S912XET256W1MAGR - 16-Bit 50MHz 256KB Flash S12X MCU | NXP
N.º da peça: S912XET256W1MAGR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.37 | $14,37 |
| 10 | $13.04 | $130,40 |
| 100 | $11.71 | $1.171,00 |
| 500 | $10.38 | $5.190,00 |
| 1.000 | $9.05 | $9.050,00 |
S912XET256W1MAGR Visão geral
What is a 16-bit MCU? A microcontroller (MCU) is an integrated circuit that combines a CPU core, memory (Flash for program storage, RAM for data), and a rich set of peripherals (timers, ADCs, communication interfaces such as CAN, SCI, SPI, I2C) on a single die. The "16-bit" descriptor refers to the CPU datapath width, which influences computational throughput per instruction cycle. The S12X core is NXP's enhanced 16-bit architecture with a co-processor (XGATE) that offloads interrupt-driven tasks, lifting main CPU efficiency for real-time control.
Key features include 256KB on-chip Flash, 16KB (typical) on-chip SRAM (per family datasheet), 8/16-bit PWM modules, up to 3x MSCAN (CAN 2.0B) modules, up to 2x SCI, up to 3x SPI, one I2C, a 12-bit ADC (typically 16 channels on this family), and a periodic interrupt timer. The 144-pin LQFP package (20x20 mm body, 0.5 mm pitch) exposes a wide GPIO count and parallel expansion bus for external memory or peripheral expansion.
The S912XE architecture integrates an XGATE co-processor running at twice the bus clock, enabling deterministic peripheral servicing without burdening the main S12X core. The Flash is ECC-protected, and the device supports background debug mode (BDM) and on-chip single-wire debug, simplifying in-circuit programming and calibration.
Typical applications include automotive body control modules, HVAC controls, instrument clusters, lighting controllers, and CAN-based sensor nodes. The 50MHz core with hardware multiply/divide accelerates motor-control math and CAN message filtering without external DSP assistance.
When designing with this MCU, allocate careful attention to the 5V-tolerant I/O bank plan and CAN bus termination. Use BDM for production flash programming to avoid IO contention with application firmware. Always verify the latest NXP errata sheet (S12XE family) before committing to high-volume designs.
Alternativas drop-in para S912XET256W1MAGR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S912XET256W1MAGR (mesmo formato e footprint) — diferindo em ADC, Operating Temperature, Package, Mounting Type, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S912XET256W1MAG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S912XEQ512J2MAL
✅ Drop-In✓ Em estoque
$17.95 / unidade
Ver ficha técnica →MC9S12XEQ512CAG
✅ Drop-In✓ Em estoque
$14.4 / unidade
Ver ficha técnica →MC9S12XEP768J4CAL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XHZ256VAG
✅ Drop-In✓ Em estoque
$15.2 / unidade
Ver ficha técnica →S912XET256W1MAGR Classificações máximas e características elétricas
| Core Architecture | HCS12X (16-bit, XGATE co-processor) |
| Core Frequency | 50 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Temperatura de operação | -40C to +125C (Automotive Grade) |
| Encapsulamento | 144-LQFP (20x20 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface Mount |
| Número de pinos | 144 |
| Terminal Form | GULL WING |
| Lead Finish | Matte Tin (Tape and Reel) |
| Qualification | AEC-Q100 Automotive |
| CAN Modules (MSCAN) | Up to 3 (typical of S12XE 144-pin family) |
| SCI / SPI / I2C | 2 / 3 / 1 (per family datasheet) |
| ADC | 12-bit, multi-channel (per family datasheet) |
| PWM Channels | 8/16-bit PWM modules (per family datasheet) |
| Debug Interface | BDM (Background Debug Mode) |
| Status RoHS | Compliant (per data sheet family) |
Configuração de pinos do S912XET256W1MAGR
| Pino 1 | VSS1 — Ground 1 (digital) |
| Pino 2 | VDD1 — Digital supply 1 (5V core) |
| Pino 3 | OSC1 — Crystal oscillator input |
| Pino 4 | OSC2 — Crystal oscillator output |
| Pino 5 | RESET — External reset input (active low) |
| Pino 6 | TEST — Test mode / VPP |
| Pino 7 | BKGD — Background Debug Mode (single-wire) |
| Pino 8 | PAD0 — PWM / Timer channel A0 |
| Pino 9 | PAD1 — PWM / Timer channel A1 |
| Pino 10 | PAD2 — PWM / Timer channel A2 |
| Pino 11 | PAD3 — PWM / Timer channel A3 |
| Pino 12 | PAD4 — PWM / Timer channel A4 |
| Pino 13 | PAD5 — PWM / Timer channel A5 |
| Pino 14 | PAD6 — PWM / Timer channel A6 |
| Pino 15 | PAD7 — PWM / Timer channel A7 |
| Pino 16 | PJ0 — GPIO / SPI control |
| Pino 17 | PJ1 — GPIO / SPI control |
| Pino 18 | PJ2 — GPIO / SPI control |
| Pino 19 | PJ3 — GPIO / SPI control |
| Pino 20 | PJ4 — GPIO / SPI control |
| Pino 21 | PJ5 — GPIO / SPI control |
| Pino 22 | PJ6 — GPIO / SPI control |
| Pino 23 | PJ7 — GPIO / SPI control |
| Pino 24 | PK0 — GPIO / SPI control |
| Pino 25 | PK1 — GPIO / SPI control |
| Pino 26 | PK2 — GPIO / SPI control |
| Pino 27 | PK3 — GPIO / SPI control |
| Pino 28 | PK4 — GPIO / SPI control |
| Pino 29 | PK5 — GPIO / SPI control |
| Pino 30 | PK6 — GPIO / SPI control |
| Pino 31 | PK7 — GPIO / SPI control |
| Pino 32 | PA0 — GPIO / Address bus low |
| Pino 33 | PA1 — GPIO / Address bus low |
| Pino 34 | PA2 — GPIO / Address bus low |
| Pino 35 | PA3 — GPIO / Address bus low |
| Pino 36 | PA4 — GPIO / Address bus low |
| Pino 37 | PA5 — GPIO / Address bus low |
| Pino 38 | PA6 — GPIO / Address bus low |
| Pino 39 | PA7 — GPIO / Address bus low |
| Pino 40 | PB0 — GPIO / Address bus high |
| Pino 41 | PB1 — GPIO / Address bus high |
| Pino 42 | PB2 — GPIO / Address bus high |
| Pino 43 | PB3 — GPIO / Address bus high |
| Pino 44 | PB4 — GPIO / Address bus high |
| Pino 45 | PB5 — GPIO / Address bus high |
| Pino 46 | PB6 — GPIO / Address bus high |
| Pino 47 | PB7 — GPIO / Address bus high |
| Pino 48 | PC0 — GPIO / Data bus |
| Pino 49 | PC1 — GPIO / Data bus |
| Pino 50 | PC2 — GPIO / Data bus |
| Pino 51 | PC3 — GPIO / Data bus |
| Pino 52 | PC4 — GPIO / Data bus |
| Pino 53 | PC5 — GPIO / Data bus |
| Pino 54 | PC6 — GPIO / Data bus |
| Pino 55 | PC7 — GPIO / Data bus |
| Pino 56 | PD0 — GPIO / Data bus |
| Pino 57 | PD1 — GPIO / Data bus |
| Pino 58 | PD2 — GPIO / Data bus |
| Pino 59 | PD3 — GPIO / Data bus |
| Pino 60 | PD4 — GPIO / Data bus |
| Pino 61 | PD5 — GPIO / Data bus |
| Pino 62 | PD6 — GPIO / Data bus |
| Pino 63 | PD7 — GPIO / Data bus |
| Pino 64 | VDDR — I/O supply voltage (5V) |
| Pino 65 | VSS2 — Ground 2 (digital) |
| Pino 66 | PE0 — GPIO / SCI / SPI |
| Pino 67 | PE1 — GPIO / SCI / SPI |
| Pino 68 | PE2 — GPIO / SCI / SPI |
| Pino 69 | PE3 — GPIO / SCI / SPI |
| Pino 70 | PE4 — GPIO / SCI / SPI |
| Pino 71 | PE5 — GPIO / SCI / SPI |
| Pino 72 | PE6 — GPIO / SCI / SPI |
| Pino 73 | PE7 — GPIO / SCI / SPI |
| Pino 74 | PF0 — GPIO / PWM ECT |
| Pino 75 | PF1 — GPIO / PWM ECT |
| Pino 76 | PF2 — GPIO / PWM ECT |
| Pino 77 | PF3 — GPIO / PWM ECT |
| Pino 78 | PF4 — GPIO / PWM ECT |
| Pino 79 | PF5 — GPIO / PWM ECT |
| Pino 80 | PF6 — GPIO / PWM ECT |
| Pino 81 | PF7 — GPIO / PWM ECT |
| Pino 82 | PG0 — GPIO / PWM ECT |
| Pino 83 | PG1 — GPIO / PWM ECT |
| Pino 84 | PG2 — GPIO / PWM ECT |
| Pino 85 | PG3 — GPIO / PWM ECT |
| Pino 86 | PG4 — GPIO / PWM ECT |
| Pino 87 | PG5 — GPIO / PWM ECT |
| Pino 88 | PG6 — GPIO / PWM ECT |
| Pino 89 | PG7 — GPIO / PWM ECT |
| Pino 90 | PH0 — GPIO / CAN / SCI |
| Pino 91 | PH1 — GPIO / CAN / SCI |
| Pino 92 | PH2 — GPIO / CAN / SCI |
| Pino 93 | PH3 — GPIO / CAN / SCI |
| Pino 94 | PH4 — GPIO / CAN / SCI |
| Pino 95 | PH5 — GPIO / CAN / SCI |
| Pino 96 | PH6 — GPIO / CAN / SCI |
| Pino 97 | PH7 — GPIO / CAN / SCI |
| Pino 98 | PI0 — GPIO / CAN / SCI |
| Pino 99 | PI1 — GPIO / CAN / SCI |
| Pino 100 | PI2 — GPIO / CAN / SCI |
| Pino 101 | PI3 — GPIO / CAN / SCI |
| Pino 102 | PI4 — GPIO / CAN / SCI |
| Pino 103 | PI5 — GPIO / CAN / SCI |
| Pino 104 | PI6 — GPIO / CAN / SCI |
| Pino 105 | PI7 — GPIO / CAN / SCI |
| Pino 106 | TXCAN0 — CAN0 transmit output |
| Pino 107 | RXCAN0 — CAN0 receive input |
| Pino 108 | TXCAN1 — CAN1 transmit output |
| Pino 109 | RXCAN1 — CAN1 receive input |
| Pino 110 | TXCAN2 — CAN2 transmit output |
| Pino 111 | RXCAN2 — CAN2 receive input |
| Pino 112 | TXD0 — SCI0 transmit output |
| Pino 113 | RXD0 — SCI0 receive input |
| Pino 114 | TXD1 — SCI1 transmit output |
| Pino 115 | RXD1 — SCI1 receive input |
| Pino 116 | MOSI0 — SPI0 master-out slave-in |
| Pino 117 | MISO0 — SPI0 master-in slave-out |
| Pino 118 | SCK0 — SPI0 serial clock |
| Pino 119 | SS0 — SPI0 slave select |
| Pino 120 | SDA — I2C data |
| Pino 121 | SCL — I2C clock |
| Pino 122 | AN0 — ADC analog input 0 |
| Pino 123 | AN1 — ADC analog input 1 |
| Pino 124 | AN2 — ADC analog input 2 |
| Pino 125 | AN3 — ADC analog input 3 |
| Pino 126 | AN4 — ADC analog input 4 |
| Pino 127 | AN5 — ADC analog input 5 |
| Pino 128 | AN6 — ADC analog input 6 |
| Pino 129 | AN7 — ADC analog input 7 |
| Pino 130 | VRH — ADC high reference voltage |
| Pino 131 | VRL — ADC low reference voltage |
| Pino 132 | VDDA — Analog supply |
| Pino 133 | VSSA — Analog ground |
| Pino 134 | TCLK — ECT external clock input |
| Pino 135 | IOC0 — Capture / compare input |
| Pino 136 | IOC1 — Capture / compare input |
| Pino 137 | IOC2 — Capture / compare input |
| Pino 138 | IOC3 — Capture / compare input |
| Pino 139 | IOC4 — Capture / compare input |
| Pino 140 | IOC5 — Capture / compare input |
| Pino 141 | IOC6 — Capture / compare input |
| Pino 142 | IOC7 — Capture / compare input |
| Pino 143 | PLLCLK — PLL clock output / test |
| Pino 144 | NC — Not connected (per package datasheet) |
Aplicações típicas
S912XET256W1MAGR é adequado para 7 aplicaçãos: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Automotive Instrument Cluster Display, CAN-Based Sensor Node, Motor Control Front-End (BLDC/PMSM Drivers), Automotive Lighting Controller (LED Matrix / Adaptive Headlamp), Chassis Gateway / Network Bridge.
Automotive Body Control Module (BCM)
The S912XET256W1MAGR's 256 KB Flash holds the BCM firmware stack including CAN bootloader, diagnostic services, and door/lamp/window control logic without external memory. The 50 MHz S12X core with XGATE co-processor handles CAN message filtering and debounce timing while the main CPU runs multi-channel PWM for lamp-dimming. Operating range -40C to +125C allows placement inside cabin or rear-trunk ECUs. Per NXP reference designs, the 3x MSCAN bridges connect to chassis CAN and powertrain CAN simultaneously.
Recomendado
HVAC Climate Control ECU
The S12X core's 50 MHz headroom with hardware multiply supports PID climate-loop math at 10 ms update rates while running CAN communication for HVAC panel and blower control. Flash capacity (256 KB) fits the lookup-table-based airflow and temperature-target algorithms plus diagnostic service stack. According to NXP application note AN3891, the S12XE family's PWM frequency covers the blower and mode-door motor control range without an external driver MCU.
Recomendado
Automotive Instrument Cluster Display
The 50 MHz S12X core drives CAN messaging (RPM, speed, fuel level) and steers LCD-segment or stepper-motor gauges inside the cluster. 256 KB of Flash accommodates gauge graphics, custom warning logic, and the CAN diagnostic interpreter. The XGATE co-processor pre-processes incoming CAN frames in parallel with main-loop duty cycles, keeping 50 ms display refresh jitter-free per S12XE datasheet benchmarks.
Recomendado
CAN-Based Sensor Node
For distributed sensor nodes (occupant detection, rain-light sensor, tire pressure monitoring satellite), the S912XET256W1MAGR integrates CAN MSCAN plus SPI/I2C interfaces for sensor readout. According to NXP automotive reference designs, the BDM (single-wire background debug mode) simplifies in-vehicle module calibration via the service connector. 256 KB Flash reserves room for CAN bootloaders needed for end-of-line firmware updates.
Recomendado
Motor Control Front-End (BLDC/PMSM Drivers)
The S12X core with hardware multiply/divide and 12-bit ADC pairs with PWM modules to run field-oriented control of small BLDC motors for HVAC blowers or coolant pumps. Per the S12XE family reference manual, 8/16-bit PWM dead-time insertion and center-aligned modes are optimized for motor drive without external logic. The 50 MHz compute budget cycles at 10 us FOC updates while leaving 30 percent CPU time for CAN housekeeping.
Recomendado
Automotive Lighting Controller (LED Matrix / Adaptive Headlamp)
The S12X core's PWMs and timers drive multi-channel LED arrays with dimming and matrix-beam switching at CAN-update rates. 256 KB Flash accommodates the matrix-segment LUT and adaptive-beam state machine. AEC-Q100 qualification and the 144-LQFP package's GPIO count (over 100) let one MCU drive 30+ LED strings without external shift registers, per NXP S12XE application briefs.
Recomendado
Chassis Gateway / Network Bridge
With three MSCAN modules, the S912XET256W1MAGR acts as a CAN-to-CAN gateway bridging powertrain CAN, chassis CAN, and diagnostic CAN. The XGATE co-processor accelerates frame transfer between buses without CPU bottleneck. Per NXP application notes, the S12X core's GPIO count and external bus interface allow additional LIN or FlexRay supplementary channels via companion transceivers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S912XET256W1MAGR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S912XET256W1MAG | S912XEQ512J2MAL | MC9S12XEQ512CAG |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors (same brand) | NXP Semiconductors (same brand) | NXP Semiconductors (same brand) |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core | HCS12X 16-bit + XGATE | HCS12X + XGATE (same) | HCS12X + XGATE (same) | HCS12X + XGATE (same) |
| Flash Memory | 256 KB | 256 KB (same) | 512 KB (+100%) | 512 KB (+100%) |
| Max CPU Frequency | 50 MHz | 50 MHz (same) | 50 MHz (same) | 50 MHz (same) |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +125C (Automotive) - same | -40C to +125C (Automotive) - same | -40C to +125C (Automotive) - same |
| CAN Modules (MSCAN) | Up to 3 | Up to 3 (same) | Up to 3 (same) | Up to 3 (same) |
| Packaging Format | Tape and Reel (R suffix) | Tray (no R suffix) | Tray | Tray |
| Qualification | AEC-Q100 | AEC-Q100 - same | AEC-Q100 - same | AEC-Q100 - same |
Principais diferenciais
- R-suffix tape-and-reel packaging (vs S912XET256W1MAG)
- XGATE co-processor for interrupt acceleration (vs MC9S08AC8MFGE)
- 256 KB Flash at 50 MHz with -40/+125C grade (vs MC9S12XHZ256VAG)
Notas de projeto
The S912XET256W1MAGR requires separate decoupling on VDDR (5V IO supply) and VDD1/VSS1/VDDA/VSSA pairs. Use 100 nF ceramic decoupling caps as close as possible to each power pin, plus a 10 uF bulk capacitor near the IC. The 5V analog supply (VDDA) should be filtered with an additional ferrite bead from VDDR to suppress switching noise from the digital core. Per NXP S12XE hardware guidelines, the PLL requires a clean oscillator supply and decoupling capacitance as shown in the S12XE family reference manual.
Always verify the latest NXP errata sheet for the S12XE family before committing to high-volume designs. Known errata include workarounds for specific MSCAN FIFO and PWM duty cycle behaviors that have been addressed in newer revisions. Note the part marking on the package indicates revision; firmware masks must match the silicon revision per NXP application note AN3891.
Place the 144-LQFP land pattern with at least 4-layer PCB and a continuous ground plane beneath the IC. Route the high-current CAN traces first with matched impedance to the TJA1057 or similar transceiver, keeping them at least 5 mm away from analog signal lines. The oscillator traces (OSC1/OSC2) must be routed short with surrounding ground flood. Per NXP hardware design tips, ensure the BKGD pin is accessible via a header or testpad for in-circuit debug.
Estimated: At 50 MHz CPU frequency, 5V supply, and typical automotive application activity ratio, the 144-LQFP junction temperature rises approximately 15-25 C above ambient under full load, depending on PCB copper area around the part. AEC-Q100 grade 0 silicon is rated to +150C junction. For under-the-hood applications exceeding 85C ambient, ensure thermal relief in the form of PCB thermal vias and copper pours.
Informações de conformidade
AEC-Q100 automotive qualified per NXP product page. RoHS and lead-free compliant per distributor listings. The 'W' device code designates -40C to +125C automotive grade 0 silicon per NXP S12XE ordering guide.
