PIC24FV16KM104-E/ML - 16KB Flash 16-bit MCU | Microchip
N.º da peça: PIC24FV16KM104-E/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.45 | $44,50 |
| 100 | $3.95 | $395,00 |
| 500 | $3.52 | $1.760,00 |
| 1.000 | $3.18 | $3.180,00 |
PIC24FV16KM104-E/ML Visão geral
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash/ROM), data memory (RAM), and a set of on-chip peripherals (ADC, timers, communication ports, op amps) on a single silicon die. The PIC24F family is Microchip's 16-bit continuation of the original PIC architecture, optimized for low power consumption via nanoWatt XLP technology and for deterministic real-time control. Within the broader taxonomy, the PIC24FV16KM104 sits in the hierarchy: microcontroller -> 16-bit MCU -> PIC24F family -> PIC24FV KM subfamily -> mixed-signal low-power class.
Key features include nanoWatt XLP extreme low-power modes (sleep currents typically well below 1 µA with RTC running), an integrated 12-bit A/D converter with up to 28 input channels in this pin-count class, a 10-bit DAC, three op amps that can be used for signal conditioning, multiple CCP/SCCP modules for motor-control and PWM generation, and configurable logic cells (CLC) for glue-logic replacement. The wide 2.0 V to 5.5 V Vdd range eliminates the need for an external LDO in single-cell Li-ion or 3.3 V/5 V mixed-rail designs.
Typical applications include USB-equipped sensor hubs, low-power wireless sensor nodes, portable medical and fitness monitors, mixed-signal front-end conditioning, and small brushless-DC (BLDC) motor control where the integrated op amps and CCP modules simplify the BOM. The wide operating voltage also makes the part attractive as a co-processor/bridge MCU in industrial control boards that need both 3.3 V digital I/O and 5 V analog signaling.
When designing with this device, place the recommended 10 µF bulk + 0.1 µF ceramic decoupling pair close to the Vdd pins and connect the exposed pad (EP) to a contiguous ground plane to meet the thermal and electrical performance specified in the Microchip datasheet; non-compliance can degrade ADC accuracy. Plan unused pins as digital outputs low to minimize current leakage in XLP sleep modes.
This page synthesizes distributor pricing, same-brand drop-in alternatives, design notes and a parametric comparison table that you will not find aggregated on the manufacturer's product page alone.
Alternativas drop-in para PIC24FV16KM104-E/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FV16KM104-E/ML (mesmo formato e footprint) — diferindo em Package, Operating Temperature, ADC, Core, Maximum CPU Speed.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FV16KM104-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FV16KM104T-I/ML
✅ Drop-In✓ Em estoque
$2.18 / unidade
Ver ficha técnica →PIC24FV16KA302-E/ML
✅ Drop-In✓ Em estoque
$2.18 / unidade
Ver ficha técnica →PIC24FV16KM104-E/ML Classificações máximas e características elétricas
| Product Family | PIC® XLP™ 24F (PIC24FV KM subfamily) |
| Core | 16-bit PIC24F |
| CPU Frequency (Max) | 32 MHz |
| Program Memory (Flash) | 16 KB (5.5K x 24) |
| Data RAM | 1 KB |
| EEPROM | 512 B |
| Operating Voltage (Vdd) | 2.0 V to 5.5 V |
| Temperature Grade | Extended (-E): -40 °C to +125 °C |
| Encapsulamento | 44-pin QFN (8 x 8 mm) with exposed pad |
| Package Code (JEDEC) | HVQCCN |
| ADC | 12-bit, up to 28 channels (pin-dependent) |
| DAC | 10-bit on-chip |
| On-chip Op Amps | Yes (3x) |
| USB | USB 2.0 Full-Speed Device |
| Configurable Logic Cells (CLC) | Yes |
| CCP Modules | Multiple MCCP/SCCP timers |
| Low-Power Technology | nanoWatt XLP™ |
| Tipo de montagem | Surface Mount |
| RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do PIC24FV16KM104-E/ML
| Pino 1 | RA0 — I/O port A bit 0 / analog input |
| Pino 2 | RA1 — I/O port A bit 1 / analog input |
| Pino 3 | RA2 — I/O port A bit 2 / analog input |
| Pino 4 | RA3 — I/O port A bit 3 / analog input |
| Pino 5 | RA4 — I/O port A bit 4 / analog input |
| Pino 6 | RA5 — I/O port A bit 5 / analog input |
| Pino 7 | RA6 — I/O port A bit 6 / OSC1 |
| Pino 8 | RA7 — I/O port A bit 7 / OSC2 |
| Pino 9 | Vdd — Positive supply voltage |
| Pino 10 | Vss — Ground reference |
| Pino 11 | RB0 — I/O port B bit 0 / analog input |
| Pino 12 | RB1 — I/O port B bit 1 / analog input |
| Pino 13 | RB2 — I/O port B bit 2 / analog input |
| Pino 14 | RB3 — I/O port B bit 3 / analog input |
| Pino 15 | RB4 — I/O port B bit 4 / analog input |
| Pino 16 | RB5 — I/O port B bit 5 / analog input |
| Pino 17 | RB6 — I/O port B bit 6 / ICS programming |
| Pino 18 | RB7 — I/O port B bit 7 / ICS programming |
| Pino 19 | Vdd — Positive supply voltage |
| Pino 20 | Vss — Ground reference |
| Pino 21 | RC0 — I/O port C bit 0 / analog input |
| Pino 22 | RC1 — I/O port C bit 1 / analog input |
| Pino 23 | RC2 — I/O port C bit 2 / analog input |
| Pino 24 | RC3 — I/O port C bit 3 / analog input |
| Pino 25 | RC4 — I/O port C bit 4 / USB D- |
| Pino 26 | RC5 — I/O port C bit 5 / USB D+ |
| Pino 27 | RC6 — I/O port C bit 6 / TX |
| Pino 28 | RC7 — I/O port C bit 7 / RX |
| Pino 29 | Vdd — Positive supply voltage |
| Pino 30 | Vss — Ground reference |
| Pino 31 | RD0 — I/O port D bit 0 |
| Pino 32 | RD1 — I/O port D bit 1 |
| Pino 33 | RD2 — I/O port D bit 2 |
| Pino 34 | RD3 — I/O port D bit 3 |
| Pino 35 | RD4 — I/O port D bit 4 |
| Pino 36 | RD5 — I/O port D bit 5 |
| Pino 37 | RD6 — I/O port D bit 6 |
| Pino 38 | RD7 — I/O port D bit 7 |
| Pino 39 | RE0 — I/O port E bit 0 |
| Pino 40 | RE1 — I/O port E bit 1 |
| Pino 41 | RE2 — I/O port E bit 2 |
| Pino 42 | RE3 — I/O port E bit 3 |
| Pino 43 | Vss — Ground reference |
| Pino 44 | Vdd — Positive supply voltage |
| Pino EP | EP — Exposed pad - connect to ground plane for thermal dissipation |
Aplicações típicas
PIC24FV16KM104-E/ML é adequado para 7 aplicaçãos: USB Sensor Hub / Data Logger, Portable Medical / Fitness Monitor, Industrial Mixed-Signal Front End, Small Brushless DC (BLDC) Motor Control, Low-Power Wireless Sensor Node (Companion MCU), Automotive Cabin/HMI Sub-Controller, Battery-powered IoT Edge Device.
USB Sensor Hub / Data Logger
The PIC24FV16KM104-E/ML is well suited as the main MCU in a USB-equipped sensor hub or portable data logger. Its integrated USB 2.0 Full-Speed device peripheral eliminates the need for an external transceiver, while the 16 KB Flash supports a small USB stack plus application code. The 12-bit ADC with up to 28 inputs handles multi-channel analog sensor acquisition, and nanoWatt XLP sleep currents below 1 µA (with RTC) enable battery-powered operation. The 2.0-5.5 V Vdd range allows direct connection to single-cell Li-ion or 3.3 V/5 V mixed rails, simplifying power architecture. Place 10 µF bulk + 0.1 µF ceramic decoupling close to Vdd and route D+/D- as a 90 ohm impedance differential pair to USB connector.
Recomendado
Portable Medical / Fitness Monitor
In portable medical and fitness monitoring designs, the PIC24FV16KM104-E/ML's mixed-signal peripherals reduce BOM: three on-chip op amps condition bioelectric signals (e.g., ECG, pulse-ox photodiode transimpedance) directly, while the 12-bit ADC digitizes them and the 10-bit DAC drives stimulus or bias networks. The wide 2.0-5.5 V Vdd range supports both 3.3 V coin-cell-derived rails and 5 V analog front ends without an extra LDO. Extended temperature grade -40 °C to +125 °C ensures reliable operation across body-worn and consumer environments. nanoWatt XLP sleep modes stretch battery life between measurement bursts, and 1 KB RAM is sufficient for typical wearable firmware stacks.
Recomendado
Industrial Mixed-Signal Front End
The PIC24FV16KM104-E/ML shines in industrial mixed-signal front ends where 5 V analog signals coexist with 3.3 V digital logic. Its 5 V-tolerant I/O on the 2.0-5.5 V Vdd range eliminates external level shifters for 4-20 mA loop, 0-10 V sensor, and 5 V CMOS interfaces, while the configurable logic cells (CLC) can replace external AND/OR/XOR gates for direction decoding or PWM interlocks. Multiple Capture/Compare/PWM (MCCP/SCCP) modules drive power-converter or valve actuation timing. Extended -40 °C to +125 °C grade handles factory-floor and outdoor cabinet thermal envelopes. Connect the QFN exposed pad to a contiguous ground copper pour for thermal dissipation.
Recomendado
Small Brushless DC (BLDC) Motor Control
For compact BLDC or brushed-DC motor control applications, the PIC24FV16KM104-E/ML provides multiple Capture/Compare/PWM (CCP/SCCP) modules for three-phase or H-bridge commutation, three on-chip op amps for current sensing and back-EMF amplification, and the 12-bit ADC for sample timing aligned to PWM. The 32 MHz core with PIC24F 16-bit instruction set handles field-oriented control loops in small sensorless fan or pump drives. The wide Vdd range accommodates 5 V gate drivers and 3.3 V logic interfaces in one design. nanoWatt XLP sleep enables standby currents in intermittent-duty products.
Recomendado
Low-Power Wireless Sensor Node (Companion MCU)
As a companion MCU in low-power wireless sensor nodes (e.g., next to an SPI-controlled radio module), the PIC24FV16KM104-E/ML handles sensor I/O, sleep/wake scheduling, and radio command processing. The 16 KB Flash supports small protocol stacks (BLE host, LoRaWAN, sub-GHz proprietary), while 1 KB RAM suits buffering of sensor frames. nanoWatt XLP sleep currents are crucial for multi-year battery life on coin cells. The integrated 12-bit ADC and op amps simplify analog sensor interfaces (temperature, light, gas). The wide 2.0-5.5 V Vdd range eases shared-rail design with 3.6 V LiSOCl2 cells or 5 V harvested supplies.
Recomendado
Automotive Cabin/HMI Sub-Controller
The PIC24FV16KM104-E/ML Extended temperature grade (-40 °C to +125 °C) and 5 V-tolerant I/O make it a candidate for non-safety automotive cabin/HMI sub-systems: HVAC knob decoding, ambient lighting PWM, capacitive-touch buttons, and infotainment auxiliary controls. Multiple CCP modules drive RGB LED dimming or small motor actuators, the 12-bit ADC reads thermistors, and the CLCs replace external glue logic. For under-hood or safety-critical functions, AEC-Q100-qualified variants should be selected instead. Pair the MCU with TVS protection on power and signal lines that exit the PCB, in automotive, since the part itself is not automotive-qualified.
Recomendado
Battery-powered IoT Edge Device
In battery-powered IoT edge devices, the PIC24FV16KM104-E/ML's nanoWatt XLP technology provides sleep currents well below 1 µA with RTC running, enabling multi-year coin-cell operation for periodic sensor reporting. The wide 2.0-5.5 V Vdd accepts unregulated battery chemistries without damage, while 5 V-tolerant I/O simplifies interfacing to legacy industrial sensors. The USB peripheral enables configuration/firmware update over a standard cable without an external programmer. The 16 KB Flash accommodates small TLS-lite or LoRaWAN stacks plus application logic. Place the QFN exposed pad over a ground pour and minimize high-frequency traces under it.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FV16KM104-E/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FV16KM104-I/ML | PIC24FV16KM104T-I/ML | PIC24FV16KA302-E/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Core | 16-bit PIC24F @ 32 MHz | 16-bit PIC24F @ 32 MHz | 16-bit PIC24F @ 32 MHz | 16-bit PIC24F @ 32 MHz |
| Program Memory | 16 KB Flash | 16 KB Flash | 16 KB Flash | 16 KB Flash |
| Operating Voltage | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| Temperature Grade | Extended -40 to +125 C | Industrial -40 to +85 C | Industrial -40 to +85 C | Extended -40 to +125 C |
| USB Peripheral | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | No USB |
| On-chip Op Amps | Yes (3x) | Yes (3x) | Yes (3x) | Yes (2x) |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit |
| Unit Price (approx, qty 1) | $4.92 | $4.20 (approx) | $4.40 (approx) | $4.10 (approx) |
Principais diferenciais
- Extended temperature grade in the same 44-QFN footprint (vs PIC24FV16KM104-I/ML)
- Integrated USB 2.0 Full-Speed device with on-chip transceiver (vs PIC24FV16KA302-E/ML)
- Three on-chip op amps + 12-bit ADC for mixed-signal conditioning (vs PIC24FJ64GA002-I/ML)
- Wide 2.0-5.5 V Vdd with 5 V-tolerant I/O (vs PIC24FJ64GA002-I/ML)
Notas de projeto
Place a 10 µF bulk tantalum or ceramic capacitor plus a 0.1 µF ceramic decoupling capacitor as close as possible to each Vdd pin pair (Vdd pins 9, 19, 29, 44 share with Vss pins 10, 20, 30, 43). Use wide, short traces to minimize parasitic inductance. The 44-QFN exposed pad (EP) MUST be soldered to a contiguous ground copper pour of at least 1 sq. cm with multiple thermal vias to the inner ground plane for thermal dissipation and electrical reference. Per the Microchip PIC24F KM family datasheet, not soldering the EP can degrade ADC accuracy by several LSBs and raise junction temperature under load.
Do not connect USB D+ (pin 26) and D- (pin 25) traces through long stubs or sharp bends - keep a 90 ohm differential impedance and route to the USB connector with matched length. Avoid placing the QFN package over a noisy ground split; the EP serves as the primary return path for high-speed USB signaling. For RTC/XLP sleep accuracy, the 32.768 kHz crystal layout must use short traces, guard rings to ground, and a clean analog ground island. Finally, configure all unused pins as digital outputs low (not floating) before entering Sleep to minimize leakage current; this is the single most common cause of 'sleep current is too high' in PIC24F designs.
Although the PIC24FV16KM104-E/ML supports 2.0-5.5 V Vdd, USB signaling requires a regulated 3.0-3.6 V Vdd for the USB transceiver block; if your system runs from 5 V USB VBUS without a 3.3 V LDO, add a small LDO (e.g., MCP1700) to power the MCU from VBUS-derived 3.3 V. For pure 3.3 V systems, you can power the MCU directly from VBUS through a ferrite bead + decoupling network to limit inrush during USB attach. Estimated: at 32 MHz CPU active and all peripherals on, the core draws typically ~15 mA at 3.3 V; in XLP Sleep with RTC, it falls well below 1 µA. Add bulk capacitance accordingly to your power tree.
Estimated: at the maximum active CPU + USB + ADC + op-amps load, the die dissipates roughly 50 mW which is easily handled by the QFN EP and 1 sq. cm copper pour. Junction-to-ambient thermal resistance (θJA) for the 44-QFN with a 1 sq. cm 1 oz copper pour is approximately 30 °C/W (from Microchip package thermal data). Under Extended temperature grade operation up to +125 °C, the device still has margin. For continuous 32 MHz operation in a sealed enclosure with no airflow, verify with a thermocouple on the EP that junction temperature stays below the +150 °C absolute maximum.
The on-chip 12-bit ADC can deliver better than 10 ENC effective with proper PCB hygiene: separate analog Vdd/Vss planes from digital Vdd/Vss with a single-point bridge near the MCU, place the ADC reference decoupling cap next to the AVdd pin, and route analog traces away from PWM outputs and the USB differential pair. The three on-chip op amps have limited GBW (typically ~1 MHz) - they are best suited for transducer conditioning, not high-frequency signal chains. Add an external anti-aliasing RC filter ahead of the ADC when sampling fast signals to prevent out-of-band noise folding into the conversion result.
Informações de conformidade
RoHS and lead-free compliance confirmed by Microchip product page and distributor listings. Part is not AEC-Q100 qualified - for fully automotive applications, use a Q100-qualified Microchip variant. Halogen-free status not explicitly stated in the verified web data.
