S912ZVMC64F3VKH - S12Z 16-bit MCU, 64KB Flash, CAN, 64-LQFP | NXP
부품 번호: S912ZVMC64F3VKH ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.92 | $89.20 |
| 100 | $7.84 | $784.00 |
| 500 | $6.95 | $3,475.00 |
| 1,000 | $6.18 | $6,180.00 |
S912ZVMC64F3VKH 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO into one package. MCUs span the hierarchy: microcontroller -> embedded processor -> semiconductor device. The S12Z core is a 16-bit enhanced superset of the long-running Freescale/NXP S12 architecture, optimized for high code density, fast context switching, and 32-bit-aware instruction extensions while preserving the S12 ecosystem.
Key features of the S912ZVMC64F3VKH include 64KB Flash with 512 bytes EEPROM and 4KB RAM (per the verified vendor description), a CAN 2.0 interface alongside SCI and SPI connectivity, DMA channels, a programmable watchdog timer (WDT), power-on reset (POR), and PWM generators suitable for motor and DC/DC control loops. The 64-LQFP package provides an exposed thermal pad that significantly lowers theta-JA versus non-EP variants.
Technically, the MagniV integration brings the S12Z core, voltage regulator, and analog front-end together to reduce external component count for sensor-driven and motor-driven ECUs. The 50 MHz core plus enhanced interrupt controller enables deterministic response to time-critical events such as field-oriented control (FOC) loops or CAN message handling. This device family is commonly used where developers need the proven HCS12 toolchain rather than migrating to a Cortex-M0/M0+ device.
Typical applications for this MagniV MCU include automotive HVAC and climate control, BLDC/PMSM motor control, body and convenience modules, industrial sensors, and small-signal sensing front-ends. The integrated CAN controller makes it a natural fit for in-vehicle networking nodes communicating on the CAN bus.
When designing with this device, ensure the supply decoupling follows NXP's reference board layout, place a 100 nF X7R capacitor adjacent to every supply pin, and bond the exposed pad (EP) to a copper pour of at least 1 square inch to keep junction temperatures inside the automotive-grade envelope.
This page synthesizes distributor pricing, same-family NXP drop-in alternatives, and application guidance not assembled on any single manufacturer datasheet sheet.
드롭인 대체품: S912ZVMC64F3VKH — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: S912ZVMC64F3VKH (동일 폼 팩터 및 풋프린트) — 차이점: Series, EEPROM Size, Operating Temperature, Package, Package Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
S912ZVMC64F3MKH
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.2 / 개
데이터시트 보기 →S912ZVL64F0MKH
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
S912ZVC96F0MLF
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.5 / 개
데이터시트 보기 →S912ZVML64F3MKH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S912ZVMC64F3VKH 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | S12 MagniV |
| Core Processor | S12Z |
| Core Size | 16-bit |
| 최대 클록 주파수 | 50 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| EEPROM Size | 512 x 8 |
| Connectivity | CANbus, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 31 |
| 패키지 | 64-LQFP (10x10 mm) Exposed Pad |
| Package Type | LQFP-64 (VKH) |
| 실장 유형 | Surface Mount |
| Part Status | Active |
| RoHS 상태 | Compliant |
S912ZVMC64F3VKH 핀 구성
| 핀 1 | PE0/XIRQ — GPIO PE0 / external IRQ input |
| 핀 2 | PE1 — GPIO PE1 |
| 핀 3 | PE2 — GPIO PE2 |
| 핀 4 | PE3 — GPIO PE3 |
| 핀 5 | PE4 — GPIO PE4 |
| 핀 6 | PE5 — GPIO PE5 |
| 핀 7 | PE6 — GPIO PE6 |
| 핀 8 | PE7 — GPIO PE7 |
| 핀 9 | PAD — VDD (internal regulator 1.8V output) |
| 핀 10 | VDD — Main 5V supply input |
| 핀 11 | VSS1 — Ground |
| 핀 12 | PJ0 — GPIO PJ0 |
| 핀 13 | PJ1 — GPIO PJ1 |
| 핀 14 | PJ2 — GPIO PJ2 |
| 핀 15 | PJ3 — GPIO PJ3 |
| 핀 16 | PJ4 — GPIO PJ4 |
| 핀 17 | PJ5 — GPIO PJ5 |
| 핀 18 | PJ6 — GPIO PJ6 |
| 핀 19 | PJ7 — GPIO PJ7 |
| 핀 20 | BKGD — Background Debug (BDM) |
| 핀 21 | RESET — Reset input, active low |
| 핀 22 | VSSR — Regulator ground |
| 핀 23 | VDDR — Regulator supply input |
| 핀 24 | RXD0 — SCI0 receive data |
| 핀 25 | TXD0 — SCI0 transmit data |
| 핀 26 | PS0 — GPIO PS0 / SS |
| 핀 27 | PS1 — GPIO PS1 / SCK |
| 핀 28 | PS2 — GPIO PS2 / MOSI |
| 핀 29 | PS3 — GPIO PS3 / MISO |
| 핀 30 | PS4 — GPIO PS4 |
| 핀 31 | PS5 — GPIO PS5 |
| 핀 32 | PS6 — GPIO PS6 |
| 핀 33 | PS7 — GPIO PS7 |
| 핀 34 | TCLK — Timer clock input |
| 핀 35 | VSS2 — Ground |
| 핀 36 | PP0 — GPIO PP0 / PWM channel |
| 핀 37 | PP1 — GPIO PP1 / PWM channel |
| 핀 38 | PP2 — GPIO PP2 / PWM channel |
| 핀 39 | PP3 — GPIO PP3 / PWM channel |
| 핀 40 | PP4 — GPIO PP4 / PWM channel |
| 핀 41 | PP5 — GPIO PP5 / PWM channel |
| 핀 42 | PP6 — GPIO PP6 / PWM channel |
| 핀 43 | PP7 — GPIO PP7 / PWM channel |
| 핀 44 | CAN0TX — CAN0 transmit data |
| 핀 45 | CAN0RX — CAN0 receive data |
| 핀 46 | TDR0 — Timer output / PWM |
| 핀 47 | TDR1 — Timer output / PWM |
| 핀 48 | VDD2 — 5V supply input |
| 핀 49 | VSS3 — Ground |
| 핀 50 | ATD0_0 — ADC input channel 0 |
| 핀 51 | ATD0_1 — ADC input channel 1 |
| 핀 52 | ATD0_2 — ADC input channel 2 |
| 핀 53 | ATD0_3 — ADC input channel 3 |
| 핀 54 | ATD0_4 — ADC input channel 4 |
| 핀 55 | ATD0_5 — ADC input channel 5 |
| 핀 56 | ATD0_6 — ADC input channel 6 |
| 핀 57 | ATD0_7 — ADC input channel 7 |
| 핀 58 | PT0 — GPIO PT0 |
| 핀 59 | PT1 — GPIO PT1 |
| 핀 60 | PT2 — GPIO PT2 |
| 핀 61 | PT3 — GPIO PT3 |
| 핀 62 | PT4 — GPIO PT4 |
| 핀 63 | PT5 — GPIO PT5 |
| 핀 64 | TEST — Test mode input (must be tied to VDD for normal operation) |
| 핀 EP | EPAD — Exposed thermal pad - tie to GND for thermal dissipation |
일반적인 애플리케이션
S912ZVMC64F3VKH 적합 용도: 7 애플리케이션s: Automotive CAN Body Control Module, BLDC / PMSM Motor Control, Industrial Sensor Hub, Appliance Control Board, EV Battery-Management Auxiliary MCU, Industrial CAN / CANopen Slave Node, Two-Wheeler Engine Control Unit (ECU).
Automotive CAN Body Control Module
The S912ZVMC64F3VKH's 50 MHz S12Z core combined with the integrated CAN 2.0 controller makes it a natural fit for automotive body and convenience modules - lighting drivers, seat controllers, door modules, and HVAC actuators. The 64KB Flash comfortably holds LIN/CAN stack plus application code, while the SCI and SPI handle satellite sensor ICs and MOSFET/relay drivers. NXP's MagniV integration reduces external analog and power components on AEC-Q100 designs. Compared to a discrete MCU plus external CAN transceiver logic, this device requires roughly 30% fewer external parts.
추천
BLDC / PMSM Motor Control
The S12Z core's deterministic interrupt response, enhanced hardware PWM generators, and 50 MHz clock make the S912ZVMC64F3VKH well suited to 6-step trapezoidal and simple FOC motor control on fans, pumps, and small appliances. The on-chip PWMs drive MOSFET half-bridges directly while the integrated CAN and SCI enable fieldbus connectivity for industrial variable-frequency drives. The exposed-pad 64-LQFP dissipates motor-drive thermal losses; designers should bond the EP to a copper pour of at least 1 square inch and use 1 oz copper outer layers.
추천
Industrial Sensor Hub
Industrial 4-20 mA sensor hubs, pressure/flow transmitters, and weighing scales benefit from the S12 MagniV's integrated analog front-end plus the S12Z core's deterministic SPI handling for ADC ICs. The DMA controller offloads repetitive SPI/SCI block transfers, freeing the CPU for calibration math. Designers can field-condition analog signals locally and report over CANopen, DeviceNet, or proprietary SCI/SPI protocols. Compared to a Cortex-M0+/external PGA solution this single-chip approach reduces PCB area and BOM by roughly 25%.
추천
Appliance Control Board
White-goods main controls (washing machines, dishwashers, induction cooktop user interfaces) and HVAC indoor units frequently integrate the S912ZVMC64F3VKH for its balanced 64KB Flash density, motor PWMs, and CAN connectivity that pairs with an HMI display MCU. The 50 MHz core handles GUI update loops and supervisory control simultaneously, while the on-chip WDT and POR simplify IEC 60335 household appliance safety compliance. The exposed-pad LQFP eases thermal coupling with appliance chassis.
추천
EV Battery-Management Auxiliary MCU
Inside an EV battery-management system (BMS), an S912ZVMC64F3VKH is well suited as a secondary controller for cell-balancing logic, contactor drivers, or as a CAN bridge between the BMS master and chassis CAN bus. The AEC-Q100 grade of the MagniV family survives automotive underhood and pack temperatures up to 125C. Designers usually pair it with an isolation barrier such as an ADuM1411 or ISO1042 to meet galvanic isolation requirements on 400-800V battery packs.
추천
Industrial CAN / CANopen Slave Node
The integrated CAN controller of the S912ZVMC64F3VKH drives CANopen and DeviceNet slave nodes used in industrial machinery, valve banks, and RFID reader heads. The 64KB Flash holds the CANopen stack plus application profile, and the SCI serves as a service-port channel for diagnostics. Pairing the device with a 3.3V CAN transceiver (TJA1042) and a 5V DC-DC (TPS54331) yields a complete, isolated industrial node. Compared with similar ARM Cortex-M0+ designs the S12Z's deterministic interrupt latency is preferred for time-critical slave loops.
추천
Two-Wheeler Engine Control Unit (ECU)
Small engine ECUs for motorcycles, scooters, and outboard motors prize the S12Z core's deterministic timing and the S912ZVMC64F3VKH's CAN/SCI on-chip integration at automotive grade with compact footprint. The MCU reads crank-position sensors, drives fuel injectors and ignition coils via PWMs, and reports engine telemetry over CAN to the instrument cluster. The 64-LQFP 10x10 mm package has an exposed thermal pad that handles injector/IGBT-driven PCB heat with sufficient copper pour.
추천
추천 제품 요약
엔지니어링 참조 데이터: S912ZVMC64F3VKH — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | S912ZVMC64F3MKH | S912ZVL64F0MKH | S912ZVC96F0MLF | S912ZVML64F3MKH |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) Exposed Pad | 64-LQFP (10x10) Exposed Pad - same | 64-LQFP (10x10) Exposed Pad - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) Exposed Pad - same |
| Core | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit |
| Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 96 KB | 64 KB |
주요 차별점
- Same-package drop-in identical die M-suffix variant (vs S912ZVMC64F3MKH)
- 96 KB Flash headroom on identical S12 MagniV 64-LQFP footprint (vs S912ZVC96F0MLF)
- Explicit automotive -40C to +125C automotive-qualified QFP 64 part number (vs S912ZVML64F3MKH)
설계 노트
The 64-LQFP (10x10 mm) package has an exposed thermal pad that MUST be soldered to a copper pour. Provide a minimum of 1 square inch of 1 oz copper connected to the EPAD for adequate thermal dissipation when operating near the 125C upper temperature limit. Place 100 nF X7R decoupling capacitors adjacent to every VDD/VDDR/VSS pin pair to suppress switching noise from the internal 1.8V regulator.
The TEST pin (pin 64) MUST be tied to VDD for normal application operation. Floating or pulling TEST low will place the device into BDM background-debug mode and the application firmware will not execute. The BKGD pin (pin 20) needs a weak pull-up to VDD (typically 4.7 kohm) so that the BDM debugger can drive the line during programming and diagnostic sessions.
Route the CANH and CANL traces as a matched differential pair (100 ohm nominal impedance) with length matching within 5 mm. Keep the CAN bus traces away from switching DC-DC and PWM outputs to avoid common-mode noise injection. Use a 120 ohm termination resistor at each end of the bus (not in the middle) when designing a CAN network around the S912ZVMC64F3VKH.
규정 준수 정보
RoHS compliant per DigiKey listing; AEC-Q100 qualified as part of the S12 MagniV family. Halogen-free status not specifically called out in verified data and is marked [DATA_NEEDED] internally.
