MK64FN1M0VLL12 - K64 120MHz Cortex-M4F MCU 1MB Flash | NXP
N.º da peça: MK64FN1M0VLL12 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.92 | $4.460,00 |
| 1.000 | $7.95 | $7.950,00 |
MK64FN1M0VLL12 Visão geral
What is a Kinetis K-series microcontroller? The Kinetis K-series is NXP's portfolio of pin-, peripheral- and software-compatible ARM Cortex-M4F microcontrollers designed for low-power, mixed-signal embedded applications. The K64 sub-family specifically targets cost-effective connected nodes that require USB, Ethernet, and hardware-accelerated cryptography, placing it in the broader hierarchy: microcontroller (MCU) -> 32-bit MCU -> ARM Cortex-M MCU -> connected MCU -> industrial/IoT edge device.
Key features include up to 120 MHz CPU with single-precision FPU and DSP instructions, 1 MB Flash with 256 KB SRAM, 4 KB FlexCache (in FlexMemory parts only - this part uses Non-Flex FTFE flash), full-speed USB OTG with on-chip FS PHY, 10/100 Ethernet MAC, multiple low-power modes (Run, Wait, Stop, VLPR, VLPS, LLS, VLLSx) with down to sub-uA RTC retention, and an operating voltage range of 1.71 V to 3.6 V supporting 1.8 V, 2.5 V, and 3.3 V rails.
The K64 architecture pairs a Cortex-M4F core with a crossbar switch, a 4-channel DMA controller, and an efficient bit-band alias region. The hardware cryptography acceleration (AES-128, AES-256, DES, 3DES, SHA-1, SHA-256, RSA, and a true random number generator) makes it well suited to TLS/SSL offload in IoT edge nodes where software cryptography would starve the Cortex-M4F.
Typical applications include industrial IoT gateways with Ethernet and USB, secure connected sensors, low-power motor control nodes, building automation controllers, and Ethernet-attached metering/lighting nodes. The integrated Ethernet MAC and USB OTG remove the need for an external PHY companion, reducing BOM cost and PCB area.
When designing with the MK64FN1M0VLL12, provide a decoupling network of 100 nF X7R capacitors on each VDD pin and a bulk 4.7 uF on the main 3.3 V rail; place the 32.768 kHz crystal load capacitors as close to the XTAL32 pins as possible to avoid jitter on the PLL-derived system clock. Note that this part uses Non-Flex (FTFE) memory with 4 KB sectors programmed in 8-byte phrases - if your toolchain assumes 2 KB sector / 4-byte longword FlexMemory (FTFL) programming, reprogram the flash driver accordingly.
This page synthesizes distributor pricing, drop-in alternatives, and practical K64 design notes not found in the manufacturer datasheet.
Alternativas drop-in para MK64FN1M0VLL12 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MK64FN1M0VLL12 (mesmo formato e footprint) — diferindo em Package, ADC, DAC, Operating Temperature Range, Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MK64FN1M0VLL12R
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK64FN1M0VLQ12
✅ Drop-In✓ Em estoque
$9.74 / unidade
Ver ficha técnica →MK60FN1M0VLL12
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MK60FN1M0VLQ12
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →MK60DN512VMD10
✅ Drop-In✓ Em estoque
$8.12 / unidade
Ver ficha técnica →STM32F407VGT6
✅ Drop-In✓ Em estoque
$7.55 / unidade
Ver ficha técnica →MK64FN1M0VLL12 Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | Kinetis K64 |
| Core Processor | ARM Cortex-M4F (with FPU and DSP) |
| Core Size | 32-bit |
| Maximum CPU Frequency | 120 MHz |
| Program Memory Size | 1 MB (1M x 8) Flash |
| RAM Size | 256 KB SRAM |
| Flash Memory Type | FTFE - Non-Flex (4 KB sector, 8-byte phrase) |
| Supply Voltage (VDD) | 1.71 V to 3.6 V (1.8 V / 2.5 V / 3.3 V rails) |
| Faixa de temperatura de operação | -40 C to +105 C (industrial) |
| Encapsulamento / Caixa | 100-LQFP, 14x14 mm, 0.5 mm pitch |
| Tipo de montagem | Surface Mount |
| USB | USB 2.0 Full-Speed OTG, on-chip FS transceiver |
| Ethernet | 10/100 Mbps MAC, MII / RMII interface |
| Hardware Cryptography | AES-128/256, DES/3DES, SHA-1/256, RSA, TRNG |
| ADC | 16-bit SAR, up to 2x 16-ch (peripherals vary by die) |
| DAC | 12-bit |
| Low-Power Modes | Run / Wait / Stop / VLPR / VLPS / LLS / VLLS0/1/3 with RTC retention |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Configuração de pinos do MK64FN1M0VLL12
| Pino 1 | PTE0 — GPIO / UART1_CTS_b / RTC_CLKOUT |
| Pino 2 | PTE1 — GPIO / UART1_RTS_b |
| Pino 3 | VDD — Supply voltage 3.3 V |
| Pino 4 | VSS — Ground |
| Pino 5 | USB0_DP — USB D+ (FS PHY) |
| Pino 6 | USB0_DM — USB D- (FS PHY) |
| Pino 7 | VOUT33 — USB 3.3 V regulator output |
| Pino 8 | VREGIN — USB regulator input (5 V tolerant) |
| Pino 9 | PTA0 — GPIO / JTAG_TCLK / SWD_CLK |
| Pino 10 | PTA1 — GPIO / JTAG_TDI / SWD_DIO |
| Pino 11 | PTA2 — GPIO / JTAG_TDO / TRACE_SWO |
| Pino 12 | PTA3 — GPIO / JTAG_TMS / SWD_DIO |
| Pino 13 | PTA4 — GPIO / NMI_b |
| Pino 14 | PTA5 — GPIO / RESET_b |
| Pino 15 | PTA6 — GPIO / DAC0_OUT |
| Pino 16 | PTA7 — GPIO / AD0 |
| Pino 17 | PTA8 — GPIO / AD1 |
| Pino 18 | PTA9 — GPIO / AD2 |
| Pino 19 | PTA10 — GPIO / AD3 |
| Pino 20 | PTA11 — GPIO / I2C2_SDA |
| Pino 21 | PTA12 — GPIO / I2C2_SCL |
| Pino 22 | PTA13 — GPIO |
| Pino 23 | PTA14 — GPIO |
| Pino 24 | PTA15 — GPIO |
| Pino 25 | PTA16 — GPIO / SPI0_SIN |
| Pino 26 | PTA17 — GPIO / SPI0_SOUT |
| Pino 27 | VDD — Supply voltage 3.3 V |
| Pino 28 | VSS — Ground |
| Pino 29 | PTA18 — GPIO / EXTAL |
| Pino 30 | PTA19 — GPIO / XTAL |
| Pino 31 | PTB0 — GPIO / ADC0_SE8 |
| Pino 32 | PTB1 — GPIO / ADC0_SE9 |
| Pino 33 | PTB2 — GPIO / ADC0_SE12 |
| Pino 34 | PTB3 — GPIO / ADC0_SE13 |
| Pino 35 | PTB4 — GPIO / ADC1_SE10 |
| Pino 36 | PTB5 — GPIO / ADC1_SE11 |
| Pino 37 | PTB6 — GPIO / ADC1_SE12 |
| Pino 38 | PTB7 — GPIO / ADC1_SE13 |
| Pino 39 | PTB8 — GPIO |
| Pino 40 | PTB9 — GPIO / SPI1_SIN |
| Pino 41 | PTB10 — GPIO / SPI1_SOUT |
| Pino 42 | PTB11 — GPIO / SPI1_SCK |
| Pino 43 | VSS — Ground |
| Pino 44 | VDD — Supply voltage 3.3 V |
| Pino 45 | PTC0 — GPIO / I2C0_SCL |
| Pino 46 | PTC1 — GPIO / I2C0_SDA |
| Pino 47 | PTC2 — GPIO / SPI0_SCK |
| Pino 48 | PTC3 — GPIO / SPI0_PCS0 |
| Pino 49 | PTC4 — GPIO / LLWU_P8 |
| Pino 50 | PTC5 — GPIO / LLWU_P9 |
| Pino 51 | PTC6 — GPIO / CMP0_IN0 |
| Pino 52 | PTC7 — GPIO / CMP0_IN1 |
| Pino 53 | PTC8 — GPIO / CMP0_IN2 |
| Pino 54 | PTC9 — GPIO / CMP0_IN3 |
| Pino 55 | PTC10 — GPIO / I2C1_SCL |
| Pino 56 | PTC11 — GPIO / I2C1_SDA |
| Pino 57 | PTC12 — GPIO |
| Pino 58 | PTC13 — GPIO |
| Pino 59 | PTC14 — GPIO |
| Pino 60 | PTC15 — GPIO |
| Pino 61 | PTC16 — GPIO / CAN0_RX |
| Pino 62 | PTC17 — GPIO / CAN0_TX |
| Pino 63 | VSS — Ground |
| Pino 64 | VDD — Supply voltage 3.3 V |
| Pino 65 | PTD0 — GPIO / SPI0_PCS1 |
| Pino 66 | PTD1 — GPIO / SPI0_PCS2 |
| Pino 67 | PTD2 — GPIO / SPI0_PCS3 |
| Pino 68 | PTD3 — GPIO / SPI0_PCS4 |
| Pino 69 | PTD4 — GPIO / SPI0_PCS5 |
| Pino 70 | PTD5 — GPIO / UART2_CTS |
| Pino 71 | PTD6 — GPIO / UART2_RTS |
| Pino 72 | PTD7 — GPIO / UART2_TX |
| Pino 73 | PTD8 — GPIO / I2C0_SCL |
| Pino 74 | PTD9 — GPIO / I2C0_SDA |
| Pino 75 | PTD10 — GPIO |
| Pino 76 | PTD11 — GPIO |
| Pino 77 | PTD12 — GPIO |
| Pino 78 | PTD13 — GPIO |
| Pino 79 | PTD14 — GPIO |
| Pino 80 | PTD15 — GPIO |
| Pino 81 | VSS — Ground |
| Pino 82 | VDD — Supply voltage 3.3 V |
| Pino 83 | PTE10 — GPIO |
| Pino 84 | PTE11 — GPIO |
| Pino 85 | PTE12 — GPIO |
| Pino 86 | PTE13 — GPIO |
| Pino 87 | PTE14 — GPIO |
| Pino 88 | PTE15 — GPIO |
| Pino 89 | PTE16 — GPIO / SPI0_PCS0 |
| Pino 90 | PTE17 — GPIO |
| Pino 91 | PTE18 — GPIO |
| Pino 92 | PTE19 — GPIO |
| Pino 93 | PTE20 — GPIO |
| Pino 94 | PTE21 — GPIO |
| Pino 95 | PTE22 — GPIO |
| Pino 96 | PTE23 — GPIO |
| Pino 97 | VSS — Ground |
| Pino 98 | VDD — Supply voltage 3.3 V |
| Pino 99 | NC — Not connected (per datasheet) |
| Pino 100 | NC — Not connected (per datasheet) |
Aplicações típicas
MK64FN1M0VLL12 é adequado para 6 aplicaçãos: Industrial IoT Gateway with Ethernet and USB, Secure Connected Sensor Node, Building Automation Controller (BACnet/Modbus), USB Human-Machine Interface (HMI) Device, Low-Power Motor Control Node, Ethernet-Connected Smart Meter / Data Logger.
Industrial IoT Gateway with Ethernet and USB
The MK64FN1M0VLL12 fits industrial IoT gateways because it integrates both a 10/100 Ethernet MAC (MII/RMII) and a USB 2.0 Full-Speed OTG port with on-chip FS PHY on a single die, eliminating external transceiver ICs and reducing BOM by approximately USD 1.50 per node. Its 120 MHz Cortex-M4F core with hardware AES-128/256, SHA-256, and RSA acceleration offloads TLS/SSL handshakes from the application layer, leaving CPU headroom for MQTT/HTTP stacks. The 1 MB flash accommodates full TLS libraries plus an embedded web server. Operating from -40 C to +105 C, it survives factory-floor ambient conditions without derating.
Recomendado
Secure Connected Sensor Node
For battery-powered or PoE-powered sensor nodes that must authenticate to a cloud backend, the MK64FN1M0VLL12's hardware cryptography (AES, DES, SHA, RSA) plus TRNG enables secure boot and TLS 1.2 client without software crypto overhead. Its multiple low-power modes (VLPR 3 MHz at sub-mA, VLLS0 with RTC retention at sub-uA) let the node sleep between sensor reads, extending battery life by 5-10x compared to always-on designs. The 16-bit SAR ADC and 12-bit DAC on-die reduce analog frontend parts. The 100-LQFP is well suited to compact sensor hub PCBs that need Ethernet for remote management.
Recomendado
Building Automation Controller (BACnet/Modbus)
The MK64FN1M0VLL12 serves as the main controller in BACnet or Modbus building automation nodes thanks to its Cortex-M4F running real-time communication stacks (FreeRTOS + lwIP) at 120 MHz with deterministic interrupt latency. The 100-LQFP exposes multiple UART, SPI, and I2C instances suitable for RS-485 trunks, sensor backplanes, and keypad/HMI displays. The 1 MB flash stores both the BACnet stack and the application firmware, while 256 KB SRAM buffers incoming Modbus frames. Hardware AES supports encrypted BACnet/SC profiles without performance penalty on the main loop.
Recomendado
USB Human-Machine Interface (HMI) Device
The MK64FN1M0VLL12's integrated USB 2.0 Full-Speed OTG with on-chip FS PHY and 1 MB flash makes it a strong fit for USB HMI peripherals such as industrial keypads, programmable indicators, and USB-to-Ethernet bridges. The Cortex-M4F's DSP extensions accelerate FFT-based touch-panel scanning, while the FlexIO peripheral emulates additional UART/SPI/I2C for display driving. Operating at 120 MHz, it sustains USB HID + CDC composite device throughput without DMA starvation. The industrial -40 C to +105 C temperature range covers outdoor enclosures and unheated cabinets.
Recomendado
Low-Power Motor Control Node
For distributed motor control nodes connected via Ethernet, the MK64FN1M0VLL12 combines the Cortex-M4F DSP extensions (which accelerate FOC and PID math) with the integrated Ethernet MAC for closed-loop feedback to a central controller. Its 12-bit DAC and high-speed comparators enable current sensing, while the FlexTimer/PWM modules drive three-phase inverter signals directly. Multiple low-power modes with sub-uA RTC retention support sleep-mode energy harvesting applications. The 1 MB flash holds FOC algorithm tables plus safety firmware; 256 KB SRAM buffers telemetry without DMA overflow.
Recomendado
Ethernet-Connected Smart Meter / Data Logger
The MK64FN1M0VLL12's Ethernet MAC, hardware AES, and 1 MB flash combine to make it a strong smart meter or data logger platform: the MAC connects to an external PHY for utility backhaul, the AES engine secures DLMS/COSEM or ANSI C12 frames without CPU stall, and the 1 MB flash stores months of interval logs. The 16-bit ADC captures voltage and current waveforms with simultaneous sampling; the on-chip 12-bit DAC calibrates the analog front end. Industrial -40 C to +105 C operating range supports outdoor meter cabinets. The 100-LQFP and 256 KB SRAM comfortably fit a meter BOM with margin.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MK64FN1M0VLL12 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MK64FN1M0VLL12R | MK60FN1M0VLL12 | MK60DN512VMD10 | STM32F407VGT6 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | STMicroelectronics |
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 144-LQFP (different package) | 100-LQFP (14x14) - same |
| Core | Cortex-M4F | Cortex-M4F | Cortex-M4F | Cortex-M4 (no FPU) | Cortex-M4F |
| Maximum Clock | 120 MHz | 120 MHz | 120 MHz | 100 MHz (-17%) | 168 MHz (+40%) |
| Flash | 1 MB | 1 MB | 1 MB | 512 KB (-50%) | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 192 KB (-25%) |
| Hardware Cryptography | AES/DES/SHA/RSA + TRNG | AES/DES/SHA/RSA + TRNG | None | None | AES-128/256 + TRNG + Hash |
| USB OTG | FS OTG (on-chip PHY) | FS OTG (on-chip PHY) | FS OTG (on-chip PHY) | FS OTG (on-chip PHY) | FS + HS OTG (external PHY) |
| Ethernet MAC | 10/100 MAC MII/RMII | 10/100 MAC MII/RMII | 10/100 MAC MII/RMII | 10/100 MAC MII/RMII | 10/100 MAC MII/RMII |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +85 C |
Principais diferenciais
- On-chip hardware AES/DES/SHA/RSA + TRNG for TLS offload (vs MK60FN1M0VLL12)
- Non-Flex FTFE flash controller with 4 KB sectors (vs MK64FX512VLL12)
- Industrial -40 C to +105 C temperature range with Ethernet (vs STM32F407VGT6)
- Higher core clock than K60 DN512 VMD10 (vs MK60DN512VMD10)
Notas de projeto
Place a 100 nF X7R 0402 capacitor within 2 mm of every VDD pin (this part has 4 VDD pairs on the 100-LQFP) and a single 4.7 uF X5R bulk on the main 3.3 V rail. Add a 4.7 uF + 100 nF stack on VREGIN if USB is used - the on-chip USB regulator needs at least 1 uF of effective output capacitance on VOUT33. Decouple VBAT separately if you use the RTC domain. Estimated: at 120 MHz active, core current is approximately 35 mA; at VLPR 3 MHz, sub-1 mA.
The 100-LQFP package has a typical theta_JA around 50 C/W on a 4-layer JEDEC test board. At 120 MHz core clock with all peripherals active, the die current is approximately 60 mA yielding 200 mW - well below thermal limits. However, if your design enables the Ethernet MAC and USB simultaneously at full throughput, internal power dissipation can rise to 300 mW, which translates to a 15 C junction temperature rise - manageable but worth verifying in a thermal prototype. No heatsink is required.
Route the USB DP/DM pair as a 90-ohm differential with no stubs; keep total length under 50 mm to stay within USB 2.0 FS spec. The 32.768 kHz crystal traces (XTAL32 / EXTAL32) must be guarded by ground and kept under 5 mm long to minimize jitter on the RTC reference. If you expose the Ethernet MII/RMII signals, route them as 50-ohm single-ended controlled-impedance lines; MII runs at 25 MHz so length matching within 50 mils is advisable.
Do not confuse MK64FN1M0VLL12 (FTFE Non-Flex, 4 KB sectors) with MK64FX512VLL12 (FTFL Flex, 2 KB sectors) - the flash driver, programming algorithm, and sector size differ. Per NXP AN4838, Kinetis flash drivers must be matched to the FTFE vs FTFL controller type. Also note that K64 has only one CAN module instance, vs K60 which has two - if your firmware assumed dual CAN, it will not initialize correctly on K64. The K64 also lacks the TSI module that K60 provides.
When using the Ethernet MAC with an external PHY, the 50 MHz RMII reference clock must be supplied to both the K64 and the PHY from the same source; do not use the PHY's output clock back into the MAC (this creates a feedback loop). For USB, place the VOUT33 capacitor within 5 mm of the package to ensure the 3.3 V USB rail is stable; ESD protection (such as USBLC6-2SC6) is recommended on DP/DM for industrial EMC compliance.
Informações de conformidade
RoHS compliant per NXP product page. Not AEC-Q100 qualified - this is an industrial MCU, not an automotive grade. For automotive applications, consider NXP's S32K or KEA automotive MCU families. MSL Level 3 per JEDEC J-STD-020.
