MC9S12D64CPVE - 16-Bit HCS12 MCU, 64KB Flash, 25MHz, 112-LQFP | NXP
N.º da peça: MC9S12D64CPVE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.2 | $6.600,00 |
| 1.000 | $11.5 | $11.500,00 |
MC9S12D64CPVE Visão geral
A microcontroller (MCU) is a single-chip computer that combines a CPU core, program memory, data memory, and peripherals such as timers, ADCs, and communication interfaces. The HCS12 is a 16-bit CISC architecture that targets automotive body controllers, instrument clusters, and industrial control where deterministic interrupt response and rich on-chip peripherals matter more than raw MHz. Within the broader taxonomy, the MC9S12D64 sits in the family HCS12 -> 16-bit MCU -> microcontroller -> embedded processor -> semiconductor.
Key features of the MC9S12D64CPVE include 91 general-purpose I/O lines, two asynchronous serial communication interfaces (SCI), one SPI, one I2C, and a CANbus controller for in-vehicle networking. The peripheral set also contains two 8-channel 10-bit analog-to-digital converters (ATD), an 8-channel enhanced capture timer (ECT) with input-capture/output-compare capability, an 8-channel pulse-width modulator (PWM), and a watchdog timer (WDT). On-chip oscillator, PLL, and reset/clock-generation logic simplify board-level design by removing many external components.
Typical applications include automotive body controllers, HVAC control modules, instrument clusters, lighting controllers, seat-control modules, and CAN node endpoints in vehicle networks. The 5 V-tolerant I/O and integrated CAN transceiver-friendly timing make this part well-suited to 12 V/24 V vehicle electrical systems where robust communication and EMI tolerance are required.
When designing with this device, use the Freescale/NXP CodeWarrior or Cosmic/SofTec toolchains and the standard HCS12 background-debug-mode (BDM) interface for flash programming and debug. Confirm the NRND lifecycle status with your NXP representative before committing to new production, and qualify a recommended replacement such as the S12Z or S12G family for new programs. This page consolidates distributor stock, lifecycle status, and drop-in alternatives that are not present in the manufacturer datasheet alone.
Alternativas drop-in para MC9S12D64CPVE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12D64CPVE (mesmo formato e footprint) — diferindo em ADC, Operating Temperature, Supply Voltage, Debug Interface, EEPROM Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12E64CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG128CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DT256MPVE
✅ Drop-In✓ Em estoque
$14.36 / unidade
Ver ficha técnica →MC9S12DJ64MFUE
✅ Drop-In✓ Em estoque
$8.2 / unidade
Ver ficha técnica →MC9S12A128CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12D64CPV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12D64CPVE Classificações máximas e características elétricas
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Architecture | CISC |
| Maximum CPU Frequency | 25 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| EEPROM Size | 1 KB (1K x 8) |
| Number of I/O | 91 |
| Tensão de alimentação | 2.5 V / 5 V |
| Connectivity | CANbus, I2C, SCI, SPI |
| Peripherals | PWM, WDT, ECT, ATD |
| ADC | 8-channel, 10-bit (x2 ATD modules) |
| PWM Channels | 8 |
| Encapsulamento | 112-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (industrial) |
| AEC-Q100 | Qualified (automotive) |
| Lead-Free / RoHS | Compliant per NXP product page |
Configuração de pinos do MC9S12D64CPVE
| Pino 1 | BKGD — Background Debug Mode |
| Pino 2 | VDDR — Voltage regulator supply |
| Pino 3 | VSS — Ground |
| Pino 4 | XTAL — Crystal oscillator input |
| Pino 5 | EXTAL — External clock / crystal output |
| Pino 6 | RESET — Reset input (active low) |
| Pino 7 | TEST — Test mode (must be tied VSS for normal operation) |
| Pino 8 | PAD0 — Port AD bit 0 / AN0 |
| Pino 9 | PAD1 — Port AD bit 1 / AN1 |
| Pino 10 | PAD2 — Port AD bit 2 / AN2 |
| Pino 11 | PAD3 — Port AD bit 3 / AN3 |
| Pino 12 | PAD4 — Port AD bit 4 / AN4 |
| Pino 13 | PAD5 — Port AD bit 5 / AN5 |
| Pino 14 | PAD6 — Port AD bit 6 / AN6 |
| Pino 15 | PAD7 — Port AD bit 7 / AN7 |
| Pino 16 | VDDX — Digital I/O supply |
| Pino 17 | VSSX — Digital I/O ground |
| Pino 18 | PA0 — Port A bit 0 |
| Pino 19 | PA1 — Port A bit 1 |
| Pino 20 | PA2 — Port A bit 2 |
| Pino 21 | PA3 — Port A bit 3 |
| Pino 22 | PA4 — Port A bit 4 |
| Pino 23 | PA5 — Port A bit 5 |
| Pino 24 | PA6 — Port A bit 6 |
| Pino 25 | PA7 — Port A bit 7 |
| Pino 26 | PB0 — Port B bit 0 |
| Pino 27 | PB1 — Port B bit 1 |
| Pino 28 | PB2 — Port B bit 2 |
| Pino 29 | PB3 — Port B bit 3 |
| Pino 30 | PB4 — Port B bit 4 |
| Pino 31 | PB5 — Port B bit 5 |
| Pino 32 | PB6 — Port B bit 6 |
| Pino 33 | PB7 — Port B bit 7 |
| Pino 34 | PE0 — Port E bit 0 / IRQ |
| Pino 35 | PE1 — Port E bit 1 / XIRQ |
| Pino 36 | PE2 — Port E bit 2 |
| Pino 37 | PE3 — Port E bit 3 |
| Pino 38 | PE4 — Port E bit 4 |
| Pino 39 | PE5 — Port E bit 5 |
| Pino 40 | PE6 — Port E bit 6 |
| Pino 41 | PE7 — Port E bit 7 |
| Pino 42 | PH0 — Port H bit 0 / PWM0 |
| Pino 43 | PH1 — Port H bit 1 / PWM1 |
| Pino 44 | PH2 — Port H bit 2 / PWM2 |
| Pino 45 | PH3 — Port H bit 3 / PWM3 |
| Pino 46 | PH4 — Port H bit 4 / PWM4 |
| Pino 47 | PH5 — Port H bit 5 / PWM5 |
| Pino 48 | PH6 — Port H bit 6 / PWM6 |
| Pino 49 | PH7 — Port H bit 7 / PWM7 |
| Pino 50 | PJ0 — Port J bit 0 |
| Pino 51 | PJ1 — Port J bit 1 |
| Pino 52 | PJ2 — Port J bit 2 |
| Pino 53 | PJ3 — Port J bit 3 |
| Pino 54 | PJ4 — Port J bit 4 |
| Pino 55 | PJ5 — Port J bit 5 |
| Pino 56 | PJ6 — Port J bit 6 |
| Pino 57 | PJ7 — Port J bit 7 |
| Pino 58 | PK0 — Port K bit 0 |
| Pino 59 | PK1 — Port K bit 1 |
| Pino 60 | PK2 — Port K bit 2 |
| Pino 61 | PK3 — Port K bit 3 |
| Pino 62 | PK4 — Port K bit 4 |
| Pino 63 | PK5 — Port K bit 5 |
| Pino 64 | PK6 — Port K bit 6 |
| Pino 65 | PK7 — Port K bit 7 |
| Pino 66 | PM0 — Port M bit 0 |
| Pino 67 | PM1 — Port M bit 1 |
| Pino 68 | PM2 — Port M bit 2 |
| Pino 69 | PM3 — Port M bit 3 |
| Pino 70 | PM4 — Port M bit 4 |
| Pino 71 | PM5 — Port M bit 5 |
| Pino 72 | PM6 — Port M bit 6 |
| Pino 73 | PM7 — Port M bit 7 |
| Pino 74 | PP0 — Port P bit 0 / PWM / IOC |
| Pino 75 | PP1 — Port P bit 1 / PWM / IOC |
| Pino 76 | PP2 — Port P bit 2 / PWM / IOC |
| Pino 77 | PP3 — Port P bit 3 / PWM / IOC |
| Pino 78 | PP4 — Port P bit 4 / PWM / IOC |
| Pino 79 | PP5 — Port P bit 5 / PWM / IOC |
| Pino 80 | PP6 — Port P bit 6 / PWM / IOC |
| Pino 81 | PP7 — Port P bit 7 / PWM / IOC |
| Pino 82 | PS0 — Port S bit 0 / SCI0 |
| Pino 83 | PS1 — Port S bit 1 / SCI0 |
| Pino 84 | PS2 — Port S bit 2 / SPI0 |
| Pino 85 | PS3 — Port S bit 3 / SPI0 |
| Pino 86 | PS4 — Port S bit 4 / SCI1 |
| Pino 87 | PS5 — Port S bit 5 / SCI1 |
| Pino 88 | PS6 — Port S bit 6 / I2C |
| Pino 89 | PS7 — Port S bit 7 / I2C |
| Pino 90 | PT0 — Port T bit 0 / IOC0 / ECT |
| Pino 91 | PT1 — Port T bit 1 / IOC1 / ECT |
| Pino 92 | PT2 — Port T bit 2 / IOC2 / ECT |
| Pino 93 | PT3 — Port T bit 3 / IOC3 / ECT |
| Pino 94 | PT4 — Port T bit 4 / IOC4 / ECT |
| Pino 95 | PT5 — Port T bit 5 / IOC5 / ECT |
| Pino 96 | PT6 — Port T bit 6 / IOC6 / ECT |
| Pino 97 | PT7 — Port T bit 7 / IOC7 / ECT |
| Pino 98 | CANRX — CAN receive pin (MSCAN) |
| Pino 99 | CANTX — CAN transmit pin (MSCAN) |
| Pino 100 | VDDPLL — PLL supply |
| Pino 101 | VSSPLL — PLL ground |
| Pino 102 | XFC — PLL loop filter capacitor |
| Pino 103 | VDDA — ADC supply |
| Pino 104 | VSSA — ADC ground |
| Pino 105 | VRL — ADC reference low |
| Pino 106 | VRH — ADC reference high |
| Pino 107 | AN0 — ADC channel 0 (alternate mapping) |
| Pino 108 | AN1 — ADC channel 1 (alternate mapping) |
| Pino 109 | AN2 — ADC channel 2 (alternate mapping) |
| Pino 110 | AN3 — ADC channel 3 (alternate mapping) |
| Pino 111 | TCLK — ECT external clock input |
| Pino 112 | MODC — Mode select for BDM/normal |
Aplicações típicas
MC9S12D64CPVE é adequado para 6 aplicaçãos: Automotive Body Control Module, HVAC Control Module, Instrument Cluster, CAN Node Endpoint / Sensor Interface, Industrial Control / 5 V Automation, Seat and Mirror Control Module.
Automotive Body Control Module
The MC9S12D64CPVE fits automotive body-control modules because it integrates one CANbus controller, two SCI (UART), SPI, I2C, 91 GPIO, 8-channel PWM, and two 8-channel 10-bit ADCs in a single 112-LQFP. The on-chip CAN peripheral handles OBD-II/body-CAN traffic without an external transceiver controller, and the 64 KB Flash easily stores typical BCM firmware plus bootloader. AEC-Q100 qualification and 5 V-tolerant I/O align with 12 V vehicle electrical rails. Compared with newer S12G parts, the D64CPVE remains a low-risk choice for cost-sensitive platforms already on HCS12 toolchains.
Recomendado
HVAC Control Module
The 8-channel PWM of the MC9S12D64CPVE drives blower motors and mode doors directly, while its two 10-bit ADC banks read temperature sensors, potentiometers, and pressure transducers with adequate resolution for climate-loop control. CANbus connectivity talks to the vehicle body network, and the 64 KB Flash holds HVAC application code plus calibration tables. Industrial temperature grade (-40C to +85C) covers cabin and engine-bay environments, and AEC-Q100 qualification is required by most OEMs. The 112-LQFP provides sufficient GPIO for blend-door actuators and backlight drivers in a single chip.
Recomendado
Instrument Cluster
An instrument cluster benefits from the MC9S12D64CPVE's 91 GPIO lines to drive stepper motors, indicator LEDs, and LCD segment drivers while the HCS12 core runs the gauge-sweep, warning-logic, and CAN-message-decode tasks. The 25 MHz HCS12 provides deterministic interrupt response needed for cluster refresh rates, and 64 KB Flash holds the full cluster firmware including telltale logic. The two SCI channels enable LIN or K-line diagnostics, and the 8-channel PWM can drive backlight brightness. AEC-Q100 qualification and -40C to +85C operation cover cabin thermal requirements.
Recomendado
CAN Node Endpoint / Sensor Interface
As a CAN node endpoint, the MC9S12D64CPVE's on-chip MSCAN controller implements CAN 2.0A/B at up to 1 Mbps, while its ADC banks digitize sensor outputs and its PWM channels drive actuator loads. The 4 KB RAM buffers incoming CAN frames, and 64 KB Flash holds the CANopen, J1939, or OEM-proprietary stack. Industrial temperature range and AEC-Q100 grade suit both industrial CANopen masters and automotive J1939 nodes. The 5 V I/O tolerance simplifies interfacing with 5 V sensors still common in industrial CAN nodes.
Recomendado
Industrial Control / 5 V Automation
Legacy 5 V industrial automation uses the MC9S12D64CPVE's 2.5 V/5 V supply tolerance to drop into existing 5 V backplanes without level shifters. The HCS12 core's CISC instruction set eases porting from older HC11/HCS12 designs, and the SCI/SPI/I2C channels talk to industrial sensors and motor drivers. The 91 GPIO and 8-channel PWM support multi-axis stepper or brushed-DC control, while the watchdog timer and reset-generation harden the design against field faults. AEC-Q100 over-qualifies for non-automotive use but signals high reliability.
Recomendado
Seat and Mirror Control Module
Seat and mirror modules need multiple PWM channels, abundant GPIO, and a CAN interface - all delivered by the MC9S12D64CPVE. The 8-channel PWM drives seat motors, mirror position, and heater pads while the two ADCs read position-feedback potentiometers. CANbus links the module to the body controller for memory-set recall and diagnostics, and 64 KB Flash holds the position-memory, anti-pinch, and calibration routines. AEC-Q100 grade and the 112-LQFP's compact 20x20 mm footprint fit inside seat-mounted enclosures with high vibration profiles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12D64CPVE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12E64CPVE | MC9S12DG128CPVE | MC9S12DT256MPVE | MC9S12DJ64MFUE | MC9S12A128CPVE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Core | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz | HCS12 16-bit, 25 MHz |
| Flash Memory | 64 KB | 64 KB | 128 KB | 256 KB | 64 KB | 128 KB |
| RAM | 4 KB | 4 KB | 8 KB | 12 KB | 4 KB | 8 KB |
| EEPROM | 1 KB | Expanded | 2 KB | 4 KB | 1 KB | 2 KB |
| CAN Controllers | 1 (MSCAN) | 1 | 2 | 2 | 2 | 1 |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | Active | Active | Active | Active | Active |
Principais diferenciais
- AEC-Q100 automotive qualification with 5 V I/O tolerance (vs MC9S12E64CPVE)
- Same-footprint upgrade path to higher Flash densities (vs MC9S12DT256MPVE)
- HCS12 CISC toolchain compatibility (vs STM32F1 (Cortex-M3))
Notas de projeto
Decouple the MC9S12D64CPVE with 100 nF ceramic capacitors on every VDDX pin and a bulk 4.7 uF to 10 uF tantalum or ceramic on the main supply. Place the PLL loop-filter capacitor on XFC as specified in the NXP datasheet to maintain oscillator stability. Route VDDR through a ferrite bead from VDDX to keep regulator noise out of the digital supply. The internal voltage regulator requires adequate copper area under the die for heat spreading.
Use a 4-layer PCB with a dedicated ground plane under the 112-LQFP footprint. Keep the BKGD and RESET traces short and away from PWM switching traces to avoid spurious debug-mode entry. Route the CANRX/CANTX differential pair with 120 ohm characteristic impedance and place a common-mode choke near the transceiver connector for automotive EMI robustness. The crystal/EXTAL traces must be short and guarded by ground.
Do not leave the TEST pin floating; tie it to VSS through a 10 kohm pull-down so the device enters normal mode instead of factory test mode. Confirm the BDM pod compatibility (P&E Multilink or USB-ML-12) before bringing up firmware. Verify the ordering-code breakdown because CPVE, CPV, MPVE suffixes denote different temperature and quality grades per NXP ordering codes. Always check the device errata sheet before releasing firmware.
Informações de conformidade
AEC-Q100 qualified per NXP product page. RoHS and REACH compliant per NXP product page. Lifecycle status NRND - new designs should migrate to S12G/S12Z family.
