MC9S12H128VPVE - 16-bit HCS12 MCU 128KB Flash 50MHz | NXP
N.º da peça: MC9S12H128VPVE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $19.07 | $19,07 |
| 10 | $17.5 | $175,00 |
| 100 | $15.2 | $1.520,00 |
| 500 | $13.1 | $6.550,00 |
| 1.000 | $11.45 | $11.450,00 |
MC9S12H128VPVE Visão geral
A microcontroller is a self-contained computing system on a single IC, integrating a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of analog and digital peripherals into one package. Within the semiconductor hierarchy, the MC9S12H128VPVE belongs to the class of microcontrollers (MCUs), then to 16-bit CISC microcontrollers, then to the automotive-grade HCS12 family, and finally to the H128 sub-family. Its role in the system hierarchy is to act as the central real-time control element, executing firmware that drives actuators, samples sensors, and manages communication buses.
The key differentiating features of the MC9S12H128VPVE include: 128KB of in-application programmable Flash (128K x 8 organization), 6KB of RAM, 85 general-purpose I/O lines, an on-chip LCD driver, and a peripheral set that includes PWM, an ATD (analog-to-digital) converter, a watchdog timer, and power-on reset. Communications interfaces include CAN (CANbus), I²C, SCI (UART), and SPI, making the device suitable for multi-bus industrial nodes.
The HCS12 core is a 16-bit CISC architecture with a 20-bit ALU, an enhanced indexable addressing mode set, and a Background Debug Mode (BDM) interface for non-intrusive in-circuit debugging. The bus can be clocked up to 50MHz from an internal PLL synthesizer, while the on-chip oscillator and a Phase-Locked Loop provide a stable system clock without an external crystal in many configurations. The 112-pin LQFP package provides sufficient I/O and ADC channels for body-electronics modules.
Typical applications include automotive body controllers, instrument clusters with on-chip LCD drive, HVAC control modules, industrial CAN nodes, and general-purpose 16-bit embedded control. The integrated LCD driver makes the device a strong fit for human-driven dashboards and operator interfaces where display cost is a factor.
When designing with this part, engineers should size the decoupling network for the multiple VDD/VSS pins, route the LCDFP/LCDRP LCD bias pins with low-impedance traces, and verify the BDM (Background Debug Mode) pins are accessible for production programming. Operating voltage is 2.5V or 5V per the datasheet.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for part evaluation, BOM risk reduction, and lifecycle planning.
Alternativas drop-in para MC9S12H128VPVE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12H128VPVE (mesmo formato e footprint) — diferindo em Package, PWM Channels, Number of I/O, Operating Voltage, Program Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12H128VPV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12H256VPVE
✅ Drop-In✓ Em estoque
$17.25 / unidade
Ver ficha técnica →MC9S12B128VPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DJ128CPVE
✅ Drop-In✓ Em estoque
$19.75 / unidade
Ver ficha técnica →MC9S12DP512MPVE
✅ Drop-In✓ Em estoque
$9.45 / unidade
Ver ficha técnica →MC9S12DP512CPVE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12H128VPVE Classificações máximas e características elétricas
| Core Processor | HCS12 |
| Core Size | 16-bit |
| Core Architecture | CISC |
| Program Memory Size | 128KB (128K x 8) Flash |
| RAM Size | 6KB (6K x 8) |
| Maximum CPU Speed | 50MHz |
| Operating Voltage | 2.5V / 5V |
| Number of I/O | 85 |
| Connectivity | CANbus, I²C, SCI, SPI |
| Peripherals | LCD driver, POR, PWM, WDT, ATD |
| Oscillator Type | Internal |
| Encapsulamento | 112-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +105C |
| AEC-Q100 Grade | Automotive qualified |
| Packaging | Tray |
| Program Memory Type | Flash |
Configuração de pinos do MC9S12H128VPVE
| Pino 1 | VDDR — Voltage regulator supply |
| Pino 2 | VDD1 — Digital supply 1 |
| Pino 3 | VSS1 — Digital ground 1 |
| Pino 4 | VDDX — I/O supply |
| Pino 5 | VSSX — I/O ground |
| Pino 6 | RESET — External reset input (active low) |
| Pino 7 | MODC — Mode select |
| Pino 8 | BKGD — Background Debug Mode pin |
| Pino 9 | PAD0 — Port AD bit 0 (ATD analog input) |
| Pino 10 | PAD1 — Port AD bit 1 |
| Pino 11 | PAD2 — Port AD bit 2 |
| Pino 12 | PAD3 — Port AD bit 3 |
| Pino 13 | PAD4 — Port AD bit 4 |
| Pino 14 | PAD5 — Port AD bit 5 |
| Pino 15 | PAD6 — Port AD bit 6 |
| Pino 16 | PAD7 — Port AD bit 7 |
| Pino 17 | PAD8 — Port AD bit 8 |
| Pino 18 | PAD9 — Port AD bit 9 |
| Pino 19 | PAD10 — Port AD bit 10 |
| Pino 20 | PAD11 — Port AD bit 11 |
| Pino 21 | PAD12 — Port AD bit 12 |
| Pino 22 | PAD13 — Port AD bit 13 |
| Pino 23 | PAD14 — Port AD bit 14 |
| Pino 24 | PAD15 — Port AD bit 15 |
| Pino 25 | PTA0 — Port A bit 0 |
| Pino 26 | PTA1 — Port A bit 1 |
| Pino 27 | PTA2 — Port A bit 2 |
| Pino 28 | PTA3 — Port A bit 3 |
| Pino 29 | PTA4 — Port A bit 4 |
| Pino 30 | PTA5 — Port A bit 5 |
| Pino 31 | PTA6 — Port A bit 6 |
| Pino 32 | PTA7 — Port A bit 7 |
| Pino 33 | PTB0 — Port B bit 0 |
| Pino 34 | PTB1 — Port B bit 1 |
| Pino 35 | PTB2 — Port B bit 2 |
| Pino 36 | PTB3 — Port B bit 3 |
| Pino 37 | PTB4 — Port B bit 4 |
| Pino 38 | PTB5 — Port B bit 5 |
| Pino 39 | PTB6 — Port B bit 6 |
| Pino 40 | PTB7 — Port B bit 7 |
| Pino 41 | PTC0 — Port C bit 0 |
| Pino 42 | PTC1 — Port C bit 1 |
| Pino 43 | PTC2 — Port C bit 2 |
| Pino 44 | PTC3 — Port C bit 3 |
| Pino 45 | PTC4 — Port C bit 4 |
| Pino 46 | PTC5 — Port C bit 5 |
| Pino 47 | PTC6 — Port C bit 6 |
| Pino 48 | PTC7 — Port C bit 7 |
| Pino 49 | PTD0 — Port D bit 0 / CAN TX |
| Pino 50 | PTD1 — Port D bit 1 / CAN RX |
| Pino 51 | PTD2 — Port D bit 2 / SCI TX |
| Pino 52 | PTD3 — Port D bit 3 / SCI RX |
| Pino 53 | PTD4 — Port D bit 4 / SPI MOSI |
| Pino 54 | PTD5 — Port D bit 5 / SPI MISO |
| Pino 55 | PTD6 — Port D bit 6 / SPI SCK |
| Pino 56 | PTD7 — Port D bit 7 / SPI SS |
| Pino 57 | PTE0 — Port E bit 0 / I²C SCL |
| Pino 58 | PTE1 — Port E bit 1 / I²C SDA |
| Pino 59 | PTE2 — Port E bit 2 |
| Pino 60 | PTE3 — Port E bit 3 |
| Pino 61 | PTE4 — Port E bit 4 |
| Pino 62 | PTE5 — Port E bit 5 |
| Pino 63 | PTE6 — Port E bit 6 |
| Pino 64 | PTE7 — Port E bit 7 |
| Pino 65 | PTF0 — Port F bit 0 |
| Pino 66 | PTF1 — Port F bit 1 |
| Pino 67 | PTF2 — Port F bit 2 |
| Pino 68 | PTF3 — Port F bit 3 |
| Pino 69 | PTF4 — Port F bit 4 |
| Pino 70 | PTF5 — Port F bit 5 |
| Pino 71 | PTF6 — Port F bit 6 |
| Pino 72 | PTF7 — Port F bit 7 |
| Pino 73 | PTG0 — Port G bit 0 |
| Pino 74 | PTG1 — Port G bit 1 |
| Pino 75 | PTG2 — Port G bit 2 |
| Pino 76 | PTG3 — Port G bit 3 |
| Pino 77 | PTG4 — Port G bit 4 |
| Pino 78 | PTG5 — Port G bit 5 |
| Pino 79 | PTG6 — Port G bit 6 |
| Pino 80 | PTG7 — Port G bit 7 |
| Pino 81 | PTH0 — Port H bit 0 / PWM0 |
| Pino 82 | PTH1 — Port H bit 1 / PWM1 |
| Pino 83 | PTH2 — Port H bit 2 / PWM2 |
| Pino 84 | PTH3 — Port H bit 3 / PWM3 |
| Pino 85 | PTH4 — Port H bit 4 / PWM4 |
| Pino 86 | PTH5 — Port H bit 5 / PWM5 |
| Pino 87 | PTH6 — Port H bit 6 / PWM6 |
| Pino 88 | PTH7 — Port H bit 7 / PWM7 |
| Pino 89 | PJ0 — Port J bit 0 / LCD segment |
| Pino 90 | PJ1 — Port J bit 1 / LCD segment |
| Pino 91 | PJ2 — Port J bit 2 / LCD segment |
| Pino 92 | PJ3 — Port J bit 3 / LCD segment |
| Pino 93 | PJ4 — Port J bit 4 / LCD segment |
| Pino 94 | PJ5 — Port J bit 5 / LCD segment |
| Pino 95 | PJ6 — Port J bit 6 / LCD segment |
| Pino 96 | PJ7 — Port J bit 7 / LCD segment |
| Pino 97 | PK0 — Port K bit 0 / LCD segment |
| Pino 98 | PK1 — Port K bit 1 / LCD segment |
| Pino 99 | PK2 — Port K bit 2 / LCD segment |
| Pino 100 | PK3 — Port K bit 3 / LCD segment |
| Pino 101 | PK4 — Port K bit 4 / LCD segment |
| Pino 102 | PK5 — Port K bit 5 / LCD segment |
| Pino 103 | PK6 — Port K bit 6 / LCD segment |
| Pino 104 | PK7 — Port K bit 7 / LCD segment |
| Pino 105 | LCDFP — LCD front-plane bias |
| Pino 106 | LCDRP — LCD back-plane bias |
| Pino 107 | VDD2 — Digital supply 2 |
| Pino 108 | VSS2 — Digital ground 2 |
| Pino 109 | XOSC1 — Crystal oscillator input |
| Pino 110 | XOSC2 — Crystal oscillator output |
| Pino 111 | TEST — Test pin (factory use) |
| Pino 112 | PLL/VDDPLL — PLL supply |
Aplicações típicas
MC9S12H128VPVE é adequado para 6 aplicaçãos: Automotive Body Control Module, Automotive Instrument Cluster, Industrial CAN Node Controller, HVAC Climate Control Module, Automotive Door Module / Seat Controller, General 16-bit Embedded Control Platform.
Automotive Body Control Module
The MC9S12H128VPVE is well matched to automotive body control modules because of its 16-bit HCS12 core, single-CAN interface, and 85 GPIO lines. Body controllers typically aggregate inputs from door switches, lighting, and rain sensors and drive relays, LEDs, and small motors; the on-chip PWM and ATD peripherals cover those functions without external counters. With 128KB Flash, typical BCM firmware fits comfortably, leaving headroom for bootloaders and OBD diagnostic routines. The AEC-Q100 qualification and -40C to +105C rating allow under-hood and cabin placement. The 112-LQFP exposes enough pins for multi-channel lighting and CAN node fan-out without external bus expanders.
Recomendado
Automotive Instrument Cluster
The integrated LCD segment driver makes the MC9S12H128VPVE a natural fit for automotive instrument clusters that drive segment-LCD speedometers, tachometers, and fuel/temperature gauges. The 85 GPIO and the LCD bias generator drive typical 4-to-8 multiplex displays without an external charge pump, reducing BOM cost. The 128KB Flash holds graphic-segment maps and diagnostic libraries; 6KB RAM supports runtime variables for CAN-received vehicle data. The 50MHz CPU bus speed is sufficient to refresh 100+ segments per frame while servicing CAN messages from the BCM and powertrain gateway in real time.
Recomendado
Industrial CAN Node Controller
Industrial CAN nodes such as PLC expansion slices, motor inverters, and sensor hubs benefit from the MC9S12H128VPVE's HCS12 deterministic core, integrated CAN module, and -40C to +105C rating. The CAN 2.0A/B interface supports standard industrial protocols (CANopen, DeviceNet) at 1 Mbit/s, while SCI and SPI enable side-channel diagnostics. 128KB Flash accommodates industrial protocol stacks (CANopen over CAN, simple Modbus over SCI) without external memory, and the 112-LQFP provides enough I/O for digital inputs, relay drivers, and PWM outputs. The 50MHz bus frequency keeps CAN message latency under 1 ms at full bus load.
HVAC Climate Control Module
HVAC control modules combine temperature sensing, fan/motor PWM control, and a user display - a profile the MC9S12H128VPVE covers directly. The ATD converter samples multiple thermistor inputs, while PWM channels drive blower fans and mode doors at variable duty cycles. The integrated LCD segment driver is well suited to status display of temperature setpoints and fan speed. The AEC-Q100 grade and wide operating temperature support under-dash mounting where ambient can reach 85C. With 128KB Flash, the firmware can include PID control loops, CAN diagnostics, and a small bootloader for field updates.
Recomendado
Automotive Door Module / Seat Controller
Door modules and seat controllers need many GPIOs for window switches, mirror controls, and position feedback, plus CAN to communicate with the BCM. The MC9S12H128VPVE's 85 GPIO count accommodates 8-channel switch scanning, mirror motor H-bridge control, and PWM-driven seat adjusters. The HCS12 core executes the seat-position control loop deterministically at 50MHz, while the CAN interface reports faults and accepts commands. The 112-LQFP package supports mixed-signal routing for the ATD channels that read Hall-effect mirror/position sensors.
Recomendado
General 16-bit Embedded Control Platform
Beyond automotive, the MC9S12H128VPVE serves as a general-purpose 16-bit embedded platform for sensor aggregation, motor control, and CAN-connected industrial nodes. The HCS12 instruction set supports C compilers with predictable interrupt latency, and 128KB Flash plus 6KB RAM covers typical sensor-hub firmware. The peripheral mix (PWM, ATD, SCI, SPI, I²C, CAN) maps cleanly onto industrial sensor boards that aggregate multiple analog inputs and report over CAN. The exposed-pad 112-LQFP aids thermal dissipation for PWM-intensive motor control.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12H128VPVE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12H128VPV | MC9S12H256VPVE | MC9S12B128VPVE | MC9S12DJ128CPVE | MC9S12DP512MPVE |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (S12H family) | HCS12 (S12H) | HCS12 (S12H) | HCS12 (S12B) | HCS12 (S12D) | HCS12 (S12D) |
| Flash Memory | 128KB | 128KB | 256KB | 128KB | 128KB | 512KB |
| RAM Size | 6KB | 6KB | 12KB | 6KB | 8KB | 32KB |
| Max CPU Speed | 50MHz | 50MHz | 50MHz | 50MHz | 50MHz | 50MHz |
| CAN Modules | 1 (CANbus) | 1 | 1 | 1 | 2 | 2 |
| LCD Driver | Yes (integrated) | Yes | Yes | No | No | No |
| Operating Temperature | -40C to +105C | 0C to +70C (typical) | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Integrated LCD segment driver eliminates external charge-pump IC (vs MC9S12B128VPVE)
- Higher Flash density (128KB vs 256KB Flash tradeoff) (vs MC9S12H256VPVE)
- AEC-Q100 automotive grade with -40C to +105C range (vs MC9S12DJ128CPVE)
Notas de projeto
Place 100nF decoupling capacitors as close as possible to each VDD/VSS pair on the 112-LQFP, with at least one bulk 10uF tantalum or ceramic near the VDDR pin. The exposed thermal pad (if present on the package variant) must be soldered to a ground copper pour of at least 1 square inch to meet the thermal resistance spec and improve EMI immunity for the LCD bias lines.
Route the LCDFP and LCDRP pins directly to the LCD glass with short, wide traces to minimize the loop area and reduce susceptibility to display artifacts. Keep digital switching traces (PWM, SCI) away from the LCD bias network; a ground guard trace between them is recommended. The XOSC1/XOSC2 crystal traces should be short, symmetric, and surrounded by a ground ring for PLL stability.
Do not assume all 112-LQFP S12 parts are firmware-compatible: pin-multiplexing maps differ between S12H, S12B, and S12D families. The MC9S12H128VPVE maps LCD segments to PJ/PK ports; S12D parts reuse those pins for general GPIO. Verify the BKGND/MODC pins are accessible on the production PCB for in-circuit programming and that the RESET pin has a proper pull-up and decoupling capacitor as required by the datasheet.
Informações de conformidade
AEC-Q100 qualified per datasheets.com listing; RoHS and lead-free per NXP product family. Halogen-free status not explicitly confirmed in retrieved web data.
