S912XET256W1MAGR - 16-Bit 50MHz 256KB Flash S12X MCU | NXP
Référence : S912XET256W1MAGR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.37 | $14,37 |
| 10 | $13.04 | $130,40 |
| 100 | $11.71 | $1 171,00 |
| 500 | $10.38 | $5 190,00 |
| 1 000 | $9.05 | $9 050,00 |
S912XET256W1MAGR Présentation
What is a 16-bit MCU? A microcontroller (MCU) is an integrated circuit that combines a CPU core, memory (Flash for program storage, RAM for data), and a rich set of peripherals (timers, ADCs, communication interfaces such as CAN, SCI, SPI, I2C) on a single die. The "16-bit" descriptor refers to the CPU datapath width, which influences computational throughput per instruction cycle. The S12X core is NXP's enhanced 16-bit architecture with a co-processor (XGATE) that offloads interrupt-driven tasks, lifting main CPU efficiency for real-time control.
Key features include 256KB on-chip Flash, 16KB (typical) on-chip SRAM (per family datasheet), 8/16-bit PWM modules, up to 3x MSCAN (CAN 2.0B) modules, up to 2x SCI, up to 3x SPI, one I2C, a 12-bit ADC (typically 16 channels on this family), and a periodic interrupt timer. The 144-pin LQFP package (20x20 mm body, 0.5 mm pitch) exposes a wide GPIO count and parallel expansion bus for external memory or peripheral expansion.
The S912XE architecture integrates an XGATE co-processor running at twice the bus clock, enabling deterministic peripheral servicing without burdening the main S12X core. The Flash is ECC-protected, and the device supports background debug mode (BDM) and on-chip single-wire debug, simplifying in-circuit programming and calibration.
Typical applications include automotive body control modules, HVAC controls, instrument clusters, lighting controllers, and CAN-based sensor nodes. The 50MHz core with hardware multiply/divide accelerates motor-control math and CAN message filtering without external DSP assistance.
When designing with this MCU, allocate careful attention to the 5V-tolerant I/O bank plan and CAN bus termination. Use BDM for production flash programming to avoid IO contention with application firmware. Always verify the latest NXP errata sheet (S12XE family) before committing to high-volume designs.
Alternatives de remplacement direct pour S912XET256W1MAGR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XET256W1MAGR (même facteur de forme et même empreinte) — différant par ADC, Operating Temperature, Package, Mounting Type, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912XET256W1MAG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XEQ512J2MAL
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →MC9S12XEQ512CAG
✅ Remplacement direct✓ En stock
$14.4 / unité
Voir la fiche technique →MC9S12XEP768J4CAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XHZ256VAG
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →S912XET256W1MAGR Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12X (16-bit, XGATE co-processor) |
| Core Frequency | 50 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Température de fonctionnement | -40C to +125C (Automotive Grade) |
| Boîtier | 144-LQFP (20x20 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Nombre de broches | 144 |
| Terminal Form | GULL WING |
| Lead Finish | Matte Tin (Tape and Reel) |
| Qualification | AEC-Q100 Automotive |
| CAN Modules (MSCAN) | Up to 3 (typical of S12XE 144-pin family) |
| SCI / SPI / I2C | 2 / 3 / 1 (per family datasheet) |
| ADC | 12-bit, multi-channel (per family datasheet) |
| PWM Channels | 8/16-bit PWM modules (per family datasheet) |
| Debug Interface | BDM (Background Debug Mode) |
| Statut RoHS | Compliant (per data sheet family) |
Configuration des broches de S912XET256W1MAGR
| Broche 1 | VSS1 — Ground 1 (digital) |
| Broche 2 | VDD1 — Digital supply 1 (5V core) |
| Broche 3 | OSC1 — Crystal oscillator input |
| Broche 4 | OSC2 — Crystal oscillator output |
| Broche 5 | RESET — External reset input (active low) |
| Broche 6 | TEST — Test mode / VPP |
| Broche 7 | BKGD — Background Debug Mode (single-wire) |
| Broche 8 | PAD0 — PWM / Timer channel A0 |
| Broche 9 | PAD1 — PWM / Timer channel A1 |
| Broche 10 | PAD2 — PWM / Timer channel A2 |
| Broche 11 | PAD3 — PWM / Timer channel A3 |
| Broche 12 | PAD4 — PWM / Timer channel A4 |
| Broche 13 | PAD5 — PWM / Timer channel A5 |
| Broche 14 | PAD6 — PWM / Timer channel A6 |
| Broche 15 | PAD7 — PWM / Timer channel A7 |
| Broche 16 | PJ0 — GPIO / SPI control |
| Broche 17 | PJ1 — GPIO / SPI control |
| Broche 18 | PJ2 — GPIO / SPI control |
| Broche 19 | PJ3 — GPIO / SPI control |
| Broche 20 | PJ4 — GPIO / SPI control |
| Broche 21 | PJ5 — GPIO / SPI control |
| Broche 22 | PJ6 — GPIO / SPI control |
| Broche 23 | PJ7 — GPIO / SPI control |
| Broche 24 | PK0 — GPIO / SPI control |
| Broche 25 | PK1 — GPIO / SPI control |
| Broche 26 | PK2 — GPIO / SPI control |
| Broche 27 | PK3 — GPIO / SPI control |
| Broche 28 | PK4 — GPIO / SPI control |
| Broche 29 | PK5 — GPIO / SPI control |
| Broche 30 | PK6 — GPIO / SPI control |
| Broche 31 | PK7 — GPIO / SPI control |
| Broche 32 | PA0 — GPIO / Address bus low |
| Broche 33 | PA1 — GPIO / Address bus low |
| Broche 34 | PA2 — GPIO / Address bus low |
| Broche 35 | PA3 — GPIO / Address bus low |
| Broche 36 | PA4 — GPIO / Address bus low |
| Broche 37 | PA5 — GPIO / Address bus low |
| Broche 38 | PA6 — GPIO / Address bus low |
| Broche 39 | PA7 — GPIO / Address bus low |
| Broche 40 | PB0 — GPIO / Address bus high |
| Broche 41 | PB1 — GPIO / Address bus high |
| Broche 42 | PB2 — GPIO / Address bus high |
| Broche 43 | PB3 — GPIO / Address bus high |
| Broche 44 | PB4 — GPIO / Address bus high |
| Broche 45 | PB5 — GPIO / Address bus high |
| Broche 46 | PB6 — GPIO / Address bus high |
| Broche 47 | PB7 — GPIO / Address bus high |
| Broche 48 | PC0 — GPIO / Data bus |
| Broche 49 | PC1 — GPIO / Data bus |
| Broche 50 | PC2 — GPIO / Data bus |
| Broche 51 | PC3 — GPIO / Data bus |
| Broche 52 | PC4 — GPIO / Data bus |
| Broche 53 | PC5 — GPIO / Data bus |
| Broche 54 | PC6 — GPIO / Data bus |
| Broche 55 | PC7 — GPIO / Data bus |
| Broche 56 | PD0 — GPIO / Data bus |
| Broche 57 | PD1 — GPIO / Data bus |
| Broche 58 | PD2 — GPIO / Data bus |
| Broche 59 | PD3 — GPIO / Data bus |
| Broche 60 | PD4 — GPIO / Data bus |
| Broche 61 | PD5 — GPIO / Data bus |
| Broche 62 | PD6 — GPIO / Data bus |
| Broche 63 | PD7 — GPIO / Data bus |
| Broche 64 | VDDR — I/O supply voltage (5V) |
| Broche 65 | VSS2 — Ground 2 (digital) |
| Broche 66 | PE0 — GPIO / SCI / SPI |
| Broche 67 | PE1 — GPIO / SCI / SPI |
| Broche 68 | PE2 — GPIO / SCI / SPI |
| Broche 69 | PE3 — GPIO / SCI / SPI |
| Broche 70 | PE4 — GPIO / SCI / SPI |
| Broche 71 | PE5 — GPIO / SCI / SPI |
| Broche 72 | PE6 — GPIO / SCI / SPI |
| Broche 73 | PE7 — GPIO / SCI / SPI |
| Broche 74 | PF0 — GPIO / PWM ECT |
| Broche 75 | PF1 — GPIO / PWM ECT |
| Broche 76 | PF2 — GPIO / PWM ECT |
| Broche 77 | PF3 — GPIO / PWM ECT |
| Broche 78 | PF4 — GPIO / PWM ECT |
| Broche 79 | PF5 — GPIO / PWM ECT |
| Broche 80 | PF6 — GPIO / PWM ECT |
| Broche 81 | PF7 — GPIO / PWM ECT |
| Broche 82 | PG0 — GPIO / PWM ECT |
| Broche 83 | PG1 — GPIO / PWM ECT |
| Broche 84 | PG2 — GPIO / PWM ECT |
| Broche 85 | PG3 — GPIO / PWM ECT |
| Broche 86 | PG4 — GPIO / PWM ECT |
| Broche 87 | PG5 — GPIO / PWM ECT |
| Broche 88 | PG6 — GPIO / PWM ECT |
| Broche 89 | PG7 — GPIO / PWM ECT |
| Broche 90 | PH0 — GPIO / CAN / SCI |
| Broche 91 | PH1 — GPIO / CAN / SCI |
| Broche 92 | PH2 — GPIO / CAN / SCI |
| Broche 93 | PH3 — GPIO / CAN / SCI |
| Broche 94 | PH4 — GPIO / CAN / SCI |
| Broche 95 | PH5 — GPIO / CAN / SCI |
| Broche 96 | PH6 — GPIO / CAN / SCI |
| Broche 97 | PH7 — GPIO / CAN / SCI |
| Broche 98 | PI0 — GPIO / CAN / SCI |
| Broche 99 | PI1 — GPIO / CAN / SCI |
| Broche 100 | PI2 — GPIO / CAN / SCI |
| Broche 101 | PI3 — GPIO / CAN / SCI |
| Broche 102 | PI4 — GPIO / CAN / SCI |
| Broche 103 | PI5 — GPIO / CAN / SCI |
| Broche 104 | PI6 — GPIO / CAN / SCI |
| Broche 105 | PI7 — GPIO / CAN / SCI |
| Broche 106 | TXCAN0 — CAN0 transmit output |
| Broche 107 | RXCAN0 — CAN0 receive input |
| Broche 108 | TXCAN1 — CAN1 transmit output |
| Broche 109 | RXCAN1 — CAN1 receive input |
| Broche 110 | TXCAN2 — CAN2 transmit output |
| Broche 111 | RXCAN2 — CAN2 receive input |
| Broche 112 | TXD0 — SCI0 transmit output |
| Broche 113 | RXD0 — SCI0 receive input |
| Broche 114 | TXD1 — SCI1 transmit output |
| Broche 115 | RXD1 — SCI1 receive input |
| Broche 116 | MOSI0 — SPI0 master-out slave-in |
| Broche 117 | MISO0 — SPI0 master-in slave-out |
| Broche 118 | SCK0 — SPI0 serial clock |
| Broche 119 | SS0 — SPI0 slave select |
| Broche 120 | SDA — I2C data |
| Broche 121 | SCL — I2C clock |
| Broche 122 | AN0 — ADC analog input 0 |
| Broche 123 | AN1 — ADC analog input 1 |
| Broche 124 | AN2 — ADC analog input 2 |
| Broche 125 | AN3 — ADC analog input 3 |
| Broche 126 | AN4 — ADC analog input 4 |
| Broche 127 | AN5 — ADC analog input 5 |
| Broche 128 | AN6 — ADC analog input 6 |
| Broche 129 | AN7 — ADC analog input 7 |
| Broche 130 | VRH — ADC high reference voltage |
| Broche 131 | VRL — ADC low reference voltage |
| Broche 132 | VDDA — Analog supply |
| Broche 133 | VSSA — Analog ground |
| Broche 134 | TCLK — ECT external clock input |
| Broche 135 | IOC0 — Capture / compare input |
| Broche 136 | IOC1 — Capture / compare input |
| Broche 137 | IOC2 — Capture / compare input |
| Broche 138 | IOC3 — Capture / compare input |
| Broche 139 | IOC4 — Capture / compare input |
| Broche 140 | IOC5 — Capture / compare input |
| Broche 141 | IOC6 — Capture / compare input |
| Broche 142 | IOC7 — Capture / compare input |
| Broche 143 | PLLCLK — PLL clock output / test |
| Broche 144 | NC — Not connected (per package datasheet) |
Applications typiques
S912XET256W1MAGR convient pour 7 applications: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Automotive Instrument Cluster Display, CAN-Based Sensor Node, Motor Control Front-End (BLDC/PMSM Drivers), Automotive Lighting Controller (LED Matrix / Adaptive Headlamp), Chassis Gateway / Network Bridge.
Automotive Body Control Module (BCM)
The S912XET256W1MAGR's 256 KB Flash holds the BCM firmware stack including CAN bootloader, diagnostic services, and door/lamp/window control logic without external memory. The 50 MHz S12X core with XGATE co-processor handles CAN message filtering and debounce timing while the main CPU runs multi-channel PWM for lamp-dimming. Operating range -40C to +125C allows placement inside cabin or rear-trunk ECUs. Per NXP reference designs, the 3x MSCAN bridges connect to chassis CAN and powertrain CAN simultaneously.
Recommandé
HVAC Climate Control ECU
The S12X core's 50 MHz headroom with hardware multiply supports PID climate-loop math at 10 ms update rates while running CAN communication for HVAC panel and blower control. Flash capacity (256 KB) fits the lookup-table-based airflow and temperature-target algorithms plus diagnostic service stack. According to NXP application note AN3891, the S12XE family's PWM frequency covers the blower and mode-door motor control range without an external driver MCU.
Recommandé
Automotive Instrument Cluster Display
The 50 MHz S12X core drives CAN messaging (RPM, speed, fuel level) and steers LCD-segment or stepper-motor gauges inside the cluster. 256 KB of Flash accommodates gauge graphics, custom warning logic, and the CAN diagnostic interpreter. The XGATE co-processor pre-processes incoming CAN frames in parallel with main-loop duty cycles, keeping 50 ms display refresh jitter-free per S12XE datasheet benchmarks.
Recommandé
CAN-Based Sensor Node
For distributed sensor nodes (occupant detection, rain-light sensor, tire pressure monitoring satellite), the S912XET256W1MAGR integrates CAN MSCAN plus SPI/I2C interfaces for sensor readout. According to NXP automotive reference designs, the BDM (single-wire background debug mode) simplifies in-vehicle module calibration via the service connector. 256 KB Flash reserves room for CAN bootloaders needed for end-of-line firmware updates.
Recommandé
Motor Control Front-End (BLDC/PMSM Drivers)
The S12X core with hardware multiply/divide and 12-bit ADC pairs with PWM modules to run field-oriented control of small BLDC motors for HVAC blowers or coolant pumps. Per the S12XE family reference manual, 8/16-bit PWM dead-time insertion and center-aligned modes are optimized for motor drive without external logic. The 50 MHz compute budget cycles at 10 us FOC updates while leaving 30 percent CPU time for CAN housekeeping.
Recommandé
Automotive Lighting Controller (LED Matrix / Adaptive Headlamp)
The S12X core's PWMs and timers drive multi-channel LED arrays with dimming and matrix-beam switching at CAN-update rates. 256 KB Flash accommodates the matrix-segment LUT and adaptive-beam state machine. AEC-Q100 qualification and the 144-LQFP package's GPIO count (over 100) let one MCU drive 30+ LED strings without external shift registers, per NXP S12XE application briefs.
Recommandé
Chassis Gateway / Network Bridge
With three MSCAN modules, the S912XET256W1MAGR acts as a CAN-to-CAN gateway bridging powertrain CAN, chassis CAN, and diagnostic CAN. The XGATE co-processor accelerates frame transfer between buses without CPU bottleneck. Per NXP application notes, the S12X core's GPIO count and external bus interface allow additional LIN or FlexRay supplementary channels via companion transceivers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XET256W1MAGR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912XET256W1MAG | S912XEQ512J2MAL | MC9S12XEQ512CAG |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors (same brand) | NXP Semiconductors (same brand) | NXP Semiconductors (same brand) |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core | HCS12X 16-bit + XGATE | HCS12X + XGATE (same) | HCS12X + XGATE (same) | HCS12X + XGATE (same) |
| Flash Memory | 256 KB | 256 KB (same) | 512 KB (+100%) | 512 KB (+100%) |
| Max CPU Frequency | 50 MHz | 50 MHz (same) | 50 MHz (same) | 50 MHz (same) |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +125C (Automotive) - same | -40C to +125C (Automotive) - same | -40C to +125C (Automotive) - same |
| CAN Modules (MSCAN) | Up to 3 | Up to 3 (same) | Up to 3 (same) | Up to 3 (same) |
| Packaging Format | Tape and Reel (R suffix) | Tray (no R suffix) | Tray | Tray |
| Qualification | AEC-Q100 | AEC-Q100 - same | AEC-Q100 - same | AEC-Q100 - same |
Principaux différenciateurs
- R-suffix tape-and-reel packaging (vs S912XET256W1MAG)
- XGATE co-processor for interrupt acceleration (vs MC9S08AC8MFGE)
- 256 KB Flash at 50 MHz with -40/+125C grade (vs MC9S12XHZ256VAG)
Notes de conception
The S912XET256W1MAGR requires separate decoupling on VDDR (5V IO supply) and VDD1/VSS1/VDDA/VSSA pairs. Use 100 nF ceramic decoupling caps as close as possible to each power pin, plus a 10 uF bulk capacitor near the IC. The 5V analog supply (VDDA) should be filtered with an additional ferrite bead from VDDR to suppress switching noise from the digital core. Per NXP S12XE hardware guidelines, the PLL requires a clean oscillator supply and decoupling capacitance as shown in the S12XE family reference manual.
Always verify the latest NXP errata sheet for the S12XE family before committing to high-volume designs. Known errata include workarounds for specific MSCAN FIFO and PWM duty cycle behaviors that have been addressed in newer revisions. Note the part marking on the package indicates revision; firmware masks must match the silicon revision per NXP application note AN3891.
Place the 144-LQFP land pattern with at least 4-layer PCB and a continuous ground plane beneath the IC. Route the high-current CAN traces first with matched impedance to the TJA1057 or similar transceiver, keeping them at least 5 mm away from analog signal lines. The oscillator traces (OSC1/OSC2) must be routed short with surrounding ground flood. Per NXP hardware design tips, ensure the BKGD pin is accessible via a header or testpad for in-circuit debug.
Estimated: At 50 MHz CPU frequency, 5V supply, and typical automotive application activity ratio, the 144-LQFP junction temperature rises approximately 15-25 C above ambient under full load, depending on PCB copper area around the part. AEC-Q100 grade 0 silicon is rated to +150C junction. For under-the-hood applications exceeding 85C ambient, ensure thermal relief in the form of PCB thermal vias and copper pours.
Informations de conformité
AEC-Q100 automotive qualified per NXP product page. RoHS and lead-free compliant per distributor listings. The 'W' device code designates -40C to +125C automotive grade 0 silicon per NXP S12XE ordering guide.
