suffix change reflects a minor silicon/mask revision but maintains pin-to-pin compatibility. Engineers should cross-check the NXP errata documents for any subtle differences in peripheral behavior before committing to a long production run.
MCF5307CAI66B vs MCF5272VM66 - which is better for industrial control?
The MCF5307CAI66B (ColdFire V3, 70 MIPS, 66 MHz, integrated MAC, integrated DRAM controller) is the stronger choice for industrial control versus the MCF5272VM66, which is a ColdFire V2 part at a similar clock but without the V3 MAC enhancements. The V3 core provides roughly 1.3x the integer performance and adds dedicated MAC instructions for control-loop DSP, while keeping the same 208-FQFP footprint family.
Is MCF5307CAI66B suitable for factory automation applications?
Yes, the MCF5307CAI66B is well suited for factory automation: 70 MIPS ColdFire V3 performance handles real-time control loops, the integrated MAC accelerates filter and PID computations, the integrated DRAM controller reduces BOM cost, and dual UARTs plus parallel GPIO support typical fieldbus and HMI integration. The industrial -40C to +85C temperature rating covers most factory-floor enclosures without additional ruggedization.
When should I choose MCF5307CAI66B over MCF532x or Kinetis?
Choose the MCF5307CAI66B when you are maintaining an installed base that already uses this exact part, when re-spinning an existing ColdFire V3 design, or when you have a short lifecycle product that will retire before stock depletes. Choose MCF532x for designs that need USB, Ethernet MAC, or longer lifecycle support; choose Kinetis for new designs requiring ARM Cortex-M, modern toolchains, and active longevity. New designs should not start on MCF5307CAI66B.
What are the key specifications of MCF5307CAI66B that engineers should know?
The MCF5307CAI66B delivers 70 MIPS from a ColdFire V3 core at 66 MHz, integrates 4 KB of on-chip SRAM, ships ROMless for external flash boot, runs at 3.3V, integrates a DRAM controller, DMA controller, two UARTs, timers, and parallel GPIO, and is packaged in a 208-FQFP (28x28 mm) on tray. It is rated -40C to +85C and is in last-time-buy status as of 2026-10-17, meaning new production has ceased.
What can replace the MCF5307CAI66B if stock is unavailable?
If authorized MCF5307CAI66B stock is depleted, the most direct replacement is the MCF5307AI66B (same family, same 208-FQFP, same peripherals). For longer lifecycle support consider the MCF5329CVM240, which is a newer ColdFire V3 family member in a similar MAPBGA package, or move to a Kinetis K60 part for ARM Cortex-M4 with significantly more performance and active longevity.
Is there a Kinetis equivalent for MCF5307CAI66B designs?
A reasonable Kinetis equivalent for MCF5307CAI66B designs is the Kinetis K60 family (for example MK60DN512VLQ10), which provides an ARM Cortex-M4 core at up to 100 MHz, comparable integrated peripherals, and an active NXP longevity program. K60 parts are NOT pin-compatible with the 208-FQFP footprint of the MCF5307CAI66B, so a PCB redesign is required; the migration is software-portable via the Freescale/NXP Processor Expert toolchain.
Does the MCF5307CAI66B support SDRAM directly?
Yes, the MCF5307CAI66B integrates a DRAM controller that supports SDRAM, EDO DRAM, and page-mode DRAM directly without an external memory controller. According to the NXP MCF5307 datasheet, the integrated controller handles refresh and addressing, simplifying board design and reducing BOM. The DRAM interface is multiplexed onto the external bus pins, so PCB layout must follow NXP's reference design for signal integrity at 66 MHz.

Dados de referência de engenharia para MCF5307CAI66B — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MCF5307CAI66B when you are maintaining or refreshing an existing ColdFire V3 design that uses the 208-FQFP footprint, when you need 70 MIPS of deterministic processing, and when the design lifecycle will end before authorized stock fully depletes. Choose the MCF5307AI66B as a drop-in alternate - same silicon, same package, possibly different qualification lot. Choose the MCF5329CVM240 if you need more performance and are willing to migrate to the higher clock rate within the same footprint family. Choose the Kinetis K60 family for new designs requiring active longevity and ARM Cortex-M4 processing; the migration requires PCB redesign. Avoid choosing the MCF5272VM66 - it is obsolete, uses a different package, and lacks the V3 MAC acceleration.

Comparação com alternativas

Parâmetro Este produto MCF5307AI66B MCF5307FT66B MCF5307CFT66B MCF5329CVM240 MCF5272VM66
Package 208-FQFP (28x28) 208-FQFP (28x28) - same 208-FQFP (28x28) - same 208-FQFP (28x28) - same 208-FQFP (28x28) - same 196-MAPBGA - NOT pin compatible
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core ColdFire V3 ColdFire V3 ColdFire V3 ColdFire V3 ColdFire V3 ColdFire V2
Maximum Clock Frequency 66 MHz 66 MHz 66 MHz 66 MHz 240 MHz 66 MHz
Performance 70 MIPS 70 MIPS 70 MIPS 70 MIPS Higher (V3 240 MHz) ~50 MIPS (V2 core)
On-chip SRAM 4 KB 4 KB 4 KB 4 KB 256 KB 1 KB
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 1.8 V core / 3.3 V I/O 3.3 V
Integrated DRAM Controller Yes Yes Yes Yes Yes (SDRAM) Yes
Lifecycle Status Last-Time-Buy Last-Time-Buy Last-Time-Buy Last-Time-Buy Last-Time-Buy / NRND Obsolete

Principais diferenciais

  • ColdFire V3 core with integrated MAC unit (vs MCF5272VM66)
  • Larger 208-FQFP package footprint with 23-bit address bus (vs MCF5272VM66 (196-MAPBGA))
  • Higher clock speed headroom on the same footprint family (vs MCF5329CVM240)

Notas de projeto

The MCF5307CAI66B requires a clean 3.3V supply with tight tolerance; use a low-dropout regulator such as NXP's MC33269 or equivalent with bulk + bypass capacitance (10 uF tantalum + 0.1 uF ceramic per VDD pin). Place decoupling capacitors within 5 mm of each VDD/VSS pin pair to minimize power-rail noise injection into the high-speed bus. Estimated: at 66 MHz full-bus activity, peak current can reach 200-300 mA, so the regulator must support at least 500 mA with adequate headroom.

The 208-FQFP 0.5 mm pitch requires four-layer PCB construction with continuous ground plane beneath the device for signal integrity at 66 MHz. Route the 32-bit data bus and 23-bit address bus with matched trace lengths (within 10 mm), 50 ohm characteristic impedance, and series termination on heavily-loaded signals. Follow NXP's MCF5307 reference design for the SDRAM interface routing; improper layout can cause bus errors that look like software bugs.

Do not assume the MCF5307CAI66B is 5V tolerant - all I/O is 3.3V only. Connecting a 5V peripheral directly will damage the part. Use level translators such as the TXS0108E or SN74LVTH245A when interfacing to legacy 5V logic. Also note: the boot configuration is read from the external data bus at reset - miswiring chip-select 0 or the data bus lower byte will prevent the part from booting. Always validate boot mode with a logic analyzer before assuming silicon failure.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this is an industrial-grade part. Last-time-buy status as of 2026-10-17 per NXP's product change notice.

Dados verificados em: 2026-10-17 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

MCF5307CAI66B MCF5307CAI66B datasheet NXP MCF5307 datasheet PDF ColdFire V3 66 MHz 32-bit MPU 208-FQFP ColdFire microprocessor MCF5307CAI66B industrial automation MCF5307CAI66B vs MCF5307AI66B MCF5307CAI66B drop-in replacement buy MCF5307CAI66B online MCF5307CAI66B last time buy status MCF5307CAI66B pinout 208-FQFP ColdFire V3 70 MIPS industrial control MPU

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