NT5CC256M16CP-DIB - 4Gb DDR3L SDRAM 256Mx16 | Nanya Technology
N.º da peça: NT5CC256M16CP-DIB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
NT5CC256M16CP-DIB Visão geral
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a reduced voltage of 1.35V compared to standard DDR3's 1.5V, enabling lower power consumption in mobile and embedded systems. It is part of the DDR3 memory family, which uses double data rate signaling to transfer data on both edges of the clock, and is widely used in computing, networking, and industrial applications.
Key features include a 4Gb density, 16-bit I/O width, 96-ball TFBGA package (9x13mm, 0.8mm pitch), industrial temperature range (-40°C to +95°C), and RoHS compliance. The device supports programmable CAS latency of 5, 6, 7, 8, and 9, and write latency of 5, 6, 7, 8, and 9, with a refresh cycle count of 8192. It also features on-die termination (ODT) and dynamic ODT for improved signal integrity.
Technically, the NT5CC256M16CP-DIB uses a CMOS process and incorporates a differential clock input (CK, CK#) for precise timing. The device supports auto-refresh and self-refresh modes, with a reduced standby current for power saving. The 1.35V operation is backward compatible with 1.5V DDR3 parts, allowing flexible system design.
Typical applications include industrial embedded systems, networking equipment, and automotive infotainment, where high-density, low-power memory is required. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.35V supply and a reference voltage (VREF) for the I/O.
Alternativas drop-in para NT5CC256M16CP-DIB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com NT5CC256M16CP-DIB (mesmo formato e footprint) — diferindo em Package, Data Rate, Supply Voltage, CAS Latency, Memory Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
NT5CC256M16CP-DII
✅ Drop-In✓ Em estoque
$2.3 / unidade
Ver ficha técnica →NT5CC256M16DP-DI
✅ Drop-In✓ Em estoque
$6.5 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →K4B4G1646D-BYK0
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.9 / unidade
Ver ficha técnica →IS43TR16512B-125KBLI
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
NT5CC256M16CP-DIB Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4Gb |
| Organização da memória | 256M x 16 |
| Tensão de alimentação | 1.35V |
| Taxa de dados | 1600 Mbps (DDR3L-1600) |
| Encapsulamento | TFBGA-96 (9x13mm, 0.8mm pitch) |
| Number of Terminals | 96 |
| Internal Banks | 8 |
| Refresh Cycles | 8192 |
| CAS Latency (CL) | 5, 6, 7, 8, 9 |
| Write Latency (CWL) | 5, 6, 7, 8, 9 |
| Temperature Grade | Industrial (-40°C to +95°C) |
| RoHS | Compliant |
| Livre de halogênio | Yes |
| Package Shape | Rectangular |
Configuração de pinos do NT5CC256M16CP-DIB
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDD — Power supply (1.35V) |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ8 — Data input/output 8 |
| Pino B3 | DQ9 — Data input/output 9 |
| Pino B4 | VDD — Power supply (1.35V) |
| Pino B5 | DQ10 — Data input/output 10 |
| Pino B6 | DQ11 — Data input/output 11 |
| Pino B7 | VSS — Ground |
| Pino B8 | DQ12 — Data input/output 12 |
| Pino B9 | DQ13 — Data input/output 13 |
| Pino B10 | VDD — Power supply (1.35V) |
| Pino B11 | DQ14 — Data input/output 14 |
| Pino B12 | DQ15 — Data input/output 15 |
Aplicações típicas
NT5CC256M16CP-DIB é adequado para 6 aplicaçãos: Industrial Embedded Systems, Networking Equipment, Automotive Infotainment, Medical Devices, Test and Measurement, IoT Gateways.
Industrial Embedded Systems
The NT5CC256M16CP-DIB provides high-density, low-power memory for industrial controllers and PLCs. Its 4Gb capacity and 1.35V operation enable reliable operation in harsh environments with wide temperature ranges. The industrial temperature grade (-40°C to +95°C) ensures performance in factory automation and process control systems. With a data rate of 1600 Mbps, it supports real-time data processing and logging. The TFBGA-96 package allows compact PCB designs, and the low power consumption reduces thermal stress in sealed enclosures.
Recomendado
Networking Equipment
In networking switches and routers, the NT5CC256M16CP-DIB serves as packet buffer memory, providing high bandwidth and low latency. Its 1600 Mbps data rate and 16-bit interface enable fast packet processing. The 1.35V operation reduces power consumption in 24/7 operation, and the 4Gb density supports large routing tables and buffering. The industrial temperature grade ensures reliability in telecom cabinets and outdoor installations. The TFBGA-96 package is ideal for high-density line cards.
Recomendado
Automotive Infotainment
The NT5CC256M16CP-DIB is used in automotive infotainment systems for navigation, multimedia, and instrument clusters. Its 4Gb capacity supports high-resolution graphics and audio buffering. The 1.35V low-voltage operation is critical for automotive power budgets. Although the standard part is industrial grade, the -DII variant offers automotive grade. The high data rate enables smooth video playback and responsive UI. The compact TFBGA-96 package fits space-constrained head units.
Recomendado
Medical Devices
In medical imaging and patient monitoring, the NT5CC256M16CP-DIB provides reliable memory for data acquisition and processing. Its industrial temperature range ensures operation in clinical environments. The 4Gb density supports large image buffers and waveform storage. The low power consumption is beneficial for battery-powered portable devices. The high data rate enables real-time signal processing. The TFBGA-96 package is suitable for compact medical PCBs.
Recomendado
Test and Measurement
The NT5CC256M16CP-DIB is used in oscilloscopes, logic analyzers, and data acquisition systems for high-speed data buffering. Its 1600 Mbps data rate and 16-bit interface enable fast waveform capture. The 4Gb density provides deep memory for long recordings. The industrial temperature grade ensures accuracy in lab and field environments. The low power consumption reduces heat in benchtop instruments. The TFBGA-96 package allows high-density memory arrays.
Recomendado
IoT Gateways
In IoT gateways, the NT5CC256M16CP-DIB provides memory for protocol processing, data aggregation, and edge computing. Its 4Gb capacity supports large data buffers and application code. The 1.35V operation is ideal for power-constrained gateways. The industrial temperature grade ensures operation in outdoor and industrial settings. The high data rate enables efficient handling of multiple sensor streams. The compact TFBGA-96 package fits small gateway designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para NT5CC256M16CP-DIB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | NT5CC256M16CP-DII | NT5CC256M16DP-DI | MT41K256M16HA-125 | K4B4G1646D-BYK0 |
|---|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | FBGA-96 | FBGA-96 |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology | Samsung Electronics |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps |
| Temperature Grade | Industrial (-40°C to +95°C) | Industrial (-40°C to +95°C) | Industrial (-40°C to +95°C) | Industrial (-40°C to +95°C) | Industrial (-40°C to +95°C) |
| CAS Latency | 5, 6, 7, 8, 9 | 5, 6, 7, 8, 9 | 5, 6, 7, 8, 9 | 5, 6, 7, 8, 9 | 5, 6, 7, 8, 9 |
Principais diferenciais
- Industrial temperature grade (vs NT5CC256M16CP-DI)
- Low voltage operation (vs MT41K256M16HA-125)
- High data rate (vs NT5CC256M16DP-DI)
Notas de projeto
Place 0.1uF decoupling capacitors close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the power entry. Ensure the VREF decoupling capacitor is placed as close as possible to the VREF pin. Follow the layout guidelines in the Nanya datasheet to minimize signal integrity issues.
The industrial temperature grade allows operation up to +95°C, but ensure adequate airflow or heatsinking in high-power systems. The TFBGA-96 package has a thermal resistance that should be considered; use thermal vias under the package to improve heat dissipation.
For high-speed DDR3L signals, maintain controlled impedance of 40-50 ohms for data lines and 40 ohms for address/command lines. Use series termination resistors (22-33 ohms) near the driver to reduce reflections. Keep trace lengths matched within 100 mils for each byte lane.
Informações de conformidade
RoHS compliant and halogen-free per datasheet. Not AEC-Q100 qualified; use -DII for automotive.
