RTAX2000SL-CGS624E - 2M-Gate Rad-Tolerant FPGA CGA-624 | Microchip
N.º da peça: RTAX2000SL-CGS624E ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
RTAX2000SL-CGS624E Visão geral
A radiation-tolerant FPGA is a field programmable gate array qualified to survive the total ionizing dose (TID) and single-event effects (SEE) found in orbital and deep-space radiation environments. Within the power hierarchy of programmable logic, the RTAX-S/SL family sits above commercial FPGAs in robustness while being based on the proven Microsemi Axcelerator commercial architecture, giving space designers a flight-proven, single-chip programmable fabric.
Key features include 2M system gates of CMOS anti-fuse fabric, 21,504 CLBs, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic. Live-at-power-up operation means the configured design is functional immediately when power is applied - a critical property for spacecraft that cannot tolerate configuration boot delays or configuration-memory upsets.
Technically, the RTAX2000SL is one-time programmable (OTP): the anti-fuse interconnect is permanently set during programming, which eliminates configuration memory SEU vulnerability, a key advantage over SRAM-based FPGAs in orbit. The SL variant adds SEU-hardened flip-flop enhancements over the base RTAX2000S. The family scales to four million equivalent system gates, and designs can be prototyped on the equivalent commercial Axcelerator devices using a documented migration flow, or emulated with Aldec ACT-H3Ki-CG624 adaptors that mimic the CG624 footprint.
Typical applications include satellite payload data processing, spacecraft bus control and telemetry, communication transponder digital baseband, and space science instrument interface logic - anywhere reprogrammability at the design stage plus radiation tolerance in flight are required together.
A key design consideration: the CGA-624 ceramic package requires a matching 624-pad PCB footprint and column-grid soldering process; verify board layout against the manufacturer datasheet package drawing before release.
This page synthesizes verified distributor data, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing tiers to follow as distributor quotes are confirmed.
Alternativas drop-in para RTAX2000SL-CGS624E — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com RTAX2000SL-CGS624E (mesmo formato e footprint) — diferindo em Package, Configuration, Embedded Memory, Equivalent System Gates, Programming Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
RTAX2000SL-1CGS624E
✅ Drop-In✓ Em estoque
$10750 / unidade
Ver ficha técnica →RTAX2000S-CGS624E
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
RTAX2000S-CGS624
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
RTAX2000SL-CGS624V
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6500 / unidade
Ver ficha técnica →RTAX2000S-1CGS624EV
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3600 / unidade
Ver ficha técnica →RTAX2000SL-CGS624E Classificações máximas e características elétricas
| Logic Elements / CLBs | 21504 CLBs |
| Equivalent System Gates | 2000000 gates |
| Additional ASIC Gates | 250000 gates |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs |
| Technology | CMOS, anti-fuse OTP |
| Radiation Tolerance | Radiation-tolerant (space-flight grade) |
| Encapsulamento | CBGA624 / CGA-624 ceramic column grid array |
| Tipo de montagem | Surface Mount |
| Configuration | Live at power-up, one-time programmable |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Carry logic |
Guia de Configuração de Pinos do RTAX2000SL-CGS624E cbga624 / cga-624 ceramic column grid array
Configuração de pinos para RTAX2000SL-CGS624E (pacote cbga624 / cga-624 ceramic column grid array). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para RTAX2000SL-CGS624E.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
RTAX2000SL-CGS624E é adequado para 6 aplicaçãos: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Communication Transponder Digital Baseband, Space Science Instrument Interfaces, Launch Vehicle and Avionics Logic, RTAX Prototyping and Emulation Flow.
Satellite Payload Data Processing
The RTAX2000SL-CGS624E fits payload signal-processing chains where 2,000,000 system gates and 21,504 CLBs absorb FIR filters, FFT engines, and framing logic implemented with the fabric's carry-logic arithmetic support. Embedded SRAM blocks with built-in FIFO control logic buffer data between acquisition front-ends and downlink formatters without external memory. Because the anti-fuse fabric has no configuration memory to upset, and the SL flip-flops add SEU hardening, the device sustains data throughput through the radiation environment of LEO, MEO, and GEO orbits. Live-at-power-up configuration removes boot delay, so the payload begins processing immediately at eclipse exit or reset. Designers prototype on the equivalent Axcelerator commercial device, then migrate the identical netlist to flight silicon.
Recomendado
Spacecraft Bus Control and Telemetry
Housekeeping controllers, mode-management state machines, and telemetry encoders map efficiently into the RTAX2000SL-CGS624E's segmented clock domains and chip-wide highway routing, which isolate the low-rate bus logic from payload timing. The segmentable clocking lets designers run a conservative bus clock while payload sections run faster, easing static timing closure on a non-reprogrammable part. Because OTP anti-fuse programming is permanent, the live-at-power-up behavior guarantees the bus controller is functional from the first power cycle after launch-separation events. Embedded FIFO-capable SRAM collects sensor telemetry before serial downlink. The CGA-624 ceramic package provides the hermeticity and mechanical robustness required for launch vibration and thermal cycling in space-flight housings.
Recomendado
Communication Transponder Digital Baseband
Transponder modulators, demodulator front-ends, and framing layers use the RTAX2000SL-CGS624E's 21,504 CLBs and carry-logic chains for matched filters, scramblers, and Reed-Solomon or convolutional coding support. Embedded SRAM with FIFO control implements elastic buffers between the continuous-symbol domain and burst-formatted uplink/downlink frames. The 2M-gate density accommodates multiple simultaneous channels within one single-chip device, reducing board count and radiation-sensitive component inventory. SL flip-flop SEU hardening reduces triple-modular-redundancy overhead versus unhardened fabric, freeing gates for payload functions. Designs verified on the commercial Axcelerator counterpart port unchanged, protecting schedule since functional verification is completed before committing OTP flight parts.
Recomendado
Space Science Instrument Interfaces
Imagers, spectrometers, and particle detectors require custom glueless interfaces that the RTAX2000SL-CGS624E implements with 2M gates of user fabric and embedded FIFO SRAM for high-rate data capture. Instrument timing generators built from segmented clock domains deliver deterministic exposure and readout sequences, while live-at-power-up logic ensures acquisition begins at instrument turn-on without a configuration controller. The one-time-programmable anti-fuse fabric eliminates the configuration-memory upset risk that SRAM FPGAs face in high-radiation science orbits, and SL SEU-hardened registers protect counters and state machines. The CGA-624 hermetic ceramic package suits instrument electronics boxes with conformal coating and thermal-cycle requirements typical of scientific missions.
Recomendado
Launch Vehicle and Avionics Logic
Stage-separation sequencing, telemetry acquisition, and safety-critical command decoding benefit from the RTAX2000SL-CGS624E's deterministic, configuration-free startup: the anti-fuse fabric is functional the instant power arrives, with no boot firmware that could be corrupted by vibration-induced connectors or radiation. 21,504 CLBs provide capacity for redundant two-out-of-three voting logic implemented with SL SEU-hardened flip-flops. Segmentable clocks keep safety logic on an independent conservative timing domain from mission logic. The ceramic CGA-624 package tolerates the shock and thermal profiles of launch environments better than plastic packaging. Engineers close timing on the equivalent Axcelerator device first, then transfer the frozen design to OTP flight silicon for final integration.
Recomendado
RTAX Prototyping and Emulation Flow
Because RTAX-S/SL devices are one-time programmable, Microchip's documented methodology targets the equivalent commercial Axcelerator-class device - such as the A3PE3000 ProASIC3E family - for functional verification, with Actel Extender boards mapping the commercial package to the RTAX-S footprint for board-level reuse. Aldec's ACT-H3Ki-CG624 adaptor goes further: its BGA balls mimic the CG624 footprint so a reprogrammable flash-based A3PE3000 assembles directly in the RTAX chip's place on the target PCB. This flow lets teams debug RTL, exercise interfaces, and regress firmware repeatedly before committing the RTAX2000SL-CGS624E, protecting expensive OTP flight units and preserving the program schedule.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para RTAX2000SL-CGS624E — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | RTAX2000SL-1CGS624E | RTAX2000S-CGS624E | RTAX2000S-CGS624 |
|---|---|---|---|---|
| Package | CGA-624 (CBGA624) ceramic | CGA-624 - same | CGA-624 - same | CGA-624 - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| CLBs | 21,504 | 21,504 | 21,504 | 21,504 |
| SEU-Hardened Flip-Flops (SL) | Yes | Yes | No | No |
| Speed Grade | Standard | -1 (faster) | Standard | Standard |
| Configuration | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up |
| Pin-to-Pin Compatibility | Reference | Pin-to-pin identical | Pin-to-pin identical | Pin-to-pin identical |
Principais diferenciais
- SEU-hardened flip-flops in SL variant (vs RTAX2000S-CGS624E)
- Standard speed grade cost option (vs RTAX2000SL-1CGS624E)
- Radiation-tolerant OTP anti-fuse fabric (vs A3PE3000-FGG896)
Notas de projeto
The CGA-624 ceramic column grid array uses solder columns, not plain BGA balls; the PCB land pattern must follow the package drawing in the Microchip RTAX-S/SL datasheet (rtaxs_ds2169), not a generic BGA-624 footprint. Column pitch, pad diameter, and via-in-pad rules differ from PBGA, and stencil aperture design should account for column collapse during reflow. Verify board warpage limits across the 624-column array over the mission thermal cycle range before releasing the footprint.
RTAX-S/SL devices are one-time programmable - any design change after programming requires a new device. Complete full functional verification on the commercial Axcelerator counterpart (e.g., A3PE3000) or on an Aldec ACT-H3Ki-CG624 CG624-footprint emulation adaptor before committing flight silicon. Reserve timing margin on the standard speed grade; if static timing analysis shows less than roughly 10% slack, move to the RTAX2000SL-1CGS624E '-1' speed grade, which is pin-compatible.
Use the family's segmentable clock resources to isolate safety- or bus-rate logic from high-speed payload domains, reducing simultaneous-switching noise across the 624-ball interface. Employ the chip-wide highway routing for global signals rather than general fabric routing to preserve timing predictability. Derate I/O drive and account for board-level crosstalk on high-parallelism data buses typical of 2M-gate designs; simulate SSO cases with maximum simultaneous outputs per the datasheet electrical tables.
Informações de conformidade
Space-flight-grade device; compliance status not stated in provided web data. Verify QML class (Q/V) screening and environmental declarations with Microchip for flight lots.
