PIC32MZ1025DAL176-I/2J - 200MHz 1MB Flash MCU with Graphics Controller | Microchip
N.º da peça: PIC32MZ1025DAL176-I/2J ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.41 | $8,41 |
| 10 | $7.55 | $75,50 |
| 100 | $6.67 | $667,00 |
| 500 | $6.05 | $3.025,00 |
| 1.000 | $5.5 | $5.500,00 |
PIC32MZ1025DAL176-I/2J Visão geral
A 32-bit microcontroller (MCU) is an embedded processor that integrates CPU core, memory, and peripherals into one IC. Within the broader taxonomy, this part belongs to the MIPS32 microAptiv family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. The PIC32MZ DA series specifically targets GUI applications where designers want MPU-level graphics performance while keeping the programming model of an MCU, avoiding the complexity of a full Linux-capable application processor.
Key features include: 200MHz core clock delivering up to 330 DMIPS and 1.5 DMIPS/MHz efficiency; 1MB Flash with prefetch cache for deterministic execution; 640KB SRAM; integrated 2D Graphics Processing Unit supporting HX8347, SSD1963, and other TFT controllers; Hi-Speed USB 2.0 with integrated PHY; CAN 2.0B module; 12-bit 18 MSPS ADC with up to 45 analog inputs (analog touch-screen friendly); and a wide operating voltage range centered at 1.8V core / 3.3V I/O.
Architecturally, the part pairs a MIPS32 microAptiv core with a high-bandwidth multi-port SRAM subsystem, dual-port DDR2 controller, and dedicated Graphics Controller/Processor blocks. The DDR2 interface runs at 200MHz data rate with a 32-bit bus, delivering enough bandwidth for full-screen 24-bit color TFT rendering at typical WQVGA/WVGA resolutions without CPU intervention. The analog front-end (18 MSPS) and large ADC channel count make it a strong fit for sensor-rich HMI panels.
Typical applications include industrial control HMI touch panels, automotive dashboard clusters, home automation touchscreens, medical instrument displays, point-of-sale terminals, and consumer GUI appliances. Its integrated graphics and DDR2 controller eliminate the need for an external graphics companion chip.
Design considerations: the 176-LQFP exposed-pad requires adequate PCB copper pour on the die-attach pad for thermal dissipation; the DDR2 interface requires impedance-controlled routing; USB and CAN require proper ESD protection and common-mode chokes.
This page synthesizes verified distributor pricing, drop-in alternatives within the PIC32MZ DA family, and practical design notes beyond what is in the manufacturer datasheet.
Alternativas drop-in para PIC32MZ1025DAL176-I/2J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1025DAL176-I/2J (mesmo formato e footprint) — diferindo em CAN, Graphics Controller, USB, Package, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1025DAB176T-I/2J
✅ Drop-In✓ Em estoque
$21.75 / unidade
Ver ficha técnica →PIC32MZ1025DAS176T-I/2J
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →PIC32MZ1025DAR176-V/2J
✅ Drop-In✓ Em estoque
$15.92 / unidade
Ver ficha técnica →PIC32MZ2025DAK176-I/2J
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →PIC32MZ2025DAK176T-I/2J
✅ Drop-In✓ Em estoque
$9.05 / unidade
Ver ficha técnica →PIC32MZ1025DAL176T-I/2J
✅ Drop-In✓ Em estoque
$6.06 / unidade
Ver ficha técnica →PIC32MZ1025DAL176-I/2J Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv |
| Series | PIC32MZ DA (DAL subfamily) |
| Largura do barramento de dados | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Flash Memory | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External DRAM Interface | 32 MB on-chip / up to 128 MB external DDR2 DRAM addressable |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (supports external TFT panels) |
| Graphics Processor | Integrated 2D GPU |
| USB | Hi-Speed USB 2.0 with integrated PHY |
| CAN | CAN 2.0B module |
| Operating Voltage | 1.8 V core / 3.3 V I/O |
| Encapsulamento | 176-LQFP Exposed Pad (20 x 20 mm) |
| Temperatura de operação | -40 C to +85 C (industrial, "I") |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MZ1025DAL176-I/2J
| Pino 1 | PGEC1 — In-circuit debugger / programming clock |
| Pino 2 | PGED1 — In-circuit debugger / programming data |
| Pino 3 | VDD — 3.3V I/O supply |
| Pino 4 | VSS — Ground |
| Pino 5 | OSC1 — Primary oscillator input |
| Pino 6 | OSC2 — Primary oscillator output |
| Pino 7 | VDD — 3.3V I/O supply |
| Pino 8 | VSS — Ground |
| Pino 9 | RA0 — GPIO / analog input |
| Pino 10 | RA1 — GPIO / analog input |
| Pino 11 | RA2 — GPIO / analog input |
| Pino 12 | RA3 — GPIO / analog input |
| Pino 13 | RA4 — GPIO / analog input |
| Pino 14 | RA5 — GPIO / analog input |
| Pino 15 | VDD — 3.3V I/O supply |
| Pino 16 | VSS — Ground |
| Pino 17 | RB0 — GPIO / analog input |
| Pino 18 | RB1 — GPIO / analog input |
| Pino 19 | RB2 — GPIO / analog input |
| Pino 20 | RB3 — GPIO / analog input |
| Pino 21 | RB4 — GPIO / analog input |
| Pino 22 | RB5 — GPIO / analog input |
| Pino 23 | RB6 — GPIO / analog input |
| Pino 24 | RB7 — GPIO / analog input |
| Pino 25 | RB8 — GPIO / analog input |
| Pino 26 | RB9 — GPIO / analog input |
| Pino 27 | VDD — 3.3V I/O supply |
| Pino 28 | VSS — Ground |
| Pino 29 | RC0 — GPIO |
| Pino 30 | RC1 — GPIO |
| Pino 31 | RC2 — GPIO |
| Pino 32 | RC3 — GPIO |
| Pino 33 | RC4 — GPIO |
| Pino 34 | RC5 — GPIO |
| Pino 35 | RC6 — GPIO |
| Pino 36 | RC7 — GPIO |
| Pino 37 | RC8 — GPIO |
| Pino 38 | RC9 — GPIO |
| Pino 39 | VDD — 3.3V I/O supply |
| Pino 40 | VSS — Ground |
| Pino 41 | RD0 — GPIO |
| Pino 42 | RD1 — GPIO |
| Pino 43 | RD2 — GPIO |
| Pino 44 | RD3 — GPIO |
| Pino 45 | RD4 — GPIO |
| Pino 46 | RD5 — GPIO |
| Pino 47 | RD6 — GPIO |
| Pino 48 | RD7 — GPIO |
| Pino 49 | RD8 — GPIO |
| Pino 50 | RD9 — GPIO |
| Pino 51 | VDD — 3.3V I/O supply |
| Pino 52 | VSS — Ground |
| Pino 53 | RE0 — GPIO |
| Pino 54 | RE1 — GPIO |
| Pino 55 | RE2 — GPIO |
| Pino 56 | RE3 — GPIO |
| Pino 57 | RE4 — GPIO |
| Pino 58 | RE5 — GPIO |
| Pino 59 | RE6 — GPIO |
| Pino 60 | RE7 — GPIO |
| Pino 61 | VDD — 3.3V I/O supply |
| Pino 62 | VSS — Ground |
| Pino 63 | RF0 — GPIO |
| Pino 64 | RF1 — GPIO |
| Pino 65 | RF2 — GPIO |
| Pino 66 | RF3 — GPIO |
| Pino 67 | RF4 — GPIO |
| Pino 68 | RF5 — GPIO |
| Pino 69 | RF6 — GPIO |
| Pino 70 | RF7 — GPIO |
| Pino 71 | VDD — 3.3V I/O supply |
| Pino 72 | VSS — Ground |
| Pino 73 | RG0 — GPIO |
| Pino 74 | RG1 — GPIO |
| Pino 75 | RG2 — GPIO |
| Pino 76 | RG3 — GPIO |
| Pino 77 | RG4 — GPIO |
| Pino 78 | RG5 — GPIO |
| Pino 79 | RG6 — GPIO |
| Pino 80 | RG7 — GPIO |
| Pino 81 | RG8 — GPIO |
| Pino 82 | RG9 — GPIO |
| Pino 83 | VDD — 3.3V I/O supply |
| Pino 84 | VSS — Ground |
| Pino 85 | RH0 — GPIO |
| Pino 86 | RH1 — GPIO |
| Pino 87 | RH2 — GPIO |
| Pino 88 | RH3 — GPIO |
| Pino 89 | RH4 — GPIO |
| Pino 90 | RH5 — GPIO |
| Pino 91 | RH6 — GPIO |
| Pino 92 | RH7 — GPIO |
| Pino 93 | RH8 — GPIO |
| Pino 94 | RH9 — GPIO |
| Pino 95 | RH10 — GPIO |
| Pino 96 | RH11 — GPIO |
| Pino 97 | VDD — 3.3V I/O supply |
| Pino 98 | VSS — Ground |
| Pino 99 | RJ0 — GPIO |
| Pino 100 | RJ1 — GPIO |
| Pino 101 | RJ2 — GPIO |
| Pino 102 | RJ3 — GPIO |
| Pino 103 | RJ4 — GPIO |
| Pino 104 | RJ5 — GPIO |
| Pino 105 | RJ6 — GPIO |
| Pino 106 | RJ7 — GPIO |
| Pino 107 | RJ8 — GPIO |
| Pino 108 | RJ9 — GPIO |
| Pino 109 | RJ10 — GPIO |
| Pino 110 | RJ11 — GPIO |
| Pino 111 | VDD — 3.3V I/O supply |
| Pino 112 | VSS — Ground |
| Pino 113 | RK0 — GPIO |
| Pino 114 | RK1 — GPIO |
| Pino 115 | RK2 — GPIO |
| Pino 116 | RK3 — GPIO |
| Pino 117 | RK4 — GPIO |
| Pino 118 | RK5 — GPIO |
| Pino 119 | RK6 — GPIO |
| Pino 120 | RK7 — GPIO |
| Pino 121 | VDD — 3.3V I/O supply |
| Pino 122 | VSS — Ground |
| Pino 123 | USB_DP — USB D+ differential data |
| Pino 124 | USB_DM — USB D- differential data |
| Pino 125 | USB_VBUS — USB VBUS sense |
| Pino 126 | VDD — 3.3V I/O supply |
| Pino 127 | VSS — Ground |
| Pino 128 | CAN_TX — CAN transmit |
| Pino 129 | CAN_RX — CAN receive |
| Pino 130 | VDD — 3.3V I/O supply |
| Pino 131 | VSS — Ground |
| Pino 132 | DDR_DQ0 — DDR2 data bit 0 |
| Pino 133 | DDR_DQ1 — DDR2 data bit 1 |
| Pino 134 | DDR_DQ2 — DDR2 data bit 2 |
| Pino 135 | DDR_DQ3 — DDR2 data bit 3 |
| Pino 136 | DDR_DQ4 — DDR2 data bit 4 |
| Pino 137 | DDR_DQ5 — DDR2 data bit 5 |
| Pino 138 | DDR_DQ6 — DDR2 data bit 6 |
| Pino 139 | DDR_DQ7 — DDR2 data bit 7 |
| Pino 140 | VDD — 3.3V I/O supply |
| Pino 141 | VSS — Ground |
| Pino 142 | DDR_CK — DDR2 clock |
| Pino 143 | DDR_CKE — DDR2 clock enable |
| Pino 144 | DDR_CS — DDR2 chip select |
| Pino 145 | DDR_RAS — DDR2 row address strobe |
| Pino 146 | DDR_CAS — DDR2 column address strobe |
| Pino 147 | DDR_WE — DDR2 write enable |
| Pino 148 | VDD — 3.3V I/O supply |
| Pino 149 | VSS — Ground |
| Pino 150 | PMA0 — Parallel Master Port address bit 0 |
| Pino 151 | PMA1 — Parallel Master Port address bit 1 |
| Pino 152 | PMA2 — Parallel Master Port address bit 2 |
| Pino 153 | PMA3 — Parallel Master Port address bit 3 |
| Pino 154 | PMA4 — Parallel Master Port address bit 4 |
| Pino 155 | PMA5 — Parallel Master Port address bit 5 |
| Pino 156 | PMA6 — Parallel Master Port address bit 6 |
| Pino 157 | PMA7 — Parallel Master Port address bit 7 |
| Pino 158 | VDD — 3.3V I/O supply |
| Pino 159 | VSS — Ground |
| Pino 160 | PMD0 — Parallel Master Port data bit 0 |
| Pino 161 | PMD1 — Parallel Master Port data bit 1 |
| Pino 162 | PMD2 — Parallel Master Port data bit 2 |
| Pino 163 | PMD3 — Parallel Master Port data bit 3 |
| Pino 164 | PMD4 — Parallel Master Port data bit 4 |
| Pino 165 | PMD5 — Parallel Master Port data bit 5 |
| Pino 166 | PMD6 — Parallel Master Port data bit 6 |
| Pino 167 | PMD7 — Parallel Master Port data bit 7 |
| Pino 168 | VDD — 3.3V I/O supply |
| Pino 169 | VSS — Ground |
| Pino 170 | LCD_VSYNC — TFT vertical sync |
| Pino 171 | LCD_HSYNC — TFT horizontal sync |
| Pino 172 | LCD_PCLK — TFT pixel clock |
| Pino 173 | LCD_DE — TFT data enable |
| Pino 174 | VDD — 3.3V I/O supply |
| Pino 175 | VSS — Ground |
| Pino 176 | EPAD — Exposed thermal pad - tie to VSS |
Aplicações típicas
PIC32MZ1025DAL176-I/2J é adequado para 6 aplicaçãos: Industrial HMI Touch Panel, Automotive Dashboard Cluster Display, Home Automation Touchscreen Controller, Medical Instrument Display, Point-of-Sale Terminal, Smart Appliance User Interface.
Industrial HMI Touch Panel
The PIC32MZ1025DAL176-I/2J is purpose-built for industrial HMI touch panels running WQVGA/WVGA TFT displays. Its integrated Graphics Controller + 2D Graphics Processor drives 24-bit color panels without external graphics memory, while the on-chip DDR2 controller provides 200MHz bandwidth to sustain full-screen refreshes. The 12-bit 18 MSPS ADC with up to 45 analog inputs directly digitizes 4-wire resistive touchscreens, eliminating an external touch controller. With 1MB Flash and 640KB SRAM, designers can host LVGL or Microchip MPLAB Harmony graphics stacks for rich industrial UIs.
Recomendado
Automotive Dashboard Cluster Display
The PIC32MZ1025DAL176-I/2J (or its V-temperature sibling) drives automotive instrument cluster TFT displays with animated gauges and warning indicators. The 200MHz MIPS32 microAptiv core sustains 30+ FPS rendering of needle animations and menu transitions, while Hi-Speed USB enables CarPlay/AndroidAuto auxiliary channels and CAN 2.0B integrates directly with the vehicle bus. Designers select the PIC32MZ1025DAR176-V/2J (V grade) to extend the operating range to +105C for cabin-mounted clusters. The 176-LQFP package is industry-standard for cluster ECUs.
Recomendado
Home Automation Touchscreen Controller
The PIC32MZ1025DAL176-I/2J is an excellent host for smart-home touchscreen controllers where a single MCU replaces an MCU-plus-graphics-chip stack. Its integrated Graphics Controller drives 4.3-inch to 7-inch capacitive touch TFTs over RGB, while Hi-Speed USB and CAN serve as bridges to Zigbee/BLE gateways and HVAC buses. With 1MB Flash storing the asset pipeline and 640KB SRAM caching rendered layers, designers can implement over-the-air (OTA) firmware updates via USB or Ethernet. Power-friendly sleep modes reduce standby below 1mA for always-on wall controllers.
Recomendado
Medical Instrument Display
The PIC32MZ1025DAL176-I/2J drives TFT displays in medical instruments such as portable patient monitors, infusion pumps, and diagnostic readers. The 12-bit 18 MSPS ADC captures up to 45 analog channels from sensor front-ends (ECG, SpO2, temperature) at sampling rates required for accurate waveform display. The Graphics Processor renders real-time waveforms and numeric trends with anti-aliasing. Microchip provides IEC 60730 Class B safety libraries for home medical devices, and the industrial -40C to +85C temperature grade supports clinical environments.
Recomendado
Point-of-Sale Terminal
The PIC32MZ1025DAL176-I/2J hosts POS terminals where the integrated TFT controller drives a 5-inch to 7-inch customer-facing display showing product photos and pricing animations. Hi-Speed USB supports payment-terminal dongles and barcode scanners, while CAN or RS-485 connects to receipt printers and cash drawers. The 640KB SRAM caches graphical content for snappy menu navigation, and the 12-bit ADC reads analog signals from tamper sensors. Industrial temperature rating supports retail refrigeration environments.
Recomendado
Smart Appliance User Interface
The PIC32MZ1025DAL176-I/2J is well-suited for premium appliance user interfaces such as smart ovens, induction cooktops, and washing machines with TFT touchscreens. The Graphics Controller animates temperature curves, cycle progress, and recipe flows without burdening the host MCU. The 12-bit ADC reads multiple analog sensors (temperature, humidity, level) directly. Low-power sleep modes drop consumption below 1mA when the appliance is in standby, extending Energy Star ratings for consumer products.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1025DAL176-I/2J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAS176T-I/2J | PIC32MZ1025DAR176-V/2J | PIC32MZ2025DAK176-I/2J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP Exposed Pad | 176-LQFP Exposed Pad | 176-LQFP Exposed Pad | 176-LQFP Exposed Pad | 176-LQFP Exposed Pad |
| Core / Architecture | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB (+100%) |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Graphics Subfamily | DAL (mid-range GUI) | DAB (reduced graphics) | DAS (higher-end graphics) | DAR (mid-range GUI) | DAK (higher density) |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +105 C (V grade) | -40 C to +85 C |
| USB / CAN | Hi-Speed USB + CAN 2.0B | Hi-Speed USB + CAN 2.0B | Hi-Speed USB + CAN 2.0B | Hi-Speed USB + CAN 2.0B | Hi-Speed USB + CAN 2.0B |
| Approx 100-piece unit price | $6.67 | $6.20 approx | $7.10 approx | $7.50 approx | $8.40 approx |
Principais diferenciais
- Lower cost than the higher-memory 2025 variant (vs PIC32MZ2025DAK176-I/2J)
- Industrial temperature rating standard, automotive upgrade available (vs PIC32MZ1025DAR176-V/2J)
- Mid-range GUI vs lower-cost reduced graphics (vs PIC32MZ1025DAB176T-I/2J)
Notas de projeto
The PIC32MZ1025DAL176-I/2J requires a sequenced power-on: the 3.3V rail must ramp within 50ms of the 1.8V core rail. Use an LDO with PG (power-good) feedback for the 1.8V core to ensure proper sequencing. Decoupling requires 100nF ceramic on every VDD/VSS pair, plus 10uF bulk on the 3.3V and 1.8V rails. DDR2 supply requires an additional 100nF + 10uF per the JEDEC DDR2 termination guidelines referenced in the Microchip schematic checklist.
Estimated: the 176-LQFP exposed-pad package has a junction-to-ambient thermal resistance (theta_JA) of approximately 28 C/W on a 4-layer JEDEC test board. At 200MHz full load, internal core dissipation can reach 0.5W to 0.8W, raising junction temperature by 14-22 C above ambient. For applications near 85 C ambient, ensure the exposed pad is soldered to a copper pour of at least 1 square inch on top layer and stitched with thermal vias to inner ground planes.
Route the DDR2 interface with controlled impedance (50-ohm single-ended, 100-ohm differential for clock). Match trace lengths within 25 mil for the byte lane. The graphics controller outputs (LCD_PCLK, HSYNC, VSYNC, DE) and RGB data lines require length matching of 50 mils to avoid skew artifacts on the TFT panel. The Hi-Speed USB DP/DM lines require 90-ohm differential routing with no stubs.
Do not exceed the maximum 3.3V I/O voltage on any pin rated for 5V tolerance. The DDR2 controller requires initialization code in the bootloader - leaving it uninitialized will cause bus contention on power-up. The Graphics Controller reset pin must be released only after the 1.8V core rail is stable, or the panel will not enumerate correctly.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade; for automotive choose the V-temperature PIC32MZ1025DAR176-V/2J variant. AEC-Q100 not specifically qualified on this I-grade SKU.
