RTAX2000SL-1CGS624E - 2M-Gate Rad-Tolerant FPGA CGA624 | Microchip
MPN: RTAX2000SL-1CGS624E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12950 | $12,950.00 |
| 10 | $12400 | $124,000.00 |
| 100 | $11800 | $1,180,000.00 |
| 500 | $11250 | $5,625,000.00 |
| 1,000 | $10750 | $10,750,000.00 |
Drop-in alternatives for RTAX2000SL-1CGS624E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000SL-1CGS624EV
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View Datasheet →RTAX2000SL-1CGS624V
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View Datasheet →RTAX2000SL-CGS624E
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View Datasheet →RTAX2000S-1CG624PROTO
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View Datasheet →RTAX250S-CG624E
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View Datasheet →RTAX250SL-CG624B
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$3950 / Unit
View Datasheet →RTAX2000SL-1CGS624E Maximum Ratings & Electrical Characteristics
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 2000000 |
| Additional ASIC Gates | 250000 |
| Configurable Logic Blocks (CLBs) | 21504 |
| Technology | CMOS, 0.15 um |
| Core Supply Voltage | 1.5 V |
| Maximum Combinatorial Performance | 649 MHz |
| Speed Grade | -1 |
| Package | CBGA624 / CGA-624 Ceramic Column Grid Array |
| Package Material | Ceramic |
| Programming Technology | Anti-fuse, one-time programmable, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified family) |
| Mounting Type | Surface Mount |
RTAX2000SL-1CGS624E ceramic Pin Configuration Guide
Complete pinout information for RTAX2000SL-1CGS624E (ceramic package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000SL-1CGS624E.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000SL-1CGS624E is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Onboard Data Handling, Scientific Instrument Front Ends, Telemetry and Telecommand (TM/TC) Interfaces, Launch Vehicle and Avionics Logic, Deep-Space Probe Instrumentation and Ranging.
Satellite Payload Data Processing
The RTAX2000SL-1CGS624E fits satellite payload data-path processing because it provides 2,000,000 equivalent system gates and 21,504 CLBs of logic with embedded SRAM blocks that include built-in FIFO control logic, letting engineers implement channelizers, encoders, and frame formators in a single chip. Its anti-fuse configuration is immune to single-event upsets in the configuration memory, eliminating the scrubbing overhead that SRAM FPGAs require in orbit. Typical implementations clock the fabric at 100-649 MHz depending on speed grade, with the -1 grade selected for tight timing closure on high-throughput links. Because the device is live-at-power-up with no external configuration PROM, payload cold-start reliability improves and board area shrinks. The trade-off is one-time programmability: the bitstream must be fully verified before programming flight silicon, so reprogrammable prototyping on flash-based devices is standard practice.
Recommended
Spacecraft Bus Control and Onboard Data Handling
For spacecraft bus control, the RTAX2000SL-1CGS624E implements housekeeping interfaces, telemetry/telecommand framing, and power-switching sequencers. The chip-wide highway routing and segmentable clock structure simplify the distribution of low-skew clocks across a distributed control logic design spanning the 21,504 CLBs. Radiation tolerance and live-at-power-up behavior mean the bus controller is operational immediately after separation events or reset, with no configuration load time and no configuration memory to corrupt. The 1.5 V core process supports the low-power budget of smallsat and ESPA-class buses, where every watt of housekeeping overhead matters. Designers typically combine the FPGA with rad-tolerant supervisors and watchdog circuits, and reserve the 250,000 additional ASIC gates for future logic growth. One-time programming requires rigorous simulation sign-off, including corner-case reset and safe-mode state machines, before committing flight parts.
Recommended
Scientific Instrument Front Ends
Scientific instruments on planetary and Earth-observation missions use the RTAX2000SL-1CGS624E to time-stamp, filter, and packetize detector data. The fabric's carry logic supports pipelined arithmetic for matched filters and correlators, while embedded SRAM with FIFO control buffers burst data between acquisition front ends and downlink formatters. Performance up to 649 MHz combinatorial (family maximum) enables direct processing of high-rate detector streams without external glue logic. Radiation tolerance protects against cumulative total ionizing dose across multi-year missions, and the ceramic CGA-624 package withstands launch vibration and thermal cycling better than plastic packages. The main engineering consideration is pin mapping: the 624-ball ceramic footprint fixes I/O allocation early, so instrument interface definitions must be frozen before board layout. Prototyping on reprogrammable adaptors mitigates the anti-fuse one-shot commitment.
Recommended
Telemetry and Telecommand (TM/TC) Interfaces
TM/TC subsystems benefit from the RTAX2000SL-1CGS624E's deterministic, configuration-upset-immune logic implementing CCSDS-style framing, convolutional or LDPC-adjacent lower-complexity coding front ends, and command decoders. With 2M system gates and embedded SRAM FIFOs, the device hosts multiple independent TM/TC channels in one package, reducing component count on the avionics board. Live-at-power-up operation ensures the spacecraft can receive and act upon commands from the moment power is applied, a critical requirement for recovery from safe mode. The -1 speed grade provides timing margin for serial interface bit rates used in command links, which are typically far below the 649 MHz family limit, allowing relaxed pipelining and easier closure. Designers should budget the fixed 1.5 V core supply in the power distribution design and follow Microchip's ceramic CGA assembly guidelines for column solder inspection.
Recommended
Launch Vehicle and Avionics Logic
Launch vehicle avionics and flight-termination-adjacent logic use the RTAX2000SL-1CGS624E where programmable flexibility must coexist with configuration integrity under high vibration and radiation exposure. The anti-fuse fabric retains its configuration permanently, and the ceramic column grid array package provides mechanical robustness for the launch environment. The 21,504-CLB capacity accommodates redundant-voter logic, majority-voting protection, and discrete I/O conditioning in a single device, while carry logic accelerates time-tag generation and GNSS-correlated timing distribution. Because the part is one-time programmable, avionics programs typically freeze the functional specification at PDR, verify exhaustively on the RTAX2000S-1CG624PROTO prototyping variant, and then program the final flight lot. The -1 speed grade timing closure with worst-case temperature and radiation corners should be demonstrated in Libero SoC timing reports before commit.
Recommended
Deep-Space Probe Instrumentation and Ranging
Deep-space probes employ the RTAX2000SL-1CGS624E for ranging correlators, regenerative ranging modules, and instrument sequencing where mission durations of a decade or more demand high total-ionizing-dose endurance. The 250,000 additional ASIC gates and 2M system gates support DSP-style pre-processing that reduces downlink bandwidth, while embedded FIFO-managed SRAM smooths burst data between instruments and the communications subsystem. Single-chip, live-at-power-up operation removes configuration-read failure modes that cannot be serviced after launch. Radiation-tolerant (not fully rad-hard) qualification makes the part appropriate where program radiation requirements are moderate and system-level mitigation (watchdogs, redundant strings) is applied. Layout should respect the CGA-624 thermal design: the ceramic package conducts heat primarily through its columns, so board-level thermal vias under the footprint are recommended for vacuum operation where convection does not exist.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000SL-1CGS624E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-1CGS624EV | RTAX2000SL-CGS624E | RTAX250S-CG624E |
|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | CGA-624 (CBGA624 ceramic) | CGA-624 (CBGA624 ceramic) - same | CGA-624 (CBGA624 ceramic) - same | CGA-624 (CBGA624 ceramic) - same |
| Equivalent System Gates | 2000000 | 2000000 | 2000000 | Lower (RTAX250 density class) |
| CLBs | 21504 | 21504 | 21504 | Lower (RTAX250 density class) |
| Speed Grade | -1 | -1 | Base (standard) | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Programming Technology | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up | Anti-fuse OTP, live at power-up |
| Screening / Flow Suffix | S + E (space screening, extended flow) | S + V variant | S + E | S + E |
| Price (qty 1, as of 2026-09-02) | 12950.00 USD | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest -1 speed grade in the CGS624E package line (vs RTAX2000SL-CGS624E)
- SEU-immune configuration memory (vs A3PE3000 (ProASIC3E))
- Full 2M-gate density on the shared 624-ball footprint (vs RTAX250S-CG624E)
Design Notes
RTAX2000SL-1CGS624E is a one-time-programmable anti-fuse FPGA: a wrong or unverifiable bitstream permanently consumes a flight device worth thousands of dollars. Complete full functional simulation, timing closure at worst-case corners (voltage, temperature, radiation-induced delay shift), and an independent design review before programming. Use the RTAX2000S-1CG624PROTO prototyping variant or Microchip/Aldec's ProASIC3E-based reprogrammable adaptor board to validate the design in real hardware first.
The CGA-624 ceramic column package requires column-specific assembly: define the land pattern per the Microchip package drawing, use column-appropriate stencil apertures, and qualify X-ray or visual inspection for column solder joints, since columns do not self-align like BGA balls. Provide board support during reflow to prevent column bridging under the heavy ceramic body. Verify solder column versus solder ball variant against the exact ordering code before fabricating the board.
Plan the power tree around a 1.5 V core supply plus the specified I/O bank supplies per the RTAX-S/SL datasheet. Estimate core current from Libero SoC power analysis at maximum utilization and toggle rates; do not size regulators from gate count alone. Implement power-up sequencing per the datasheet's supply ramp requirements to guarantee live-at-power-up configuration integrity, and include radiation-tolerant supervisor devices for brown-out protection in orbit.
With up to 649 MHz combinatorial capability, high fan-out clocks and fast I/O edges demand controlled-impedance routing, series termination on fast single-ended outputs, and careful return-path management on the avionics board. Use the RTAX-S/SL I/O attribute settings to soften slew rates where interface speed allows, reducing EMI and crosstalk on cable harnesses typical of spacecraft integration.
Compliance Information
Space-flight ceramic-packaged device qualified per Mil Prf 38535 class Q/V flows per Microchip DLA Cross Reference Guide; RoHS/REACH declarations not present in captured distributor data - request Certificate of Conformance.
