STM32F103RGT6 - 72MHz Cortex-M3 MCU 1MB Flash | STMicroelectronics
N.º da peça: STM32F103RGT6 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.12 | $512,00 |
| 500 | $4.6 | $2.300,00 |
| 1.000 | $4.15 | $4.150,00 |
STM32F103RGT6 Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and programmable peripherals on one die, sitting within the broader hierarchy of semiconductor devices as an embedded processor within the system-on-chip and power management ecosystem. The STM32F1 series performance line targets cost-sensitive embedded control where the ARM Cortex-M3 architecture provides deterministic, single-cycle multiply and hardware division.
Key features include 1 MB of embedded Flash for large application code, 96 KB of SRAM, 17 timers, 3x 12-bit ADCs, and 13 communication interfaces covering USB, CAN, USART, SPI, and I2C. The flexible static memory controller (FSMC) supports 4 chip selects and a parallel LCD interface in 8080/6800 modes.
Architecturally, the Cortex-M3 core operates from a 2.0V to 3.6V supply with an embedded PLL generating the 72 MHz system clock. Interrupt latency is handled by the nested vectored interrupt controller, and the bus matrix enables parallel peripheral access for deterministic real-time behavior in motor control and communication workloads.
Typical applications include industrial automation and motor control, USB and CAN-based communication modules, consumer appliances, and low-cost development platforms, where the large 1 MB Flash accommodates RTOS and communication stacks without external memory.
Design consideration: the ADC performance is sensitive to VDDA quality, so provide separate analog supply filtering; also note Flash zero-wait-state behavior only up to 24 MHz, with wait states required at 72 MHz.
This page synthesizes distributor pricing, verified drop-in alternatives such as GD32F103RGT6, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para STM32F103RGT6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com STM32F103RGT6 (mesmo formato e footprint) — diferindo em Package, ADC, Core, SRAM, Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
STM32F103RCT6
✅ Drop-In✓ Em estoque
$1.6406 / unidade
Ver ficha técnica →STM32F103RBT6
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.18 / unidade
Ver ficha técnica →GD32F103RGT6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
APM32F103RGT6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
STM32F103RGT7
✅ Drop-In✓ Em estoque
$9.814 / unidade
Ver ficha técnica →STM32F103RGT6 Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Frequência máxima de clock | 72 MHz |
| Performance | 1.25 DMIPS/MHz (Dhrystone 2.1) |
| Flash Memory | 1 MB (1M x 8) |
| SRAM | 96 KB |
| Tensão de alimentação | 2.0 V to 3.6 V |
| Number of Timers | 17 |
| Number of ADCs | 3 x 12-bit |
| Communication Interfaces | 13 (USB, CAN, USART, SPI, I2C) |
| External Memory Controller | FSMC, 4 chip selects, LCD parallel interface 8080/6800 modes |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C |
| Series | STM32F1 (XL-density performance line) |
| Status RoHS | Compliant |
Configuração de pinos do STM32F103RGT6
| Pino 1 | VBAT — Battery backup supply for RTC |
| Pino 2 | PC13 — GPIO / TAMPER-RTC |
| Pino 3 | PC14 — GPIO / OSC32_IN (32.768 kHz) |
| Pino 4 | PC15 — GPIO / OSC32_OUT (32.768 kHz) |
| Pino 5 | PD0 — GPIO / OSC_IN (main oscillator) |
| Pino 6 | PD1 — GPIO / OSC_OUT (main oscillator) |
| Pino 7 | NRST — Active-low reset input |
| Pino 8 | VSSA — Analog ground |
| Pino 9 | VDDA — Analog power supply (ADC) |
| Pino 10 | PA0 — GPIO / WKUP / ADC12_IN0 / TIM2_CH1 |
| Pino 11 | PA1 — GPIO / ADC12_IN1 / TIM2_CH2 |
| Pino 12 | PA2 — GPIO / USART2_TX / ADC12_IN2 |
| Pino 13 | PA3 — GPIO / USART2_RX / ADC12_IN3 |
| Pino 14 | PA4 — GPIO / SPI1_NSS / DAC_OUT1 / ADC12_IN4 |
| Pino 15 | PA5 — GPIO / SPI1_SCK / DAC_OUT2 / ADC12_IN5 |
| Pino 16 | PA6 — GPIO / SPI1_MISO / ADC12_IN6 |
| Pino 17 | PA7 — GPIO / SPI1_MOSI / ADC12_IN7 |
| Pino 18 | PC4 — GPIO / ADC12_IN14 |
| Pino 19 | PC5 — GPIO / ADC12_IN15 |
| Pino 20 | PB0 — GPIO / ADC12_IN8 / TIM3_CH3 |
| Pino 21 | PB1 — GPIO / ADC12_IN9 / TIM3_CH4 |
| Pino 22 | PB2 — GPIO / BOOT1 |
| Pino 23 | PB10 — GPIO / I2C2_SCL / USART3_TX / TIM2_CH3 remap |
| Pino 24 | PB11 — GPIO / I2C2_SDA / USART3_RX |
| Pino 25 | VSS1 — Digital ground 1 |
| Pino 26 | VDD1 — Digital power supply 1 |
| Pino 27 | PB12 — GPIO / SPI2_NSS / TIM1_BKIN |
| Pino 28 | PB13 — GPIO / SPI2_SCK / TIM1_CH1N |
| Pino 29 | PB14 — GPIO / SPI2_MISO / TIM1_CH2N |
| Pino 30 | PB15 — GPIO / SPI2_MOSI / TIM1_CH3N |
| Pino 31 | PC6 — GPIO / FSMC / TIM3_CH1 remap |
| Pino 32 | PC7 — GPIO / FSMC / TIM3_CH2 remap |
| Pino 33 | PC8 — GPIO / FSMC / TIM3_CH3 remap |
| Pino 34 | PC9 — GPIO / FSMC / TIM3_CH4 remap |
| Pino 35 | PA8 — GPIO / USART1_CK / TIM1_CH1 / MCO |
| Pino 36 | PA9 — GPIO / USART1_TX / TIM1_CH2 |
| Pino 37 | PA10 — GPIO / USART1_RX / TIM1_CH3 |
| Pino 38 | PA11 — GPIO / USB_DM / CAN_RX / TIM1_CH4 |
| Pino 39 | PA12 — GPIO / USB_DP / CAN_TX |
| Pino 40 | PA13 — GPIO / JTMS / SWDIO (debug) |
| Pino 41 | VSS2 — Digital ground 2 |
| Pino 42 | VDD2 — Digital power supply 2 |
| Pino 43 | PA14 — GPIO / JTCK / SWCLK (debug) |
| Pino 44 | PA15 — GPIO / JTDI / SPI1_NSS remap |
| Pino 45 | PC10 — GPIO / FSMC / UART4_TX remap |
| Pino 46 | PC11 — GPIO / FSMC / UART5_RX remap |
| Pino 47 | PC12 — GPIO / FSMC / UART5_TX remap |
| Pino 48 | PD2 — GPIO / TIM3_ETR / UART5_RX |
| Pino 49 | PB3 — GPIO / JTDO / SPI1_SCK remap |
| Pino 50 | PB4 — GPIO / NJTRST / SPI1_MISO remap |
| Pino 51 | PB5 — GPIO / I2C1_SMBA / SPI1_MOSI remap / CAN2 |
| Pino 52 | PB6 — GPIO / I2C1_SCL / USART1_TX / TIM4_CH1 |
| Pino 53 | PB7 — GPIO / I2C1_SDA / USART1_RX / TIM4_CH2 |
| Pino 54 | BOOT0 — Boot mode selection pin |
| Pino 55 | PB8 — GPIO / I2C1_SCL remap / TIM4_CH3 / CANRX remap |
| Pino 56 | PB9 — GPIO / I2C1_SDA remap / TIM4_CH4 / CANTX remap |
| Pino 57 | VSS3 — Digital ground 3 |
| Pino 58 | VDD3 — Digital power supply 3 |
| Pino 59 | PC0 — GPIO / ADC12_IN10 |
| Pino 60 | PC1 — GPIO / ADC12_IN11 |
| Pino 61 | PC2 — GPIO / ADC12_IN12 |
| Pino 62 | PC3 — GPIO / ADC12_IN13 |
| Pino 63 | VSS4 — Digital ground 4 |
| Pino 64 | VDD4 — Digital power supply 4 |
Aplicações típicas
STM32F103RGT6 é adequado para 6 aplicaçãos: Industrial Motor Control, USB Communication Modules, CAN Bus Industrial Networking, TFT LCD HMI Panels, Embedded Development Platforms, Consumer Appliance Control.
Industrial Motor Control
The STM32F103RGT6 fits industrial motor control because its 72 MHz Cortex-M3 with single-cycle multiply and hardware division executes FOC (field-oriented control) loops at the required PWM frequencies, while its 17 timers include advanced timers with complementary PWM outputs and dead-time insertion. In a typical topology, TIM1 generates the 3-phase PWM driving an inverter gate-driver stage, and the 3x 12-bit ADCs sample phase currents synchronized to the PWM center. The 1 MB Flash retains full FOC libraries plus communication stacks. Designers should budget Flash wait states at 72 MHz and validate ADC sampling jitter, since deterministic current sampling is the key performance factor in low-ripple torque control.
Recomendado
USB Communication Modules
The STM32F103RGT6 is a mainstay of USB device modules because its integrated USB 2.0 full-speed device controller requires no external PHY, and the 1 MB Flash comfortably holds the USB stack plus application firmware (CDC, HID, MSC classes). In a typical design, the MCU enumerates as a virtual COM port over the 12 Mbps full-speed bus, with the internal 48 MHz USB clock derived from the PLL. The 96 KB SRAM buffers packet traffic without burdening the application heap. A key consideration: USB and CAN share dedicated SRAM on this device, so choose the interface per product variant. Crystal tolerance of 0.01% or better is recommended for reliable USB enumeration.
Recomendado
CAN Bus Industrial Networking
For CAN networking nodes, the STM32F103RGT6 offers a 2.0B-active CAN controller with 14 scalable filter banks, and the 1 MB Flash supports protocol stacks such as CANopen or J1939 alongside the application. The MCU typically connects through an external CAN transceiver to the differential bus, with the PLL-derived 72 MHz APB clock generating accurate bit timing up to 1 Mbps. The 96 KB SRAM maintains message FIFOs and object dictionaries for industrial profiles. Because CAN shares hardware resources with USB as noted in the ST datasheet, confirm the interface allocation early. The -40C to +85C temperature range suits cabinet-mounted industrial nodes.
Recomendado
TFT LCD HMI Panels
The STM32F103RGT6 drives TFT LCD human-machine interfaces efficiently through its FSMC, which provides a dedicated parallel LCD interface in 8080/6800 modes, offloading bus timing from software. Connected to common controllers like the ILI9341 over a 16-bit parallel bus, the FSMC achieves fast framebuffer transfers for responsive GUI updates, while the 1 MB Flash stores glyph tables and compressed image assets without external SPI Flash. The 3x 12-bit ADCs can handle resistive touch-screen sampling. Designers should reserve GPIO for the LCD control signals and consider DMA-driven FSMC writes to keep the CPU free for application logic during screen redraws.
Recomendado
Embedded Development Platforms
The STM32F103RGT6 is the classic choice for low-cost development boards and educational platforms because the STM32F1 series has the largest ecosystem of open-source tooling, including ST-Link/SWD debugging, libOpenCM3, and Arduino-core ports. The 1 MB Flash and 96 KB SRAM remove memory constraints that frustrate beginners on smaller F103 variants, allowing full RTOS demos (FreeRTOS, RT-Thread) plus networking stacks. SWD requires only 4 wires (SWDIO, SWCLK, GND, 3.3V), and the BOOT0 pin enables built-in UART bootloader programming with no external programmer. This mature ecosystem shortens learning curves and prototyping cycles substantially.
Recomendado
Consumer Appliance Control
In appliances such as air conditioners, rice cookers, and washing machines, the STM32F103RGT6 provides sufficient compute for control plus display and communication in a single chip. Its 13 communication interfaces allow simultaneous USART links to display or Wi-Fi modules and I2C control of sensors, while the 3x 12-bit ADCs read temperature sensors (NTC) and mains-synchronized zero-cross detection. The 1 MB Flash supports OTA-capable firmware with dual-bank-style bootloaders within the single bank architecture. The 2.0V to 3.6V supply and -40C to +85C range fit typical appliance power trees, and RoHS compliance satisfies consumer product regulations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para STM32F103RGT6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | STM32F103RCT6 | STM32F103RBT6 | GD32F103RGT6 | APM32F103RGT6 | STM32F103RGT7 |
|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | GigaDevice | Geehy Semiconductor | STMicroelectronics |
| Core / Max Clock | Cortex-M3 / 72 MHz | Cortex-M3 / 72 MHz | Cortex-M3 / 72 MHz | Cortex-M3 / 108 MHz | Cortex-M3 / 72 MHz | Cortex-M3 / 72 MHz |
| Flash Memory | 1 MB | 256 KB | 128 KB | 1 MB | 1 MB | 1 MB |
| SRAM | 96 KB | 48 KB | 20 KB | 96 KB | 96 KB | 96 KB |
| Flash Wait States | 2 WS at 72 MHz (64-bit flash, prefetch) | 2 WS at 72 MHz | 2 WS at 72 MHz | 0 WS (SRAM-buffered flash) | 2 WS at 72 MHz | 2 WS at 72 MHz |
| Supply Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.6 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
Principais diferenciais
- Maximum Flash in 64-pin F103 family (vs STM32F103RCT6)
- Native ST ecosystem and errata maturity (vs GD32F103RGT6)
- Wider industrial temperature availability (vs STM32F103RBT6)
Notas de projeto
Provide a separate filtered analog supply: feed VDDA through a ferrite bead plus 1 uF and 10 nF ceramic capacitors placed within 5 mm of pin 9, with VSSA star-grounded to pin 8. ADC accuracy on the F103 degrades noticeably with digital switching noise on VDDA, especially when FSMC or USB is active. Estimated: an RC filter with 600-ohm ferrite DC resistance is negligible against the ~10 mA analog supply draw but blocks >50 MHz switching harmonics effectively.
Set Flash latency correctly for your clock: 0 wait states up to 24 MHz, 1 WS up to 48 MHz, 2 WS up to 72 MHz per the ST datasheet clock tree. Migrating code to GD32F103RGT6 changes this completely - its SRAM-buffered Flash runs at 0 WS, which silently speeds up timing-sensitive loops (bit-banged protocols, delay loops). Additionally, remember USB and CAN share dedicated SRAM on F103 parts and cannot operate simultaneously; and BOOT0 must be tied to ground via 10 k-ohm for normal flash boot.
Place a 100 nF ceramic decoupling capacitor at each VDD/VSS pair (pins 25/26, 41/42, 57/58, 63/64) plus 4.7 uF bulk capacitance, within 2 mm of the pins on the same layer. Route the 8 MHz crystal (PD0/PD1) with short traces, ground guard rings, and keep the 3.3V USB differential pair (PA11/PA12) 90-ohm matched if the full-speed bus is used. SWDIO/SWCLK (pins 40/43) should be broken out to a 4-pin header on every production board for field debugging.
Informações de conformidade
RoHS compliant per distributor listings. AEC-Q100 qualification not indicated for this commercial/industrial grade part.
