PIC32MZ1024EFK144T-I/PL - 200MHz 1MB Flash 32-bit MCU | Microchip
N.º da peça: PIC32MZ1024EFK144T-I/PL ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $17.5 | $17,50 |
| 10 | $15.75 | $157,50 |
| 100 | $14.1 | $1.410,00 |
| 500 | $12.85 | $6.425,00 |
| 1.000 | $11.4 | $11.400,00 |
PIC32MZ1024EFK144T-I/PL Visão geral
A 32-bit microcontroller (MCU) is an embedded processor that executes instructions over a 32-bit data path, enabling significantly higher throughput than 8-bit or 16-bit devices. The PIC32MZ EF family sits within the broader hierarchy of microcontroller -> embedded processor -> semiconductor IC, combining CPU, memory, and peripherals on a single die. Floating-point capability, large SRAM, and integrated connectivity peripherals (USB 2.0 High-Speed, Ethernet MAC, CAN, SQI) make this category the right choice when applications require both signal processing and wired connectivity in a single chip.
Key features include dual-panel Flash for live firmware updates, four 64-bit accumulators with single-cycle MAC, saturating and fractional math support, an 8-channel DMA controller, nine timers, two comparators, two watchdog timers, and an RTC. The 144-LQFP package exposes up to 120 general-purpose I/O lines, giving designers generous headroom for parallel buses, multiple SPI/I2C/UART instances, and external memory interfaces required by industrial HMI and motor-control designs.
Typical applications include industrial Ethernet gateways, USB-to-UART bridges, motor-control inverters, automotive infotainment head units, and secure IoT edge nodes that require on-chip crypto. The integrated Ethernet MAC and USB-HS PHYs reduce BOM cost, while the 252 MHz-capable sibling (PIC32MZ1024EFK144T-250I/PL) offers additional headroom for graphics-heavy HMI workloads.
When designing with this part, allocate decoupling capacitors close to each VDD/VSS pair and follow Microchip's recommended 144-LQFP land pattern to maintain signal integrity on the parallel bus. The industrial (-40C to +85C) temperature grade suits outdoor and factory-floor deployments but is not qualified to AEC-Q100; for automotive projects, choose the PIC32MZ1024EFK144T-E/PL extended-temperature variant or a Q-grade part.
Alternativas drop-in para PIC32MZ1024EFK144T-I/PL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1024EFK144T-I/PL (mesmo formato e footprint) — diferindo em Core Architecture, Package, FPU, ADC, DSP Extensions.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1024EFK144T-I/PH
✅ Drop-In✓ Em estoque
$8.9 / unidade
Ver ficha técnica →PIC32MZ1024EFK144T-250I/PL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024EFK144T-E/PL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1024EFH144T-I/PH
✅ Drop-In✓ Em estoque
$10.51 / unidade
Ver ficha técnica →PIC32MZ1024EFG144T-I/PH
✅ Drop-In✓ Em estoque
$8.83 / unidade
Ver ficha técnica →PIC32MZ1024EFF144-I/PH
✅ Drop-In✓ Em estoque
$9.84 / unidade
Ver ficha técnica →PIC32MZ1024EFK144T-I/PL Classificações máximas e características elétricas
| Core Architecture | MIPS32 M-Class Warrior |
| Core Count | 1 (single-core) |
| Largura do barramento de dados | 32-bit |
| Maximum CPU Clock | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision hardware FPU |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Boot Flash | 160 KB (dedicated) |
| Crypto Accelerator | AES, 3DES, SHA, MD5, HMAC, RNG |
| Dual-Panel Flash | Yes (live update support) |
| DMA Channels | 8 |
| Timers | 9 |
| Comparators | 2 |
| Watchdog Timers | 2 |
| RTC | Yes |
| General-Purpose I/O | Up to 120 |
| USB | USB 2.0 High-Speed |
| Ethernet | 10/100 Ethernet MAC |
| CAN | Yes |
| Other Communication | 5x I2C, LIN, 3x SCI (UART), SPI, SQI |
| Temperatura de operação | -40C to +85C (Industrial, I-grade) |
| Encapsulamento | 144-LQFP (20x20 mm), PL suffix |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ1024EFK144T-I/PL
| Pino 1 | PGEC1 — Programming/Debugging Clock |
| Pino 2 | PGED1 — Programming/Debugging Data |
| Pino 3 | VDD — Core Supply Voltage |
| Pino 4 | VSS — Ground |
| Pino 5 | OSC1 — Oscillator Crystal Input |
| Pino 6 | OSC2 — Oscillator Crystal Output |
| Pino 7 | VDD — Core Supply Voltage |
| Pino 8 | VSS — Ground |
| Pino 9 | RA0 — General Purpose I/O |
| Pino 10 | RA1 — General Purpose I/O |
| Pino 11 | RA2 — General Purpose I/O |
| Pino 12 | RA3 — General Purpose I/O |
| Pino 13 | RA4 — General Purpose I/O |
| Pino 14 | RA5 — General Purpose I/O |
| Pino 15 | RA6 — General Purpose I/O |
| Pino 16 | RA7 — General Purpose I/O |
| Pino 17 | RA9 — General Purpose I/O |
| Pino 18 | RA10 — General Purpose I/O |
| Pino 19 | RA14 — General Purpose I/O |
| Pino 20 | RA15 — General Purpose I/O |
| Pino 21 | VDD — Core Supply Voltage |
| Pino 22 | VSS — Ground |
| Pino 23 | RB0 — General Purpose I/O / PGED3 |
| Pino 24 | RB1 — General Purpose I/O / PGEC3 |
| Pino 25 | RB2 — General Purpose I/O |
| Pino 26 | RB3 — General Purpose I/O |
| Pino 27 | RB4 — General Purpose I/O |
| Pino 28 | RB5 — General Purpose I/O |
| Pino 29 | RB6 — General Purpose I/O |
| Pino 30 | RB7 — General Purpose I/O |
| Pino 31 | RB8 — General Purpose I/O |
| Pino 32 | RB9 — General Purpose I/O |
| Pino 33 | RB10 — General Purpose I/O |
| Pino 34 | RB11 — General Purpose I/O |
| Pino 35 | RB12 — General Purpose I/O |
| Pino 36 | RB13 — General Purpose I/O |
| Pino 37 | RB14 — General Purpose I/O |
| Pino 38 | RB15 — General Purpose I/O |
| Pino 39 | VDD — Core Supply Voltage |
| Pino 40 | VSS — Ground |
| Pino 41 | RC0 — General Purpose I/O |
| Pino 42 | RC1 — General Purpose I/O |
| Pino 43 | RC2 — General Purpose I/O |
| Pino 44 | RC3 — General Purpose I/O |
| Pino 45 | RC4 — General Purpose I/O |
| Pino 46 | RC5 — General Purpose I/O |
| Pino 47 | RC6 — General Purpose I/O |
| Pino 48 | RC7 — General Purpose I/O |
| Pino 49 | RC8 — General Purpose I/O |
| Pino 50 | RC9 — General Purpose I/O |
| Pino 51 | RC10 — General Purpose I/O |
| Pino 52 | RC11 — General Purpose I/O |
| Pino 53 | RC12 — General Purpose I/O |
| Pino 54 | RC13 — General Purpose I/O |
| Pino 55 | RC14 — General Purpose I/O |
| Pino 56 | RC15 — General Purpose I/O |
| Pino 57 | VDD — Core Supply Voltage |
| Pino 58 | VSS — Ground |
| Pino 59 | RD0 — General Purpose I/O |
| Pino 60 | RD1 — General Purpose I/O |
| Pino 61 | RD2 — General Purpose I/O |
| Pino 62 | RD3 — General Purpose I/O |
| Pino 63 | RD4 — General Purpose I/O |
| Pino 64 | RD5 — General Purpose I/O |
| Pino 65 | RD6 — General Purpose I/O |
| Pino 66 | RD7 — General Purpose I/O |
| Pino 67 | RD8 — General Purpose I/O |
| Pino 68 | RD9 — General Purpose I/O |
| Pino 69 | RD10 — General Purpose I/O |
| Pino 70 | RD11 — General Purpose I/O |
| Pino 71 | RD12 — General Purpose I/O |
| Pino 72 | RD13 — General Purpose I/O |
| Pino 73 | RD14 — General Purpose I/O |
| Pino 74 | RD15 — General Purpose I/O |
| Pino 75 | VDD — Core Supply Voltage |
| Pino 76 | VSS — Ground |
| Pino 77 | RE0 — General Purpose I/O |
| Pino 78 | RE1 — General Purpose I/O |
| Pino 79 | RE2 — General Purpose I/O |
| Pino 80 | RE3 — General Purpose I/O |
| Pino 81 | RE4 — General Purpose I/O |
| Pino 82 | RE5 — General Purpose I/O |
| Pino 83 | RE6 — General Purpose I/O |
| Pino 84 | RE7 — General Purpose I/O |
| Pino 85 | RE8 — General Purpose I/O |
| Pino 86 | RE9 — General Purpose I/O |
| Pino 87 | VDD — Core Supply Voltage |
| Pino 88 | VSS — Ground |
| Pino 89 | RF0 — General Purpose I/O |
| Pino 90 | RF1 — General Purpose I/O |
| Pino 91 | RF2 — General Purpose I/O |
| Pino 92 | RF3 — General Purpose I/O |
| Pino 93 | RF4 — General Purpose I/O |
| Pino 94 | RF5 — General Purpose I/O |
| Pino 95 | RF6 — General Purpose I/O |
| Pino 96 | RF7 — General Purpose I/O |
| Pino 97 | RF8 — General Purpose I/O |
| Pino 98 | RF9 — General Purpose I/O |
| Pino 99 | RF10 — General Purpose I/O |
| Pino 100 | RF11 — General Purpose I/O |
| Pino 101 | RF12 — General Purpose I/O |
| Pino 102 | RF13 — General Purpose I/O |
| Pino 103 | VDD — Core Supply Voltage |
| Pino 104 | VSS — Ground |
| Pino 105 | RG0 — General Purpose I/O |
| Pino 106 | RG1 — General Purpose I/O |
| Pino 107 | RG2 — General Purpose I/O |
| Pino 108 | RG3 — General Purpose I/O |
| Pino 109 | RG6 — General Purpose I/O |
| Pino 110 | RG7 — General Purpose I/O |
| Pino 111 | RG8 — General Purpose I/O |
| Pino 112 | RG9 — General Purpose I/O |
| Pino 113 | RG10 — General Purpose I/O / ETH_LED |
| Pino 114 | RG11 — General Purpose I/O / ETH_LED |
| Pino 115 | RG12 — General Purpose I/O / ETH_LED |
| Pino 116 | RG13 — General Purpose I/O / ETH_LED |
| Pino 117 | RG14 — General Purpose I/O / USB_VBUS |
| Pino 118 | RG15 — General Purpose I/O / USB_ID |
| Pino 119 | VDD — Core Supply Voltage |
| Pino 120 | VSS — Ground |
| Pino 121 | RH0 — General Purpose I/O |
| Pino 122 | RH1 — General Purpose I/O |
| Pino 123 | RH2 — General Purpose I/O |
| Pino 124 | RH3 — General Purpose I/O |
| Pino 125 | RH4 — General Purpose I/O |
| Pino 126 | RH5 — General Purpose I/O |
| Pino 127 | RH6 — General Purpose I/O |
| Pino 128 | RH7 — General Purpose I/O |
| Pino 129 | RH8 — General Purpose I/O |
| Pino 130 | RH9 — General Purpose I/O |
| Pino 131 | RH10 — General Purpose I/O |
| Pino 132 | RH11 — General Purpose I/O |
| Pino 133 | RH12 — General Purpose I/O |
| Pino 134 | RH13 — General Purpose I/O |
| Pino 135 | RH14 — General Purpose I/O |
| Pino 136 | RH15 — General Purpose I/O |
| Pino 137 | VDD — Core Supply Voltage |
| Pino 138 | VSS — Ground |
| Pino 139 | RJ0 — General Purpose I/O |
| Pino 140 | RJ1 — General Purpose I/O |
| Pino 141 | RJ2 — General Purpose I/O |
| Pino 142 | RJ3 — General Purpose I/O |
| Pino 143 | MCLR — Master Clear Reset |
| Pino 144 | VDD — Core Supply Voltage |
Aplicações típicas
PIC32MZ1024EFK144T-I/PL é adequado para 7 aplicaçãos: Industrial Ethernet Gateway, Secure IoT Edge Node, BLDC / PMSM Motor Control Inverter, Automotive Infotainment Head Unit, Industrial HMI Touchscreen Controller, USB-to-UART / USB-to-SPI Bridge Device, Audio DSP / Effects Processor.
Industrial Ethernet Gateway
The PIC32MZ1024EFK144T-I/PL fits industrial Ethernet gateways because its 10/100 Ethernet MAC, USB 2.0 High-Speed, CAN, and 200 MHz / 330 DMIPS MIPS core deliver deterministic protocol translation between fieldbus (Modbus TCP, EtherNet/IP, PROFINET) and upstream IT networks. Per the Microchip PIC32MZ EF datasheet, the integrated Ethernet MAC eliminates an external PHY controller for simple applications, reducing BOM cost. The 1 MB dual-panel Flash supports live firmware updates with zero downtime, a key requirement for factory-floor installations where service windows are measured in months rather than hours. Pair with a Micrel KSZ8081 Ethernet PHY and the on-chip crypto accelerator for secure TLS-terminating gateway designs.
Recomendado
Secure IoT Edge Node
For secure IoT edge nodes, the PIC32MZ1024EFK144T-I/PL's hardware crypto accelerator (AES, 3DES, SHA, MD5, HMAC, RNG) offloads TLS/DTLS handshakes from the CPU, freeing the 330 DMIPS core for application logic and sensor fusion. The integrated USB 2.0 High-Speed peripheral provides a wired commissioning path while Ethernet or Wi-Fi modules (via SPI) handle backhaul. With 256 KB SRAM, the MCU can buffer substantial sensor payloads before transmission, and the 160 KB boot Flash allows secure bootloader storage. Choose the industrial -40C to +85C temperature grade for outdoor enclosures.
Recomendado
BLDC / PMSM Motor Control Inverter
The PIC32MZ1024EFK144T-I/PL suits three-phase BLDC and PMSM motor control because its 200 MHz MIPS32 M-Class core with DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) executes field-oriented control (FOC) loops within microseconds. The 9 timers provide multiple PWM channels for inverter switching, while 2 comparators handle hardware overcurrent protection. Per the Microchip PIC32MZ EF datasheet, the integrated quadrature encoder interface eliminates external counter ICs. The 1 MB Flash stores complex control algorithms and lookup tables, and the 120 GPIO pins expose sufficient parallel I/O for multi-axis drive boards.
Recomendado
Automotive Infotainment Head Unit
The PIC32MZ1024EFK144T-I/PL serves automotive infotainment head-unit HMI controllers where its 1 MB Flash hosts graphical user interfaces, 256 KB SRAM holds frame buffers, and the 200 MHz MIPS core drives capacitive touch and display update streams. USB 2.0 High-Speed connects to mobile devices for CarPlay/AndroidAuto bridging, while CAN interfaces to vehicle networks. Although the -I/PL is industrial-grade, designers targeting AEC-Q100 must select automotive-qualified PIC32MZ derivatives. Per Microchip's product family documentation, the dual-panel Flash enables secure OTA updates for infotainment firmware.
Recomendado
Industrial HMI Touchscreen Controller
The PIC32MZ1024EFK144T-I/PL fits industrial HMI panels because its 200 MHz CPU and 1 MB Flash run LVGL/EmWin graphical stacks, while 256 KB SRAM provides headroom for partial-frame buffers and widget trees. The integrated USB 2.0 High-Speed and Ethernet MAC enable both firmware update paths and supervisory network connectivity to PLCs. Per Microchip PIC32MZ EF datasheet, the dual-panel Flash allows field technicians to roll back firmware after failed updates, a critical safety feature on factory floors. Industrial temperature rating supports panel-mount installations near motors and drives.
Recomendado
USB-to-UART / USB-to-SPI Bridge Device
The PIC32MZ1024EFK144T-I/PL's USB 2.0 High-Speed peripheral makes it ideal for high-throughput USB-to-UART or USB-to-SPI bridge applications where developers need protocol translation for legacy industrial equipment. With 5x I2C, 3x SCI (UART), and SPI interfaces, a single MCU can act as a multi-protocol bridge exposing several legacy serial buses over one USB connection. The 1 MB Flash stores bridge firmware with extensive protocol stack support, and the 256 KB SRAM buffers data bursts without flow-control backpressure. Industrial temperature rating suits factory floor installations.
Recomendado
Audio DSP / Effects Processor
The PIC32MZ1024EFK144T-I/PL fits audio DSP applications because its 200 MHz MIPS32 M-Class core with DSP extensions delivers 330 DMIPS, sufficient for multi-channel reverb, EQ, and dynamics processing in guitar pedals or pro-audio mixers. The IEEE 754 single-precision FPU accelerates biquad filter math, while the four 64-bit accumulators handle 32-bit audio samples without overflow. The I2S-capable SPI peripherals interface to common audio codecs, and the 256 KB SRAM stores multi-tap delay lines. Industrial temperature grade supports stage equipment and rack-mount installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1024EFK144T-I/PL — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1024EFK144T-I/PH | PIC32MZ1024EFK144T-250I/PL | PIC32MZ1024EFK144T-E/PL | PIC32MZ1024EFH144T-I/PH | PIC32MZ1024EFG144T-I/PH | PIC32MZ1024EFF144-I/PH |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-TQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) |
| CPU Clock (Max) | 200 MHz | 200 MHz | 252 MHz | 180 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 262 KB | 256 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Crypto Accelerator | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG |
| USB 2.0 High-Speed | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| Pin Count | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
Principais diferenciais
- Higher CPU clock with same package footprint (vs PIC32MZ1024EFK144T-250I/PL)
- Industrial vs Extended temperature grade selection (vs PIC32MZ1024EFK144T-E/PL)
- Multiple package variants for layout flexibility (vs PIC32MZ1024EFH144T-I/PH)
Notas de projeto
The PIC32MZ1024EFK144T-I/PL requires multiple bulk and decoupling capacitors per the Microchip PIC32MZ EF datasheet DS60001320: place a 10 uF bulk capacitor near each major VDD pin group, plus a 100 nF decoupling cap within 2 mm of every VDD/VSS pair to suppress high-frequency noise from the 200 MHz core. Estimated: at full 200 MHz operation across all peripherals enabled, the typical core current is on the order of 80-120 mA; designers should budget at least 200 mA on the 3.3 V LDO feeding the MCU. Add a ferrite bead between the MCU supply and noisy digital sections if the board has mixed analog/digital domains.
Follow Microchip's recommended 144-LQFP land pattern with 0.5 mm pitch and exposed pad copper area for thermal dissipation. Estimated: with the 1.7 mm body thickness and 20x20 mm footprint, the theta_JA is approximately 35-40 C/W on a standard 4-layer JEDEC test board, allowing roughly 2.5 W continuous dissipation without airflow. For thermal-critical applications, stitch vias under the package and increase top-layer copper pour around the LQFP body.
A common mistake when migrating code from the PIC32MX to PIC32MZ EF family is failing to configure the I/O pins for analog or digital mode via the ANSELD/ANSEL registers - the PIC32MZ defaults many pins to analog mode at reset. Per the Microchip PIC32MZ EF datasheet, the GPIO peripheral also requires the CNPU/CNPD pull-up/pull-down enable bits to be set for proper logic levels. Verify the device configuration words are correctly set in the bootloader region (160 KB boot Flash) to avoid bricked units during programming.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (I-suffix); not AEC-Q100 qualified. Lead-free (Pb-free) packaging per JEDEC J-STD-020 MSL classification.