PIC18F66K22-I/MR - 64KB Flash 8-bit MCU, 64MHz, 64-VQFN | Microchip
N.º da peça: PIC18F66K22-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.3 | $6,30 |
| 10 | $5.78 | $57,80 |
| 100 | $5.04 | $504,00 |
| 500 | $4.49 | $2.245,00 |
| 1.000 | $4.05 | $4.050,00 |
PIC18F66K22-I/MR Visão geral
A PIC18F-series microcontroller is a modified-Harvard 8-bit RISC MCU built around a 16-bit instruction word and an 8-bit data path, optimised for high code density, deterministic interrupt latency, and low power consumption. PIC18 devices sit between simple PIC16/12 controllers and the higher-performance dsPIC/PIC32 lines in the Microchip portfolio, and are typically deployed as main system controllers in cost-sensitive, low-power embedded designs spanning consumer white goods, industrial sensors, and automotive body electronics.
Key features include nanoWatt XLP sleep currents below 100 nA typical, a 12-bit A/D converter with up to 16 input channels, multiple Enhanced USART, SPI, and I2C peripherals, a 16-bit Capture/Compare/PWM module, and an RTCC with independent clocking. The CTMU peripheral enables robust capacitive touch buttons, sliders, and proximity sensing using only a few external passive components. The 64-pin VQFN package exposes up to 54 digital I/O lines for parallel expansion and user-interface needs.
The device uses Microchip's enhanced Flash cell technology and supports self-programmability under firmware control, plus background-debug MPLAB ICD support through two interface pins. Internal oscillator blocks (HFINTOSC up to 16 MHz and LFINTOSC at 31 kHz) allow operation without an external crystal, while a Phase-Locked Loop (PLL) is available to derive the 64 MHz system clock from internal or external sources. The architecture also integrates a 5-bit DAC, multiple comparators, and hardware CRC for data integrity.
Typical applications include capacitive-touch user interfaces for white goods and consumer appliances, low-power battery-driven sensor nodes with sleep duty cycling, industrial control panels with mixed analog and digital I/O, and automotive body modules requiring AEC-style robustness under extended temperature. The wide 2.5V-5.5V supply range also makes the part suitable for both 3.3V and 5V system rails.
When designing with this MCU, plan for a low-impedance ground return and decoupling of VDD/AVDD pairs within 5 mm of the respective pins. Engineers should also evaluate the RTCC current budget against their standby lifetime target, since the XLP sleep-current figure dominates battery-life calculations.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes that are not aggregated on the manufacturer datasheet alone.
Alternativas drop-in para PIC18F66K22-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F66K22-I/MR (mesmo formato e footprint) — diferindo em Package, Operating Temperature Range, Timers, ADC, Maximum Clock Speed.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F66K22-E/MR
✅ Drop-In✓ Em estoque
$3.79 / unidade
Ver ficha técnica →PIC18F65K22-E/MR
✅ Drop-In✓ Em estoque
$3.5 / unidade
Ver ficha técnica →PIC18F65K90-I/MR
✅ Drop-In✓ Em estoque
$3.02 / unidade
Ver ficha técnica →PIC18F65K90-E/MR
✅ Drop-In✓ Em estoque
$4.6 / unidade
Ver ficha técnica →PIC18F65K80T-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F66K22-I/MR Classificações máximas e características elétricas
| Family | PIC18F "K22" 8-bit MCU |
| Core | PIC18 8-bit RISC, 16-bit instruction word |
| Program Memory | 64 KB Flash |
| Data RAM | 4 KB |
| Data EEPROM | 1 KB |
| Maximum CPU Frequency | 64 MHz |
| Supply Voltage (VDD) | 2.5 V to 5.5 V |
| ADC | 12-bit, up to 16 channels |
| DAC | 5-bit, 2 channels |
| Comparators | 2 |
| Digital I/O Pins | 54 (max) |
| Timers | 8-bit/16-bit, CCP/ECCP modules |
| Communication Peripherals | Enhanced USART, SPI, I2C (multiple instances) |
| Special Peripherals | CTMU (touch), RTCC, HLVD, CRC, mTouch |
| Low-Power Technology | nanoWatt XLP, deep sleep current < 100 nA typical |
| Encapsulamento | 64-VQFN (9x9 mm) with exposed pad |
| Faixa de temperatura de operação | -40C to +85C (industrial, "I") |
| Tipo de montagem | Surface Mount |
| Nível MSL | MSL3 (per JEDEC J-STD-020, reflow peak 260C) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do PIC18F66K22-I/MR
| Pino 1 | EP — Exposed thermal pad; connect to VSS for thermal and electrical reference (per datasheet) |
| Pino 2 | RF3 — Digital I/O / analog input |
| Pino 3 | RF2 — Digital I/O / analog input |
| Pino 4 | RF1 — Digital I/O / analog input |
| Pino 5 | RF0 — Digital I/O / analog input |
| Pino 6 | VDD — Digital supply voltage |
| Pino 7 | RG7 — Digital I/O |
| Pino 8 | RG6 — Digital I/O |
| Pino 9 | RG5 — Digital I/O |
| Pino 10 | RG4 — Digital I/O |
| Pino 11 | RG3 — Digital I/O |
| Pino 12 | RG2 — Digital I/O |
| Pino 13 | RG1 — Digital I/O |
| Pino 14 | RG0 — Digital I/O |
| Pino 15 | VSS — Digital ground |
| Pino 16 | RA7 — Digital I/O / oscillator |
| Pino 17 | RA6 — Digital I/O / oscillator |
| Pino 18 | RA5 — Digital I/O |
| Pino 19 | RA4 — Digital I/O / T0CKI |
| Pino 20 | RA3 — Digital I/O |
| Pino 21 | RA2 — Digital I/O |
| Pino 22 | RA1 — Digital I/O / analog input |
| Pino 23 | RA0 — Digital I/O / analog input |
| Pino 24 | VSS — Digital ground |
| Pino 25 | AVDD — Analog supply voltage |
| Pino 26 | AVSS — Analog ground |
| Pino 27 | RB7 — Digital I/O / PGEC |
| Pino 28 | RB6 — Digital I/O / PGED |
| Pino 29 | RB5 — Digital I/O |
| Pino 30 | RB4 — Digital I/O |
| Pino 31 | RB3 — Digital I/O |
| Pino 32 | RB2 — Digital I/O |
| Pino 33 | RB1 — Digital I/O |
| Pino 34 | RB0 — Digital I/O / interrupt |
| Pino 35 | RC7 — Digital I/O / RX |
| Pino 36 | RC6 — Digital I/O / TX |
| Pino 37 | RC5 — Digital I/O |
| Pino 38 | RC4 — Digital I/O |
| Pino 39 | RC3 — Digital I/O / SCL |
| Pino 40 | RC2 — Digital I/O / SDA |
| Pino 41 | RC1 — Digital I/O |
| Pino 42 | RC0 — Digital I/O |
| Pino 43 | VSS — Digital ground |
| Pino 44 | RD7 — Digital I/O / PSP7 |
| Pino 45 | RD6 — Digital I/O / PSP6 |
| Pino 46 | RD5 — Digital I/O / PSP5 |
| Pino 47 | RD4 — Digital I/O / PSP4 |
| Pino 48 | RD3 — Digital I/O / PSP3 |
| Pino 49 | RD2 — Digital I/O / PSP2 |
| Pino 50 | RD1 — Digital I/O / PSP1 |
| Pino 51 | RD0 — Digital I/O / PSP0 |
| Pino 52 | VDD — Digital supply voltage |
| Pino 53 | RE7 — Digital I/O / CCP2 |
| Pino 54 | RE6 — Digital I/O / CCP1 |
| Pino 55 | RE5 — Digital I/O |
| Pino 56 | RE4 — Digital I/O |
| Pino 57 | RE3 — Digital I/O |
| Pino 58 | RE2 — Digital I/O |
| Pino 59 | RE1 — Digital I/O |
| Pino 60 | RE0 — Digital I/O |
| Pino 61 | RF7 — Digital I/O / analog input |
| Pino 62 | RF6 — Digital I/O / analog input |
| Pino 63 | RF5 — Digital I/O / analog input |
| Pino 64 | RF4 — Digital I/O / analog input |
Aplicações típicas
PIC18F66K22-I/MR é adequado para 6 aplicaçãos: Capacitive Touch User Interface, Low-Power Battery Sensor Node, Industrial Control Panel, Automotive Body Electronics, White Goods and Consumer Appliances, Digital Panel Meter and Test Instrument.
Capacitive Touch User Interface
The PIC18F66K22-I/MR's integrated Charge Time Measurement Unit (CTMU) and 16-channel 12-bit ADC make it well-suited for capacitive touch sensing on home appliances, industrial HMIs, and consumer products. The CTMU's constant-current source combined with mTouch firmware libraries supports up to 16 touch buttons or sliders with sub-pF capacitance resolution, eliminating the need for a dedicated touch controller and reducing BOM cost. Pin resources from the 54 available I/Os are partitioned between the touch sensor matrix, drive LEDs, and a small status display. The 64 MHz core handles debouncing and gesture recognition in firmware without taxing the main control loop, while nanoWatt XLP deep-sleep currents below 100 nA typical keep battery-powered devices like cordless remotes and portable medical controls idle for years.
Recomendado
Low-Power Battery Sensor Node
Battery-powered wireless sensor nodes benefit from the PIC18F66K22-I/MR's nanoWatt XLP sleep-current architecture, which keeps RTC-mode current draw below 1 uA and deep-sleep current below 100 nA typical at 3 V. With a 2.5-5.5 V supply, the device runs directly from two AA cells, a single CR2032, or a small Li-Ion pack, and the 64 MHz MIPS throughput supports periodic LoRa, Sub-GHz, or Zigbee transmit bursts with the radio peripheral externally attached. The 12-bit ADC and 1 KB of EEPROM suit periodic analog front-end sampling (temperature, pressure, battery voltage), with EEPROM endurance of 100k cycles for local data logging. Hardware HLVD detects brown-out for graceful sleep entry, and the RTCC runs from an independent 32 kHz source so the main core stays asleep.
Recomendado
Industrial Control Panel
Industrial control panels with mixed analog and digital I/O benefit from the PIC18F66K22-I/MR's 54 digital I/O lines, 12-bit ADC with up to 16 channels, two comparators, and 5-bit dual DAC. The part's -40C to +85C industrial temperature grade handles factory-floor conditions, while the PIC18F66K22-E/MR or similar E-grade variants extend up to 125C for harsher enclosures. Multiple Enhanced USART, SPI, and I2C peripherals support concurrent fieldbuses and isolated serial links, and the 64 KB Flash accommodates MODBUS, CAN-derived protocols, and supervisory control firmware with room to spare. Hardware CRC and the CCP modules simplify PWM-driven motor or valve control, and the 64-VQFN footprint fits compact DIN-rail-mount mainboards.
Recomendado
Automotive Body Electronics
The PIC18F66K22 family is commonly used in non-safety automotive body modules such as interior lighting controllers, seat-position memory, HVAC dampers, and mirror-adjust modules, where its wide 5 V supply tolerance and nanoWatt XLP sleep currents are critical. Although the industrial-grade PIC18F66K22-I/MR is rated -40C to +85C, E-grade PIC18F66K22-E/MR variants extend operation to +125C, qualifying for under-dash environments. The 12-bit ADC and 5-bit DAC drive LED backlighting drivers and motor-control loops, while the CTMU enables capacitive occupant-detection buttons. For AEC-Q100 qualified designs, Microchip's dsPIC33 and PIC18F Q-series parts target the higher reliability tier; the K22 parts are widely deployed in commercial-vehicle and aftermarket automotive segments.
Recomendado
White Goods and Consumer Appliances
Washing machines, dishwashers, induction cooktops, and microwave ovens increasingly use PIC18F-series microcontrollers as the main digital control element for motor drive supervision, user-panel control, and fault diagnostics. The PIC18F66K22-I/MR provides ample I/O for keypad scanning, seven-segment LED or character-LCD drives, and triac zero-crossing sensing, while its 64 KB Flash fits full-feature appliances with multi-language firmware. The CTMU touch capability drives glass-panel capacitive sliders on premium washers and ovens, eliminating mechanical buttons. The 64 MHz MIPS performance comfortably runs PID motor-control loops at 10-100 kHz PWM via hardware ECCP, and the 12-bit ADC monitors temperature, water level, and current feedback. nanoWatt XLP standby modes keep standby energy below 0.5 W for energy-star compliance.
Recomendado
Digital Panel Meter and Test Instrument
The PIC18F66K22-I/MR's 12-bit ADC, 5-bit dual DAC, two comparators, and 64 MHz core make it a strong fit for low-cost digital panel meters, lab instrumentation front-ends, and handheld multimeters. The high channel count supports simultaneous voltage/current sensing for power monitoring and battery test equipment, while hardware PWM drives LCD contrast or audio alert tones. The 1 KB of EEPROM stores calibration constants, and the PIC18F66K22-E/MR (extended temperature) variant handles automotive or industrial test environments. The PIC18F66K22-I/MR's stability at 64 MHz supports USB CDC virtual-COM firmware stacks (via external MCP2200 or MCP2221 bridges), enabling USB-equipped bench tools without changing the part.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F66K22-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F66K22-E/MR | PIC18F65K22-E/MR | PIC18F65K90-I/MR | PIC18F65K90-E/MR | PIC18F65K80T-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Program Flash | 64 KB | 64 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Data RAM | 4 KB | 4 KB | 2 KB | 2 KB | 2 KB | 3.6 KB |
| Data EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Max CPU Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Supply Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 1.8 V to 5.5 V |
| Temperature Grade | Industrial -40C to +85C | Extended -40C to +125C | Extended -40C to +125C | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C |
Principais diferenciais
- Doubled Flash memory (64 KB vs 32 KB) (vs PIC18F65K22-I/MR)
- Industry-standard 64-VQFN footprint enables drop-in migration (vs PIC18F46K22-I/P)
- nanoWatt XLP deep-sleep below 100 nA typical (vs PIC18F65K80T-I/MR)
Notas de projeto
On the 64-VQFN package, the exposed thermal pad (pin 1) MUST be soldered to the PCB ground plane with thermal vias to dissipate package heat and provide the silicon substrate reference. Per the Microchip datasheet, place at least 4 thermal vias (0.3 mm drill) under the EP to the inner-layer ground pour; skip this and the part can exceed junction temperature limits at 64 MHz full-load operation, especially at elevated ambient temperatures.
Each VDD/VSS pin pair should have a 0.1 uF X7R ceramic capacitor placed within 5 mm of the corresponding package pin, with a single 4.7-10 uF bulk capacitor near the package. AVDD/AVSS require an additional ferrite bead or RC filter from VDD to keep ADC measurements clean. The 12-bit ADC achieves its rated ENOB only when these decoupling and layout recommendations are followed per Microchip application note TB3016.
Do not leave MCLR floating: the PIC18F66K22 family requires MCLR either tied to VDD via a 10 kohm resistor, or driven by the ICD programmer. An unwired MCLR pin intermittently latches the part into reset on noise edges. For low-power designs, use the internal MCLR-disable configuration and rely on the internal pull-up, as documented in section 4 of the datasheet, to save the external bias current.
Estimated: at 64 MHz, 5.5 V VDD, and full I/O toggle, the PIC18F66K22 dissipates approximately 60 mW internally, contributing to junction temperature rise. With 64-VQFN theta_JA around 24 C/W on a 4-layer JEDEC test board, the device stays well under the +85C industrial limit at room ambient; however, sealed enclosures may push ambient to 70C and require derating of CPU frequency or duty cycle per the datasheet thermal table.
Informações de conformidade
Industrial-grade part not AEC-Q100 qualified; for automotive body modules requiring extended temperature use the PIC18F66K22-E/MR variant (-40C to +125C). For full AEC-Q100, source dsPIC33 or PIC18F Q-series parts instead. RoHS and lead-free compliance verified from Microchip product page.
