PIC32MZ1024EFK144T-I/PL - 200MHz 1MB Flash 32-bit MCU | Microchip
부품 번호: PIC32MZ1024EFK144T-I/PL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $17.5 | $17.50 |
| 10 | $15.75 | $157.50 |
| 100 | $14.1 | $1,410.00 |
| 500 | $12.85 | $6,425.00 |
| 1,000 | $11.4 | $11,400.00 |
PIC32MZ1024EFK144T-I/PL 개요
A 32-bit microcontroller (MCU) is an embedded processor that executes instructions over a 32-bit data path, enabling significantly higher throughput than 8-bit or 16-bit devices. The PIC32MZ EF family sits within the broader hierarchy of microcontroller -> embedded processor -> semiconductor IC, combining CPU, memory, and peripherals on a single die. Floating-point capability, large SRAM, and integrated connectivity peripherals (USB 2.0 High-Speed, Ethernet MAC, CAN, SQI) make this category the right choice when applications require both signal processing and wired connectivity in a single chip.
Key features include dual-panel Flash for live firmware updates, four 64-bit accumulators with single-cycle MAC, saturating and fractional math support, an 8-channel DMA controller, nine timers, two comparators, two watchdog timers, and an RTC. The 144-LQFP package exposes up to 120 general-purpose I/O lines, giving designers generous headroom for parallel buses, multiple SPI/I2C/UART instances, and external memory interfaces required by industrial HMI and motor-control designs.
Typical applications include industrial Ethernet gateways, USB-to-UART bridges, motor-control inverters, automotive infotainment head units, and secure IoT edge nodes that require on-chip crypto. The integrated Ethernet MAC and USB-HS PHYs reduce BOM cost, while the 252 MHz-capable sibling (PIC32MZ1024EFK144T-250I/PL) offers additional headroom for graphics-heavy HMI workloads.
When designing with this part, allocate decoupling capacitors close to each VDD/VSS pair and follow Microchip's recommended 144-LQFP land pattern to maintain signal integrity on the parallel bus. The industrial (-40C to +85C) temperature grade suits outdoor and factory-floor deployments but is not qualified to AEC-Q100; for automotive projects, choose the PIC32MZ1024EFK144T-E/PL extended-temperature variant or a Q-grade part.
드롭인 대체품: PIC32MZ1024EFK144T-I/PL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1024EFK144T-I/PL (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, FPU, ADC, DSP Extensions.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFK144T-I/PH
✅ 드롭인✓ 재고 있음
$8.9 / 개
데이터시트 보기 →PIC32MZ1024EFK144T-250I/PL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1024EFK144T-E/PL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1024EFH144T-I/PH
✅ 드롭인✓ 재고 있음
$10.51 / 개
데이터시트 보기 →PIC32MZ1024EFG144T-I/PH
✅ 드롭인✓ 재고 있음
$8.83 / 개
데이터시트 보기 →PIC32MZ1024EFF144-I/PH
✅ 드롭인✓ 재고 있음
$9.84 / 개
데이터시트 보기 →PIC32MZ1024EFK144T-I/PL 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class Warrior |
| Core Count | 1 (single-core) |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Clock | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision hardware FPU |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Boot Flash | 160 KB (dedicated) |
| Crypto Accelerator | AES, 3DES, SHA, MD5, HMAC, RNG |
| Dual-Panel Flash | Yes (live update support) |
| DMA Channels | 8 |
| Timers | 9 |
| Comparators | 2 |
| Watchdog Timers | 2 |
| RTC | Yes |
| General-Purpose I/O | Up to 120 |
| USB | USB 2.0 High-Speed |
| Ethernet | 10/100 Ethernet MAC |
| CAN | Yes |
| Other Communication | 5x I2C, LIN, 3x SCI (UART), SPI, SQI |
| 동작 온도 | -40C to +85C (Industrial, I-grade) |
| 패키지 | 144-LQFP (20x20 mm), PL suffix |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
PIC32MZ1024EFK144T-I/PL 핀 구성
| 핀 1 | PGEC1 — Programming/Debugging Clock |
| 핀 2 | PGED1 — Programming/Debugging Data |
| 핀 3 | VDD — Core Supply Voltage |
| 핀 4 | VSS — Ground |
| 핀 5 | OSC1 — Oscillator Crystal Input |
| 핀 6 | OSC2 — Oscillator Crystal Output |
| 핀 7 | VDD — Core Supply Voltage |
| 핀 8 | VSS — Ground |
| 핀 9 | RA0 — General Purpose I/O |
| 핀 10 | RA1 — General Purpose I/O |
| 핀 11 | RA2 — General Purpose I/O |
| 핀 12 | RA3 — General Purpose I/O |
| 핀 13 | RA4 — General Purpose I/O |
| 핀 14 | RA5 — General Purpose I/O |
| 핀 15 | RA6 — General Purpose I/O |
| 핀 16 | RA7 — General Purpose I/O |
| 핀 17 | RA9 — General Purpose I/O |
| 핀 18 | RA10 — General Purpose I/O |
| 핀 19 | RA14 — General Purpose I/O |
| 핀 20 | RA15 — General Purpose I/O |
| 핀 21 | VDD — Core Supply Voltage |
| 핀 22 | VSS — Ground |
| 핀 23 | RB0 — General Purpose I/O / PGED3 |
| 핀 24 | RB1 — General Purpose I/O / PGEC3 |
| 핀 25 | RB2 — General Purpose I/O |
| 핀 26 | RB3 — General Purpose I/O |
| 핀 27 | RB4 — General Purpose I/O |
| 핀 28 | RB5 — General Purpose I/O |
| 핀 29 | RB6 — General Purpose I/O |
| 핀 30 | RB7 — General Purpose I/O |
| 핀 31 | RB8 — General Purpose I/O |
| 핀 32 | RB9 — General Purpose I/O |
| 핀 33 | RB10 — General Purpose I/O |
| 핀 34 | RB11 — General Purpose I/O |
| 핀 35 | RB12 — General Purpose I/O |
| 핀 36 | RB13 — General Purpose I/O |
| 핀 37 | RB14 — General Purpose I/O |
| 핀 38 | RB15 — General Purpose I/O |
| 핀 39 | VDD — Core Supply Voltage |
| 핀 40 | VSS — Ground |
| 핀 41 | RC0 — General Purpose I/O |
| 핀 42 | RC1 — General Purpose I/O |
| 핀 43 | RC2 — General Purpose I/O |
| 핀 44 | RC3 — General Purpose I/O |
| 핀 45 | RC4 — General Purpose I/O |
| 핀 46 | RC5 — General Purpose I/O |
| 핀 47 | RC6 — General Purpose I/O |
| 핀 48 | RC7 — General Purpose I/O |
| 핀 49 | RC8 — General Purpose I/O |
| 핀 50 | RC9 — General Purpose I/O |
| 핀 51 | RC10 — General Purpose I/O |
| 핀 52 | RC11 — General Purpose I/O |
| 핀 53 | RC12 — General Purpose I/O |
| 핀 54 | RC13 — General Purpose I/O |
| 핀 55 | RC14 — General Purpose I/O |
| 핀 56 | RC15 — General Purpose I/O |
| 핀 57 | VDD — Core Supply Voltage |
| 핀 58 | VSS — Ground |
| 핀 59 | RD0 — General Purpose I/O |
| 핀 60 | RD1 — General Purpose I/O |
| 핀 61 | RD2 — General Purpose I/O |
| 핀 62 | RD3 — General Purpose I/O |
| 핀 63 | RD4 — General Purpose I/O |
| 핀 64 | RD5 — General Purpose I/O |
| 핀 65 | RD6 — General Purpose I/O |
| 핀 66 | RD7 — General Purpose I/O |
| 핀 67 | RD8 — General Purpose I/O |
| 핀 68 | RD9 — General Purpose I/O |
| 핀 69 | RD10 — General Purpose I/O |
| 핀 70 | RD11 — General Purpose I/O |
| 핀 71 | RD12 — General Purpose I/O |
| 핀 72 | RD13 — General Purpose I/O |
| 핀 73 | RD14 — General Purpose I/O |
| 핀 74 | RD15 — General Purpose I/O |
| 핀 75 | VDD — Core Supply Voltage |
| 핀 76 | VSS — Ground |
| 핀 77 | RE0 — General Purpose I/O |
| 핀 78 | RE1 — General Purpose I/O |
| 핀 79 | RE2 — General Purpose I/O |
| 핀 80 | RE3 — General Purpose I/O |
| 핀 81 | RE4 — General Purpose I/O |
| 핀 82 | RE5 — General Purpose I/O |
| 핀 83 | RE6 — General Purpose I/O |
| 핀 84 | RE7 — General Purpose I/O |
| 핀 85 | RE8 — General Purpose I/O |
| 핀 86 | RE9 — General Purpose I/O |
| 핀 87 | VDD — Core Supply Voltage |
| 핀 88 | VSS — Ground |
| 핀 89 | RF0 — General Purpose I/O |
| 핀 90 | RF1 — General Purpose I/O |
| 핀 91 | RF2 — General Purpose I/O |
| 핀 92 | RF3 — General Purpose I/O |
| 핀 93 | RF4 — General Purpose I/O |
| 핀 94 | RF5 — General Purpose I/O |
| 핀 95 | RF6 — General Purpose I/O |
| 핀 96 | RF7 — General Purpose I/O |
| 핀 97 | RF8 — General Purpose I/O |
| 핀 98 | RF9 — General Purpose I/O |
| 핀 99 | RF10 — General Purpose I/O |
| 핀 100 | RF11 — General Purpose I/O |
| 핀 101 | RF12 — General Purpose I/O |
| 핀 102 | RF13 — General Purpose I/O |
| 핀 103 | VDD — Core Supply Voltage |
| 핀 104 | VSS — Ground |
| 핀 105 | RG0 — General Purpose I/O |
| 핀 106 | RG1 — General Purpose I/O |
| 핀 107 | RG2 — General Purpose I/O |
| 핀 108 | RG3 — General Purpose I/O |
| 핀 109 | RG6 — General Purpose I/O |
| 핀 110 | RG7 — General Purpose I/O |
| 핀 111 | RG8 — General Purpose I/O |
| 핀 112 | RG9 — General Purpose I/O |
| 핀 113 | RG10 — General Purpose I/O / ETH_LED |
| 핀 114 | RG11 — General Purpose I/O / ETH_LED |
| 핀 115 | RG12 — General Purpose I/O / ETH_LED |
| 핀 116 | RG13 — General Purpose I/O / ETH_LED |
| 핀 117 | RG14 — General Purpose I/O / USB_VBUS |
| 핀 118 | RG15 — General Purpose I/O / USB_ID |
| 핀 119 | VDD — Core Supply Voltage |
| 핀 120 | VSS — Ground |
| 핀 121 | RH0 — General Purpose I/O |
| 핀 122 | RH1 — General Purpose I/O |
| 핀 123 | RH2 — General Purpose I/O |
| 핀 124 | RH3 — General Purpose I/O |
| 핀 125 | RH4 — General Purpose I/O |
| 핀 126 | RH5 — General Purpose I/O |
| 핀 127 | RH6 — General Purpose I/O |
| 핀 128 | RH7 — General Purpose I/O |
| 핀 129 | RH8 — General Purpose I/O |
| 핀 130 | RH9 — General Purpose I/O |
| 핀 131 | RH10 — General Purpose I/O |
| 핀 132 | RH11 — General Purpose I/O |
| 핀 133 | RH12 — General Purpose I/O |
| 핀 134 | RH13 — General Purpose I/O |
| 핀 135 | RH14 — General Purpose I/O |
| 핀 136 | RH15 — General Purpose I/O |
| 핀 137 | VDD — Core Supply Voltage |
| 핀 138 | VSS — Ground |
| 핀 139 | RJ0 — General Purpose I/O |
| 핀 140 | RJ1 — General Purpose I/O |
| 핀 141 | RJ2 — General Purpose I/O |
| 핀 142 | RJ3 — General Purpose I/O |
| 핀 143 | MCLR — Master Clear Reset |
| 핀 144 | VDD — Core Supply Voltage |
일반적인 애플리케이션
PIC32MZ1024EFK144T-I/PL 적합 용도: 7 애플리케이션s: Industrial Ethernet Gateway, Secure IoT Edge Node, BLDC / PMSM Motor Control Inverter, Automotive Infotainment Head Unit, Industrial HMI Touchscreen Controller, USB-to-UART / USB-to-SPI Bridge Device, Audio DSP / Effects Processor.
Industrial Ethernet Gateway
The PIC32MZ1024EFK144T-I/PL fits industrial Ethernet gateways because its 10/100 Ethernet MAC, USB 2.0 High-Speed, CAN, and 200 MHz / 330 DMIPS MIPS core deliver deterministic protocol translation between fieldbus (Modbus TCP, EtherNet/IP, PROFINET) and upstream IT networks. Per the Microchip PIC32MZ EF datasheet, the integrated Ethernet MAC eliminates an external PHY controller for simple applications, reducing BOM cost. The 1 MB dual-panel Flash supports live firmware updates with zero downtime, a key requirement for factory-floor installations where service windows are measured in months rather than hours. Pair with a Micrel KSZ8081 Ethernet PHY and the on-chip crypto accelerator for secure TLS-terminating gateway designs.
추천
Secure IoT Edge Node
For secure IoT edge nodes, the PIC32MZ1024EFK144T-I/PL's hardware crypto accelerator (AES, 3DES, SHA, MD5, HMAC, RNG) offloads TLS/DTLS handshakes from the CPU, freeing the 330 DMIPS core for application logic and sensor fusion. The integrated USB 2.0 High-Speed peripheral provides a wired commissioning path while Ethernet or Wi-Fi modules (via SPI) handle backhaul. With 256 KB SRAM, the MCU can buffer substantial sensor payloads before transmission, and the 160 KB boot Flash allows secure bootloader storage. Choose the industrial -40C to +85C temperature grade for outdoor enclosures.
추천
BLDC / PMSM Motor Control Inverter
The PIC32MZ1024EFK144T-I/PL suits three-phase BLDC and PMSM motor control because its 200 MHz MIPS32 M-Class core with DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) executes field-oriented control (FOC) loops within microseconds. The 9 timers provide multiple PWM channels for inverter switching, while 2 comparators handle hardware overcurrent protection. Per the Microchip PIC32MZ EF datasheet, the integrated quadrature encoder interface eliminates external counter ICs. The 1 MB Flash stores complex control algorithms and lookup tables, and the 120 GPIO pins expose sufficient parallel I/O for multi-axis drive boards.
추천
Automotive Infotainment Head Unit
The PIC32MZ1024EFK144T-I/PL serves automotive infotainment head-unit HMI controllers where its 1 MB Flash hosts graphical user interfaces, 256 KB SRAM holds frame buffers, and the 200 MHz MIPS core drives capacitive touch and display update streams. USB 2.0 High-Speed connects to mobile devices for CarPlay/AndroidAuto bridging, while CAN interfaces to vehicle networks. Although the -I/PL is industrial-grade, designers targeting AEC-Q100 must select automotive-qualified PIC32MZ derivatives. Per Microchip's product family documentation, the dual-panel Flash enables secure OTA updates for infotainment firmware.
추천
Industrial HMI Touchscreen Controller
The PIC32MZ1024EFK144T-I/PL fits industrial HMI panels because its 200 MHz CPU and 1 MB Flash run LVGL/EmWin graphical stacks, while 256 KB SRAM provides headroom for partial-frame buffers and widget trees. The integrated USB 2.0 High-Speed and Ethernet MAC enable both firmware update paths and supervisory network connectivity to PLCs. Per Microchip PIC32MZ EF datasheet, the dual-panel Flash allows field technicians to roll back firmware after failed updates, a critical safety feature on factory floors. Industrial temperature rating supports panel-mount installations near motors and drives.
추천
USB-to-UART / USB-to-SPI Bridge Device
The PIC32MZ1024EFK144T-I/PL's USB 2.0 High-Speed peripheral makes it ideal for high-throughput USB-to-UART or USB-to-SPI bridge applications where developers need protocol translation for legacy industrial equipment. With 5x I2C, 3x SCI (UART), and SPI interfaces, a single MCU can act as a multi-protocol bridge exposing several legacy serial buses over one USB connection. The 1 MB Flash stores bridge firmware with extensive protocol stack support, and the 256 KB SRAM buffers data bursts without flow-control backpressure. Industrial temperature rating suits factory floor installations.
추천
Audio DSP / Effects Processor
The PIC32MZ1024EFK144T-I/PL fits audio DSP applications because its 200 MHz MIPS32 M-Class core with DSP extensions delivers 330 DMIPS, sufficient for multi-channel reverb, EQ, and dynamics processing in guitar pedals or pro-audio mixers. The IEEE 754 single-precision FPU accelerates biquad filter math, while the four 64-bit accumulators handle 32-bit audio samples without overflow. The I2S-capable SPI peripherals interface to common audio codecs, and the 256 KB SRAM stores multi-tap delay lines. Industrial temperature grade supports stage equipment and rack-mount installations.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1024EFK144T-I/PL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFK144T-I/PH | PIC32MZ1024EFK144T-250I/PL | PIC32MZ1024EFK144T-E/PL | PIC32MZ1024EFH144T-I/PH | PIC32MZ1024EFG144T-I/PH | PIC32MZ1024EFF144-I/PH |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-TQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) |
| CPU Clock (Max) | 200 MHz | 200 MHz | 252 MHz | 180 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 262 KB | 256 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Crypto Accelerator | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG |
| USB 2.0 High-Speed | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| Pin Count | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
주요 차별점
- Higher CPU clock with same package footprint (vs PIC32MZ1024EFK144T-250I/PL)
- Industrial vs Extended temperature grade selection (vs PIC32MZ1024EFK144T-E/PL)
- Multiple package variants for layout flexibility (vs PIC32MZ1024EFH144T-I/PH)
설계 노트
The PIC32MZ1024EFK144T-I/PL requires multiple bulk and decoupling capacitors per the Microchip PIC32MZ EF datasheet DS60001320: place a 10 uF bulk capacitor near each major VDD pin group, plus a 100 nF decoupling cap within 2 mm of every VDD/VSS pair to suppress high-frequency noise from the 200 MHz core. Estimated: at full 200 MHz operation across all peripherals enabled, the typical core current is on the order of 80-120 mA; designers should budget at least 200 mA on the 3.3 V LDO feeding the MCU. Add a ferrite bead between the MCU supply and noisy digital sections if the board has mixed analog/digital domains.
Follow Microchip's recommended 144-LQFP land pattern with 0.5 mm pitch and exposed pad copper area for thermal dissipation. Estimated: with the 1.7 mm body thickness and 20x20 mm footprint, the theta_JA is approximately 35-40 C/W on a standard 4-layer JEDEC test board, allowing roughly 2.5 W continuous dissipation without airflow. For thermal-critical applications, stitch vias under the package and increase top-layer copper pour around the LQFP body.
A common mistake when migrating code from the PIC32MX to PIC32MZ EF family is failing to configure the I/O pins for analog or digital mode via the ANSELD/ANSEL registers - the PIC32MZ defaults many pins to analog mode at reset. Per the Microchip PIC32MZ EF datasheet, the GPIO peripheral also requires the CNPU/CNPD pull-up/pull-down enable bits to be set for proper logic levels. Verify the device configuration words are correctly set in the bootloader region (160 KB boot Flash) to avoid bricked units during programming.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (I-suffix); not AEC-Q100 qualified. Lead-free (Pb-free) packaging per JEDEC J-STD-020 MSL classification.