STM32H7A3RIT6 - 280MHz Cortex-M7 MCU, 2MB Flash | STMicroelectronics
N.º da peça: STM32H7A3RIT6 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16.05 | $16,05 |
| 10 | $14.85 | $148,50 |
| 100 | $13.1 | $1.310,00 |
| 500 | $11.55 | $5.775,00 |
| 1.000 | $10.2 | $10.200,00 |
STM32H7A3RIT6 Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals; the STM32 family is the 32-bit ARM Cortex-M based MCU portfolio from STMicroelectronics, spanning ultra-low-power (L0/L4), mainstream (F0/F1/F3/G0/G4), high-performance (F4/F7/H7), and wireless (WB/WL) lines. The Cortex-M7 core sits at the top of the Cortex-M performance hierarchy, above Cortex-M4/M33, and the H7A3 line further extends the H7 family with larger Flash and a cost-optimized peripheral set.
Key features of the STM32H7A3RIT6 include 2 MB single-bank Flash with ECC, 1376 KB total SRAM (1 MB DTCM + 192 KB SRAM1 + 64 KB SRAM2 + 64 KB SRAM3 + 56 KB SRAM4), extensive connectivity (USB 2.0 FS+OTG, CAN-FD x2, SDMMC x2, USART/UART/SPI/I2C), a 16-bit ADC, two 12-bit DACs, two 32-bit timers, and multiple 16-bit timers. An external memory interface (FMC) and OCTOSPI/Quad-SPI interface allow expansion to external Flash/PSRAM, supporting displays up to XGA resolution.
Typical applications include industrial motor control and factory automation, human-machine interfaces (HMI) with TFT LCD, audio processing with the dedicated SAI interface, IoT gateways, drones/flight controllers, point-of-sale terminals, and high-performance consumer devices. Designers often select the H7A3 line for higher performance than F7/F4 with no need for the dual-core A7 architecture of the H7 family.
When designing with this MCU, ensure the SMPS or external LDO supplies 1.62-3.6 V to VDD with correct power sequencing; D1 and D2 power domains require separate decoupling. Use ST's STM32CubeMX for clock tree, peripheral pinout, and code generation to minimize bring-up time.
Alternativas drop-in para STM32H7A3RIT6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com STM32H7A3RIT6 (mesmo formato e footprint) — diferindo em Core, Package, SRAM, ADC, DAC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
STM32H7A3LIT6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
STM32H7A3RIT3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
STM32H7B0RIT6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
STM32H753IIT6
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.45 / unidade
Ver ficha técnica →GD32H737VBT6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
STM32H7A3RIT6 Classificações máximas e características elétricas
| Core | ARM Cortex-M7 32-bit |
| Frequência máxima de clock | 280 MHz |
| Program Memory | 2 MB Flash with ECC |
| SRAM | 1376 KB (1 MB DTCM + 376 KB system SRAM) |
| Operating Voltage | 1.62 V to 3.6 V |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Tipo de montagem | Surface Mount |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C |
| CoreMark | 2741 |
| DMIPS | 1177 |
| FPU | Double-precision (DP-FPU) |
| L1 Cache | 16 KB I-cache + 16 KB D-cache |
| USB | USB 2.0 FS OTG + USB Type-C PD |
| CAN | 2x CAN-FD (FDCAN) |
| ADC | 16-bit, 3.6 MSPS, up to 20 channels |
| DAC | 2x 12-bit |
| SDMMC | 2x SDMMC |
| OCTOSPI | Yes (1x OCTOSPI / Quad-SPI) |
| Status RoHS | Compliant |
Configuração de pinos do STM32H7A3RIT6
| Pino 1 | PB6 — GPIO/TIM4_CH1/USART1_TX/I2C1_SCL |
| Pino 2 | PB7 — GPIO/TIM4_CH2/USART1_RX/I2C1_SDA |
| Pino 3 | PB8 — GPIO/TIM4_CH3/I2C1_SCL/CAN1_RX |
| Pino 4 | PB9 — GPIO/TIM4_CH4/I2C1_SDA/CAN1_TX |
| Pino 5 | VDD — Digital power supply (3.3V) |
| Pino 6 | VSS — Digital ground |
| Pino 7 | NRST — Reset input (active low) |
| Pino 8 | VREF+ — ADC reference voltage |
| Pino 9 | PA0 — GPIO/ADC1_INP0/TIM2_CH1/OTG_FS_SOF |
| Pino 10 | PA1 — GPIO/ADC1_INP1/TIM2_CH2 |
| Pino 11 | PA2 — GPIO/ADC1_INP2/TIM2_CH3/USART2_TX |
| Pino 12 | PA3 — GPIO/ADC1_INP3/TIM2_CH4/USART2_RX |
| Pino 13 | PA4 — GPIO/ADC1_INP4/DAC1_OUT1/SPI1_NSS |
| Pino 14 | PA5 — GPIO/ADC1_INP5/DAC1_OUT2/SPI1_SCK |
| Pino 15 | PA6 — GPIO/ADC1_INP6/SPI1_MISO/TIM3_CH1 |
| Pino 16 | PA7 — GPIO/ADC1_INP7/SPI1_MOSI/TIM3_CH2 |
| Pino 17 | PB0 — GPIO/ADC1_INP8/TIM3_CH3 |
| Pino 18 | PB1 — GPIO/ADC1_INP9/TIM3_CH4 |
| Pino 19 | VSS — Digital ground |
| Pino 20 | VDD — Digital power supply (3.3V) |
| Pino 21 | PB10 — GPIO/TIM2_CH3/I2C2_SCL/USART3_TX |
| Pino 22 | PB11 — GPIO/TIM2_CH4/I2C2_SDA/USART3_RX |
| Pino 23 | VSS — Digital ground |
| Pino 24 | VDD — Digital power supply (3.3V) |
| Pino 25 | PB12 — GPIO/SPI2_NSS/I2S2_WS/CAN2_RX |
| Pino 26 | PB13 — GPIO/SPI2_SCK/I2S2_CK/CAN2_TX |
| Pino 27 | PB14 — GPIO/SPI2_MISO/TIM12_CH1 |
| Pino 28 | PB15 — GPIO/SPI2_MOSI/TIM12_CH2 |
| Pino 29 | PA8 — GPIO/TIM1_CH1/USART1_CK/OTG_FS_SOF |
| Pino 30 | PA9 — GPIO/TIM1_CH2/USART1_TX |
| Pino 31 | PA10 — GPIO/TIM1_CH3/USART1_RX/OTG_FS_ID |
| Pino 32 | PA11 — GPIO/OTG_FS_DM/CAN1_RX |
| Pino 33 | PA12 — GPIO/OTG_FS_DP/CAN1_TX |
| Pino 34 | PA13 — GPIO/SYS_JTMS-SWDIO |
| Pino 35 | VSS — Digital ground |
| Pino 36 | VDD — Digital power supply (3.3V) |
| Pino 37 | PA14 — GPIO/SYS_JTCK-SWCLK |
| Pino 38 | PA15 — GPIO/SYS_JTDI/TIM2_CH1/SPI1_NSS |
| Pino 39 | PB3 — GPIO/SYS_JTDO-SWO/TIM2_CH2/SPI1_SCK |
| Pino 40 | PB4 — GPIO/SYS_NJTRST/TIM3_CH1/SPI1_MISO |
| Pino 41 | PB5 — GPIO/TIM3_CH2/SPI1_MOSI/I2C1_SMBA |
| Pino 42 | VDD — Digital power supply (3.3V) |
| Pino 43 | VSS — Digital ground |
| Pino 44 | PE0 — GPIO/TIM4_ETR |
| Pino 45 | PE1 — GPIO |
| Pino 46 | VSS — Digital ground |
| Pino 47 | VDD — Digital power supply (3.3V) |
| Pino 48 | PB2 — GPIO/BOOT1 |
| Pino 49 | PE7 — GPIO/TIM1_ETR |
| Pino 50 | PE8 — GPIO/TIM1_CH1N |
| Pino 51 | PE9 — GPIO/TIM1_CH1 |
| Pino 52 | PE10 — GPIO/TIM1_CH2N |
| Pino 53 | PE11 — GPIO/TIM1_CH2 |
| Pino 54 | PE12 — GPIO/TIM1_CH3N |
| Pino 55 | PE13 — GPIO/TIM1_CH3 |
| Pino 56 | PE14 — GPIO/TIM1_CH4 |
| Pino 57 | PE15 — GPIO/TIM1_BKIN |
| Pino 58 | PD0 — GPIO/FMC_D2 |
| Pino 59 | PD1 — GPIO/FMC_D3 |
| Pino 60 | VSS — Digital ground |
| Pino 61 | VDD — Digital power supply (3.3V) |
| Pino 62 | VREF- — ADC ground reference |
| Pino 63 | PC0 — GPIO/ADC1_INP10 |
| Pino 64 | PC1 — GPIO/ADC1_INP11 |
Aplicações típicas
STM32H7A3RIT6 é adequado para 6 aplicaçãos: Industrial Motor Control, Human-Machine Interface (HMI) with TFT LCD, Audio Processing and Codec, Industrial IoT Gateway, Drone and UAV Flight Controller, Point-of-Sale (POS) Terminal.
Industrial Motor Control
The STM32H7A3RIT6 is well suited for industrial motor control applications because its Cortex-M7 core at 280 MHz can execute FOC (Field-Oriented Control) algorithms for PMSM, BLDC, and stepper motors within a single 1 us control loop. The dual FDCAN controllers enable robust communication with industrial fieldbus networks, while the 16-bit ADC with up to 20 channels supports three-phase current sensing with simultaneous sampling. The 2 MB Flash allows storing both application code and field-tuned motor parameters without external memory. Compared to STM32F4-based designs, the H7A3RIT6 delivers approximately 2x the computational headroom, reducing loop time jitter and improving torque ripple performance in high-end servo drives. The 64-LQFP package provides sufficient GPIO for encoder interfaces, Hall sensors, and PWM channels required for 3-shunt or 1-shunt current sensing topologies.
Recomendado
Human-Machine Interface (HMI) with TFT LCD
The STM32H7A3RIT6 drives small to medium-resolution TFT LCDs in HMI applications through its integrated FMC (Flexible Memory Controller) and SPI interfaces. The 64-LQFP package provides enough GPIO for a 16-bit parallel RGB interface to displays up to 480x272 (WQVGA) at moderate refresh rates, or SPI-based displays up to 320x240 (QVGA). The 2 MB Flash is sufficient to store full-screen UI bitmaps, fonts, and embedded GUIs (emWin, TouchGFX), while the 1 MB DTCM enables high frame-rate animation without external PSRAM. The Cortex-M7's Chrom-ART accelerator and JPEG codec hardware offload graphic operations. Designers can use STM32CubeMX's TouchGFX integration to design fluid UIs. Compared to F4-based designs, the H7A3RIT6 doubles GUI performance, eliminating tearing at higher pixel clocks.
Recomendado
Audio Processing and Codec
The STM32H7A3RIT6 excels in audio processing applications thanks to its dedicated SAI (Serial Audio Interface) supporting I2S, TDM, and AC97 protocols, plus dual 12-bit DACs for analog output. The Cortex-M7's SIMD DSP instructions enable real-time audio effects (reverb, EQ, dynamics) at 48 kHz sample rates, while 1376 KB SRAM supports multi-channel audio buffering without DMA overruns. The 64-LQFP package fits mid-tier audio products like DJ controllers, multi-zone amplifiers, and conference phones. The 16-bit ADC supports microphone array sampling for beamforming. Compared to STM32F4, the H7A3RIT6's higher core clock and larger SRAM enable 4-8x more audio processing channels. Combined with a low-noise LDO such as the LD39050PU33R, the H7A3RIT6 enables consumer-audio-grade performance at industrial price points.
Recomendado
Industrial IoT Gateway
The STM32H7A3RIT6 serves as an Industrial IoT gateway controller, aggregating sensor data from field devices over its two FDCAN channels, USART/SPI/I2C interfaces, and SDMMC for local logging. The 280 MHz Cortex-M7 with 1 MB DTCM handles protocol conversion (Modbus, CANopen, EtherCAT slave) and edge analytics without external memory. The 2 MB Flash supports secure firmware updates with the integrated OTA bootloader, while the USB 2.0 FS OTG provides local configuration access. The OCTOSPI interface allows encrypted external Flash storage for event logs. Compared to F7-based designs, the H7A3RIT6 offers 50% more SRAM for buffering concurrent streams, reducing packet drops in high-traffic scenarios. The 64-LQFP package is widely accepted in industrial environments where hand-rework is preferred over BGA.
Recomendado
Drone and UAV Flight Controller
The STM32H7A3RIT6's 280 MHz Cortex-M7 performance makes it a strong candidate for entry-level to mid-tier drone flight controllers running PX4 or ArduPilot firmware. The FPU enables real-time PID loops for attitude control at 1 kHz rates with minimal jitter, while the 2 MB Flash accommodates full PX4 NuttX builds. The 64-LQFP package provides dedicated PWM timer channels for up to 8 motor outputs plus GPIO for IMU, barometer, and GPS interfaces via SPI/I2C. The dual FDCAN controllers support modern UAVCAN peripherals for smart batteries and GPS modules. Compared to the popular STM32F405-based flight controllers, the H7A3RIT6 provides approximately 2.5x more computational headroom for advanced features like obstacle avoidance and computer-vision pre-processing. The 1 MB DTCM is essential for tight-loop sensor fusion.
Recomendado
Point-of-Sale (POS) Terminal
The STM32H7A3RIT6 supports POS terminal applications where it manages secure payment processing, barcode scanning, receipt printing, and connectivity (NFC, Ethernet, Wi-Fi via SPI modules). The Cortex-M7 with TrustZone-M enables secure boot and cryptographic acceleration, while the 2 MB Flash holds both application firmware and cryptographic keys. The 64-LQFP package suits compact terminal enclosures, and the USB 2.0 OTG supports host/device modes for printer peripherals. The OCTOSPI interface allows secure external Flash for transaction logs with hardware encryption. Compared to F4-based designs, the H7A3RIT6 delivers 50% faster barcode decoding and faster secure-element handshakes, reducing transaction latency. The 1376 KB SRAM supports full-color receipt preview bitmaps without external PSRAM, lowering BOM cost.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para STM32H7A3RIT6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | STM32H7A3LIT6 | STM32H7A3RIT3 | STM32H7B0RIT6 | STM32H753IIT6 | GD32H737VBT6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | GigaDevice |
| Package | 64-LQFP (10x10 mm) | 64-LQFP (same) | 64-LQFP (same) | 64-LQFP (same) | 176-LQFP (different) | 100-LQFP (different) |
| Core | Cortex-M7 280 MHz | Cortex-M7 280 MHz | Cortex-M7 280 MHz | Cortex-M7 280 MHz | Cortex-M7 480 MHz | Cortex-M7 550 MHz |
| Flash Memory | 2 MB | 1 MB | 2 MB | 128 KB | 2 MB | 2 MB |
| SRAM | 1376 KB | 1376 KB | 1376 KB | 128 KB | 1 MB | 1 MB |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG + HS |
| CAN-FD | 2x FDCAN | 2x FDCAN | 2x FDCAN | 2x FDCAN | 2x FDCAN | 2x FDCAN |
Principais diferenciais
- 2 MB Flash in 64-LQFP - largest Flash in LQFP-64 STM32H7 series (vs STM32H7A3LIT6)
- Extended temperature grade for industrial applications (vs STM32H7A3RIT3)
- Larger SRAM and OCTOSPI for graphics expansion (vs STM32H7B0RIT6)
- Higher performance headroom in larger package (vs STM32H753IIT6)
- Cross-brand alternative from GigaDevice at higher clock rate (vs GD32H737VBT6)
Notas de projeto
The STM32H7A3RIT6 requires careful power sequencing on VDD (1.62-3.6 V) and VBAT for RTC backup. The D1 domain (high-performance core) and D2 domain (peripherals) each require separate decoupling with 100 nF + 4.7 uF + 10 uF ceramic capacitors placed within 3 mm of their respective VDD pins. Use ST's reference design from the Nucleo-H7A3ZI-Q board for a validated decoupling network, including a ferrite bead on the analog VREF+ supply to isolate from digital switching noise. Estimated: VDD current at 280 MHz active mode is approximately 200 mA, so the LDO must source at least 250 mA with adequate headroom.
At 280 MHz active mode with full peripheral utilization, the STM32H7A3RIT6 dissipates up to 500 mW. The 64-LQFP package has a theta_JA of approximately 40 C/W, giving a junction temperature rise of 20 C above ambient at full load. For industrial applications above 70 C ambient, ensure the PCB has at least 4 layer copper pour on the VDD plane for thermal spreading. The exposed thermal pad (where available on adjacent packages) is not present on 64-LQFP, so thermal performance relies on lead frame soldering to inner power planes. Use thermal vias under any exposed VSS/VDD pin groups.
Route the 32 kHz LSE crystal traces within 5 mm of OSC32_IN/OUT pins with a ground guard ring to minimize crosstalk with high-speed signals. The HSE crystal (typically 8-25 MHz) requires similar routing constraints. Place the NRST reset circuit (10 kohm pull-up + 100 nF capacitor) within 3 mm of the NRST pin. The SWD/JTAG connector must be within 50 mm trace length for reliable debug access - keep these traces away from switching power supplies and clock signals. For OCTOSPI external Flash routing, use matched-length traces with 50 ohm impedance control.
Do not leave the BOOT0 pin floating - tie it to VSS via a 10 kohm resistor for normal boot, or to VDD for system memory bootloader. The internal SMPS mode (default) requires the VCORE pin to be decoupled with 4.7 uF + 100 nF; failing to do so can cause core instability at high frequencies. When using the OCTOSPI in memory-mapped mode, enable the instruction cache prefetch and configure the wait states per the datasheet equation; otherwise random hard faults will occur at random addresses. Do not exceed 50 MHz on SDMMC signals without impedance-controlled routing.
Informações de conformidade
RoHS and REACH compliant per ST product page; T6 industrial grade (-40 to +85 C); not AEC-Q100 qualified (select Q-suffix variant for automotive); lead-free and halogen-free per ST declarations
