SPC5606SF2CLU6 - 32-bit MCU, 1MB Flash, 64MHz, QFP-176 | NXP
N.º da peça: SPC5606SF2CLU6 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.81 | $13,81 |
| 10 | $12.43 | $124,30 |
| 100 | $10.88 | $1.088,00 |
| 500 | $9.65 | $4.825,00 |
| 1.000 | $8.78 | $8.780,00 |
SPC5606SF2CLU6 Visão geral
An automotive microcontroller (MCU) is a microprocessor unit qualified to operate reliably in the harsh electrical, thermal, and vibration environment of a vehicle, integrating one or more CPU cores, non-volatile program memory (Flash), volatile working memory (SRAM), and a heterogeneous peripheral set on a single die. SPC5606SF2CLU6 sits in the wider NXP Power Architecture MCU hierarchy (PowerPC e200 -> Qorivva MPC56xx -> MPC560xS cluster family) and targets mid-range instrument clusters that balance cost, performance, and integrated graphics/display peripherals over general-purpose automotive MCUs such as the MPC5566.
Key features include up to 64 MHz core frequency, 1 MB on-chip Flash program memory, an integrated TFT display controller (LCDC) and video DAC, enhanced modular I/O subsystem (eMIOS), multiple CAN 2.0B controllers (FlexCAN), SPI, I2C, UART/SCI, a 12-bit ADC and an enhanced queued analog-to-digital converter (eQADC) for precision sensor acquisition. The device integrates a stepper-motor driver interface for gauge movements and supports the SPC5Studio software ecosystem with AUTOSAR MCAL drivers, reference hardware platforms, and a hardware security module (HSE) for secure boot in production-grade deployments.
The SPC5606SF2CLU6 is built on a 90-nm non-volatile memory (NVM) CMOS process with an on-chip voltage regulator (low-voltage detection, power-on reset, and standby modes). A PLL provides the system clock, while independent peripheral clocks can be gated for active-power management. Memory protection and error-correcting code support contribute to functional safety compliance under ISO 26262 up to ASIL-B for instrument-cluster applications.
Typical applications are mid-range automotive instrument clusters with 5-inch to 7-inch TFT color panels, body control modules driving multiple stepper gauges, CAN-based gateway nodes, HVAC controllers with graphical displays, and aftermarket heads-up displays. The wide operating temperature range of -40C to +85C and AEC-Q100 qualification make it well-suited to cabin and engine-bay-adjacent locations.
When designing with this MCU, ensure a 4.7uF or larger bulk decoupling capacitor is placed near each VDD/VSS pair and that the analog and digital grounds return to a single low-impedance ground plane. Crystal layout must follow the short-trace, guard-ring rules described in the NXP hardware design guide to keep the PLL within its jitter mask. Software engineers should select the documented oscillator frequency (40 MHz external crystal is recommended) and configure the PLL through the SPC5Studio clock tool rather than overriding registers manually.
Alternativas drop-in para SPC5606SF2CLU6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com SPC5606SF2CLU6 (mesmo formato e footprint) — diferindo em Package, Series, Supply Voltage, Program Memory Size, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
SPC5605SF2CLU6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
SPC5607SF2CLU6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
SPC5642AF2MLU1
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$21.23 / unidade
Ver ficha técnica →SPC5644AF0MLU2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.5 / unidade
Ver ficha técnica →SPC5746BSK1MKU2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.25 / unidade
Ver ficha técnica →SPC5602BF2MLL6
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.59 / unidade
Ver ficha técnica →SPC5606SF2CLU6 Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | MPC560xS (Qorivva) |
| Core Architecture | Power Architecture e200z0h |
| Core Count | 1 |
| Largura do barramento de dados | 32-bit |
| Frequência máxima de clock | 64 MHz |
| Program Memory Size (Flash) | 1 MB (1024 KB) |
| Tensão de alimentação | 3.3 V / 5 V |
| Faixa de temperatura de operação | -40C to +85C |
| Encapsulamento / Caixa | 176-LQFP (24x24 mm) |
| Tipo de montagem | Surface Mount |
| Número de pinos | 176 |
| Automotive Qualification | AEC-Q100 qualified |
| Status RoHS | Compliant |
| Terminal Form | GULL WING |
| Temperature Grade | INDUSTRIAL (automotive application) |
| Peripheral Highlights | FlexCAN, eMIOS, eQADC, SPI, I2C, SCI, LCDC |
Guia de Configuração de Pinos do SPC5606SF2CLU6 176-lqfp (24x24 mm)
Configuração de pinos para SPC5606SF2CLU6 (pacote 176-lqfp (24x24 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para SPC5606SF2CLU6.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
SPC5606SF2CLU6 é adequado para 6 aplicaçãos: Automotive Instrument Cluster with TFT Display, Body Control Module (BCM), CAN Gateway / Network Hub, HVAC Control Unit with Graphical Display, Stepper-Motor Gauge Cluster, Industrial TFT Human-Machine Interface (HMI).
Automotive Instrument Cluster with TFT Display
The SPC5606SF2CLU6 is purpose-built for color TFT instrument clusters in mid-range vehicles, where its integrated LCD controller (LCDC) and dedicated video DAC drive 5 to 7-inch panels without an external graphics controller. The e200z0h core at 64 MHz sustains automotive-grade real-time workloads: pointer driving, RPM/speed rendering, telltale animation, and CAN message processing at 500 kbps. Compared with a discrete MCU + external GPU approach, the SPC5606SF2CLU6 reduces PCB area, lowers BOM cost, and shortens software bring-up by keeping the display pipeline in peripheral hardware rather than the CPU.
Recomendado
Body Control Module (BCM)
In BCM applications the SPC5606SF2CLU6 acts as the central node aggregating CAN/LIN messages from door modules, lighting controllers, and HVAC units. Its multiple FlexCAN 2.0B controllers, eMIOS timer channels, and 12-bit ADC deliver the determinism required for lock/unlock, courtesy-light timing, and PWM-driven LED headlamp leveling. AEC-Q100 qualification and the -40C to +85C thermal range meet underhood and cabin-environment derating rules, while the 176-LQFP footprint allows generous trace escape for high-current MOSFET driver outputs alongside CAN transceivers.
Recomendado
CAN Gateway / Network Hub
The SPC5606SF2CLU6's multiple FlexCAN modules and dedicated message RAM make it an excellent CAN-to-CAN or CAN-to-LIN gateway bridging powertrain, chassis, and body networks. At 64 MHz, it can filter and forward messages at bus speeds up to 1 Mbps with sub-millisecond latency, offloading the central gateway MCU in a zone-oriented E/E architecture. Power-on reset, low-voltage detection, and the integrated voltage regulator simplify the power tree and reduce external components compared with discrete MCU + external CAN bridge ICs.
Recomendado
HVAC Control Unit with Graphical Display
Climate-control head units with TFT or segment+icon displays run dual-zone logic, blower PWM control, and LIN communication to actuator nodes - all within the SPC5606SF2CLU6's peripheral set. The eQADC digitizes NTC thermistor inputs for cabin and ambient temperature with 12-bit resolution and the eMIOS channels generate the 25 kHz PWM needed for brushless blower drives. Compared with using a small 8-bit MCU plus an external display driver, this single-chip approach cuts board area and reduces integration effort.
Recomendado
Stepper-Motor Gauge Cluster
Stepper-motor gauges (analog speedometer, tachometer, fuel and temperature pointers) are driven directly by the SPC5606SF2CLU6's eMIOS channels with micro-stepping waveforms, eliminating external stepper drivers and reducing PCB size. The same MCU renders the central TFT display, manages CAN diagnostics, and services OBD-II requests - all inside one device. AEC-Q100 qualification and wide thermal range ensure the electromechanical gauges remain on-spec through a vehicle's lifetime across extreme cabin temperatures.
Recomendado
Industrial TFT Human-Machine Interface (HMI)
Outside automotive, the SPC5606SF2CLU6 fits rugged industrial HMIs for factory automation and process control where deterministic GPIO, multi-protocol serial, and an integrated TFT controller reduce the bill of materials. The 64 MHz CPU runs embedded GUI libraries such as emWin or Crank Storyboard for HMI panels, while the CAN and SPI peripherals tie the HMI into fieldbus networks. The 176-LQFP package makes the part easy to route on 4-layer industrial PCBs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para SPC5606SF2CLU6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | SPC5605SF2CLU6 | SPC5607SF2CLU6 | SPC5642AF2MLU1 | SPC5644AF0MLU2 | SPC5746BSK1MKU2 | SPC5602BF2MLL6 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) |
| Core | e200z0h (single core) | e200z0h (single core) | e200z0h (single core) | e200z4 (dual core) | e200z4 (dual core) | e200z4 (lockstep) | e200z0h (single core) |
| Maximum Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 120 MHz | 150 MHz | 180 MHz | 64 MHz |
| Flash Size | 1 MB | 768 KB | 1.5 MB | 2 MB | 3 MB | 4 MB | 768 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +105C | -40C to +125C | -40C to +85C |
| Automotive Qualification | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| Unit Price (qty 1) | $13.81 | $11.50 | $15.20 | $24.50 | $26.30 | $32.40 | $9.80 |
Principais diferenciais
- Purpose-built LCD controller (LCDC) integrated on-chip (vs STM32H563ZIT6)
- True automotive-grade temperature and qualification (vs LPC2468FBD208551)
- 1 MB Flash delivers larger application headroom than smaller variants (vs SPC5602BF2MLL6)
- Single-core design keeps BOM cost low for mid-range clusters (vs SPC5642AF2MLU1)
Notas de projeto
Decouple each VDD/VSS pair with a 100 nF X7R ceramic in parallel with a 4.7 uF bulk capacitor placed within 5 mm of the package. The SPC5606SF2CLU6 has multiple supply pins (VDD, VDDA, VDDX, VSSS) that must all be tied to low-impedance planes. The internal voltage regulator requires an external ballast transistor and reverse-battery protection - follow the SPC5 hardware design guide reference schematic exactly to avoid POR instability during crank events.
Keep the 40 MHz external crystal traces short, symmetric, and surrounded by a grounded guard ring. Place the crystal within 5 mm of the XTAL pins and avoid routing high-current or TFT data lines across the oscillator area. The 176-LQFP's 0.5 mm pitch pads require 4-layer PCB stack-up; use 1 oz copper and 8 mil-wide escape traces to keep impedance-controlled stubs on the LCD bus within 25 mm.
Do not leave unused FlexCAN pins floating - configure them in software as disabled or tie them to ground through 10 kohm. Watch out for the VDDX voltage tolerance (3.3 V or 5 V variants: verify your board revision). Failing to enable the JTAG security bit before locking production Flash leaves the MCU debuggable - use NXP's HSE secure-boot toolchain to lock the part before volume deployment.
Estimated: with 1.5 W typical power dissipation and a theta_JA of approximately 28 C/W for the LQFP-176 package, the junction-to-ambient rise is roughly 42 C at still air. Derate by 5 C/W for closed plastic enclosures and reserve a copper pour under the exposed die-attach pad as a heat-spreading layer. Automotive clusters at +85 C ambient typically run well inside the 125 C junction limit.
Informações de conformidade
AEC-Q100 qualified per NXP product page. RoHS and REACH compliance stated by distributor listings. Halogen-free status not explicitly disclosed in the verified web data - set to unknown.
