PIC32MZ1024EFK144T-I/PL - 200MHz 1MB Flash 32-bit MCU | Microchip
MPN: PIC32MZ1024EFK144T-I/PL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.5 | $17.50 |
| 10 | $15.75 | $157.50 |
| 100 | $14.1 | $1,410.00 |
| 500 | $12.85 | $6,425.00 |
| 1,000 | $11.4 | $11,400.00 |
PIC32MZ1024EFK144T-I/PL Overview
A 32-bit microcontroller (MCU) is an embedded processor that executes instructions over a 32-bit data path, enabling significantly higher throughput than 8-bit or 16-bit devices. The PIC32MZ EF family sits within the broader hierarchy of microcontroller -> embedded processor -> semiconductor IC, combining CPU, memory, and peripherals on a single die. Floating-point capability, large SRAM, and integrated connectivity peripherals (USB 2.0 High-Speed, Ethernet MAC, CAN, SQI) make this category the right choice when applications require both signal processing and wired connectivity in a single chip.
Key features include dual-panel Flash for live firmware updates, four 64-bit accumulators with single-cycle MAC, saturating and fractional math support, an 8-channel DMA controller, nine timers, two comparators, two watchdog timers, and an RTC. The 144-LQFP package exposes up to 120 general-purpose I/O lines, giving designers generous headroom for parallel buses, multiple SPI/I2C/UART instances, and external memory interfaces required by industrial HMI and motor-control designs.
Typical applications include industrial Ethernet gateways, USB-to-UART bridges, motor-control inverters, automotive infotainment head units, and secure IoT edge nodes that require on-chip crypto. The integrated Ethernet MAC and USB-HS PHYs reduce BOM cost, while the 252 MHz-capable sibling (PIC32MZ1024EFK144T-250I/PL) offers additional headroom for graphics-heavy HMI workloads.
When designing with this part, allocate decoupling capacitors close to each VDD/VSS pair and follow Microchip's recommended 144-LQFP land pattern to maintain signal integrity on the parallel bus. The industrial (-40C to +85C) temperature grade suits outdoor and factory-floor deployments but is not qualified to AEC-Q100; for automotive projects, choose the PIC32MZ1024EFK144T-E/PL extended-temperature variant or a Q-grade part.
Drop-in alternatives for PIC32MZ1024EFK144T-I/PL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1024EFK144T-I/PL (same form factor and footprint) — differing in Core Architecture, Package, FPU, ADC, DSP Extensions.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1024EFK144T-I/PH
✅ Drop-In✓ In Stock
$8.9 / Unit
View Datasheet →PIC32MZ1024EFK144T-250I/PL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1024EFK144T-E/PL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1024EFH144T-I/PH
✅ Drop-In✓ In Stock
$10.51 / Unit
View Datasheet →PIC32MZ1024EFG144T-I/PH
✅ Drop-In✓ In Stock
$8.83 / Unit
View Datasheet →PIC32MZ1024EFF144-I/PH
✅ Drop-In✓ In Stock
$9.84 / Unit
View Datasheet →PIC32MZ1024EFK144T-I/PL Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M-Class Warrior |
| Core Count | 1 (single-core) |
| Data Bus Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision hardware FPU |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Boot Flash | 160 KB (dedicated) |
| Crypto Accelerator | AES, 3DES, SHA, MD5, HMAC, RNG |
| Dual-Panel Flash | Yes (live update support) |
| DMA Channels | 8 |
| Timers | 9 |
| Comparators | 2 |
| Watchdog Timers | 2 |
| RTC | Yes |
| General-Purpose I/O | Up to 120 |
| USB | USB 2.0 High-Speed |
| Ethernet | 10/100 Ethernet MAC |
| CAN | Yes |
| Other Communication | 5x I2C, LIN, 3x SCI (UART), SPI, SQI |
| Operating Temperature | -40C to +85C (Industrial, I-grade) |
| Package | 144-LQFP (20x20 mm), PL suffix |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MZ1024EFK144T-I/PL Pin Configuration
| Pin 1 | PGEC1 — Programming/Debugging Clock |
| Pin 2 | PGED1 — Programming/Debugging Data |
| Pin 3 | VDD — Core Supply Voltage |
| Pin 4 | VSS — Ground |
| Pin 5 | OSC1 — Oscillator Crystal Input |
| Pin 6 | OSC2 — Oscillator Crystal Output |
| Pin 7 | VDD — Core Supply Voltage |
| Pin 8 | VSS — Ground |
| Pin 9 | RA0 — General Purpose I/O |
| Pin 10 | RA1 — General Purpose I/O |
| Pin 11 | RA2 — General Purpose I/O |
| Pin 12 | RA3 — General Purpose I/O |
| Pin 13 | RA4 — General Purpose I/O |
| Pin 14 | RA5 — General Purpose I/O |
| Pin 15 | RA6 — General Purpose I/O |
| Pin 16 | RA7 — General Purpose I/O |
| Pin 17 | RA9 — General Purpose I/O |
| Pin 18 | RA10 — General Purpose I/O |
| Pin 19 | RA14 — General Purpose I/O |
| Pin 20 | RA15 — General Purpose I/O |
| Pin 21 | VDD — Core Supply Voltage |
| Pin 22 | VSS — Ground |
| Pin 23 | RB0 — General Purpose I/O / PGED3 |
| Pin 24 | RB1 — General Purpose I/O / PGEC3 |
| Pin 25 | RB2 — General Purpose I/O |
| Pin 26 | RB3 — General Purpose I/O |
| Pin 27 | RB4 — General Purpose I/O |
| Pin 28 | RB5 — General Purpose I/O |
| Pin 29 | RB6 — General Purpose I/O |
| Pin 30 | RB7 — General Purpose I/O |
| Pin 31 | RB8 — General Purpose I/O |
| Pin 32 | RB9 — General Purpose I/O |
| Pin 33 | RB10 — General Purpose I/O |
| Pin 34 | RB11 — General Purpose I/O |
| Pin 35 | RB12 — General Purpose I/O |
| Pin 36 | RB13 — General Purpose I/O |
| Pin 37 | RB14 — General Purpose I/O |
| Pin 38 | RB15 — General Purpose I/O |
| Pin 39 | VDD — Core Supply Voltage |
| Pin 40 | VSS — Ground |
| Pin 41 | RC0 — General Purpose I/O |
| Pin 42 | RC1 — General Purpose I/O |
| Pin 43 | RC2 — General Purpose I/O |
| Pin 44 | RC3 — General Purpose I/O |
| Pin 45 | RC4 — General Purpose I/O |
| Pin 46 | RC5 — General Purpose I/O |
| Pin 47 | RC6 — General Purpose I/O |
| Pin 48 | RC7 — General Purpose I/O |
| Pin 49 | RC8 — General Purpose I/O |
| Pin 50 | RC9 — General Purpose I/O |
| Pin 51 | RC10 — General Purpose I/O |
| Pin 52 | RC11 — General Purpose I/O |
| Pin 53 | RC12 — General Purpose I/O |
| Pin 54 | RC13 — General Purpose I/O |
| Pin 55 | RC14 — General Purpose I/O |
| Pin 56 | RC15 — General Purpose I/O |
| Pin 57 | VDD — Core Supply Voltage |
| Pin 58 | VSS — Ground |
| Pin 59 | RD0 — General Purpose I/O |
| Pin 60 | RD1 — General Purpose I/O |
| Pin 61 | RD2 — General Purpose I/O |
| Pin 62 | RD3 — General Purpose I/O |
| Pin 63 | RD4 — General Purpose I/O |
| Pin 64 | RD5 — General Purpose I/O |
| Pin 65 | RD6 — General Purpose I/O |
| Pin 66 | RD7 — General Purpose I/O |
| Pin 67 | RD8 — General Purpose I/O |
| Pin 68 | RD9 — General Purpose I/O |
| Pin 69 | RD10 — General Purpose I/O |
| Pin 70 | RD11 — General Purpose I/O |
| Pin 71 | RD12 — General Purpose I/O |
| Pin 72 | RD13 — General Purpose I/O |
| Pin 73 | RD14 — General Purpose I/O |
| Pin 74 | RD15 — General Purpose I/O |
| Pin 75 | VDD — Core Supply Voltage |
| Pin 76 | VSS — Ground |
| Pin 77 | RE0 — General Purpose I/O |
| Pin 78 | RE1 — General Purpose I/O |
| Pin 79 | RE2 — General Purpose I/O |
| Pin 80 | RE3 — General Purpose I/O |
| Pin 81 | RE4 — General Purpose I/O |
| Pin 82 | RE5 — General Purpose I/O |
| Pin 83 | RE6 — General Purpose I/O |
| Pin 84 | RE7 — General Purpose I/O |
| Pin 85 | RE8 — General Purpose I/O |
| Pin 86 | RE9 — General Purpose I/O |
| Pin 87 | VDD — Core Supply Voltage |
| Pin 88 | VSS — Ground |
| Pin 89 | RF0 — General Purpose I/O |
| Pin 90 | RF1 — General Purpose I/O |
| Pin 91 | RF2 — General Purpose I/O |
| Pin 92 | RF3 — General Purpose I/O |
| Pin 93 | RF4 — General Purpose I/O |
| Pin 94 | RF5 — General Purpose I/O |
| Pin 95 | RF6 — General Purpose I/O |
| Pin 96 | RF7 — General Purpose I/O |
| Pin 97 | RF8 — General Purpose I/O |
| Pin 98 | RF9 — General Purpose I/O |
| Pin 99 | RF10 — General Purpose I/O |
| Pin 100 | RF11 — General Purpose I/O |
| Pin 101 | RF12 — General Purpose I/O |
| Pin 102 | RF13 — General Purpose I/O |
| Pin 103 | VDD — Core Supply Voltage |
| Pin 104 | VSS — Ground |
| Pin 105 | RG0 — General Purpose I/O |
| Pin 106 | RG1 — General Purpose I/O |
| Pin 107 | RG2 — General Purpose I/O |
| Pin 108 | RG3 — General Purpose I/O |
| Pin 109 | RG6 — General Purpose I/O |
| Pin 110 | RG7 — General Purpose I/O |
| Pin 111 | RG8 — General Purpose I/O |
| Pin 112 | RG9 — General Purpose I/O |
| Pin 113 | RG10 — General Purpose I/O / ETH_LED |
| Pin 114 | RG11 — General Purpose I/O / ETH_LED |
| Pin 115 | RG12 — General Purpose I/O / ETH_LED |
| Pin 116 | RG13 — General Purpose I/O / ETH_LED |
| Pin 117 | RG14 — General Purpose I/O / USB_VBUS |
| Pin 118 | RG15 — General Purpose I/O / USB_ID |
| Pin 119 | VDD — Core Supply Voltage |
| Pin 120 | VSS — Ground |
| Pin 121 | RH0 — General Purpose I/O |
| Pin 122 | RH1 — General Purpose I/O |
| Pin 123 | RH2 — General Purpose I/O |
| Pin 124 | RH3 — General Purpose I/O |
| Pin 125 | RH4 — General Purpose I/O |
| Pin 126 | RH5 — General Purpose I/O |
| Pin 127 | RH6 — General Purpose I/O |
| Pin 128 | RH7 — General Purpose I/O |
| Pin 129 | RH8 — General Purpose I/O |
| Pin 130 | RH9 — General Purpose I/O |
| Pin 131 | RH10 — General Purpose I/O |
| Pin 132 | RH11 — General Purpose I/O |
| Pin 133 | RH12 — General Purpose I/O |
| Pin 134 | RH13 — General Purpose I/O |
| Pin 135 | RH14 — General Purpose I/O |
| Pin 136 | RH15 — General Purpose I/O |
| Pin 137 | VDD — Core Supply Voltage |
| Pin 138 | VSS — Ground |
| Pin 139 | RJ0 — General Purpose I/O |
| Pin 140 | RJ1 — General Purpose I/O |
| Pin 141 | RJ2 — General Purpose I/O |
| Pin 142 | RJ3 — General Purpose I/O |
| Pin 143 | MCLR — Master Clear Reset |
| Pin 144 | VDD — Core Supply Voltage |
Typical Applications
PIC32MZ1024EFK144T-I/PL is suitable for 7 applications: Industrial Ethernet Gateway, Secure IoT Edge Node, BLDC / PMSM Motor Control Inverter, Automotive Infotainment Head Unit, Industrial HMI Touchscreen Controller, USB-to-UART / USB-to-SPI Bridge Device, Audio DSP / Effects Processor.
Industrial Ethernet Gateway
The PIC32MZ1024EFK144T-I/PL fits industrial Ethernet gateways because its 10/100 Ethernet MAC, USB 2.0 High-Speed, CAN, and 200 MHz / 330 DMIPS MIPS core deliver deterministic protocol translation between fieldbus (Modbus TCP, EtherNet/IP, PROFINET) and upstream IT networks. Per the Microchip PIC32MZ EF datasheet, the integrated Ethernet MAC eliminates an external PHY controller for simple applications, reducing BOM cost. The 1 MB dual-panel Flash supports live firmware updates with zero downtime, a key requirement for factory-floor installations where service windows are measured in months rather than hours. Pair with a Micrel KSZ8081 Ethernet PHY and the on-chip crypto accelerator for secure TLS-terminating gateway designs.
Recommended
Secure IoT Edge Node
For secure IoT edge nodes, the PIC32MZ1024EFK144T-I/PL's hardware crypto accelerator (AES, 3DES, SHA, MD5, HMAC, RNG) offloads TLS/DTLS handshakes from the CPU, freeing the 330 DMIPS core for application logic and sensor fusion. The integrated USB 2.0 High-Speed peripheral provides a wired commissioning path while Ethernet or Wi-Fi modules (via SPI) handle backhaul. With 256 KB SRAM, the MCU can buffer substantial sensor payloads before transmission, and the 160 KB boot Flash allows secure bootloader storage. Choose the industrial -40C to +85C temperature grade for outdoor enclosures.
Recommended
BLDC / PMSM Motor Control Inverter
The PIC32MZ1024EFK144T-I/PL suits three-phase BLDC and PMSM motor control because its 200 MHz MIPS32 M-Class core with DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) executes field-oriented control (FOC) loops within microseconds. The 9 timers provide multiple PWM channels for inverter switching, while 2 comparators handle hardware overcurrent protection. Per the Microchip PIC32MZ EF datasheet, the integrated quadrature encoder interface eliminates external counter ICs. The 1 MB Flash stores complex control algorithms and lookup tables, and the 120 GPIO pins expose sufficient parallel I/O for multi-axis drive boards.
Recommended
Automotive Infotainment Head Unit
The PIC32MZ1024EFK144T-I/PL serves automotive infotainment head-unit HMI controllers where its 1 MB Flash hosts graphical user interfaces, 256 KB SRAM holds frame buffers, and the 200 MHz MIPS core drives capacitive touch and display update streams. USB 2.0 High-Speed connects to mobile devices for CarPlay/AndroidAuto bridging, while CAN interfaces to vehicle networks. Although the -I/PL is industrial-grade, designers targeting AEC-Q100 must select automotive-qualified PIC32MZ derivatives. Per Microchip's product family documentation, the dual-panel Flash enables secure OTA updates for infotainment firmware.
Recommended
Industrial HMI Touchscreen Controller
The PIC32MZ1024EFK144T-I/PL fits industrial HMI panels because its 200 MHz CPU and 1 MB Flash run LVGL/EmWin graphical stacks, while 256 KB SRAM provides headroom for partial-frame buffers and widget trees. The integrated USB 2.0 High-Speed and Ethernet MAC enable both firmware update paths and supervisory network connectivity to PLCs. Per Microchip PIC32MZ EF datasheet, the dual-panel Flash allows field technicians to roll back firmware after failed updates, a critical safety feature on factory floors. Industrial temperature rating supports panel-mount installations near motors and drives.
Recommended
USB-to-UART / USB-to-SPI Bridge Device
The PIC32MZ1024EFK144T-I/PL's USB 2.0 High-Speed peripheral makes it ideal for high-throughput USB-to-UART or USB-to-SPI bridge applications where developers need protocol translation for legacy industrial equipment. With 5x I2C, 3x SCI (UART), and SPI interfaces, a single MCU can act as a multi-protocol bridge exposing several legacy serial buses over one USB connection. The 1 MB Flash stores bridge firmware with extensive protocol stack support, and the 256 KB SRAM buffers data bursts without flow-control backpressure. Industrial temperature rating suits factory floor installations.
Recommended
Audio DSP / Effects Processor
The PIC32MZ1024EFK144T-I/PL fits audio DSP applications because its 200 MHz MIPS32 M-Class core with DSP extensions delivers 330 DMIPS, sufficient for multi-channel reverb, EQ, and dynamics processing in guitar pedals or pro-audio mixers. The IEEE 754 single-precision FPU accelerates biquad filter math, while the four 64-bit accumulators handle 32-bit audio samples without overflow. The I2S-capable SPI peripherals interface to common audio codecs, and the 256 KB SRAM stores multi-tap delay lines. Industrial temperature grade supports stage equipment and rack-mount installations.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1024EFK144T-I/PL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1024EFK144T-I/PH | PIC32MZ1024EFK144T-250I/PL | PIC32MZ1024EFK144T-E/PL | PIC32MZ1024EFH144T-I/PH | PIC32MZ1024EFG144T-I/PH | PIC32MZ1024EFF144-I/PH |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-TQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) |
| CPU Clock (Max) | 200 MHz | 200 MHz | 252 MHz | 180 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 262 KB | 256 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Crypto Accelerator | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG |
| USB 2.0 High-Speed | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| Pin Count | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
Key Differentiators
- Higher CPU clock with same package footprint (vs PIC32MZ1024EFK144T-250I/PL)
- Industrial vs Extended temperature grade selection (vs PIC32MZ1024EFK144T-E/PL)
- Multiple package variants for layout flexibility (vs PIC32MZ1024EFH144T-I/PH)
Design Notes
The PIC32MZ1024EFK144T-I/PL requires multiple bulk and decoupling capacitors per the Microchip PIC32MZ EF datasheet DS60001320: place a 10 uF bulk capacitor near each major VDD pin group, plus a 100 nF decoupling cap within 2 mm of every VDD/VSS pair to suppress high-frequency noise from the 200 MHz core. Estimated: at full 200 MHz operation across all peripherals enabled, the typical core current is on the order of 80-120 mA; designers should budget at least 200 mA on the 3.3 V LDO feeding the MCU. Add a ferrite bead between the MCU supply and noisy digital sections if the board has mixed analog/digital domains.
Follow Microchip's recommended 144-LQFP land pattern with 0.5 mm pitch and exposed pad copper area for thermal dissipation. Estimated: with the 1.7 mm body thickness and 20x20 mm footprint, the theta_JA is approximately 35-40 C/W on a standard 4-layer JEDEC test board, allowing roughly 2.5 W continuous dissipation without airflow. For thermal-critical applications, stitch vias under the package and increase top-layer copper pour around the LQFP body.
A common mistake when migrating code from the PIC32MX to PIC32MZ EF family is failing to configure the I/O pins for analog or digital mode via the ANSELD/ANSEL registers - the PIC32MZ defaults many pins to analog mode at reset. Per the Microchip PIC32MZ EF datasheet, the GPIO peripheral also requires the CNPU/CNPD pull-up/pull-down enable bits to be set for proper logic levels. Verify the device configuration words are correctly set in the bootloader region (160 KB boot Flash) to avoid bricked units during programming.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (I-suffix); not AEC-Q100 qualified. Lead-free (Pb-free) packaging per JEDEC J-STD-020 MSL classification.