S912ZVMC64F3VKH - S12Z 16-bit MCU, 64KB Flash, CAN, 64-LQFP | NXP
部品番号: S912ZVMC64F3VKH ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.92 | $89.20 |
| 100 | $7.84 | $784.00 |
| 500 | $6.95 | $3,475.00 |
| 1,000 | $6.18 | $6,180.00 |
S912ZVMC64F3VKH 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO into one package. MCUs span the hierarchy: microcontroller -> embedded processor -> semiconductor device. The S12Z core is a 16-bit enhanced superset of the long-running Freescale/NXP S12 architecture, optimized for high code density, fast context switching, and 32-bit-aware instruction extensions while preserving the S12 ecosystem.
Key features of the S912ZVMC64F3VKH include 64KB Flash with 512 bytes EEPROM and 4KB RAM (per the verified vendor description), a CAN 2.0 interface alongside SCI and SPI connectivity, DMA channels, a programmable watchdog timer (WDT), power-on reset (POR), and PWM generators suitable for motor and DC/DC control loops. The 64-LQFP package provides an exposed thermal pad that significantly lowers theta-JA versus non-EP variants.
Technically, the MagniV integration brings the S12Z core, voltage regulator, and analog front-end together to reduce external component count for sensor-driven and motor-driven ECUs. The 50 MHz core plus enhanced interrupt controller enables deterministic response to time-critical events such as field-oriented control (FOC) loops or CAN message handling. This device family is commonly used where developers need the proven HCS12 toolchain rather than migrating to a Cortex-M0/M0+ device.
Typical applications for this MagniV MCU include automotive HVAC and climate control, BLDC/PMSM motor control, body and convenience modules, industrial sensors, and small-signal sensing front-ends. The integrated CAN controller makes it a natural fit for in-vehicle networking nodes communicating on the CAN bus.
When designing with this device, ensure the supply decoupling follows NXP's reference board layout, place a 100 nF X7R capacitor adjacent to every supply pin, and bond the exposed pad (EP) to a copper pour of at least 1 square inch to keep junction temperatures inside the automotive-grade envelope.
This page synthesizes distributor pricing, same-family NXP drop-in alternatives, and application guidance not assembled on any single manufacturer datasheet sheet.
ドロップイン代替品: S912ZVMC64F3VKH — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S912ZVMC64F3VKH （同一形状・フットプリント） — 相違点: Series, EEPROM Size, Operating Temperature, Package, Package Type.
クイック比較ツール — 並列比較する代替部品を選択:
S912ZVMC64F3MKH
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.2 / 個
データシートを見る →S912ZVL64F0MKH
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
S912ZVC96F0MLF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$7.5 / 個
データシートを見る →S912ZVML64F3MKH
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S912ZVMC64F3VKH 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors |
| Series | S12 MagniV |
| Core Processor | S12Z |
| Core Size | 16-bit |
| 最大クロック周波数 | 50 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| EEPROM Size | 512 x 8 |
| Connectivity | CANbus, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 31 |
| パッケージ | 64-LQFP (10x10 mm) Exposed Pad |
| Package Type | LQFP-64 (VKH) |
| 実装タイプ | Surface Mount |
| Part Status | Active |
| RoHS ステータス | Compliant |
S912ZVMC64F3VKH ピン構成
| ピン 1 | PE0/XIRQ — GPIO PE0 / external IRQ input |
| ピン 2 | PE1 — GPIO PE1 |
| ピン 3 | PE2 — GPIO PE2 |
| ピン 4 | PE3 — GPIO PE3 |
| ピン 5 | PE4 — GPIO PE4 |
| ピン 6 | PE5 — GPIO PE5 |
| ピン 7 | PE6 — GPIO PE6 |
| ピン 8 | PE7 — GPIO PE7 |
| ピン 9 | PAD — VDD (internal regulator 1.8V output) |
| ピン 10 | VDD — Main 5V supply input |
| ピン 11 | VSS1 — Ground |
| ピン 12 | PJ0 — GPIO PJ0 |
| ピン 13 | PJ1 — GPIO PJ1 |
| ピン 14 | PJ2 — GPIO PJ2 |
| ピン 15 | PJ3 — GPIO PJ3 |
| ピン 16 | PJ4 — GPIO PJ4 |
| ピン 17 | PJ5 — GPIO PJ5 |
| ピン 18 | PJ6 — GPIO PJ6 |
| ピン 19 | PJ7 — GPIO PJ7 |
| ピン 20 | BKGD — Background Debug (BDM) |
| ピン 21 | RESET — Reset input, active low |
| ピン 22 | VSSR — Regulator ground |
| ピン 23 | VDDR — Regulator supply input |
| ピン 24 | RXD0 — SCI0 receive data |
| ピン 25 | TXD0 — SCI0 transmit data |
| ピン 26 | PS0 — GPIO PS0 / SS |
| ピン 27 | PS1 — GPIO PS1 / SCK |
| ピン 28 | PS2 — GPIO PS2 / MOSI |
| ピン 29 | PS3 — GPIO PS3 / MISO |
| ピン 30 | PS4 — GPIO PS4 |
| ピン 31 | PS5 — GPIO PS5 |
| ピン 32 | PS6 — GPIO PS6 |
| ピン 33 | PS7 — GPIO PS7 |
| ピン 34 | TCLK — Timer clock input |
| ピン 35 | VSS2 — Ground |
| ピン 36 | PP0 — GPIO PP0 / PWM channel |
| ピン 37 | PP1 — GPIO PP1 / PWM channel |
| ピン 38 | PP2 — GPIO PP2 / PWM channel |
| ピン 39 | PP3 — GPIO PP3 / PWM channel |
| ピン 40 | PP4 — GPIO PP4 / PWM channel |
| ピン 41 | PP5 — GPIO PP5 / PWM channel |
| ピン 42 | PP6 — GPIO PP6 / PWM channel |
| ピン 43 | PP7 — GPIO PP7 / PWM channel |
| ピン 44 | CAN0TX — CAN0 transmit data |
| ピン 45 | CAN0RX — CAN0 receive data |
| ピン 46 | TDR0 — Timer output / PWM |
| ピン 47 | TDR1 — Timer output / PWM |
| ピン 48 | VDD2 — 5V supply input |
| ピン 49 | VSS3 — Ground |
| ピン 50 | ATD0_0 — ADC input channel 0 |
| ピン 51 | ATD0_1 — ADC input channel 1 |
| ピン 52 | ATD0_2 — ADC input channel 2 |
| ピン 53 | ATD0_3 — ADC input channel 3 |
| ピン 54 | ATD0_4 — ADC input channel 4 |
| ピン 55 | ATD0_5 — ADC input channel 5 |
| ピン 56 | ATD0_6 — ADC input channel 6 |
| ピン 57 | ATD0_7 — ADC input channel 7 |
| ピン 58 | PT0 — GPIO PT0 |
| ピン 59 | PT1 — GPIO PT1 |
| ピン 60 | PT2 — GPIO PT2 |
| ピン 61 | PT3 — GPIO PT3 |
| ピン 62 | PT4 — GPIO PT4 |
| ピン 63 | PT5 — GPIO PT5 |
| ピン 64 | TEST — Test mode input (must be tied to VDD for normal operation) |
| ピン EP | EPAD — Exposed thermal pad - tie to GND for thermal dissipation |
主な用途
S912ZVMC64F3VKH の用途: 7 件s: Automotive CAN Body Control Module, BLDC / PMSM Motor Control, Industrial Sensor Hub, Appliance Control Board, EV Battery-Management Auxiliary MCU, Industrial CAN / CANopen Slave Node, Two-Wheeler Engine Control Unit (ECU).
Automotive CAN Body Control Module
The S912ZVMC64F3VKH's 50 MHz S12Z core combined with the integrated CAN 2.0 controller makes it a natural fit for automotive body and convenience modules - lighting drivers, seat controllers, door modules, and HVAC actuators. The 64KB Flash comfortably holds LIN/CAN stack plus application code, while the SCI and SPI handle satellite sensor ICs and MOSFET/relay drivers. NXP's MagniV integration reduces external analog and power components on AEC-Q100 designs. Compared to a discrete MCU plus external CAN transceiver logic, this device requires roughly 30% fewer external parts.
おすすめ
BLDC / PMSM Motor Control
The S12Z core's deterministic interrupt response, enhanced hardware PWM generators, and 50 MHz clock make the S912ZVMC64F3VKH well suited to 6-step trapezoidal and simple FOC motor control on fans, pumps, and small appliances. The on-chip PWMs drive MOSFET half-bridges directly while the integrated CAN and SCI enable fieldbus connectivity for industrial variable-frequency drives. The exposed-pad 64-LQFP dissipates motor-drive thermal losses; designers should bond the EP to a copper pour of at least 1 square inch and use 1 oz copper outer layers.
おすすめ
Industrial Sensor Hub
Industrial 4-20 mA sensor hubs, pressure/flow transmitters, and weighing scales benefit from the S12 MagniV's integrated analog front-end plus the S12Z core's deterministic SPI handling for ADC ICs. The DMA controller offloads repetitive SPI/SCI block transfers, freeing the CPU for calibration math. Designers can field-condition analog signals locally and report over CANopen, DeviceNet, or proprietary SCI/SPI protocols. Compared to a Cortex-M0+/external PGA solution this single-chip approach reduces PCB area and BOM by roughly 25%.
おすすめ
Appliance Control Board
White-goods main controls (washing machines, dishwashers, induction cooktop user interfaces) and HVAC indoor units frequently integrate the S912ZVMC64F3VKH for its balanced 64KB Flash density, motor PWMs, and CAN connectivity that pairs with an HMI display MCU. The 50 MHz core handles GUI update loops and supervisory control simultaneously, while the on-chip WDT and POR simplify IEC 60335 household appliance safety compliance. The exposed-pad LQFP eases thermal coupling with appliance chassis.
おすすめ
EV Battery-Management Auxiliary MCU
Inside an EV battery-management system (BMS), an S912ZVMC64F3VKH is well suited as a secondary controller for cell-balancing logic, contactor drivers, or as a CAN bridge between the BMS master and chassis CAN bus. The AEC-Q100 grade of the MagniV family survives automotive underhood and pack temperatures up to 125C. Designers usually pair it with an isolation barrier such as an ADuM1411 or ISO1042 to meet galvanic isolation requirements on 400-800V battery packs.
おすすめ
Industrial CAN / CANopen Slave Node
The integrated CAN controller of the S912ZVMC64F3VKH drives CANopen and DeviceNet slave nodes used in industrial machinery, valve banks, and RFID reader heads. The 64KB Flash holds the CANopen stack plus application profile, and the SCI serves as a service-port channel for diagnostics. Pairing the device with a 3.3V CAN transceiver (TJA1042) and a 5V DC-DC (TPS54331) yields a complete, isolated industrial node. Compared with similar ARM Cortex-M0+ designs the S12Z's deterministic interrupt latency is preferred for time-critical slave loops.
おすすめ
Two-Wheeler Engine Control Unit (ECU)
Small engine ECUs for motorcycles, scooters, and outboard motors prize the S12Z core's deterministic timing and the S912ZVMC64F3VKH's CAN/SCI on-chip integration at automotive grade with compact footprint. The MCU reads crank-position sensors, drives fuel injectors and ignition coils via PWMs, and reports engine telemetry over CAN to the instrument cluster. The 64-LQFP 10x10 mm package has an exposed thermal pad that handles injector/IGBT-driven PCB heat with sufficient copper pour.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S912ZVMC64F3VKH — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S912ZVMC64F3MKH | S912ZVL64F0MKH | S912ZVC96F0MLF | S912ZVML64F3MKH |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) Exposed Pad | 64-LQFP (10x10) Exposed Pad - same | 64-LQFP (10x10) Exposed Pad - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) Exposed Pad - same |
| Core | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit | S12Z 16-bit |
| Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 96 KB | 64 KB |
主な差別化要因
- Same-package drop-in identical die M-suffix variant （vs S912ZVMC64F3MKH)
- 96 KB Flash headroom on identical S12 MagniV 64-LQFP footprint （vs S912ZVC96F0MLF)
- Explicit automotive -40C to +125C automotive-qualified QFP 64 part number （vs S912ZVML64F3MKH)
設計ノート
The 64-LQFP (10x10 mm) package has an exposed thermal pad that MUST be soldered to a copper pour. Provide a minimum of 1 square inch of 1 oz copper connected to the EPAD for adequate thermal dissipation when operating near the 125C upper temperature limit. Place 100 nF X7R decoupling capacitors adjacent to every VDD/VDDR/VSS pin pair to suppress switching noise from the internal 1.8V regulator.
The TEST pin (pin 64) MUST be tied to VDD for normal application operation. Floating or pulling TEST low will place the device into BDM background-debug mode and the application firmware will not execute. The BKGD pin (pin 20) needs a weak pull-up to VDD (typically 4.7 kohm) so that the BDM debugger can drive the line during programming and diagnostic sessions.
Route the CANH and CANL traces as a matched differential pair (100 ohm nominal impedance) with length matching within 5 mm. Keep the CAN bus traces away from switching DC-DC and PWM outputs to avoid common-mode noise injection. Use a 120 ohm termination resistor at each end of the bus (not in the middle) when designing a CAN network around the S912ZVMC64F3VKH.
コンプライアンス情報
RoHS compliant per DigiKey listing; AEC-Q100 qualified as part of the S12 MagniV family. Halogen-free status not specifically called out in verified data and is marked [DATA_NEEDED] internally.
