P1013NSE2MHB557 - QorIQ P1013 e500v2 MPU 1.2GHz 689-TEPBGA II | NXP
N.º da peça: P1013NSE2MHB557 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $30.5 | $30,50 |
| 10 | $27.84 | $278,40 |
| 100 | $24.9 | $2.490,00 |
| 500 | $22.45 | $11.225,00 |
| 1.000 | $20.78 | $20.780,00 |
P1013NSE2MHB557 Visão geral
A QorIQ P1013 device is a 32-bit embedded communications processor built on Power Architecture technology, designed for low-power, highly integrated networking and industrial applications. It sits within the QorIQ P1 series, which targets branch-office routers, Ethernet switches, protocol converters, and motion-control/industrial automation, where deterministic performance, security acceleration, and high-speed connectivity (PCIe, GbE, SerDes) are required. Within NXP's hierarchy it falls under communications processors -> PowerQUICC/QorIQ -> Power Architecture -> embedded microprocessor.
Key specifications include a 32-bit e500v2 core with integrated double-precision floating-point unit, 32 KB I-cache and 32 KB D-cache, 32-bit DDR2/DDR3 memory controller with ECC running up to 800 MHz data rate, three enhanced 10/100/1000 Ethernet MACs, two PCI Express endpoints/RCs, USB 2.0, SD/MMC, SPI, I2C, UART, DMA, and 1.0 GHz SerDes lanes for high-speed interconnect.
The e500v2 core includes hardware security acceleration for symmetric (AES, 3DES, RC4) and asymmetric (RSA, ECC) cryptography, plus packet processing accelerators for IPsec, SSL/TLS, and IEEE 1588 hardware timestamping. The 689-TEPBGA II (31x31 mm) package has a thermal resistance of approximately 16 C/W with proper PCB stack-up, enabling operation in industrial temperature ranges.
Typical applications include branch-office routers, Ethernet industrial switches, protocol-conversion gateways, networked motion controllers, secure VPN/SSL appliances, and IEC-61850 smart-grid controllers. The combination of GbE, PCIe, and security hardware offload enables line-rate encrypted traffic processing without an external coprocessor.
When designing with the P1013NSE2MHB557, ensure the 31x31 mm TEPBGA-II land pattern uses a 12-layer PCB stack-up with matched impedance for DDR2/DDR3 routes, decoupling capacitors directly under the BGA, and adequate thermal vias. The boot ROM configuration must be set up before reset release, and system designers should consult the QorIQ P1013 reference manual.
This page synthesizes distributor pricing from LCSC, DigiKey, Mouser and JLCPCB, plus drop-in QorIQ P1 family alternatives, BGA layout guidelines, and practical design notes not found condensed on the manufacturer datasheet alone.
Alternativas drop-in para P1013NSE2MHB557 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P1013NSE2MHB557 (mesmo formato e footprint) — diferindo em Maximum Core Frequency, Memory Controller, Mounting Type, Package, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P1013NSE2MHB
✅ Drop-In✓ Em estoque
$98.75 / unidade
Ver ficha técnica →P1014NSE2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1012NSE2HFB
✅ Drop-In✓ Em estoque
$52.75 / unidade
Ver ficha técnica →P1020NSE2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2020NSE2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1013NSE2MHB557 Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Largura do barramento de dados | 32-bit |
| Maximum Core Frequency | 1.2 GHz |
| Encapsulamento | 689-TEPBGA II (31x31 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Memory Controller | DDR2 / DDR3 with ECC, up to 800 MHz data rate |
| Ethernet | 3x 10/100/1000 Mbps Enhanced GMII/RGMII/TBI MACs |
| PCI Express | 2x PCIe endpoints / root complex controllers |
| Security Accelerator | AES, 3DES, RC4, RSA, ECC, IPsec, SSL/TLS offload |
| L1 Cache | 32 KB I-cache + 32 KB D-cache |
| Faixa de temperatura de operação | -40 C to +85 C (industrial) |
| MSL (Moisture Sensitivity Level) | 3 (168 hours) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do P1013NSE2MHB557 689-tepbga ii (31x31 mm)
Configuração de pinos para P1013NSE2MHB557 (pacote 689-tepbga ii (31x31 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P1013NSE2MHB557.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P1013NSE2MHB557 é adequado para 7 aplicaçãos: Branch-Office Routers, Industrial Ethernet Switches, Protocol-Conversion Gateways, Secure VPN / SSL Appliances, IEC-61850 Smart-Grid Controllers, Networked Motion Controllers, Networked Printers & Multifunction Devices.
Branch-Office Routers
The P1013NSE2MHB557's three integrated 10/100/1000 Ethernet MACs plus dedicated IPsec/SSL/TLS hardware accelerators make it ideal for branch-office router designs. The single e500v2 core at 1.2 GHz delivers enough throughput (~1 Gbps encrypted traffic) for typical WAN aggregation, while the DDR2/DDR3 controller sustains NAT table lookup rates required for stateful firewalls. The hardware crypto engine offloads AES/3DES/RSA, freeing the CPU for routing and QoS - lower-power alternative to multi-core alternatives for SMB edge routers.
Recomendado
Industrial Ethernet Switches
Designed into the management plane of industrial GbE switches, the P1013NSE2MHB557 serves as a CPU for SNMP, IEEE 1588 hardware timestamping, and protocol-aware packet processing. Its industrial-grade -40 C to +85 C temperature range combined with three GbE MACs supports ring topologies with hardware-assisted PTP synchronization. The PCIe and SerDes lanes connect to external PHY/Switch ASICs without additional glue logic, reducing BOM cost for industrial automation switches.
Recomendado
Protocol-Conversion Gateways
Industrial protocol-conversion gateways (EtherCAT to EtherNet/IP, Modbus to OPC-UA) benefit from the P1013NSE2MHB557's hardware-accelerated cryptography and triple-Ethernet architecture. The single 1.2 GHz e500v2 core handles multi-protocol parsing at line rate, with hardware timestamping ensuring deterministic <100 us latency for motion-control loops. The 689-TEPBGA II footprint with proper thermal vias enables fanless industrial DIN-rail chassis designs.
Recomendado
Secure VPN / SSL Appliances
IPsec VPN appliances and SSL inspection gateways rely on the P1013NSE2MHB557's hardware security engine to sustain multi-gigabit encrypted throughput. The AES, 3DES, RC4, RSA, and ECC accelerators combined with dedicated IPsec/SSL/TLS offload engines enable line-rate encryption without CPU bottlenecks. Compared to software-only encryption, hardware acceleration reduces CPU utilization by 60-80%, supporting smaller chassis and lower cooling budgets.
Recomendado
IEC-61850 Smart-Grid Controllers
Smart-grid substation controllers leveraging IEC-61850 GOOSE/Sampled Values protocols benefit from the P1013NSE2MHB557's hardware timestamping via the IEEE 1588 timestamping engine, which achieves <50 ns time-synchronization accuracy mandated by substation automation standards. The industrial temperature range and high immunity to electrical noise from the 689-TEPBGA-II substrate makes it suitable for harsh substation environments. Combined with hardware cryptography, secure DNP3/IP and IEC-104 gateways fit on a single P1013 die.
Recomendado
Networked Motion Controllers
Industrial motion-control systems using EtherCAT, PROFINET, or SERCOS require deterministic real-time networking, which the P1013NSE2MHB557 provides via its hardware timestamping and DMA engines. The single e500v2 core at 1.2 GHz drives a 32-axis motion loop at typical 1 kHz update rates, with DMA offload of synchronized GPIO triggering. The PCIe endpoint connects to external motor-controller ASICs without external bridges, reducing BOM complexity for multi-axis drives.
Recomendado
Networked Printers & Multifunction Devices
High-end networked printers and multifunction devices use the P1013NSE2MHB557 as an image-processing controller with hardware-accelerated encryption for secure print/PIN-release workflows. The USB 2.0 controller supports direct-attached peripherals, while the GbE MAC handles networking at gigabit speeds. The platform's reliability and industrial temperature range suit commercial printer environments where downtime is unacceptable.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P1013NSE2MHB557 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P1013NSE2MHB | P1014NSE2HFB | P1012NSE2HFB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Number of Cores | 1 | 1 | 1 | 1 |
| Maximum Core Frequency | 1.2 GHz | 1.2 GHz | ~1.26 GHz | 1.2 GHz |
| Ethernet MACs | 3 GbE | 3 GbE | 3 GbE | 3 GbE |
| PCI Express | 2x PCIe end/RC | 2x PCIe end/RC | 2x PCIe end/RC | 2x PCIe end/RC |
| Security Accelerator | AES, 3DES, RC4, RSA, ECC full | AES, 3DES, RC4, RSA, ECC full | AES, 3DES, RC4, RSA, ECC full | Reduced scope (no ECC acceleration) |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) |
Principais diferenciais
- Triple GbE + hardware crypto in single-chip integration (vs P1012NSE2HFB)
- Single-core deterministic performance (vs P1020NSE2HFB)
- Supplier/spin identifier preservation (557 suffix) (vs P1013NSE2MHB (without 557))
- Inventory breadth across distributor network (vs P1014NSE2HFB)
Notas de projeto
Estimated: The 689-TEPBGA II (31x31 mm) package requires a 12-layer PCB stack-up with continuous reference planes for all DDR2/DDR3 routes to meet signal-integrity targets. Place 0.1 uF decoupling capacitors directly under adjacent BGA power/ground balls using 8-mil vias and a power/ground sandwich stack-up. Use a 1 oz copper weight on outer layers plus 0.5 oz on inner power/ground planes to minimize inductance.
Estimated: With a typical 3-5 W power dissipation, compute the worst-case junction temperature using theta_JA of approximately 16 C/W in still air. Implement a thermal via array under the central ground balls and use a heat spreader for fanless enclosures. Derate ambient by 10 C in sealed industrial enclosures, otherwise the device could exceed 110 C junction under continuous encryption load.
DDR2/DDR3 routes require matched-impedance (50 ohm single-ended, 100 ohm differential) length-matched byte lanes with maximum 25 mil length mismatch within the byte. PCIe and SerDes lanes need 100 ohm differential pairs with 5 mil max mismatch; reference plane must be unbroken under the entire route. The IEEE 1588 timestamping block requires a low-jitter clock source.
Do not hot-plug power rails - sequence 1.0 V core, 1.5/1.8 V DDR, and 3.3 V I/O with stagger of at least 5 ms to prevent latch-up. Ensure PORESET is held low until all rails are stable. The boot ROM configuration (RCW) is read on the rising edge of PORESET; configure cfg_rom_loc[0:1] pins via 10 kohm pull-up/pull-down resistors before reset release.
The P1013NSE2MHB557's 1.0 GHz SerDes and 1.2 GHz core frequency produce harmonic content up to 5 GHz; implement common-mode chokes on all GbE output pairs and PCIe transmit pairs. Use spread-spectrum clocking on the 100/125 MHz platform reference clock to reduce EMI peaks. Shielded inductors on DC-DC converters feeding the 1.0 V core rail prevent conducted emissions into GbE PHY devices.
Informações de conformidade
RoHS compliant per NXP product page. Not AEC-Q100 qualified (industrial-grade communications processor, not automotive). Halogen-free status not explicitly documented in supplied data; recommend confirmation with NXP datasheet.
