PIC32MZ1025DAL176-I/2J - 200MHz 1MB Flash MCU with Graphics Controller | Microchip
Référence : PIC32MZ1025DAL176-I/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.41 | $8,41 |
| 10 | $7.55 | $75,50 |
| 100 | $6.67 | $667,00 |
| 500 | $6.05 | $3 025,00 |
| 1 000 | $5.5 | $5 500,00 |
PIC32MZ1025DAL176-I/2J Présentation
A 32-bit microcontroller (MCU) is an embedded processor that integrates CPU core, memory, and peripherals into one IC. Within the broader taxonomy, this part belongs to the MIPS32 microAptiv family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. The PIC32MZ DA series specifically targets GUI applications where designers want MPU-level graphics performance while keeping the programming model of an MCU, avoiding the complexity of a full Linux-capable application processor.
Key features include: 200MHz core clock delivering up to 330 DMIPS and 1.5 DMIPS/MHz efficiency; 1MB Flash with prefetch cache for deterministic execution; 640KB SRAM; integrated 2D Graphics Processing Unit supporting HX8347, SSD1963, and other TFT controllers; Hi-Speed USB 2.0 with integrated PHY; CAN 2.0B module; 12-bit 18 MSPS ADC with up to 45 analog inputs (analog touch-screen friendly); and a wide operating voltage range centered at 1.8V core / 3.3V I/O.
Architecturally, the part pairs a MIPS32 microAptiv core with a high-bandwidth multi-port SRAM subsystem, dual-port DDR2 controller, and dedicated Graphics Controller/Processor blocks. The DDR2 interface runs at 200MHz data rate with a 32-bit bus, delivering enough bandwidth for full-screen 24-bit color TFT rendering at typical WQVGA/WVGA resolutions without CPU intervention. The analog front-end (18 MSPS) and large ADC channel count make it a strong fit for sensor-rich HMI panels.
Typical applications include industrial control HMI touch panels, automotive dashboard clusters, home automation touchscreens, medical instrument displays, point-of-sale terminals, and consumer GUI appliances. Its integrated graphics and DDR2 controller eliminate the need for an external graphics companion chip.
Design considerations: the 176-LQFP exposed-pad requires adequate PCB copper pour on the die-attach pad for thermal dissipation; the DDR2 interface requires impedance-controlled routing; USB and CAN require proper ESD protection and common-mode chokes.
This page synthesizes verified distributor pricing, drop-in alternatives within the PIC32MZ DA family, and practical design notes beyond what is in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1025DAL176-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1025DAL176-I/2J (même facteur de forme et même empreinte) — différant par CAN, Graphics Controller, USB, Package, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1025DAB176T-I/2J
✅ Remplacement direct✓ En stock
$21.75 / unité
Voir la fiche technique →PIC32MZ1025DAS176T-I/2J
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →PIC32MZ1025DAR176-V/2J
✅ Remplacement direct✓ En stock
$15.92 / unité
Voir la fiche technique →PIC32MZ2025DAK176-I/2J
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →PIC32MZ2025DAK176T-I/2J
✅ Remplacement direct✓ En stock
$9.05 / unité
Voir la fiche technique →PIC32MZ1025DAL176T-I/2J
✅ Remplacement direct✓ En stock
$6.06 / unité
Voir la fiche technique →PIC32MZ1025DAL176-I/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Series | PIC32MZ DA (DAL subfamily) |
| Largeur du bus de données | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Flash Memory | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External DRAM Interface | 32 MB on-chip / up to 128 MB external DDR2 DRAM addressable |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (supports external TFT panels) |
| Graphics Processor | Integrated 2D GPU |
| USB | Hi-Speed USB 2.0 with integrated PHY |
| CAN | CAN 2.0B module |
| Operating Voltage | 1.8 V core / 3.3 V I/O |
| Boîtier | 176-LQFP Exposed Pad (20 x 20 mm) |
| Température de fonctionnement | -40 C to +85 C (industrial, "I") |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1025DAL176-I/2J
| Broche 1 | PGEC1 — In-circuit debugger / programming clock |
| Broche 2 | PGED1 — In-circuit debugger / programming data |
| Broche 3 | VDD — 3.3V I/O supply |
| Broche 4 | VSS — Ground |
| Broche 5 | OSC1 — Primary oscillator input |
| Broche 6 | OSC2 — Primary oscillator output |
| Broche 7 | VDD — 3.3V I/O supply |
| Broche 8 | VSS — Ground |
| Broche 9 | RA0 — GPIO / analog input |
| Broche 10 | RA1 — GPIO / analog input |
| Broche 11 | RA2 — GPIO / analog input |
| Broche 12 | RA3 — GPIO / analog input |
| Broche 13 | RA4 — GPIO / analog input |
| Broche 14 | RA5 — GPIO / analog input |
| Broche 15 | VDD — 3.3V I/O supply |
| Broche 16 | VSS — Ground |
| Broche 17 | RB0 — GPIO / analog input |
| Broche 18 | RB1 — GPIO / analog input |
| Broche 19 | RB2 — GPIO / analog input |
| Broche 20 | RB3 — GPIO / analog input |
| Broche 21 | RB4 — GPIO / analog input |
| Broche 22 | RB5 — GPIO / analog input |
| Broche 23 | RB6 — GPIO / analog input |
| Broche 24 | RB7 — GPIO / analog input |
| Broche 25 | RB8 — GPIO / analog input |
| Broche 26 | RB9 — GPIO / analog input |
| Broche 27 | VDD — 3.3V I/O supply |
| Broche 28 | VSS — Ground |
| Broche 29 | RC0 — GPIO |
| Broche 30 | RC1 — GPIO |
| Broche 31 | RC2 — GPIO |
| Broche 32 | RC3 — GPIO |
| Broche 33 | RC4 — GPIO |
| Broche 34 | RC5 — GPIO |
| Broche 35 | RC6 — GPIO |
| Broche 36 | RC7 — GPIO |
| Broche 37 | RC8 — GPIO |
| Broche 38 | RC9 — GPIO |
| Broche 39 | VDD — 3.3V I/O supply |
| Broche 40 | VSS — Ground |
| Broche 41 | RD0 — GPIO |
| Broche 42 | RD1 — GPIO |
| Broche 43 | RD2 — GPIO |
| Broche 44 | RD3 — GPIO |
| Broche 45 | RD4 — GPIO |
| Broche 46 | RD5 — GPIO |
| Broche 47 | RD6 — GPIO |
| Broche 48 | RD7 — GPIO |
| Broche 49 | RD8 — GPIO |
| Broche 50 | RD9 — GPIO |
| Broche 51 | VDD — 3.3V I/O supply |
| Broche 52 | VSS — Ground |
| Broche 53 | RE0 — GPIO |
| Broche 54 | RE1 — GPIO |
| Broche 55 | RE2 — GPIO |
| Broche 56 | RE3 — GPIO |
| Broche 57 | RE4 — GPIO |
| Broche 58 | RE5 — GPIO |
| Broche 59 | RE6 — GPIO |
| Broche 60 | RE7 — GPIO |
| Broche 61 | VDD — 3.3V I/O supply |
| Broche 62 | VSS — Ground |
| Broche 63 | RF0 — GPIO |
| Broche 64 | RF1 — GPIO |
| Broche 65 | RF2 — GPIO |
| Broche 66 | RF3 — GPIO |
| Broche 67 | RF4 — GPIO |
| Broche 68 | RF5 — GPIO |
| Broche 69 | RF6 — GPIO |
| Broche 70 | RF7 — GPIO |
| Broche 71 | VDD — 3.3V I/O supply |
| Broche 72 | VSS — Ground |
| Broche 73 | RG0 — GPIO |
| Broche 74 | RG1 — GPIO |
| Broche 75 | RG2 — GPIO |
| Broche 76 | RG3 — GPIO |
| Broche 77 | RG4 — GPIO |
| Broche 78 | RG5 — GPIO |
| Broche 79 | RG6 — GPIO |
| Broche 80 | RG7 — GPIO |
| Broche 81 | RG8 — GPIO |
| Broche 82 | RG9 — GPIO |
| Broche 83 | VDD — 3.3V I/O supply |
| Broche 84 | VSS — Ground |
| Broche 85 | RH0 — GPIO |
| Broche 86 | RH1 — GPIO |
| Broche 87 | RH2 — GPIO |
| Broche 88 | RH3 — GPIO |
| Broche 89 | RH4 — GPIO |
| Broche 90 | RH5 — GPIO |
| Broche 91 | RH6 — GPIO |
| Broche 92 | RH7 — GPIO |
| Broche 93 | RH8 — GPIO |
| Broche 94 | RH9 — GPIO |
| Broche 95 | RH10 — GPIO |
| Broche 96 | RH11 — GPIO |
| Broche 97 | VDD — 3.3V I/O supply |
| Broche 98 | VSS — Ground |
| Broche 99 | RJ0 — GPIO |
| Broche 100 | RJ1 — GPIO |
| Broche 101 | RJ2 — GPIO |
| Broche 102 | RJ3 — GPIO |
| Broche 103 | RJ4 — GPIO |
| Broche 104 | RJ5 — GPIO |
| Broche 105 | RJ6 — GPIO |
| Broche 106 | RJ7 — GPIO |
| Broche 107 | RJ8 — GPIO |
| Broche 108 | RJ9 — GPIO |
| Broche 109 | RJ10 — GPIO |
| Broche 110 | RJ11 — GPIO |
| Broche 111 | VDD — 3.3V I/O supply |
| Broche 112 | VSS — Ground |
| Broche 113 | RK0 — GPIO |
| Broche 114 | RK1 — GPIO |
| Broche 115 | RK2 — GPIO |
| Broche 116 | RK3 — GPIO |
| Broche 117 | RK4 — GPIO |
| Broche 118 | RK5 — GPIO |
| Broche 119 | RK6 — GPIO |
| Broche 120 | RK7 — GPIO |
| Broche 121 | VDD — 3.3V I/O supply |
| Broche 122 | VSS — Ground |
| Broche 123 | USB_DP — USB D+ differential data |
| Broche 124 | USB_DM — USB D- differential data |
| Broche 125 | USB_VBUS — USB VBUS sense |
| Broche 126 | VDD — 3.3V I/O supply |
| Broche 127 | VSS — Ground |
| Broche 128 | CAN_TX — CAN transmit |
| Broche 129 | CAN_RX — CAN receive |
| Broche 130 | VDD — 3.3V I/O supply |
| Broche 131 | VSS — Ground |
| Broche 132 | DDR_DQ0 — DDR2 data bit 0 |
| Broche 133 | DDR_DQ1 — DDR2 data bit 1 |
| Broche 134 | DDR_DQ2 — DDR2 data bit 2 |
| Broche 135 | DDR_DQ3 — DDR2 data bit 3 |
| Broche 136 | DDR_DQ4 — DDR2 data bit 4 |
| Broche 137 | DDR_DQ5 — DDR2 data bit 5 |
| Broche 138 | DDR_DQ6 — DDR2 data bit 6 |
| Broche 139 | DDR_DQ7 — DDR2 data bit 7 |
| Broche 140 | VDD — 3.3V I/O supply |
| Broche 141 | VSS — Ground |
| Broche 142 | DDR_CK — DDR2 clock |
| Broche 143 | DDR_CKE — DDR2 clock enable |
| Broche 144 | DDR_CS — DDR2 chip select |
| Broche 145 | DDR_RAS — DDR2 row address strobe |
| Broche 146 | DDR_CAS — DDR2 column address strobe |
| Broche 147 | DDR_WE — DDR2 write enable |
| Broche 148 | VDD — 3.3V I/O supply |
| Broche 149 | VSS — Ground |
| Broche 150 | PMA0 — Parallel Master Port address bit 0 |
| Broche 151 | PMA1 — Parallel Master Port address bit 1 |
| Broche 152 | PMA2 — Parallel Master Port address bit 2 |
| Broche 153 | PMA3 — Parallel Master Port address bit 3 |
| Broche 154 | PMA4 — Parallel Master Port address bit 4 |
| Broche 155 | PMA5 — Parallel Master Port address bit 5 |
| Broche 156 | PMA6 — Parallel Master Port address bit 6 |
| Broche 157 | PMA7 — Parallel Master Port address bit 7 |
| Broche 158 | VDD — 3.3V I/O supply |
| Broche 159 | VSS — Ground |
| Broche 160 | PMD0 — Parallel Master Port data bit 0 |
| Broche 161 | PMD1 — Parallel Master Port data bit 1 |
| Broche 162 | PMD2 — Parallel Master Port data bit 2 |
| Broche 163 | PMD3 — Parallel Master Port data bit 3 |
| Broche 164 | PMD4 — Parallel Master Port data bit 4 |
| Broche 165 | PMD5 — Parallel Master Port data bit 5 |
| Broche 166 | PMD6 — Parallel Master Port data bit 6 |
| Broche 167 | PMD7 — Parallel Master Port data bit 7 |
| Broche 168 | VDD — 3.3V I/O supply |
| Broche 169 | VSS — Ground |
| Broche 170 | LCD_VSYNC — TFT vertical sync |
| Broche 171 | LCD_HSYNC — TFT horizontal sync |
| Broche 172 | LCD_PCLK — TFT pixel clock |
| Broche 173 | LCD_DE — TFT data enable |
| Broche 174 | VDD — 3.3V I/O supply |
| Broche 175 | VSS — Ground |
| Broche 176 | EPAD — Exposed thermal pad - tie to VSS |
Applications typiques
PIC32MZ1025DAL176-I/2J convient pour 6 applications: Industrial HMI Touch Panel, Automotive Dashboard Cluster Display, Home Automation Touchscreen Controller, Medical Instrument Display, Point-of-Sale Terminal, Smart Appliance User Interface.
Industrial HMI Touch Panel
The PIC32MZ1025DAL176-I/2J is purpose-built for industrial HMI touch panels running WQVGA/WVGA TFT displays. Its integrated Graphics Controller + 2D Graphics Processor drives 24-bit color panels without external graphics memory, while the on-chip DDR2 controller provides 200MHz bandwidth to sustain full-screen refreshes. The 12-bit 18 MSPS ADC with up to 45 analog inputs directly digitizes 4-wire resistive touchscreens, eliminating an external touch controller. With 1MB Flash and 640KB SRAM, designers can host LVGL or Microchip MPLAB Harmony graphics stacks for rich industrial UIs.
Recommandé
Automotive Dashboard Cluster Display
The PIC32MZ1025DAL176-I/2J (or its V-temperature sibling) drives automotive instrument cluster TFT displays with animated gauges and warning indicators. The 200MHz MIPS32 microAptiv core sustains 30+ FPS rendering of needle animations and menu transitions, while Hi-Speed USB enables CarPlay/AndroidAuto auxiliary channels and CAN 2.0B integrates directly with the vehicle bus. Designers select the PIC32MZ1025DAR176-V/2J (V grade) to extend the operating range to +105C for cabin-mounted clusters. The 176-LQFP package is industry-standard for cluster ECUs.
Recommandé
Home Automation Touchscreen Controller
The PIC32MZ1025DAL176-I/2J is an excellent host for smart-home touchscreen controllers where a single MCU replaces an MCU-plus-graphics-chip stack. Its integrated Graphics Controller drives 4.3-inch to 7-inch capacitive touch TFTs over RGB, while Hi-Speed USB and CAN serve as bridges to Zigbee/BLE gateways and HVAC buses. With 1MB Flash storing the asset pipeline and 640KB SRAM caching rendered layers, designers can implement over-the-air (OTA) firmware updates via USB or Ethernet. Power-friendly sleep modes reduce standby below 1mA for always-on wall controllers.
Recommandé
Medical Instrument Display
The PIC32MZ1025DAL176-I/2J drives TFT displays in medical instruments such as portable patient monitors, infusion pumps, and diagnostic readers. The 12-bit 18 MSPS ADC captures up to 45 analog channels from sensor front-ends (ECG, SpO2, temperature) at sampling rates required for accurate waveform display. The Graphics Processor renders real-time waveforms and numeric trends with anti-aliasing. Microchip provides IEC 60730 Class B safety libraries for home medical devices, and the industrial -40C to +85C temperature grade supports clinical environments.
Recommandé
Point-of-Sale Terminal
The PIC32MZ1025DAL176-I/2J hosts POS terminals where the integrated TFT controller drives a 5-inch to 7-inch customer-facing display showing product photos and pricing animations. Hi-Speed USB supports payment-terminal dongles and barcode scanners, while CAN or RS-485 connects to receipt printers and cash drawers. The 640KB SRAM caches graphical content for snappy menu navigation, and the 12-bit ADC reads analog signals from tamper sensors. Industrial temperature rating supports retail refrigeration environments.
Recommandé
Smart Appliance User Interface
The PIC32MZ1025DAL176-I/2J is well-suited for premium appliance user interfaces such as smart ovens, induction cooktops, and washing machines with TFT touchscreens. The Graphics Controller animates temperature curves, cycle progress, and recipe flows without burdening the host MCU. The 12-bit ADC reads multiple analog sensors (temperature, humidity, level) directly. Low-power sleep modes drop consumption below 1mA when the appliance is in standby, extending Energy Star ratings for consumer products.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1025DAL176-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1025DAB176T-I/2J | PIC32MZ1025DAS176T-I/2J | PIC32MZ1025DAR176-V/2J | PIC32MZ2025DAK176-I/2J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP Exposed Pad | 176-LQFP Exposed Pad | 176-LQFP Exposed Pad | 176-LQFP Exposed Pad | 176-LQFP Exposed Pad |
| Core / Architecture | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB (+100%) |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Graphics Subfamily | DAL (mid-range GUI) | DAB (reduced graphics) | DAS (higher-end graphics) | DAR (mid-range GUI) | DAK (higher density) |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +105 C (V grade) | -40 C to +85 C |
| USB / CAN | Hi-Speed USB + CAN 2.0B | Hi-Speed USB + CAN 2.0B | Hi-Speed USB + CAN 2.0B | Hi-Speed USB + CAN 2.0B | Hi-Speed USB + CAN 2.0B |
| Approx 100-piece unit price | $6.67 | $6.20 approx | $7.10 approx | $7.50 approx | $8.40 approx |
Principaux différenciateurs
- Lower cost than the higher-memory 2025 variant (vs PIC32MZ2025DAK176-I/2J)
- Industrial temperature rating standard, automotive upgrade available (vs PIC32MZ1025DAR176-V/2J)
- Mid-range GUI vs lower-cost reduced graphics (vs PIC32MZ1025DAB176T-I/2J)
Notes de conception
The PIC32MZ1025DAL176-I/2J requires a sequenced power-on: the 3.3V rail must ramp within 50ms of the 1.8V core rail. Use an LDO with PG (power-good) feedback for the 1.8V core to ensure proper sequencing. Decoupling requires 100nF ceramic on every VDD/VSS pair, plus 10uF bulk on the 3.3V and 1.8V rails. DDR2 supply requires an additional 100nF + 10uF per the JEDEC DDR2 termination guidelines referenced in the Microchip schematic checklist.
Estimated: the 176-LQFP exposed-pad package has a junction-to-ambient thermal resistance (theta_JA) of approximately 28 C/W on a 4-layer JEDEC test board. At 200MHz full load, internal core dissipation can reach 0.5W to 0.8W, raising junction temperature by 14-22 C above ambient. For applications near 85 C ambient, ensure the exposed pad is soldered to a copper pour of at least 1 square inch on top layer and stitched with thermal vias to inner ground planes.
Route the DDR2 interface with controlled impedance (50-ohm single-ended, 100-ohm differential for clock). Match trace lengths within 25 mil for the byte lane. The graphics controller outputs (LCD_PCLK, HSYNC, VSYNC, DE) and RGB data lines require length matching of 50 mils to avoid skew artifacts on the TFT panel. The Hi-Speed USB DP/DM lines require 90-ohm differential routing with no stubs.
Do not exceed the maximum 3.3V I/O voltage on any pin rated for 5V tolerance. The DDR2 controller requires initialization code in the bootloader - leaving it uninitialized will cause bus contention on power-up. The Graphics Controller reset pin must be released only after the 1.8V core rail is stable, or the panel will not enumerate correctly.
Informations de conformité
RoHS compliant per Microchip product page. Industrial temperature grade; for automotive choose the V-temperature PIC32MZ1025DAR176-V/2J variant. AEC-Q100 not specifically qualified on this I-grade SKU.
