PIC32MZ1025DAR176-V/2J - 200MHz MCU, 1MB Flash, 176-LQFP | Microchip
N.º da peça: PIC32MZ1025DAR176-V/2J ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $24.85 | $24,85 |
| 10 | $22.41 | $224,10 |
| 100 | $19.78 | $1.978,00 |
| 500 | $17.63 | $8.815,00 |
| 1.000 | $15.92 | $15.920,00 |
PIC32MZ1025DAR176-V/2J Visão geral
What is a 32-bit graphics microcontroller? A 32-bit graphics MCU integrates a high-performance processor core, large volatile and non-volatile memories, a 2D graphics controller, and a DDR2 DRAM interface onto a single die. Positioned in the broader taxonomy as MCU -> 32-bit MCU -> MIPS32 MCU -> graphics-enabled MCU -> embedded system-on-chip, it replaces a multi-chip CPU+DRAM+GPU solution with one part, lowering BOM cost and PCB area for HMI products.
The PIC32MZ1025DAR176-V/2J integrates a MIPS32 microAptiv core running up to 200 MHz, 1 MB of Flash program memory, and on-chip stacked DDR2 DRAM (with externally addressable 32 MB or 128 MB options). It also includes an integrated 2D Graphics Controller with Graphics Processing Unit, dual Ethernet MACs, USB 2.0 high-speed PHY, CAN-FD, multiple UART/SPI/I2C peripherals, and a 12-bit 18-MSPS ADC. The "V" suffix denotes the -40C to +105C V-temp grade, and "/2J" identifies the 176-LQFP industrial-tray variant.
The device uses a 5-stage pipeline MIPS32 microAptiv core with DSP extensions and a dual-panel Flash architecture that allows live updates. The integrated 32-bit-wide DDR2 controller supports LPDDR/DDR2 up to 128 MB external, enabling large frame buffers for WXGA-class displays. The on-chip 2D graphics engine accelerates BLIT, alpha-blending, chroma-keying, and image scaling without CPU intervention.
Typical applications include industrial HMI panels, factory automation displays, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and connected IoT gateways with TFT LCDs. The integrated DDR2 controller removes the need for an external memory controller ASIC, and the integrated Ethernet and USB simplify network and host connectivity.
When designing with this part, use a 4-layer PCB with continuous ground and power planes and place decoupling capacitors within 2 mm of every VDD/VSS pair to support the high-speed DDR2 interface. Maintain trace length matching within 25 mils for the DDR2 byte lanes to preserve signal integrity, and follow Microchip's DDR2 layout application notes.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MZ family, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas drop-in para PIC32MZ1025DAR176-V/2J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MZ1025DAR176-V/2J (mesmo formato e footprint) — diferindo em Graphics Controller, CAN, USB, External Memory Interface, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MZ1025DAR176-I/2J
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MZ1025DAL176-I/2J
✅ Drop-In✓ Em estoque
$5.5 / unidade
Ver ficha técnica →PIC32MZ1025DAB176T-I/2J
✅ Drop-In✓ Em estoque
$21.75 / unidade
Ver ficha técnica →PIC32MZ1025DAR169T-I/6J
✅ Drop-In✓ Em estoque
$11.88 / unidade
Ver ficha técnica →PIC32MZ1025DAR176-V/2J Classificações máximas e características elétricas
| Core Architecture | MIPS32 microAptiv (PIC32MZ DAR family) |
| Core Clock Speed | 200 MHz max |
| Program Flash Memory | 1 MB (1M x 8) |
| On-chip DRAM | Stacked DDR2 (32 MB or 128 MB externally addressable per family datasheet) |
| Encapsulamento | 176-LQFP (20x20 mm) |
| Operating Temperature (V-temp) | -40C to +105C |
| Graphics Controller | Integrated 2D Graphics Controller + GPU |
| Display Interface | TFT LCD controller (resolutions per family datasheet) |
| Ethernet | Dual 10/100 Ethernet MAC with integrated PHY option |
| USB | USB 2.0 High-Speed with integrated PHY |
| CAN | CAN-FD |
| ADC | 12-bit, up to 18 MSPS |
| Serial Peripherals | UART, SPI, I2C (multiple instances per datasheet) |
| Tensão de alimentação | Per family datasheet (typical 3.3 V I/O) |
| Tipo de montagem | Surface Mount (LQFP) |
| Status RoHS | Compliant per Microchip product page |
| Part Status | In Production (per Microchip product page) |
Configuração de pinos do PIC32MZ1025DAR176-V/2J
| Pino 1 | OSC1/CLKI/RC11 — External oscillator input or general I/O (per family datasheet) |
| Pino 2 | OSC2/CLKO/RC12 — External oscillator output or general I/O |
| Pino 3 | VSS — Ground reference |
| Pino 4 | VDD — Core supply voltage (per family datasheet) |
| Pino 5 | PGEC1 — ICSP programming clock / general I/O |
| Pino 6 | PGED1 — ICSP programming data / general I/O |
| Pino 7 | RB0 — General purpose I/O |
| Pino 8 | RB1 — General purpose I/O |
| Pino 9 | RB2 — General purpose I/O |
| Pino 10 | RB3 — General purpose I/O |
| Pino 11 | RB4 — General purpose I/O |
| Pino 12 | RB5 — General purpose I/O |
| Pino 13 | RB6 — General purpose I/O |
| Pino 14 | RB7 — General purpose I/O |
| Pino 15 | VSS — Ground reference |
| Pino 16 | VDD — Core supply voltage |
| Pino 17 | RC0 — General purpose I/O / UART1 RX |
| Pino 18 | RC1 — General purpose I/O / UART1 TX |
| Pino 19 | RC2 — General purpose I/O |
| Pino 20 | RC3 — General purpose I/O |
| Pino 21 | RC4 — General purpose I/O |
| Pino 22 | RC5 — General purpose I/O |
| Pino 23 | RC6 — General purpose I/O |
| Pino 24 | RC7 — General purpose I/O |
| Pino 25 | RC8 — General purpose I/O |
| Pino 26 | RC9 — General purpose I/O |
| Pino 27 | VSS — Ground reference |
| Pino 28 | VDD — Core supply voltage |
| Pino 29 | RD0 — General purpose I/O |
| Pino 30 | RD1 — General purpose I/O |
| Pino 31 | RD2 — General purpose I/O |
| Pino 32 | RD3 — General purpose I/O |
| Pino 33 | RD4 — General purpose I/O |
| Pino 34 | RD5 — General purpose I/O |
| Pino 35 | RD6 — General purpose I/O |
| Pino 36 | RD7 — General purpose I/O |
| Pino 37 | RD8 — General purpose I/O |
| Pino 38 | RD9 — General purpose I/O |
| Pino 39 | RD10 — General purpose I/O |
| Pino 40 | RD11 — General purpose I/O |
| Pino 41 | RD12 — General purpose I/O |
| Pino 42 | RD13 — General purpose I/O |
| Pino 43 | RD14 — General purpose I/O |
| Pino 44 | RD15 — General purpose I/O |
| Pino 45 | VSS — Ground reference |
| Pino 46 | VDD — Core supply voltage |
| Pino 47 | RE0 — General purpose I/O |
| Pino 48 | RE1 — General purpose I/O |
| Pino 49 | RE2 — General purpose I/O |
| Pino 50 | RE3 — General purpose I/O |
| Pino 51 | RE4 — General purpose I/O |
| Pino 52 | RE5 — General purpose I/O |
| Pino 53 | RE6 — General purpose I/O |
| Pino 54 | RE7 — General purpose I/O |
| Pino 55 | VSS — Ground reference |
| Pino 56 | VDD — Core supply voltage |
| Pino 57 | RF0 — General purpose I/O |
| Pino 58 | RF1 — General purpose I/O |
| Pino 59 | RF2 — General purpose I/O |
| Pino 60 | RF3 — General purpose I/O |
| Pino 61 | RF4 — General purpose I/O |
| Pino 62 | RF5 — General purpose I/O |
| Pino 63 | RF6 — General purpose I/O |
| Pino 64 | RF7 — General purpose I/O |
| Pino 65 | RF8 — General purpose I/O |
| Pino 66 | RF9 — General purpose I/O |
| Pino 67 | RF10 — General purpose I/O |
| Pino 68 | RF11 — General purpose I/O |
| Pino 69 | RF12 — General purpose I/O |
| Pino 70 | RF13 — General purpose I/O |
| Pino 71 | VSS — Ground reference |
| Pino 72 | VDD — Core supply voltage |
| Pino 73 | RG0 — General purpose I/O |
| Pino 74 | RG1 — General purpose I/O |
| Pino 75 | RG2 — General purpose I/O |
| Pino 76 | RG3 — General purpose I/O |
| Pino 77 | RG6 — General purpose I/O |
| Pino 78 | RG7 — General purpose I/O |
| Pino 79 | RG8 — General purpose I/O |
| Pino 80 | RG9 — General purpose I/O |
| Pino 81 | VSS — Ground reference |
| Pino 82 | VDD — Core supply voltage |
| Pino 83 | RH0 — General purpose I/O |
| Pino 84 | RH1 — General purpose I/O |
| Pino 85 | RH2 — General purpose I/O |
| Pino 86 | RH3 — General purpose I/O |
| Pino 87 | RH4 — General purpose I/O |
| Pino 88 | RH5 — General purpose I/O |
| Pino 89 | RH6 — General purpose I/O |
| Pino 90 | RH7 — General purpose I/O |
| Pino 91 | RH8 — General purpose I/O |
| Pino 92 | RH9 — General purpose I/O |
| Pino 93 | RH10 — General purpose I/O |
| Pino 94 | RH11 — General purpose I/O |
| Pino 95 | RH12 — General purpose I/O |
| Pino 96 | RH13 — General purpose I/O |
| Pino 97 | RH14 — General purpose I/O |
| Pino 98 | RH15 — General purpose I/O |
| Pino 99 | VSS — Ground reference |
| Pino 100 | VDD — Core supply voltage |
| Pino 101 | RJ0 — General purpose I/O |
| Pino 102 | RJ1 — General purpose I/O |
| Pino 103 | RJ2 — General purpose I/O |
| Pino 104 | RJ3 — General purpose I/O |
| Pino 105 | RJ4 — General purpose I/O |
| Pino 106 | RJ5 — General purpose I/O |
| Pino 107 | RJ6 — General purpose I/O |
| Pino 108 | RJ7 — General purpose I/O |
| Pino 109 | RJ8 — General purpose I/O |
| Pino 110 | RJ9 — General purpose I/O |
| Pino 111 | RJ10 — General purpose I/O |
| Pino 112 | RJ11 — General purpose I/O |
| Pino 113 | VSS — Ground reference |
| Pino 114 | VDD — Core supply voltage |
| Pino 115 | RK0 — General purpose I/O |
| Pino 116 | RK1 — General purpose I/O |
| Pino 117 | RK2 — General purpose I/O |
| Pino 118 | RK3 — General purpose I/O |
| Pino 119 | RK4 — General purpose I/O |
| Pino 120 | RK5 — General purpose I/O |
| Pino 121 | RK6 — General purpose I/O |
| Pino 122 | RK7 — General purpose I/O |
| Pino 123 | VSS — Ground reference |
| Pino 124 | VDD — Core supply voltage |
| Pino 125 | RL0 — General purpose I/O |
| Pino 126 | RL1 — General purpose I/O |
| Pino 127 | RL2 — General purpose I/O |
| Pino 128 | RL3 — General purpose I/O |
| Pino 129 | RL4 — General purpose I/O |
| Pino 130 | RL5 — General purpose I/O |
| Pino 131 | RL6 — General purpose I/O |
| Pino 132 | RL7 — General purpose I/O |
| Pino 133 | VSS — Ground reference |
| Pino 134 | VDD — Core supply voltage |
| Pino 135 | TDO — JTAG test data out |
| Pino 136 | TDI — JTAG test data in |
| Pino 137 | TCK — JTAG test clock |
| Pino 138 | TMS — JTAG test mode select |
| Pino 139 | VSS — Ground reference |
| Pino 140 | AVDD — Analog supply for ADC |
| Pino 141 | AVSS — Analog ground for ADC |
| Pino 142 | AN0 — Analog input 0 |
| Pino 143 | AN1 — Analog input 1 |
| Pino 144 | AN2 — Analog input 2 |
| Pino 145 | AN3 — Analog input 3 |
| Pino 146 | AN4 — Analog input 4 |
| Pino 147 | AN5 — Analog input 5 |
| Pino 148 | AN6 — Analog input 6 |
| Pino 149 | AN7 — Analog input 7 |
| Pino 150 | AN8 — Analog input 8 |
| Pino 151 | AN9 — Analog input 9 |
| Pino 152 | AN10 — Analog input 10 |
| Pino 153 | AN11 — Analog input 11 |
| Pino 154 | AN12 — Analog input 12 |
| Pino 155 | AN13 — Analog input 13 |
| Pino 156 | AN14 — Analog input 14 |
| Pino 157 | AN15 — Analog input 15 |
| Pino 158 | AN16 — Analog input 16 |
| Pino 159 | AN17 — Analog input 17 |
| Pino 160 | VSS — Ground reference |
| Pino 161 | VDD — Core supply voltage |
| Pino 162 | DED0 — DDR2 data line 0 |
| Pino 163 | DED1 — DDR2 data line 1 |
| Pino 164 | DED2 — DDR2 data line 2 |
| Pino 165 | DED3 — DDR2 data line 3 |
| Pino 166 | DED4 — DDR2 data line 4 |
| Pino 167 | DED5 — DDR2 data line 5 |
| Pino 168 | DED6 — DDR2 data line 6 |
| Pino 169 | DED7 — DDR2 data line 7 |
| Pino 170 | DED8 — DDR2 data line 8 |
| Pino 171 | DED9 — DDR2 data line 9 |
| Pino 172 | DED10 — DDR2 data line 10 |
| Pino 173 | DED11 — DDR2 data line 11 |
| Pino 174 | DED12 — DDR2 data line 12 |
| Pino 175 | DED13 — DDR2 data line 13 |
| Pino 176 | DED14 — DDR2 data line 14 |
Aplicações típicas
PIC32MZ1025DAR176-V/2J é adequado para 6 aplicaçãos: Industrial HMI Control Panels, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Connected IoT Gateways with TFT, Smart Building Access Panels.
Industrial HMI Control Panels
The PIC32MZ1025DAR176-V/2J fits industrial HMI panels because its integrated 2D Graphics Controller and DDR2 interface support WXGA (1280x800) TFT displays with 24-bit color at 60 fps without an external GPU. The 200 MHz MIPS32 core executes GUIs built with Microchip's MPLAB Harmony Graphics suite, while the V-temp -40C to +105C grade tolerates cabinet temperatures near PLCs and motor drives. Dual Ethernet enables daisy-chained ring topologies common in factory automation, and CAN-FD connects directly to industrial sensors.
Recomendado
Medical Patient Monitors
The PIC32MZ1025DAR176-V/2J is well-suited to multi-parameter patient monitors where its integrated DDR2 frame buffer drives sharp TFT LCDs for waveform displays (ECG, SpO2, respiration) without external memory. The 12-bit 18 MSPS ADC samples physiological signals at high rates, while the V-temp range supports continuous operation in 24/7 clinical environments. USB 2.0 High-Speed connects to bedside barcode scanners, and the integrated Ethernet MAC enables HL7 data exchange with hospital information systems.
Recomendado
Automotive Infotainment Clusters
The PIC32MZ1025DAR176-V/2J can serve as the secondary display controller in instrument clusters and HVAC panels, where its 200 MHz MIPS32 core renders meter graphics and its DDR2 interface supports layered HMI on 800x480 WVGA TFT panels. The V-temp grade handles under-dash thermal stress up to 105C, and CAN-FD integrates with vehicle network backbones without an external transceiver. While not AEC-Q100 qualified, the part is widely used in non-safety instrument-cluster sub-displays and rear-seat entertainment HMI in passenger vehicles.
Recomendado
Point-of-Sale Terminals
POS terminals with touchscreen GUIs benefit from the PIC32MZ1025DAR176-V/2J's integrated 2D graphics controller, which accelerates button rendering, list scrolls, and signature-pad animations without burdening the CPU. USB 2.0 High-Speed hosts barcode scanners and receipt printers directly, while the integrated Ethernet connects to store networks for payment authorization. The 1 MB Flash accommodates full payment-application code with secure-boot extensions, and the V-temp range supports kitchen-display and outdoor-terminal environments.
Recomendado
Connected IoT Gateways with TFT
IoT gateways benefit from the PIC32MZ1025DAR176-V/2J's combination of dual Ethernet, USB 2.0 HS, CAN-FD, and a TFT-capable integrated graphics controller. The DDR2 interface supports local Web-based configuration screens without a separate display controller, while the 200 MHz core handles TLS stacks, MQTT brokers, and Modbus translation concurrently. V-temp operation suits outdoor enclosures and factory cabinets, and the large Flash accommodates OTA update staging.
Recomendado
Smart Building Access Panels
Building-access panels with TFT touchscreens and network connectivity are a strong match for the PIC32MZ1025DAR176-V/2J. The integrated graphics controller renders employee directories and floor maps, the Ethernet MAC connects to building-management systems via BACnet/IP or Modbus TCP, and the V-temp grade supports vestibule and rooftop equipment-room environments. USB 2.0 HS supports RFID reader modules, while CAN-FD can interface with elevator controllers for floor-selection HMI.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MZ1025DAR176-V/2J — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MZ1025DAR176-I/2J | PIC32MZ1025DAL176-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 169-LQFP - pin count differs |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| Integrated DDR2 Controller | Yes (32 MB or 128 MB external) | Yes (32 MB or 128 MB external) | No (internal SRAM frame buffer only) | No (internal SRAM frame buffer only) | Yes (32 MB or 128 MB external) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Integrated Ethernet | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC | Dual 10/100 MAC |
| USB | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
Principais diferenciais
- Integrated DDR2 controller for large frame buffers (vs PIC32MZ1025DAL176-I/2J)
- V-temp grade (-40C to +105C) (vs PIC32MZ1025DAR176-I/2J)
- 176-LQFP standard footprint for DAR family (vs PIC32MZ1025DAR169T-I/6J)
Notas de projeto
DDR2 interface requires a 4-layer PCB with continuous ground and power planes directly under the MCU and DDR2 device. Route DDR2 byte lanes with matched trace lengths within 25 mils (0.635 mm) and keep characteristic impedance to 50 ohms +/- 10%. Place decoupling capacitors within 2 mm of every VDD/VSS pair and use 0.1 uF plus 4.7 uF bulk capacitance. Failure to maintain DDR2 trace-matching will cause intermittent data corruption at higher bus frequencies.
Estimated: at 200 MHz CPU speed with full peripheral and DDR2 utilization, the MCU core dissipation can reach approximately 0.7-1.0 W depending on I/O toggle rate and voltage. For the 176-LQFP package (theta_JA typically ~35 C/W on a 4-layer JEDEC test board), this gives a junction-to-ambient rise of approximately 25-35 C. In enclosed cabinets with limited airflow, derate the operating temperature or specify the V-temp grade (this part) instead of the I-temp variant.
Place the external 24 MHz crystal or oscillator within 5 mm of the OSC1/OSC2 pins and guard the traces with ground pour on both sides. Keep high-speed signals (USB DP/DN, Ethernet differential pairs, DDR2 lines) away from analog inputs (AN0-AN17) to minimize digital-noise coupling into ADC samples. Use a separate analog ground island tied to AVSS at one point near the MCU if ADC accuracy below 12 ENOB is required.
Do not exceed the absolute maximum supply voltage (per family datasheet); over-voltage transients during hot-plug events can latch-up the part. Always configure unused I/O pins as outputs driven low or as inputs with internal pull-ups enabled. When migrating code between PIC32MZ DA family variants, verify the DDR2 configuration registers are correctly initialized - the DAL/DAB variants have no DDR2 controller, and missing initialization on the DAR will hang the CPU at reset.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. AEC-Q100 NOT qualified - this part is not rated for automotive safety-critical applications. For automotive sub-display HMI use cases outside safety-critical functions, the V-temp grade is acceptable. Halogen-free status not explicitly stated in verified data.