PIC32MZ1024EFK144T-I/PL - 200MHz 1MB Flash 32-bit MCU | Microchip
Référence : PIC32MZ1024EFK144T-I/PL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $17.5 | $17,50 |
| 10 | $15.75 | $157,50 |
| 100 | $14.1 | $1 410,00 |
| 500 | $12.85 | $6 425,00 |
| 1 000 | $11.4 | $11 400,00 |
PIC32MZ1024EFK144T-I/PL Présentation
A 32-bit microcontroller (MCU) is an embedded processor that executes instructions over a 32-bit data path, enabling significantly higher throughput than 8-bit or 16-bit devices. The PIC32MZ EF family sits within the broader hierarchy of microcontroller -> embedded processor -> semiconductor IC, combining CPU, memory, and peripherals on a single die. Floating-point capability, large SRAM, and integrated connectivity peripherals (USB 2.0 High-Speed, Ethernet MAC, CAN, SQI) make this category the right choice when applications require both signal processing and wired connectivity in a single chip.
Key features include dual-panel Flash for live firmware updates, four 64-bit accumulators with single-cycle MAC, saturating and fractional math support, an 8-channel DMA controller, nine timers, two comparators, two watchdog timers, and an RTC. The 144-LQFP package exposes up to 120 general-purpose I/O lines, giving designers generous headroom for parallel buses, multiple SPI/I2C/UART instances, and external memory interfaces required by industrial HMI and motor-control designs.
Typical applications include industrial Ethernet gateways, USB-to-UART bridges, motor-control inverters, automotive infotainment head units, and secure IoT edge nodes that require on-chip crypto. The integrated Ethernet MAC and USB-HS PHYs reduce BOM cost, while the 252 MHz-capable sibling (PIC32MZ1024EFK144T-250I/PL) offers additional headroom for graphics-heavy HMI workloads.
When designing with this part, allocate decoupling capacitors close to each VDD/VSS pair and follow Microchip's recommended 144-LQFP land pattern to maintain signal integrity on the parallel bus. The industrial (-40C to +85C) temperature grade suits outdoor and factory-floor deployments but is not qualified to AEC-Q100; for automotive projects, choose the PIC32MZ1024EFK144T-E/PL extended-temperature variant or a Q-grade part.
Alternatives de remplacement direct pour PIC32MZ1024EFK144T-I/PL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFK144T-I/PL (même facteur de forme et même empreinte) — différant par Core Architecture, Package, FPU, ADC, DSP Extensions.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFK144T-I/PH
✅ Remplacement direct✓ En stock
$8.9 / unité
Voir la fiche technique →PIC32MZ1024EFK144T-250I/PL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFK144T-E/PL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFH144T-I/PH
✅ Remplacement direct✓ En stock
$10.51 / unité
Voir la fiche technique →PIC32MZ1024EFG144T-I/PH
✅ Remplacement direct✓ En stock
$8.83 / unité
Voir la fiche technique →PIC32MZ1024EFF144-I/PH
✅ Remplacement direct✓ En stock
$9.84 / unité
Voir la fiche technique →PIC32MZ1024EFK144T-I/PL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class Warrior |
| Core Count | 1 (single-core) |
| Largeur du bus de données | 32-bit |
| Maximum CPU Clock | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision hardware FPU |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Boot Flash | 160 KB (dedicated) |
| Crypto Accelerator | AES, 3DES, SHA, MD5, HMAC, RNG |
| Dual-Panel Flash | Yes (live update support) |
| DMA Channels | 8 |
| Timers | 9 |
| Comparators | 2 |
| Watchdog Timers | 2 |
| RTC | Yes |
| General-Purpose I/O | Up to 120 |
| USB | USB 2.0 High-Speed |
| Ethernet | 10/100 Ethernet MAC |
| CAN | Yes |
| Other Communication | 5x I2C, LIN, 3x SCI (UART), SPI, SQI |
| Température de fonctionnement | -40C to +85C (Industrial, I-grade) |
| Boîtier | 144-LQFP (20x20 mm), PL suffix |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFK144T-I/PL
| Broche 1 | PGEC1 — Programming/Debugging Clock |
| Broche 2 | PGED1 — Programming/Debugging Data |
| Broche 3 | VDD — Core Supply Voltage |
| Broche 4 | VSS — Ground |
| Broche 5 | OSC1 — Oscillator Crystal Input |
| Broche 6 | OSC2 — Oscillator Crystal Output |
| Broche 7 | VDD — Core Supply Voltage |
| Broche 8 | VSS — Ground |
| Broche 9 | RA0 — General Purpose I/O |
| Broche 10 | RA1 — General Purpose I/O |
| Broche 11 | RA2 — General Purpose I/O |
| Broche 12 | RA3 — General Purpose I/O |
| Broche 13 | RA4 — General Purpose I/O |
| Broche 14 | RA5 — General Purpose I/O |
| Broche 15 | RA6 — General Purpose I/O |
| Broche 16 | RA7 — General Purpose I/O |
| Broche 17 | RA9 — General Purpose I/O |
| Broche 18 | RA10 — General Purpose I/O |
| Broche 19 | RA14 — General Purpose I/O |
| Broche 20 | RA15 — General Purpose I/O |
| Broche 21 | VDD — Core Supply Voltage |
| Broche 22 | VSS — Ground |
| Broche 23 | RB0 — General Purpose I/O / PGED3 |
| Broche 24 | RB1 — General Purpose I/O / PGEC3 |
| Broche 25 | RB2 — General Purpose I/O |
| Broche 26 | RB3 — General Purpose I/O |
| Broche 27 | RB4 — General Purpose I/O |
| Broche 28 | RB5 — General Purpose I/O |
| Broche 29 | RB6 — General Purpose I/O |
| Broche 30 | RB7 — General Purpose I/O |
| Broche 31 | RB8 — General Purpose I/O |
| Broche 32 | RB9 — General Purpose I/O |
| Broche 33 | RB10 — General Purpose I/O |
| Broche 34 | RB11 — General Purpose I/O |
| Broche 35 | RB12 — General Purpose I/O |
| Broche 36 | RB13 — General Purpose I/O |
| Broche 37 | RB14 — General Purpose I/O |
| Broche 38 | RB15 — General Purpose I/O |
| Broche 39 | VDD — Core Supply Voltage |
| Broche 40 | VSS — Ground |
| Broche 41 | RC0 — General Purpose I/O |
| Broche 42 | RC1 — General Purpose I/O |
| Broche 43 | RC2 — General Purpose I/O |
| Broche 44 | RC3 — General Purpose I/O |
| Broche 45 | RC4 — General Purpose I/O |
| Broche 46 | RC5 — General Purpose I/O |
| Broche 47 | RC6 — General Purpose I/O |
| Broche 48 | RC7 — General Purpose I/O |
| Broche 49 | RC8 — General Purpose I/O |
| Broche 50 | RC9 — General Purpose I/O |
| Broche 51 | RC10 — General Purpose I/O |
| Broche 52 | RC11 — General Purpose I/O |
| Broche 53 | RC12 — General Purpose I/O |
| Broche 54 | RC13 — General Purpose I/O |
| Broche 55 | RC14 — General Purpose I/O |
| Broche 56 | RC15 — General Purpose I/O |
| Broche 57 | VDD — Core Supply Voltage |
| Broche 58 | VSS — Ground |
| Broche 59 | RD0 — General Purpose I/O |
| Broche 60 | RD1 — General Purpose I/O |
| Broche 61 | RD2 — General Purpose I/O |
| Broche 62 | RD3 — General Purpose I/O |
| Broche 63 | RD4 — General Purpose I/O |
| Broche 64 | RD5 — General Purpose I/O |
| Broche 65 | RD6 — General Purpose I/O |
| Broche 66 | RD7 — General Purpose I/O |
| Broche 67 | RD8 — General Purpose I/O |
| Broche 68 | RD9 — General Purpose I/O |
| Broche 69 | RD10 — General Purpose I/O |
| Broche 70 | RD11 — General Purpose I/O |
| Broche 71 | RD12 — General Purpose I/O |
| Broche 72 | RD13 — General Purpose I/O |
| Broche 73 | RD14 — General Purpose I/O |
| Broche 74 | RD15 — General Purpose I/O |
| Broche 75 | VDD — Core Supply Voltage |
| Broche 76 | VSS — Ground |
| Broche 77 | RE0 — General Purpose I/O |
| Broche 78 | RE1 — General Purpose I/O |
| Broche 79 | RE2 — General Purpose I/O |
| Broche 80 | RE3 — General Purpose I/O |
| Broche 81 | RE4 — General Purpose I/O |
| Broche 82 | RE5 — General Purpose I/O |
| Broche 83 | RE6 — General Purpose I/O |
| Broche 84 | RE7 — General Purpose I/O |
| Broche 85 | RE8 — General Purpose I/O |
| Broche 86 | RE9 — General Purpose I/O |
| Broche 87 | VDD — Core Supply Voltage |
| Broche 88 | VSS — Ground |
| Broche 89 | RF0 — General Purpose I/O |
| Broche 90 | RF1 — General Purpose I/O |
| Broche 91 | RF2 — General Purpose I/O |
| Broche 92 | RF3 — General Purpose I/O |
| Broche 93 | RF4 — General Purpose I/O |
| Broche 94 | RF5 — General Purpose I/O |
| Broche 95 | RF6 — General Purpose I/O |
| Broche 96 | RF7 — General Purpose I/O |
| Broche 97 | RF8 — General Purpose I/O |
| Broche 98 | RF9 — General Purpose I/O |
| Broche 99 | RF10 — General Purpose I/O |
| Broche 100 | RF11 — General Purpose I/O |
| Broche 101 | RF12 — General Purpose I/O |
| Broche 102 | RF13 — General Purpose I/O |
| Broche 103 | VDD — Core Supply Voltage |
| Broche 104 | VSS — Ground |
| Broche 105 | RG0 — General Purpose I/O |
| Broche 106 | RG1 — General Purpose I/O |
| Broche 107 | RG2 — General Purpose I/O |
| Broche 108 | RG3 — General Purpose I/O |
| Broche 109 | RG6 — General Purpose I/O |
| Broche 110 | RG7 — General Purpose I/O |
| Broche 111 | RG8 — General Purpose I/O |
| Broche 112 | RG9 — General Purpose I/O |
| Broche 113 | RG10 — General Purpose I/O / ETH_LED |
| Broche 114 | RG11 — General Purpose I/O / ETH_LED |
| Broche 115 | RG12 — General Purpose I/O / ETH_LED |
| Broche 116 | RG13 — General Purpose I/O / ETH_LED |
| Broche 117 | RG14 — General Purpose I/O / USB_VBUS |
| Broche 118 | RG15 — General Purpose I/O / USB_ID |
| Broche 119 | VDD — Core Supply Voltage |
| Broche 120 | VSS — Ground |
| Broche 121 | RH0 — General Purpose I/O |
| Broche 122 | RH1 — General Purpose I/O |
| Broche 123 | RH2 — General Purpose I/O |
| Broche 124 | RH3 — General Purpose I/O |
| Broche 125 | RH4 — General Purpose I/O |
| Broche 126 | RH5 — General Purpose I/O |
| Broche 127 | RH6 — General Purpose I/O |
| Broche 128 | RH7 — General Purpose I/O |
| Broche 129 | RH8 — General Purpose I/O |
| Broche 130 | RH9 — General Purpose I/O |
| Broche 131 | RH10 — General Purpose I/O |
| Broche 132 | RH11 — General Purpose I/O |
| Broche 133 | RH12 — General Purpose I/O |
| Broche 134 | RH13 — General Purpose I/O |
| Broche 135 | RH14 — General Purpose I/O |
| Broche 136 | RH15 — General Purpose I/O |
| Broche 137 | VDD — Core Supply Voltage |
| Broche 138 | VSS — Ground |
| Broche 139 | RJ0 — General Purpose I/O |
| Broche 140 | RJ1 — General Purpose I/O |
| Broche 141 | RJ2 — General Purpose I/O |
| Broche 142 | RJ3 — General Purpose I/O |
| Broche 143 | MCLR — Master Clear Reset |
| Broche 144 | VDD — Core Supply Voltage |
Applications typiques
PIC32MZ1024EFK144T-I/PL convient pour 7 applications: Industrial Ethernet Gateway, Secure IoT Edge Node, BLDC / PMSM Motor Control Inverter, Automotive Infotainment Head Unit, Industrial HMI Touchscreen Controller, USB-to-UART / USB-to-SPI Bridge Device, Audio DSP / Effects Processor.
Industrial Ethernet Gateway
The PIC32MZ1024EFK144T-I/PL fits industrial Ethernet gateways because its 10/100 Ethernet MAC, USB 2.0 High-Speed, CAN, and 200 MHz / 330 DMIPS MIPS core deliver deterministic protocol translation between fieldbus (Modbus TCP, EtherNet/IP, PROFINET) and upstream IT networks. Per the Microchip PIC32MZ EF datasheet, the integrated Ethernet MAC eliminates an external PHY controller for simple applications, reducing BOM cost. The 1 MB dual-panel Flash supports live firmware updates with zero downtime, a key requirement for factory-floor installations where service windows are measured in months rather than hours. Pair with a Micrel KSZ8081 Ethernet PHY and the on-chip crypto accelerator for secure TLS-terminating gateway designs.
Recommandé
Secure IoT Edge Node
For secure IoT edge nodes, the PIC32MZ1024EFK144T-I/PL's hardware crypto accelerator (AES, 3DES, SHA, MD5, HMAC, RNG) offloads TLS/DTLS handshakes from the CPU, freeing the 330 DMIPS core for application logic and sensor fusion. The integrated USB 2.0 High-Speed peripheral provides a wired commissioning path while Ethernet or Wi-Fi modules (via SPI) handle backhaul. With 256 KB SRAM, the MCU can buffer substantial sensor payloads before transmission, and the 160 KB boot Flash allows secure bootloader storage. Choose the industrial -40C to +85C temperature grade for outdoor enclosures.
Recommandé
BLDC / PMSM Motor Control Inverter
The PIC32MZ1024EFK144T-I/PL suits three-phase BLDC and PMSM motor control because its 200 MHz MIPS32 M-Class core with DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) executes field-oriented control (FOC) loops within microseconds. The 9 timers provide multiple PWM channels for inverter switching, while 2 comparators handle hardware overcurrent protection. Per the Microchip PIC32MZ EF datasheet, the integrated quadrature encoder interface eliminates external counter ICs. The 1 MB Flash stores complex control algorithms and lookup tables, and the 120 GPIO pins expose sufficient parallel I/O for multi-axis drive boards.
Recommandé
Automotive Infotainment Head Unit
The PIC32MZ1024EFK144T-I/PL serves automotive infotainment head-unit HMI controllers where its 1 MB Flash hosts graphical user interfaces, 256 KB SRAM holds frame buffers, and the 200 MHz MIPS core drives capacitive touch and display update streams. USB 2.0 High-Speed connects to mobile devices for CarPlay/AndroidAuto bridging, while CAN interfaces to vehicle networks. Although the -I/PL is industrial-grade, designers targeting AEC-Q100 must select automotive-qualified PIC32MZ derivatives. Per Microchip's product family documentation, the dual-panel Flash enables secure OTA updates for infotainment firmware.
Recommandé
Industrial HMI Touchscreen Controller
The PIC32MZ1024EFK144T-I/PL fits industrial HMI panels because its 200 MHz CPU and 1 MB Flash run LVGL/EmWin graphical stacks, while 256 KB SRAM provides headroom for partial-frame buffers and widget trees. The integrated USB 2.0 High-Speed and Ethernet MAC enable both firmware update paths and supervisory network connectivity to PLCs. Per Microchip PIC32MZ EF datasheet, the dual-panel Flash allows field technicians to roll back firmware after failed updates, a critical safety feature on factory floors. Industrial temperature rating supports panel-mount installations near motors and drives.
Recommandé
USB-to-UART / USB-to-SPI Bridge Device
The PIC32MZ1024EFK144T-I/PL's USB 2.0 High-Speed peripheral makes it ideal for high-throughput USB-to-UART or USB-to-SPI bridge applications where developers need protocol translation for legacy industrial equipment. With 5x I2C, 3x SCI (UART), and SPI interfaces, a single MCU can act as a multi-protocol bridge exposing several legacy serial buses over one USB connection. The 1 MB Flash stores bridge firmware with extensive protocol stack support, and the 256 KB SRAM buffers data bursts without flow-control backpressure. Industrial temperature rating suits factory floor installations.
Recommandé
Audio DSP / Effects Processor
The PIC32MZ1024EFK144T-I/PL fits audio DSP applications because its 200 MHz MIPS32 M-Class core with DSP extensions delivers 330 DMIPS, sufficient for multi-channel reverb, EQ, and dynamics processing in guitar pedals or pro-audio mixers. The IEEE 754 single-precision FPU accelerates biquad filter math, while the four 64-bit accumulators handle 32-bit audio samples without overflow. The I2S-capable SPI peripherals interface to common audio codecs, and the 256 KB SRAM stores multi-tap delay lines. Industrial temperature grade supports stage equipment and rack-mount installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFK144T-I/PL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFK144T-I/PH | PIC32MZ1024EFK144T-250I/PL | PIC32MZ1024EFK144T-E/PL | PIC32MZ1024EFH144T-I/PH | PIC32MZ1024EFG144T-I/PH | PIC32MZ1024EFF144-I/PH |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20 mm) | 144-TQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) |
| CPU Clock (Max) | 200 MHz | 200 MHz | 252 MHz | 180 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 262 KB | 256 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Crypto Accelerator | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG | AES, 3DES, SHA, MD5, HMAC, RNG |
| USB 2.0 High-Speed | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| Pin Count | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
Principaux différenciateurs
- Higher CPU clock with same package footprint (vs PIC32MZ1024EFK144T-250I/PL)
- Industrial vs Extended temperature grade selection (vs PIC32MZ1024EFK144T-E/PL)
- Multiple package variants for layout flexibility (vs PIC32MZ1024EFH144T-I/PH)
Notes de conception
The PIC32MZ1024EFK144T-I/PL requires multiple bulk and decoupling capacitors per the Microchip PIC32MZ EF datasheet DS60001320: place a 10 uF bulk capacitor near each major VDD pin group, plus a 100 nF decoupling cap within 2 mm of every VDD/VSS pair to suppress high-frequency noise from the 200 MHz core. Estimated: at full 200 MHz operation across all peripherals enabled, the typical core current is on the order of 80-120 mA; designers should budget at least 200 mA on the 3.3 V LDO feeding the MCU. Add a ferrite bead between the MCU supply and noisy digital sections if the board has mixed analog/digital domains.
Follow Microchip's recommended 144-LQFP land pattern with 0.5 mm pitch and exposed pad copper area for thermal dissipation. Estimated: with the 1.7 mm body thickness and 20x20 mm footprint, the theta_JA is approximately 35-40 C/W on a standard 4-layer JEDEC test board, allowing roughly 2.5 W continuous dissipation without airflow. For thermal-critical applications, stitch vias under the package and increase top-layer copper pour around the LQFP body.
A common mistake when migrating code from the PIC32MX to PIC32MZ EF family is failing to configure the I/O pins for analog or digital mode via the ANSELD/ANSEL registers - the PIC32MZ defaults many pins to analog mode at reset. Per the Microchip PIC32MZ EF datasheet, the GPIO peripheral also requires the CNPU/CNPD pull-up/pull-down enable bits to be set for proper logic levels. Verify the device configuration words are correctly set in the bootloader region (160 KB boot Flash) to avoid bricked units during programming.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (I-suffix); not AEC-Q100 qualified. Lead-free (Pb-free) packaging per JEDEC J-STD-020 MSL classification.