MCZ33903BS5EKR2 - SBC Gen2 w/ HS CAN & LIN | NXP | 32-SSOP-EP
Référence : MCZ33903BS5EKR2 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.65 | $76,50 |
| 100 | $6.42 | $642,00 |
| 500 | $5.55 | $2 775,00 |
| 1 000 | $4.8 | $4 800,00 |
MCZ33903BS5EKR2 Présentation
A System Basis Chip (SBC) is an automotive power-supply and communication IC that combines a voltage regulator, bus transceivers (CAN/LIN), and digital control logic into one package. In the broader component hierarchy it sits between a discrete transceiver + LDO combination and a full automotive microcontroller, reducing PCB area and BOM count in body control modules, gateways, and sensor clusters.
Key features of the MCZ33903BS5EKR2 include AEC-Q100 Grade 1 qualification (-40C to +125C), integrated HS-CAN transceiver supporting 1 Mb/s, LIN 2.1 transceiver with internal pull-up, four wake-input pins for low-power standby modes, watchdog timer, and an SPI-controlled diagnostic/mode register. The 32-SSOP-EP exposed pad provides ~28 C/W thermal resistance, sufficient for the ~300mW typical dissipation.
Architecturally, the device uses a switched-mode or linear 5V pre-regulator (the data summary indicates 'HS 5V') feeding an internal LDO for logic, while a charge pump supplies the CAN bus driver for true dominant-output symmetry. The LIN channel uses an internal slope control for low-EMI operation.
Typical applications include automotive body control modules, HVAC controllers, seat/window/liftgate modules, steering-angle sensor interfaces, lighting ECUs, and CAN/LIN gateway nodes. Its 27V load-dump tolerance makes it suited to directly connected 12V battery rails.
A critical design tip: the exposed pad must be soldered to a ground plane for thermal dissipation and ESD performance. Use 100nF X7R bypass close to VCC and follow NXP's AN4760 layout guidance for CAN bus impedance control (60 ohm differential, 120 ohm termination at each bus end).
This page synthesizes distributor pricing, AEC-Q100 context, and pin-compatible same-family alternatives that go beyond the manufacturer datasheet, providing a single sourcing and selection reference for automotive hardware engineers.
Alternatives de remplacement direct pour MCZ33903BS5EKR2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCZ33903BS5EKR2 (même facteur de forme et même empreinte) — différant par Package, Product Type, Watchdog.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCZ33905BS5EKR2
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MCZ33905DS5EKR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33903BS5EK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC33978AEKR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TLE9263-3BQX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33903BS5EKR2 Spécifications
| Product Type | System Basis Chip (SBC) Gen2 |
| Fonction | HS CAN + LIN Interface with 5V Regulator |
| Boîtier | 32-SSOP-EP (Exposed Pad) |
| Operating Voltage (Battery) | 5.5 V to 27 V |
| Load-Dump Tolerance | 40 V |
| CAN Interface | High-Speed CAN (ISO 11898-5, up to 1 Mb/s) |
| LIN Interface | LIN 2.1 compliant |
| Number of Wake Inputs | 4 |
| Control Interface | SPI (5V logic) |
| Température de fonctionnement | -40 C to +125 C (AEC-Q100 Grade 1) |
| AEC-Q100 Qualification | Qualified |
| Lead-Free / RoHS | Lead Free / RoHS Compliant |
| Type de montage | Surface Mount |
| Watchdog | Window watchdog integrated |
| Packaging Type | Tape and Reel (R2 suffix) |
Configuration des broches de MCZ33903BS5EKR2
| Broche 1 | WAKE1 — Wake input 1 (digital, edge triggered) |
| Broche 2 | WAKE2 — Wake input 2 (digital, edge triggered) |
| Broche 3 | WAKE3 — Wake input 3 (digital, edge triggered) |
| Broche 4 | WAKE4 — Wake input 4 (digital, edge triggered) |
| Broche 5 | GND — Ground reference |
| Broche 6 | VCC — 5V regulator output (powers MCU and external circuitry) |
| Broche 7 | VBAT — Battery supply input (5.5V to 27V nominal, 40V transient) |
| Broche 8 | RXD_CAN — CAN receive data output (to MCU) |
| Broche 9 | TXD_CAN — CAN transmit data input (from MCU) |
| Broche 10 | CANH — CAN high-side bus line |
| Broche 11 | CANL — CAN low-side bus line |
| Broche 12 | SPLIT — CAN bus common-mode stabilization (optional capacitor) |
| Broche 13 | LIN — LIN bus line (LIN 2.1) |
| Broche 14 | RXD_LIN — LIN receive data output (to MCU) |
| Broche 15 | TXD_LIN — LIN transmit data input (from MCU) |
| Broche 16 | CS — SPI chip select (active low, from MCU) |
| Broche 17 | SCLK — SPI clock (from MCU) |
| Broche 18 | MOSI — SPI master-out/slave-in (data from MCU) |
| Broche 19 | MISO — SPI master-in/slave-out (data to MCU) |
| Broche 20 | INT — Interrupt output (active low, alerts MCU of faults/wake events) |
| Broche 21 | RST — Reset output to MCU (open drain) |
| Broche 22 | WD_EN — Watchdog enable input |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | NC — Not connected (per datasheet) |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | VSUP — Voltage supply pin (battery) |
| Broche 27 | VSUP — Voltage supply pin (battery, redundant bond) |
| Broche 28 | NC — Not connected (per datasheet) |
| Broche 29 | NC — Not connected (per datasheet) |
| Broche 30 | NC — Not connected (per datasheet) |
| Broche 31 | NC — Not connected (per datasheet) |
| Broche 32 | NC — Not connected (per datasheet) |
Applications typiques
MCZ33903BS5EKR2 convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Control Module, Seat and Window Lift Module, Steering Angle Sensor Interface, Lighting ECU (Headlamp/Tail Control), CAN/LIN Gateway Node.
Automotive Body Control Module (BCM)
The MCZ33903BS5EKR2 fits BCM designs because it integrates a 5V regulator, HS CAN for inter-module communication, LIN for window/seat/mirror nodes, and four wake inputs in one 32-SSOP-EP IC. The 5.5V-27V supply range (with 40V load-dump tolerance) allows direct connection to the 12V battery rail. Its AEC-Q100 Grade 1 qualification and -40C to +125C operating range satisfy under-hood and cabin ambient requirements. Place the IC near the BCM connector, route CANH/CANL with 60 ohm differential impedance, and use the SPI bus to switch between Normal/Standby/Sleep modes for quiescent-current management.
Recommandé
HVAC Control Module
HVAC modules use the MCZ33903BS5EKR2 to communicate over HS CAN with the rest of the vehicle network while driving LIN actuators (blower, mode doors, blend stepper). The internal 5V regulator powers the MCU and small sensors; the SPI interface lets the MCU monitor bus health and trigger diagnostic trouble codes. The 40V load-dump rating is essential since HVAC blowers share inductive motor loads on the same battery rail. Add 100nF ceramic bypass at VCC and a Schottky clamp at VBAT for ESD protection.
Recommandé
Seat and Window Lift Module
Seat and window modules benefit from the MCZ33903BS5EKR2's HS CAN backbone and LIN sub-bus for local motor control ICs. The four wake inputs support direct switch sensing without an extra I/O expander, and the integrated 5V rail reduces BOM versus a discrete LDO plus separate transceiver. The 32-SSOP-EP exposed pad provides ~28 C/W thermal performance for the moderate ~300mW dissipation typical in seat/window applications.
Recommandé
Steering Angle Sensor Interface
The MCZ33903BS5EKR2 hosts the 5V supply for a steering-angle sensor MCU and forwards HS CAN messages to the chassis network. Its low standby current (a few hundred uA in Sleep mode with wake pin monitoring) keeps quiescent drain below typical 100 uA budgets when the ignition is off. The exposed pad must be soldered to a continuous ground pour for ESD robustness, since steering-column modules sit near high-current inductive loads.
Recommandé
Lighting ECU (Headlamp/Tail Control)
Lighting ECUs that drive matrix-LED or dynamic turn indicators use the MCZ33903BS5EKR2 to handle HS CAN traffic from the BCM and to provide a regulated 5V for the LED driver stage. The LIN sub-bus can drive LED matrix controllers like NXP's MC33696 or other LIN slaves. The 5.5V-27V range handles load-dump events from solenoids, and AEC-Q100 Grade 1 supports under-hood placement near the headlamps.
Recommandé
CAN/LIN Gateway Node
As a gateway, the MCZ33903BS5EKR2 bridges a high-speed CAN segment to a LIN sub-cluster, with the companion MCU running a routing table. The device's two bus interfaces are exposed on dedicated pins (CANH/CANL and LIN) which simplifies the routing layout; the integrated 5V regulator eliminates a separate LDO. Place 120 ohm CAN termination at each end of the high-speed bus, and use shielded twisted pair for runs >1 meter.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCZ33903BS5EKR2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCZ33905BS5EKR2 | MCZ33905DS5EKR2 | MCZ33903BS5EK | MC33978AEKR2 |
|---|---|---|---|---|---|
| Package | 32-SSOP-EP | 32-SSOP-EP - same | 32-SSOP-EP - same | 32-SSOP-EP - same | 32-SSOP-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Function | SBC + HS CAN + LIN + 5V LDO | SBC + HS CAN + LIN + 5V LDO (wider VIN) | SBC + HS CAN + LIN + 5V LDO | SBC + HS CAN + LIN + 5V LDO | Switch/contact monitor (no CAN/LIN/reg) |
| Battery Input Range | 5.5 V to 27 V | 5V/9V/12V/15V/18V/24V (wider) | 5.5 V to 27 V | 5.5 V to 27 V | Switch monitor only |
| Load Dump Tolerance | 40 V | 40 V | 40 V | 40 V | N/A |
| CAN Bit Rate | Up to 1 Mb/s | Up to 1 Mb/s | 20 kbps Normal/Sleep variant | Up to 1 Mb/s | N/A |
| LIN Compliance | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 | N/A |
| AEC-Q100 Grade | Grade 1 (-40C to +125C) | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
Principaux différenciateurs
- Gen2 SBC with HS CAN + LIN in a single IC (vs MC33978AEKR2)
- Narrower battery input (5.5V-27V) versus Gen3 wider-range (vs MCZ33905BS5EKR2)
- Tape-and-Reel packaging (R2) vs tube (EK) (vs MCZ33903BS5EK)
Notes de conception
The 32-SSOP-EP exposed pad must be soldered to a continuous ground copper plane to achieve the datasheet's theta-JA. Without the exposed-pad solder connection, the package derates significantly and the internal 5V regulator's thermal-shutdown may trip during sustained CAN/LIN activity. Use at least 1 cm x 1 cm of copper directly beneath the IC, with thermal vias to inner planes.
Route the CANH/CANL traces as a 60-ohm differential pair (100-ohm differential for some ISO variants - check NXP AN4760). Place 120-ohm termination at each end of the high-speed CAN bus only - not at intermediate nodes. Keep the CAN bus traces away from switching power traces by at least 3 mm. Place a 100nF X7R 0603 bypass as close as possible to each VCC pin.
Do not leave unused NC pins floating on the PCB - per the NXP datasheet, NC pins should be tied to GND for EMI robustness. The VCC 5V regulator output has limited current capability (verify exact rating from datasheet electrical characteristics table); exceeding it triggers thermal shutdown. Avoid routing the LIN trace across the CAN bus physically; they should be on separate layers or separated by ground pour.
Informations de conformité
AEC-Q100 Grade 1 qualified per NXP product family datasheet. RoHS and lead-free status confirmed by DigiKey product listing. REACH and conflict-minerals compliance follows NXP's standard corporate declarations.
