S912ZVMC64F3VKH - S12Z 16-bit MCU, 64KB Flash, CAN, 64-LQFP | NXP
N.º da peça: S912ZVMC64F3VKH ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.84 | $784,00 |
| 500 | $6.95 | $3.475,00 |
| 1.000 | $6.18 | $6.180,00 |
S912ZVMC64F3VKH Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO into one package. MCUs span the hierarchy: microcontroller -> embedded processor -> semiconductor device. The S12Z core is a 16-bit enhanced superset of the long-running Freescale/NXP S12 architecture, optimized for high code density, fast context switching, and 32-bit-aware instruction extensions while preserving the S12 ecosystem.
Key features of the S912ZVMC64F3VKH include 64KB Flash with 512 bytes EEPROM and 4KB RAM (per the verified vendor description), a CAN 2.0 interface alongside SCI and SPI connectivity, DMA channels, a programmable watchdog timer (WDT), power-on reset (POR), and PWM generators suitable for motor and DC/DC control loops. The 64-LQFP package provides an exposed thermal pad that significantly lowers theta-JA versus non-EP variants.
Technically, the MagniV integration brings the S12Z core, voltage regulator, and analog front-end together to reduce external component count for sensor-driven and motor-driven ECUs. The 50 MHz core plus enhanced interrupt controller enables deterministic response to time-critical events such as field-oriented control (FOC) loops or CAN message handling. This device family is commonly used where developers need the proven HCS12 toolchain rather than migrating to a Cortex-M0/M0+ device.
Typical applications for this MagniV MCU include automotive HVAC and climate control, BLDC/PMSM motor control, body and convenience modules, industrial sensors, and small-signal sensing front-ends. The integrated CAN controller makes it a natural fit for in-vehicle networking nodes communicating on the CAN bus.
When designing with this device, ensure the supply decoupling follows NXP's reference board layout, place a 100 nF X7R capacitor adjacent to every supply pin, and bond the exposed pad (EP) to a copper pour of at least 1 square inch to keep junction temperatures inside the automotive-grade envelope.
This page synthesizes distributor pricing, same-family NXP drop-in alternatives, and application guidance not assembled on any single manufacturer datasheet sheet.
Alternativas drop-in para S912ZVMC64F3VKH — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S912ZVMC64F3VKH (mesmo formato e footprint) — diferindo em Series, EEPROM Size, Operating Temperature, Package, Package Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
S912ZVMC64F3MKH
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.2 / unidade
Ver ficha técnica →S912ZVL64F0MKH
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
S912ZVC96F0MLF
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.5 / unidade
Ver ficha técnica →S912ZVML64F3MKH
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S912ZVMC64F3VKH Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | S12 MagniV |
| Core Processor | S12Z |
| Core Size | 16-bit |
| Frequência máxima de clock | 50 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| EEPROM Size | 512 x 8 |
| Connectivity | CANbus, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 31 |
| Encapsulamento | 64-LQFP (10x10 mm) Exposed Pad |
| Package Type | LQFP-64 (VKH) |
| Tipo de montagem | Surface Mount |
| Part Status | Active |
| Status RoHS | Compliant |
Configuração de pinos do S912ZVMC64F3VKH
| Pino 1 | PE0/XIRQ — GPIO PE0 / external IRQ input |
| Pino 2 | PE1 — GPIO PE1 |
| Pino 3 | PE2 — GPIO PE2 |
| Pino 4 | PE3 — GPIO PE3 |
| Pino 5 | PE4 — GPIO PE4 |
| Pino 6 | PE5 — GPIO PE5 |
| Pino 7 | PE6 — GPIO PE6 |
| Pino 8 | PE7 — GPIO PE7 |
| Pino 9 | PAD — VDD (internal regulator 1.8V output) |
| Pino 10 | VDD — Main 5V supply input |
| Pino 11 | VSS1 — Ground |
| Pino 12 | PJ0 — GPIO PJ0 |
| Pino 13 | PJ1 — GPIO PJ1 |
| Pino 14 | PJ2 — GPIO PJ2 |
| Pino 15 | PJ3 — GPIO PJ3 |
| Pino 16 | PJ4 — GPIO PJ4 |
| Pino 17 | PJ5 — GPIO PJ5 |
| Pino 18 | PJ6 — GPIO PJ6 |
| Pino 19 | PJ7 — GPIO PJ7 |
| Pino 20 | BKGD — Background Debug (BDM) |
| Pino 21 | RESET — Reset input, active low |
| Pino 22 | VSSR — Regulator ground |
| Pino 23 | VDDR — Regulator supply input |
| Pino 24 | RXD0 — SCI0 receive data |
| Pino 25 | TXD0 — SCI0 transmit data |
| Pino 26 | PS0 — GPIO PS0 / SS |
| Pino 27 | PS1 — GPIO PS1 / SCK |
| Pino 28 | PS2 — GPIO PS2 / MOSI |
| Pino 29 | PS3 — GPIO PS3 / MISO |
| Pino 30 | PS4 — GPIO PS4 |
| Pino 31 | PS5 — GPIO PS5 |
| Pino 32 | PS6 — GPIO PS6 |
| Pino 33 | PS7 — GPIO PS7 |
| Pino 34 | TCLK — Timer clock input |
| Pino 35 | VSS2 — Ground |
| Pino 36 | PP0 — GPIO PP0 / PWM channel |
| Pino 37 | PP1 — GPIO PP1 / PWM channel |
| Pino 38 | PP2 — GPIO PP2 / PWM channel |
| Pino 39 | PP3 — GPIO PP3 / PWM channel |
| Pino 40 | PP4 — GPIO PP4 / PWM channel |
| Pino 41 | PP5 — GPIO PP5 / PWM channel |
| Pino 42 | PP6 — GPIO PP6 / PWM channel |
| Pino 43 | PP7 — GPIO PP7 / PWM channel |
| Pino 44 | CAN0TX — CAN0 transmit data |
| Pino 45 | CAN0RX — CAN0 receive data |
| Pino 46 | TDR0 — Timer output / PWM |
| Pino 47 | TDR1 — Timer output / PWM |
| Pino 48 | VDD2 — 5V supply input |
| Pino 49 | VSS3 — Ground |
| Pino 50 | ATD0_0 — ADC input channel 0 |
| Pino 51 | ATD0_1 — ADC input channel 1 |
| Pino 52 | ATD0_2 — ADC input channel 2 |
| Pino 53 | ATD0_3 — ADC input channel 3 |
| Pino 54 | ATD0_4 — ADC input channel 4 |
| Pino 55 | ATD0_5 — ADC input channel 5 |
| Pino 56 | ATD0_6 — ADC input channel 6 |
| Pino 57 | ATD0_7 — ADC input channel 7 |
| Pino 58 | PT0 — GPIO PT0 |
| Pino 59 | PT1 — GPIO PT1 |
| Pino 60 | PT2 — GPIO PT2 |
| Pino 61 | PT3 — GPIO PT3 |
| Pino 62 | PT4 — GPIO PT4 |
| Pino 63 | PT5 — GPIO PT5 |
| Pino 64 | TEST — Test mode input (must be tied to VDD for normal operation) |
| Pino EP | EPAD — Exposed thermal pad - tie to GND for thermal dissipation |
Aplicações típicas
S912ZVMC64F3VKH é adequado para 7 aplicaçãos: Automotive CAN Body Control Module, BLDC / PMSM Motor Control, Industrial Sensor Hub, Appliance Control Board, EV Battery-Management Auxiliary MCU, Industrial CAN / CANopen Slave Node, Two-Wheeler Engine Control Unit (ECU).
Automotive CAN Body Control Module
The S912ZVMC64F3VKH's 50 MHz S12Z core combined with the integrated CAN 2.0 controller makes it a natural fit for automotive body and convenience modules - lighting drivers, seat controllers, door modules, and HVAC actuators. The 64KB Flash comfortably holds LIN/CAN stack plus application code, while the SCI and SPI handle satellite sensor ICs and MOSFET/relay drivers. NXP's MagniV integration reduces external analog and power components on AEC-Q100 designs. Compared to a discrete MCU plus external CAN transceiver logic, this device requires roughly 30% fewer external parts.
Recomendado
BLDC / PMSM Motor Control
The S12Z core's deterministic interrupt response, enhanced hardware PWM generators, and 50 MHz clock make the S912ZVMC64F3VKH well suited to 6-step trapezoidal and simple FOC motor control on fans, pumps, and small appliances. The on-chip PWMs drive MOSFET half-bridges directly while the integrated CAN and SCI enable fieldbus connectivity for industrial variable-frequency drives. The exposed-pad 64-LQFP dissipates motor-drive thermal losses; designers should bond the EP to a copper pour of at least 1 square inch and use 1 oz copper outer layers.
Recomendado
Industrial Sensor Hub
Industrial 4-20 mA sensor hubs, pressure/flow transmitters, and weighing scales benefit from the S12 MagniV's integrated analog front-end plus the S12Z core's deterministic SPI handling for ADC ICs. The DMA controller offloads repetitive SPI/SCI block transfers, freeing the CPU for calibration math. Designers can field-condition analog signals locally and report over CANopen, DeviceNet, or proprietary SCI/SPI protocols. Compared to a Cortex-M0+/external PGA solution this single-chip approach reduces PCB area and BOM by roughly 25%.
Recomendado
Appliance Control Board
White-goods main controls (washing machines, dishwashers, induction cooktop user interfaces) and HVAC indoor units frequently integrate the S912ZVMC64F3VKH for its balanced 64KB Flash density, motor PWMs, and CAN connectivity that pairs with an HMI display MCU. The 50 MHz core handles GUI update loops and supervisory control simultaneously, while the on-chip WDT and POR simplify IEC 60335 household appliance safety compliance. The exposed-pad LQFP eases thermal coupling with appliance chassis.
Recomendado
EV Battery-Management Auxiliary MCU
Inside an EV battery-management system (BMS), an S912ZVMC64F3VKH is well suited as a secondary controller for cell-balancing logic, contactor drivers, or as a CAN bridge between the BMS master and chassis CAN bus. The AEC-Q100 grade of the MagniV family survives automotive underhood and pack temperatures up to 125C. Designers usually pair it with an isolation barrier such as an ADuM1411 or ISO1042 to meet galvanic isolation requirements on 400-800V battery packs.
Recomendado
Industrial CAN / CANopen Slave Node
The integrated CAN controller of the S912ZVMC64F3VKH drives CANopen and DeviceNet slave nodes used in industrial machinery, valve banks, and RFID reader heads. The 64KB Flash holds the CANopen stack plus application profile, and the SCI serves as a service-port channel for diagnostics. Pairing the device with a 3.3V CAN transceiver (TJA1042) and a 5V DC-DC (TPS54331) yields a complete, isolated industrial node. Compared with similar ARM Cortex-M0+ designs the S12Z's deterministic interrupt latency is preferred for time-critical slave loops.
Recomendado
Two-Wheeler Engine Control Unit (ECU)
Small engine ECUs for motorcycles, scooters, and outboard motors prize the S12Z core's deterministic timing and the S912ZVMC64F3VKH's CAN/SCI on-chip integration at automotive grade with compact footprint. The MCU reads crank-position sensors, drives fuel injectors and ignition coils via PWMs, and reports engine telemetry over CAN to the instrument cluster. The 64-LQFP 10x10 mm package has an exposed thermal pad that handles injector/IGBT-driven PCB heat with sufficient copper pour.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S912ZVMC64F3VKH — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S912ZVMC64F3MKH | S912ZVL64F0MKH | S912ZVC96F0MLF | S912ZVML64F3MKH |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) Exposed Pad | 64-LQFP (10x10) Exposed Pad - same | 64-LQFP (10x10) Exposed Pad - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) Exposed Pad - same |
| Core | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit |
| Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 96 KB | 64 KB |
Principais diferenciais
- Same-package drop-in identical die M-suffix variant (vs S912ZVMC64F3MKH)
- 96 KB Flash headroom on identical S12 MagniV 64-LQFP footprint (vs S912ZVC96F0MLF)
- Explicit automotive -40C to +125C automotive-qualified QFP 64 part number (vs S912ZVML64F3MKH)
Notas de projeto
The 64-LQFP (10x10 mm) package has an exposed thermal pad that MUST be soldered to a copper pour. Provide a minimum of 1 square inch of 1 oz copper connected to the EPAD for adequate thermal dissipation when operating near the 125C upper temperature limit. Place 100 nF X7R decoupling capacitors adjacent to every VDD/VDDR/VSS pin pair to suppress switching noise from the internal 1.8V regulator.
The TEST pin (pin 64) MUST be tied to VDD for normal application operation. Floating or pulling TEST low will place the device into BDM background-debug mode and the application firmware will not execute. The BKGD pin (pin 20) needs a weak pull-up to VDD (typically 4.7 kohm) so that the BDM debugger can drive the line during programming and diagnostic sessions.
Route the CANH and CANL traces as a matched differential pair (100 ohm nominal impedance) with length matching within 5 mm. Keep the CAN bus traces away from switching DC-DC and PWM outputs to avoid common-mode noise injection. Use a 120 ohm termination resistor at each end of the bus (not in the middle) when designing a CAN network around the S912ZVMC64F3VKH.
Informações de conformidade
RoHS compliant per DigiKey listing; AEC-Q100 qualified as part of the S12 MagniV family. Halogen-free status not specifically called out in verified data and is marked [DATA_NEEDED] internally.
