MCZ33903BS5EKR2 - SBC Gen2 w/ HS CAN & LIN | NXP | 32-SSOP-EP
N.º da peça: MCZ33903BS5EKR2 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.65 | $76,50 |
| 100 | $6.42 | $642,00 |
| 500 | $5.55 | $2.775,00 |
| 1.000 | $4.8 | $4.800,00 |
MCZ33903BS5EKR2 Visão geral
A System Basis Chip (SBC) is an automotive power-supply and communication IC that combines a voltage regulator, bus transceivers (CAN/LIN), and digital control logic into one package. In the broader component hierarchy it sits between a discrete transceiver + LDO combination and a full automotive microcontroller, reducing PCB area and BOM count in body control modules, gateways, and sensor clusters.
Key features of the MCZ33903BS5EKR2 include AEC-Q100 Grade 1 qualification (-40C to +125C), integrated HS-CAN transceiver supporting 1 Mb/s, LIN 2.1 transceiver with internal pull-up, four wake-input pins for low-power standby modes, watchdog timer, and an SPI-controlled diagnostic/mode register. The 32-SSOP-EP exposed pad provides ~28 C/W thermal resistance, sufficient for the ~300mW typical dissipation.
Architecturally, the device uses a switched-mode or linear 5V pre-regulator (the data summary indicates 'HS 5V') feeding an internal LDO for logic, while a charge pump supplies the CAN bus driver for true dominant-output symmetry. The LIN channel uses an internal slope control for low-EMI operation.
Typical applications include automotive body control modules, HVAC controllers, seat/window/liftgate modules, steering-angle sensor interfaces, lighting ECUs, and CAN/LIN gateway nodes. Its 27V load-dump tolerance makes it suited to directly connected 12V battery rails.
A critical design tip: the exposed pad must be soldered to a ground plane for thermal dissipation and ESD performance. Use 100nF X7R bypass close to VCC and follow NXP's AN4760 layout guidance for CAN bus impedance control (60 ohm differential, 120 ohm termination at each bus end).
This page synthesizes distributor pricing, AEC-Q100 context, and pin-compatible same-family alternatives that go beyond the manufacturer datasheet, providing a single sourcing and selection reference for automotive hardware engineers.
Alternativas drop-in para MCZ33903BS5EKR2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCZ33903BS5EKR2 (mesmo formato e footprint) — diferindo em Package, Product Type, Watchdog.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCZ33905BS5EKR2
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MCZ33905DS5EKR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCZ33903BS5EK
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC33978AEKR2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TLE9263-3BQX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MCZ33903BS5EKR2 Especificações
| Product Type | System Basis Chip (SBC) Gen2 |
| Função | HS CAN + LIN Interface with 5V Regulator |
| Encapsulamento | 32-SSOP-EP (Exposed Pad) |
| Operating Voltage (Battery) | 5.5 V to 27 V |
| Load-Dump Tolerance | 40 V |
| CAN Interface | High-Speed CAN (ISO 11898-5, up to 1 Mb/s) |
| LIN Interface | LIN 2.1 compliant |
| Number of Wake Inputs | 4 |
| Control Interface | SPI (5V logic) |
| Temperatura de operação | -40 C to +125 C (AEC-Q100 Grade 1) |
| AEC-Q100 Qualification | Qualified |
| Lead-Free / RoHS | Lead Free / RoHS Compliant |
| Tipo de montagem | Surface Mount |
| Watchdog | Window watchdog integrated |
| Packaging Type | Tape and Reel (R2 suffix) |
Configuração de pinos do MCZ33903BS5EKR2
| Pino 1 | WAKE1 — Wake input 1 (digital, edge triggered) |
| Pino 2 | WAKE2 — Wake input 2 (digital, edge triggered) |
| Pino 3 | WAKE3 — Wake input 3 (digital, edge triggered) |
| Pino 4 | WAKE4 — Wake input 4 (digital, edge triggered) |
| Pino 5 | GND — Ground reference |
| Pino 6 | VCC — 5V regulator output (powers MCU and external circuitry) |
| Pino 7 | VBAT — Battery supply input (5.5V to 27V nominal, 40V transient) |
| Pino 8 | RXD_CAN — CAN receive data output (to MCU) |
| Pino 9 | TXD_CAN — CAN transmit data input (from MCU) |
| Pino 10 | CANH — CAN high-side bus line |
| Pino 11 | CANL — CAN low-side bus line |
| Pino 12 | SPLIT — CAN bus common-mode stabilization (optional capacitor) |
| Pino 13 | LIN — LIN bus line (LIN 2.1) |
| Pino 14 | RXD_LIN — LIN receive data output (to MCU) |
| Pino 15 | TXD_LIN — LIN transmit data input (from MCU) |
| Pino 16 | CS — SPI chip select (active low, from MCU) |
| Pino 17 | SCLK — SPI clock (from MCU) |
| Pino 18 | MOSI — SPI master-out/slave-in (data from MCU) |
| Pino 19 | MISO — SPI master-in/slave-out (data to MCU) |
| Pino 20 | INT — Interrupt output (active low, alerts MCU of faults/wake events) |
| Pino 21 | RST — Reset output to MCU (open drain) |
| Pino 22 | WD_EN — Watchdog enable input |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | VSUP — Voltage supply pin (battery) |
| Pino 27 | VSUP — Voltage supply pin (battery, redundant bond) |
| Pino 28 | NC — Not connected (per datasheet) |
| Pino 29 | NC — Not connected (per datasheet) |
| Pino 30 | NC — Not connected (per datasheet) |
| Pino 31 | NC — Not connected (per datasheet) |
| Pino 32 | NC — Not connected (per datasheet) |
Aplicações típicas
MCZ33903BS5EKR2 é adequado para 6 aplicaçãos: Automotive Body Control Module (BCM), HVAC Control Module, Seat and Window Lift Module, Steering Angle Sensor Interface, Lighting ECU (Headlamp/Tail Control), CAN/LIN Gateway Node.
Automotive Body Control Module (BCM)
The MCZ33903BS5EKR2 fits BCM designs because it integrates a 5V regulator, HS CAN for inter-module communication, LIN for window/seat/mirror nodes, and four wake inputs in one 32-SSOP-EP IC. The 5.5V-27V supply range (with 40V load-dump tolerance) allows direct connection to the 12V battery rail. Its AEC-Q100 Grade 1 qualification and -40C to +125C operating range satisfy under-hood and cabin ambient requirements. Place the IC near the BCM connector, route CANH/CANL with 60 ohm differential impedance, and use the SPI bus to switch between Normal/Standby/Sleep modes for quiescent-current management.
Recomendado
HVAC Control Module
HVAC modules use the MCZ33903BS5EKR2 to communicate over HS CAN with the rest of the vehicle network while driving LIN actuators (blower, mode doors, blend stepper). The internal 5V regulator powers the MCU and small sensors; the SPI interface lets the MCU monitor bus health and trigger diagnostic trouble codes. The 40V load-dump rating is essential since HVAC blowers share inductive motor loads on the same battery rail. Add 100nF ceramic bypass at VCC and a Schottky clamp at VBAT for ESD protection.
Recomendado
Seat and Window Lift Module
Seat and window modules benefit from the MCZ33903BS5EKR2's HS CAN backbone and LIN sub-bus for local motor control ICs. The four wake inputs support direct switch sensing without an extra I/O expander, and the integrated 5V rail reduces BOM versus a discrete LDO plus separate transceiver. The 32-SSOP-EP exposed pad provides ~28 C/W thermal performance for the moderate ~300mW dissipation typical in seat/window applications.
Recomendado
Steering Angle Sensor Interface
The MCZ33903BS5EKR2 hosts the 5V supply for a steering-angle sensor MCU and forwards HS CAN messages to the chassis network. Its low standby current (a few hundred uA in Sleep mode with wake pin monitoring) keeps quiescent drain below typical 100 uA budgets when the ignition is off. The exposed pad must be soldered to a continuous ground pour for ESD robustness, since steering-column modules sit near high-current inductive loads.
Recomendado
Lighting ECU (Headlamp/Tail Control)
Lighting ECUs that drive matrix-LED or dynamic turn indicators use the MCZ33903BS5EKR2 to handle HS CAN traffic from the BCM and to provide a regulated 5V for the LED driver stage. The LIN sub-bus can drive LED matrix controllers like NXP's MC33696 or other LIN slaves. The 5.5V-27V range handles load-dump events from solenoids, and AEC-Q100 Grade 1 supports under-hood placement near the headlamps.
Recomendado
CAN/LIN Gateway Node
As a gateway, the MCZ33903BS5EKR2 bridges a high-speed CAN segment to a LIN sub-cluster, with the companion MCU running a routing table. The device's two bus interfaces are exposed on dedicated pins (CANH/CANL and LIN) which simplifies the routing layout; the integrated 5V regulator eliminates a separate LDO. Place 120 ohm CAN termination at each end of the high-speed bus, and use shielded twisted pair for runs >1 meter.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCZ33903BS5EKR2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCZ33905BS5EKR2 | MCZ33905DS5EKR2 | MCZ33903BS5EK | MC33978AEKR2 |
|---|---|---|---|---|---|
| Package | 32-SSOP-EP | 32-SSOP-EP - same | 32-SSOP-EP - same | 32-SSOP-EP - same | 32-SSOP-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Function | SBC + HS CAN + LIN + 5V LDO | SBC + HS CAN + LIN + 5V LDO (wider VIN) | SBC + HS CAN + LIN + 5V LDO | SBC + HS CAN + LIN + 5V LDO | Switch/contact monitor (no CAN/LIN/reg) |
| Battery Input Range | 5.5 V to 27 V | 5V/9V/12V/15V/18V/24V (wider) | 5.5 V to 27 V | 5.5 V to 27 V | Switch monitor only |
| Load Dump Tolerance | 40 V | 40 V | 40 V | 40 V | N/A |
| CAN Bit Rate | Up to 1 Mb/s | Up to 1 Mb/s | 20 kbps Normal/Sleep variant | Up to 1 Mb/s | N/A |
| LIN Compliance | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 | N/A |
| AEC-Q100 Grade | Grade 1 (-40C to +125C) | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
Principais diferenciais
- Gen2 SBC with HS CAN + LIN in a single IC (vs MC33978AEKR2)
- Narrower battery input (5.5V-27V) versus Gen3 wider-range (vs MCZ33905BS5EKR2)
- Tape-and-Reel packaging (R2) vs tube (EK) (vs MCZ33903BS5EK)
Notas de projeto
The 32-SSOP-EP exposed pad must be soldered to a continuous ground copper plane to achieve the datasheet's theta-JA. Without the exposed-pad solder connection, the package derates significantly and the internal 5V regulator's thermal-shutdown may trip during sustained CAN/LIN activity. Use at least 1 cm x 1 cm of copper directly beneath the IC, with thermal vias to inner planes.
Route the CANH/CANL traces as a 60-ohm differential pair (100-ohm differential for some ISO variants - check NXP AN4760). Place 120-ohm termination at each end of the high-speed CAN bus only - not at intermediate nodes. Keep the CAN bus traces away from switching power traces by at least 3 mm. Place a 100nF X7R 0603 bypass as close as possible to each VCC pin.
Do not leave unused NC pins floating on the PCB - per the NXP datasheet, NC pins should be tied to GND for EMI robustness. The VCC 5V regulator output has limited current capability (verify exact rating from datasheet electrical characteristics table); exceeding it triggers thermal shutdown. Avoid routing the LIN trace across the CAN bus physically; they should be on separate layers or separated by ground pour.
Informações de conformidade
AEC-Q100 Grade 1 qualified per NXP product family datasheet. RoHS and lead-free status confirmed by DigiKey product listing. REACH and conflict-minerals compliance follows NXP's standard corporate declarations.
