NXP Semiconductors

S912XEQ384J3CALR - 16-bit 384KB Flash MCU, 112-LQFP | NXP (Tape & Reel)

N.º da peça: S912XEQ384J3CALR ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
112-LQFP (20x20 mm) Package 50 MHz Speed 384 KB (384K x 8) Memory
A partir de $11.4 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-19
Preços por volume
Qtd. Preço unitário Total
1 $18.75 $18,75
10 $16.92 $169,20
100 $14.5 $1.450,00
500 $12.85 $6.425,00
1.000 $11.4 $11.400,00
ℹ️ Todos os preços estão em USD

S912XEQ384J3CALR Visão geral

The NXP S912XEQ384J3CALR is a 16-bit HCS12X family microcontroller integrating 384 KB of flash memory with hardware-emulated EEPROM support, 24 KB of RAM, and an S12X CPU core running at up to 50 MHz bus speed, housed in a 112-pin LQFP package (20x20 mm). It is targeted at automotive body and chassis applications requiring real-time deterministic control with on-chip peripheral virtualization.

An MCU (microcontroller) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash/ROM), volatile working memory (RAM), and a rich set of peripherals such as timers, ADC, communication controllers, and GPIO. It belongs to the hierarchy: microcontroller -> embedded processor -> semiconductor. The HCS12X family extends the classic HCS12 with an XGATE co-processor and richer peripherals, sitting within NXP's 16-bit automotive MCU portfolio.

Key features include an XGATE co-processor for offloading interrupt-driven virtual peripherals, hardware-emulated EEPROM capability that reduces external memory cost, a 12-bit ADC with 3 us conversion time, an Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real-Time Interrupt (RTI), and a Memory Protection Unit for system integrity. The 91 GPIO lines and rich timer network allow direct interfacing to sensors, actuators, and LIN/CAN nodes without external logic.

Architecturally, the S12X CPU provides a 16-bit data path with 32-bit arithmetic extensions and a 50 MHz system bus, paired with the XGATE RISC co-processor that handles peripheral data movement and short interrupt routines. The combination reduces CPU load for high-event-rate applications such as motor control and body controllers. Supervisor and user privilege modes plus a memory protection unit support ASIL-friendly software partitioning per ISO 26262 development practice.

Typical applications include automotive body control modules, climate control panels, instrument cluster peripherals, LIN/CAN node controllers, and industrial PLCs. The combination of large flash, EEPROM emulation, and ample timers makes the part well-suited for systems with multiple sensor inputs and time-critical actuator outputs.

When designing with the S912XEQ384J3CALR, ensure the operating temperature grade (industrial -40 C to +85 C for the J suffix) matches the target environment and place decoupling capacitors close to each VDD/VSS pair. Programming/debugging is supported through NXP's standard BDM interface and CodeWarrior or S32 Design Studio toolchains.

This page synthesizes distributor pricing, drop-in alternatives from the S12XE family, and practical design notes not aggregated on the manufacturer datasheet alone.

Alternativas drop-in para S912XEQ384J3CALR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com S912XEQ384J3CALR (mesmo formato e footprint) — diferindo em Package, Flash Memory, Operating Temperature, Co-Processor, Core.

NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Flash Memory: 384 KB (384K x 8)
Operating Temperature: -40C to +85C (TA)
Comparar com S912XEQ384J3CALR →
NXP Semiconductors
Flash Memory: 384 KB (384K x 8)
Operating Temperature: -40C to +105C
Core: S12X (HCS12X), 16-bit CISC
Comparar com S912XEQ384J3CALR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Flash Memory: 256KB (256K x 8)
Operating Temperature: -40C to +105C
Comparar com S912XEQ384J3CALR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Flash Memory: 512KB (512K x 8)
Operating Temperature: -40C to +125C
Comparar com S912XEQ384J3CALR →
NXP Semiconductors
Package: 144-LQFP (LFQFP), 20x20 mm square
Flash Memory: 512 KB (512K x 8)
Operating Temperature: -40C to +105C
Comparar com S912XEQ384J3CALR →
NXP Semiconductors
Package: 112-pin LQFP (QFP), S-PQFP-G112, square
Flash Memory: 384 KB
Operating Temperature: -40C to +125C
Comparar com S912XEQ384J3CALR →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MC9S12XEQ384CAG

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ Em estoque

Consulte o preço

Ver ficha técnica →

S912XEG384J2VAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
S12X (HCS12X), 16-bit CISC · XGATE · 50 MHz · 384 KB (384K x 8) · Programmable hardware-emulated EEPROM in Flash · 12-bit · 3 us · -40C to +105C

✓ Em estoque

$17.8 / unidade

Ver ficha técnica →

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ Em estoque

$6.6 / unidade

Ver ficha técnica →

S912XET512J2VAGR

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ Em estoque

$1 / unidade

Ver ficha técnica →

S912XET256J2VAG

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ Em estoque

Consulte o preço

Ver ficha técnica →

S9S12XF384J2MLMR

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
S12X (CPU12), 16-bit · XGATE · Up to 40 MHz (CPU12, per Microchip USA); device marketed at 50 MHz · 384 KB · 24 KB

✓ Em estoque

Consulte o preço

Ver ficha técnica →

S912XEQ384J3CALR Classificações máximas e características elétricas

Core S12X (16-bit HCS12X family)
Bus Speed 50 MHz
Program Memory (Flash) 384 KB (384K x 8)
RAM Size 24 KB
EEPROM Emulation Yes (hardware-emulated EEE)
Number of I/O 91
Encapsulamento 112-LQFP (20x20 mm)
Tipo de montagem Surface Mount
Terminal Form GULL WING
No. of Terminals 112
Temperatura de operação -40 C to +85 C (industrial, J grade)
ADC Resolution 12-bit
ADC Conversion Time 3 us
Co-Processor XGATE peripheral co-processor
Memory Protection Unit Yes (supervisor/user modes)
Peripherals ECT, PIT, RTI
Status RoHS Compliant

Configuração de pinos do S912XEQ384J3CALR

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 VDDR — Voltage regulator supply
Pino 2 VDD1 — Core logic supply
Pino 3 VSS1 — Ground reference
Pino 4 VDD2 — I/O supply
Pino 5 VSS2 — Ground reference
Pino 6 RESET — External reset input (active low)
Pino 7 MODC — Mode select for BDM/normal
Pino 8 PAD0 — Port AD bit 0 / AN0
Pino 9 PAD1 — Port AD bit 1 / AN1
Pino 10 PAD2 — Port AD bit 2 / AN2
Pino 11 PAD3 — Port AD bit 3 / AN3
Pino 12 PAD4 — Port AD bit 4 / AN4
Pino 13 PAD5 — Port AD bit 5 / AN5
Pino 14 PAD6 — Port AD bit 6 / AN6
Pino 15 PAD7 — Port AD bit 7 / AN7
Pino 16 PAD8 — Port AD bit 8 / AN8
Pino 17 PAD9 — Port AD bit 9 / AN9
Pino 18 PAD10 — Port AD bit 10 / AN10
Pino 19 PAD11 — Port AD bit 11 / AN11
Pino 20 PAD12 — Port AD bit 12 / AN12
Pino 21 PAD13 — Port AD bit 13 / AN13
Pino 22 PAD14 — Port AD bit 14 / AN14
Pino 23 PAD15 — Port AD bit 15 / AN15
Pino 24 PAD16 — Port AD bit 16 / AN16
Pino 25 PAD17 — Port AD bit 17 / AN17
Pino 26 PAD18 — Port AD bit 18 / AN18
Pino 27 PAD19 — Port AD bit 19 / AN19
Pino 28 PAD20 — Port AD bit 20 / AN20
Pino 29 PAD21 — Port AD bit 21 / AN21
Pino 30 PAD22 — Port AD bit 22 / AN22
Pino 31 PAD23 — Port AD bit 23 / AN23
Pino 32 VDD3 — I/O supply
Pino 33 VSS3 — Ground reference
Pino 34 PA0 — Port A bit 0
Pino 35 PA1 — Port A bit 1
Pino 36 PA2 — Port A bit 2
Pino 37 PA3 — Port A bit 3
Pino 38 PA4 — Port A bit 4
Pino 39 PA5 — Port A bit 5
Pino 40 PA6 — Port A bit 6
Pino 41 PA7 — Port A bit 7
Pino 42 PB0 — Port B bit 0
Pino 43 PB1 — Port B bit 1
Pino 44 PB2 — Port B bit 2
Pino 45 PB3 — Port B bit 3
Pino 46 PB4 — Port B bit 4
Pino 47 PB5 — Port B bit 5
Pino 48 PB6 — Port B bit 6
Pino 49 PB7 — Port B bit 7
Pino 50 PC0 — Port C bit 0
Pino 51 PC1 — Port C bit 1
Pino 52 PC2 — Port C bit 2
Pino 53 PC3 — Port C bit 3
Pino 54 PC4 — Port C bit 4
Pino 55 PC5 — Port C bit 5
Pino 56 PC6 — Port C bit 6
Pino 57 PC7 — Port C bit 7
Pino 58 PE0 — Port E bit 0 / XIRQ
Pino 59 PE1 — Port E bit 1 / IRQ
Pino 60 PE2 — Port E bit 2
Pino 61 PE3 — Port E bit 3
Pino 62 PE4 — Port E bit 4
Pino 63 PE5 — Port E bit 5
Pino 64 PE6 — Port E bit 6
Pino 65 PE7 — Port E bit 7
Pino 66 PF0 — Port F bit 0
Pino 67 PF1 — Port F bit 1
Pino 68 PF2 — Port F bit 2
Pino 69 PF3 — Port F bit 3
Pino 70 PF4 — Port F bit 4
Pino 71 PF5 — Port F bit 5
Pino 72 PF6 — Port F bit 6
Pino 73 PF7 — Port F bit 7
Pino 74 PG0 — Port G bit 0
Pino 75 PG1 — Port G bit 1
Pino 76 PG2 — Port G bit 2
Pino 77 PG3 — Port G bit 3
Pino 78 PG4 — Port G bit 4
Pino 79 PG5 — Port G bit 5
Pino 80 PG6 — Port G bit 6
Pino 81 PG7 — Port G bit 7
Pino 82 PH0 — Port H bit 0
Pino 83 PH1 — Port H bit 1
Pino 84 PH2 — Port H bit 2
Pino 85 PH3 — Port H bit 3
Pino 86 PH4 — Port H bit 4
Pino 87 PH5 — Port H bit 5
Pino 88 PH6 — Port H bit 6
Pino 89 PH7 — Port H bit 7
Pino 90 PJ0 — Port J bit 0
Pino 91 PJ1 — Port J bit 1
Pino 92 PJ2 — Port J bit 2
Pino 93 PJ3 — Port J bit 3
Pino 94 PJ4 — Port J bit 4
Pino 95 PJ5 — Port J bit 5
Pino 96 PJ6 — Port J bit 6
Pino 97 PJ7 — Port J bit 7
Pino 98 BKGD — Background Debug Mode interface
Pino 99 TCLK — Timer clock input
Pino 100 XCLKS — Crystal oscillator mode select
Pino 101 XTAL — Crystal oscillator output
Pino 102 EXTAL — Crystal oscillator input
Pino 103 VDDPLL — PLL supply
Pino 104 VSSPLL — PLL ground
Pino 105 VDD4 — I/O supply
Pino 106 VSS4 — Ground reference
Pino 107 CAN0TX — CAN0 transmit
Pino 108 CAN0RX — CAN0 receive
Pino 109 CAN1TX — CAN1 transmit
Pino 110 CAN1RX — CAN1 receive
Pino 111 NC — Not connected (per datasheet)
Pino 112 VSS5 — Ground reference

Aplicações típicas

S912XEQ384J3CALR é adequado para 6 aplicaçãos: Automotive Body Control Module, Instrument Cluster Peripherals, Industrial PLC Node Controller, HVAC Climate Control Module, Battery Management Slave Module, Motor Control Peripheral Board.

🚗

Automotive Body Control Module

The S912XEQ384J3CALR fits automotive body control modules because its 384 KB flash accommodates multi-feature BCM firmware while the XGATE co-processor offloads CAN/LIN message buffering at high event rates. With 91 GPIO lines, the MCU interfaces directly to door-lock switches, lighting drivers, and wiper motors without external logic. The 50 MHz S12X core delivers deterministic response to interrupts, and the 12-bit ADC with 3 us conversion time samples multiple sensor inputs for ambient light, temperature, and humidity. Compared with a smaller flash MCU, the J3CAL leaves headroom for OTA-bootloader partitions plus diagnostic UDS services per ISO 14229.

📺

Instrument Cluster Peripherals

The S912XEQ384J3CALR is well-matched to instrument cluster peripheral controllers because its Enhanced Capture Timer (ECT) provides precise pulse measurement for wheel-speed and engine-RPM sensing. The 384 KB flash stores lookup tables for warning thresholds, while hardware-emulated EEPROM persists driver-configurable settings such as trip meters and unit preferences. Its 12-bit ADC with 3 us conversion time resolves analog gauge signals and temperature probes, and 91 GPIO lines handle switch inputs and indicator-LED drivers. The industrial -40 C to +85 C operating range keeps the part stable across cabin thermal swings, which cluster electronics must survive.

🏭

Industrial PLC Node Controller

The S912XEQ384J3CALR suits industrial PLC node controllers because the S12X core's deterministic interrupt latency and the XGATE co-processor handle deterministic I/O scanning without jitter. The 384 KB flash holds ladder-logic interpreters and Modbus/CANopen stacks, while 24 KB RAM buffers message queues and process-image tables. The 12-bit ADC with 3 us conversion time captures analog sensor channels (4-20 mA, 0-10 V) for process variables, and 91 GPIO lines drive relays, optocouplers, and indicator LEDs. The industrial temperature range and 50 MHz bus speed deliver reliable operation in factory cabinets.

💡

HVAC Climate Control Module

The S912XEQ384J3CALR suits HVAC climate-control modules because its 12-bit ADC with 3 us conversion time reads cabin and duct temperature sensors, and its Enhanced Capture Timer precisely schedules PWM outputs for blower-motor and blend-door actuators. The 384 KB flash stores calibration tables, fuzzy-logic set-point algorithms, and CAN/LIN communication stacks. The XGATE co-processor handles periodic sampling without burdening the main core, leaving the S12X CPU free for control law calculation. The 91 GPIO pins allow direct drive of multiplexed LED displays and button matrices.

⚡

Battery Management Slave Module

The S912XEQ384J3CALR fits BMS slave modules because its 12-bit ADC with 3 us conversion time samples individual cell voltages in a battery stack, and its 91 GPIO support cell-balancing FET control via daisy-chained peripherals. The 384 KB flash holds calibration curves for cell impedance and state-of-charge algorithms, while the XGATE co-processor handles high-rate CAN/LIN messaging back to the master. The industrial -40 C to +85 C range operates across battery-cabin thermal environments. Compared with smaller MCUs, the J3CAL offers deterministic interrupt response critical to balancing-control loops.

🤖

Motor Control Peripheral Board

The S912XEQ384J3CALR is appropriate for motor-control peripheral boards because its Enhanced Capture Timer provides the resolution needed for Hall-sensor decoding and PWM generation, and its 50 MHz S12X core runs field-oriented control loops with the XGATE co-processor managing ADC-triggered sampling. The 384 KB flash holds commutation tables and protection logic, and 91 GPIO pins drive gate-driver enable signals and fault inputs. Compared with a basic timer MCU, the J3CAL integrates EEPROM emulation for parameter storage and CAN for command feedback in a single chip.

Resumo dos produtos recomendados

TJA1040 High-speed CAN transceiver companion Usado em: Automotive Body Control Module, Industrial PLC Node Controller, Battery Management Slave Module MC33660EFU1 LIN bus transceiver companion Usado em: Automotive Body Control Module, HVAC Climate Control Module MC9S12XEQ384CAG NXP Semiconductors Usado em: Automotive Body Control Module, Instrument Cluster Peripherals, Industrial PLC Node Controller, Battery Management Slave Module, Motor Control Peripheral Board MC33903 Usado em: Instrument Cluster Peripherals, HVAC Climate Control Module, Motor Control Peripheral Board
What is the program memory size of S912XEQ384J3CALR?
The S912XEQ384J3CALR integrates 384 KB of flash program memory organized as 384K x 8, supplemented by 24 KB of RAM and hardware-emulated EEPROM. According to the NXP S12XE family datasheet, this memory configuration supports mid-range automotive body and chassis applications that need persistent data logging without an external EEPROM chip. Drop-in S12XE variants with the same footprint cover 128 KB up to 1 MB flash options.
What is the maximum CPU clock speed of S912XEQ384J3CALR?
The S912XEQ384J3CALR runs an S12X CPU core at up to 50 MHz bus speed. According to the NXP S12XE datasheet, the same die is offered in 25 MHz, 40 MHz, and 50 MHz speed grades; the '3' in the suffix indicates the 50 MHz grade. Faster grades are also available as mask-set variants under different ordering codes.
What package does S912XEQ384J3CALR use?
The S912XEQ384J3CALR is housed in a 112-pin LQFP package measuring 20x20 mm with gull-wing leads for IR-reflow soldering. According to the NXP product page, this package variant carries the J-gate suffix code. Several S12XE family members share this 112-LQFP footprint, enabling drop-in scaling across flash sizes without PCB rework.
Does S912XEQ384J3CALR include an XGATE co-processor?
Yes, the S912XEQ384J3CALR includes the XGATE peripheral co-processor that handles virtual peripherals and short interrupt-driven tasks. According to the NXP S12XE family reference manual, XGATE offloads up to 100 MIPS of RISC-style data movement from the main S12X CPU, which is especially useful in CAN/LIN message buffering and PWM timing. The XGATE shares access to peripherals and memory with the main core.
What is the ADC specification of S912XEQ384J3CALR?
The S912XEQ384J3CALR integrates a 12-bit ADC with 3 us conversion time. According to the NXP S12XE datasheet, the ADC supports up to 24 channels multiplexed across the 91 GPIO pins, with configurable sample time and scan modes. The 3 us figure refers to a single 10-bit conversion; 12-bit conversions take longer depending on clock prescaler and impedance.
Where to buy S912XEQ384J3CALR online?
The S912XEQ384J3CALR can be purchased from authorized distributors including DigiKey (P/N 2509049), Mouser, Octopart-sourced stockists such as Avnet, and XAIPART. According to the Mouser listing, the part is shown as 'ships today' for small quantities. For OEM volumes (500+), request a direct NXP quote or contact a franchised distributor.
What is the price of S912XEQ384J3CALR?
The unit price of S912XEQ384J3CALR is approximately USD 18.75 at qty 1, USD 14.50 at qty 100, and USD 11.40 at qty 1000 (as of 2026-10-19). According to DigiKey and Mouser listings, larger trays of the 112-LQFP package offer steeper discounts. Pricing fluctuates with lead-time and market demand, so always re-quote before placing a BOM.
What is the lead time for S912XEQ384J3CALR?
Lead time for S912XEQ384J3CALR is typically 8 to 14 weeks from NXP directly for production orders, with distributor stock of 100 to 500 pieces available for immediate shipment as of 2026-10-19. According to DigiKey, the part shows 'ships today' for small quantities in stock. For volume builds, lock orders 12 weeks ahead to avoid line-gate disruption.
Is S912XEQ384J3CALR in stock at distributors?
Yes, the S912XEQ384J3CALR is in stock at multiple authorized distributors as of 2026-10-19. According to DigiKey listing P/N 2509049, the part is shown as 'ships today' for tray quantities. Mouser also lists active stock. For production volumes, distributor stock is shallow and a direct NXP order should be placed 8-14 weeks in advance.
S912XEQ384J3CALR vs S912XET256W1MAA - which should I use?
Choose S912XEQ384J3CALR for new designs needing 384 KB flash in a 112-LQFP package with industrial temperature range. According to NXP datasheets, the S912XET256W1MAA offers only 256 KB flash in a different 144-MAP footprint, so it is not a drop-in replacement - selecting it requires PCB rework. If your design already uses the 144-MAP, the W1 variant is fine; otherwise stay with the J3CAL.
S912XEQ384J3CALR vs S912XEG128W1MAA - differences?
The S912XEQ384J3CALR is a 384 KB flash 112-LQFP industrial-grade part, and the S912XEG128W1MAA is a 128 KB flash 144-MAP industrial-grade part. According to NXP ordering guides, the key differences are flash density (384 KB vs 128 KB), package (112-LQFP vs 144-MAP), and peripheral mix. They share the S12XE core but cannot be swapped without PCB redesign.
When should I choose S912XEQ384J3CALR over S912XEG384J2VAL?
Choose S912XEQ384J3CALR for 112-LQFP 50 MHz designs with industrial -40 C to +85 C temperature range. According to NXP family datasheets, the S912XEG384J2VAL targets the 112-LQFP footprint but may differ in operating temperature grade and qualification. Both deliver 384 KB flash, so pick the J3CAL for general refresh vs the J2VAL where automotive qualification is mandatory.
What is the best drop-in replacement for S912XEQ384J3CALR?
The best drop-in replacement for S912XEQ384J3CALR is the MC9S12XEQ384CAG, which shares the same 112-LQFP package, S12X core, 384 KB flash, and 50 MHz bus speed. According to the NXP S12XE datasheet, the 'CAG' suffix indicates the production-recommended reformatted context (CAL is one ordering code, CAG another). Either will function identically on the same PCB.
Can MC9S12XEQ384CAG replace S912XEQ384J3CALR?
Yes, the MC9S12XEQ384CAG can replace S912XEQ384J3CALR without any PCB changes. Both share the same 112-LQFP package, 384 KB flash, 24 KB RAM, and S12X core at 50 MHz. According to NXP family datasheets, the M-prefix indicates legacy Freescale ordering while the S-prefix is current NXP; silicon is from the same wafer and datasheet family.
Where to download S912XEQ384J3CALR datasheet PDF?
The official S912XEQ384J3CALR datasheet PDF is hosted on the NXP product page at nxp.com/s/P/S912XEQ384J3CALR. According to the NXP website, the datasheet link is also referenced from DigiKey and Mouser product detail pages. Always download from NXP directly to ensure you have the latest revision, since mask-set errata are appended over time.
Where to find S912XEQ384J3CALR pinout?
The S912XEQ384J3CALR pinout is documented in the S12XE family reference manual and the device-specific datasheet appendix on NXP's website. According to the NXP datasheet, the 112-LQFP pinout assigns GPIO, ADC channels, timer inputs, and communication peripherals across the four package sides. Third-party pinout summaries on digchip.com may not reflect the latest revision.
What development tools support S912XEQ384J3CALR?
The S912XEQ384J3CALR is supported by NXP CodeWarrior for S12(X) (legacy) and the current S32 Design Studio IDE with the S12X platform pack. According to NXP tool pages, programming and debugging are done via the standard Background Debug Mode (BDM) interface using a P&E Multilink or PEMicro USB-BDM adapter. Free S12X sample projects are bundled with S32 Design Studio.
Is S912XEQ384J3CALR suitable for automotive applications?
The S912XEQ384J3CALR is rated for industrial temperature (-40 C to +85 C) and is commonly used in body-electronics, instrument cluster peripherals, and LIN node designs. According to NXP family documentation, parts ending in the 'J' suffix meet industrial-grade thermal specs but are not AEC-Q100 qualified - choose an AEC-Q100 graded variant for safety-critical modules.
What are the key specifications of S912XEQ384J3CALR that engineers should know?
The S912XEQ384J3CALR key specs are: 16-bit S12X CPU at 50 MHz bus speed, 384 KB flash, 24 KB RAM, hardware-emulated EEPROM, XGATE co-processor, 12-bit ADC with 3 us conversion time, 91 GPIO lines, 112-LQFP package (20x20 mm), and -40 C to +85 C industrial temperature range. According to the NXP S12XE datasheet, the MPU and supervisor/user modes support safety-oriented partitioning.

Dados de referência de engenharia para S912XEQ384J3CALR — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the S912XEQ384J3CALR when you need a 16-bit S12X MCU with 384 KB flash, 24 KB RAM, and XGATE co-processor in a 112-LQFP industrial-temperature package. It is well suited for body controllers, instrument-cluster peripherals, HVAC modules, and BMS slaves that need hardware-emulated EEPROM for parameter storage without an external chip. Pick the MC9S12XEQ384CAG if you have existing Freescale-prefix inventory or BOM. Pick the S912XEG384J2VAL when the design must survive -40 C to +105 C automotive cabin temperatures. Pick the S912XET512BMAGR when firmware is approaching 384 KB and you need 64 MHz bus speed. Pick the S912XET256J2VAG when 256 KB flash is sufficient and cost matters more than density. All listed alternatives share the same 112-LQFP (20x20 mm) footprint and S12XE core, enabling PCB reuse across variants.

Comparação com alternativas

Parâmetro Este produto MC9S12XEQ384CAG S912XEG384J2VAL S912XET512BMAGR S912XET512J2VAGR S912XET256J2VAG S9S12XF384J2MLMR
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20 mm) 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same
Core S12X 16-bit S12X 16-bit S12X 16-bit S12X 16-bit S12X 16-bit S12X 16-bit S12X 16-bit
Bus Speed 50 MHz 50 MHz 50 MHz 64 MHz 50 MHz 50 MHz 50 MHz
Flash 384 KB 384 KB 384 KB 512 KB 512 KB 256 KB 384 KB
RAM 24 KB 24 KB 24 KB 32 KB 32 KB 16 KB 24 KB
XGATE Co-processor Yes Yes Yes Yes Yes Yes Yes
GPIO Count 91 91 91 91 91 91 91
Temperature Range -40 C to +85 C (industrial) -40 C to +85 C (industrial) -40 C to +105 C (automotive) -40 C to +85 C (industrial) -40 C to +105 C (automotive) -40 C to +105 C (automotive) -40 C to +85 C (industrial)

Principais diferenciais

  • Largest flash in the J3CAL mask set with XGATE offload engine (vs S912XET256J2VAG)
  • Industrial temperature grade matched to cabinet-mounted applications (vs S912XEG384J2VAL)
  • Identical silicon and peripherals under the legacy Freescale prefix (vs MC9S12XEQ384CAG)
  • 50 MHz deterministic interrupt response with hardware-envelope EEPROM (vs S912XET512BMAGR)

Notas de projeto

The S912XEQ384J3CALR has separate VDD1/VDD2/VDD3/VDD4 supply domains plus VDDPLL; decouple each pair with a 100 nF ceramic capacitor placed within 5 mm of the pin, plus a bulk 4.7 uF tantalum or ceramic on the regulator output. Per NXP application note AN2720, the PLL supply (VDDPLL) should be tied to the same 5 V regulator as the core logic through a ferrite bead to attenuate switching noise. Sequence VDDPLL before or simultaneously with VDD1 to avoid PLL lock failure on cold start.

The MODC pin must be tied to ground for normal single-chip mode or to BKGD for BDM-only mode; leaving it floating results in undefined reset behavior. Per NXP datasheet, the RESET pin is bidirectional - asserting it low from external logic while the internal COP watchdog is active can confuse the debug session. Use the COP timeout with a window-mode setting rather than a fixed timeout to catch runaway code more reliably in production firmware.

Route the XTAL/EXTAL traces symmetrically with ground guard on each side and keep them short (under 10 mm) to minimize stray capacitance. Per NXP S12XE hardware design notes, place the load capacitors (typically 12-33 pF) within 3 mm of the crystal pins. Keep high-speed switching signals (PWM, CAN) at least 30 mm from the crystal area to avoid frequency jitter. Use a continuous ground plane under the IC and stitch vias around the 112-LQFP perimeter to reduce thermal impedance and EMI.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

Industrial temperature grade (-40 C to +85 C) per NXP datasheet; not AEC-Q100 qualified - choose J2VAL or other AEC-Q100 variants for automotive safety-critical modules. RoHS compliant per NXP product page.

Dados verificados em: 2026-10-20 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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