W634GU6RB11I - 4Gb DDR3L SDRAM x16 933MHz | Winbond
N.º da peça: W634GU6RB11I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.1 | $3,10 |
| 10 | $2.85 | $28,50 |
| 100 | $2.5 | $250,00 |
| 500 | $2.2 | $1.100,00 |
| 1.000 | $1.95 | $1.950,00 |
W634GU6RB11I Visão geral
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that transfers data on both edges of the clock signal, effectively doubling the data rate. It operates at a lower voltage (1.35V) than standard DDR3 (1.5V), offering improved energy efficiency. DDR3L is part of the DDR SDRAM family, which includes DDR, DDR2, DDR3, and DDR4, and is widely used in computing, networking, and embedded systems where high bandwidth and low power are critical.
Key features of the W634GU6RB11I include a parallel interface with a 16-bit data bus, support for industrial temperature range (-40°C to +95°C), and compatibility with JEDEC DDR3L standards. The device offers burst lengths of 8 and 4, on-die termination (ODT), and programmable CAS latency. Its low-voltage operation and high density make it suitable for applications requiring large memory capacity with minimal power draw.
The W634GU6RB11I utilizes advanced DRAM process technology, achieving high-speed data transfer while maintaining low power consumption. The 96-ball VFBGA package provides excellent thermal and electrical performance, with a compact footprint suitable for space-constrained designs. The device supports auto-refresh and self-refresh modes, ensuring data integrity with minimal power consumption during idle periods.
Typical applications include networking equipment (routers, switches), industrial automation, embedded computing, and consumer electronics such as set-top boxes and smart TVs. Its industrial temperature rating makes it suitable for harsh environments, while the low-voltage operation extends battery life in portable devices.
When designing with this component, ensure proper decoupling capacitors are placed near the power pins to minimize noise. The VFBGA package requires careful PCB layout to route the fine-pitch balls, and the DDR3L interface should be terminated according to JEDEC guidelines to maintain signal integrity.
Alternativas drop-in para W634GU6RB11I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com W634GU6RB11I (mesmo formato e footprint) — diferindo em Package, Supply Voltage, Operating Temperature, CAS Latency, Data Rate.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
W634GU6RB-11
✅ Drop-In✓ Em estoque
$13.5227 / unidade
Ver ficha técnica →W634GU6NB-11
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →IS43TR16512B-125K
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
K4B4G1646E-BYMA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.3182 / unidade
Ver ficha técnica →W634GU6RB11I Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Tamanho da memória | 4Gbit (256M x 16) |
| Interface | Parallel |
| Clock Frequency | 933 MHz |
| Access Time | 20 ns |
| Tensão de alimentação | 1.35V |
| Encapsulamento | 96-VFBGA (7.5x13) |
| Temperatura de operação | -40°C to +95°C (Industrial) |
| Largura do barramento de dados | 16 bit |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Livre de halogênio | Yes |
| Organização da memória | 256M x 16 |
| Latência CAS | 11 (at 933 MHz) |
| Refresh | Auto and Self Refresh |
Configuração de pinos do W634GU6RB11I
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ2 — Data input/output 2 |
| Pino B3 | DQ3 — Data input/output 3 |
| Pino C1 | VDDQ — I/O power supply |
| Pino C2 | DQ4 — Data input/output 4 |
| Pino C3 | DQ5 — Data input/output 5 |
| Pino D1 | VSSQ — I/O ground |
| Pino D2 | DQ6 — Data input/output 6 |
| Pino D3 | DQ7 — Data input/output 7 |
| Pino E1 | CK — Clock input |
| Pino E2 | CK# — Complementary clock input |
| Pino E3 | CKE — Clock enable |
Aplicações típicas
W634GU6RB11I é adequado para 6 aplicaçãos: Networking Equipment, Industrial Automation, Embedded Computing, Consumer Electronics, Automotive Infotainment, Medical Devices.
Networking Equipment
The W634GU6RB11I's 4Gb density and 933MHz speed provide ample buffering for routers and switches. Its low 1.35V operation reduces power consumption in always-on network devices, while the industrial temperature range ensures reliability in telecom cabinets. The 16-bit interface simplifies PCB routing, and the VFBGA package fits compact line cards.
Recomendado
Industrial Automation
In industrial controllers and PLCs, the W634GU6RB11I provides reliable, high-speed memory for data logging and real-time processing. Its industrial temperature rating (-40°C to +95°C) withstands harsh factory environments. The low-voltage operation minimizes heat generation, and the 4Gb capacity supports complex control algorithms. The parallel interface integrates easily with industrial SoCs.
Recomendado
Embedded Computing
For embedded systems like single-board computers and IoT gateways, the W634GU6RB11I offers a balance of capacity, speed, and power efficiency. The 4Gb size supports operating systems and applications, while 933MHz ensures responsive performance. The 1.35V supply extends battery life in portable embedded devices. The VFBGA package is ideal for compact designs.
Recomendado
Consumer Electronics
In smart TVs, set-top boxes, and gaming consoles, the W634GU6RB11I provides the memory bandwidth needed for HD video streaming and multitasking. Its low power consumption is crucial for energy-efficient consumer devices. The 16-bit interface reduces BOM cost, and the compact VFBGA package fits slim enclosures. The industrial temperature grade ensures durability in home environments.
Recomendado
Automotive Infotainment
The W634GU6RB11I is suitable for automotive infotainment systems, providing high-speed memory for navigation, audio, and video processing. Its industrial temperature range covers automotive cabin environments, and the low-voltage operation reduces stress on vehicle power systems. The 4Gb capacity supports complex user interfaces, and the parallel interface connects to automotive SoCs.
Recomendado
Medical Devices
In medical imaging and patient monitoring equipment, the W634GU6RB11I offers reliable, high-speed memory for data acquisition and processing. Its industrial temperature rating ensures operation in clinical environments, and the low power consumption is beneficial for battery-powered devices. The 4Gb capacity supports large data buffers, and the VFBGA package is suitable for compact medical devices.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para W634GU6RB11I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | W634GU6RB-11 | MT41K256M16HA-125 | IS43TR16512B-125K |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Micron Technology | ISSI |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Clock Frequency | 933 MHz | 933 MHz | 933 MHz | 933 MHz |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Industrial temperature range (vs MT41K256M16HA-125)
- Low-voltage operation (vs IS43TR16512B-125K)
- Same-brand availability (vs K4B4G1646E-BYMA)
Notas de projeto
For the 96-ball VFBGA package, ensure the PCB has adequate routing channels for the fine-pitch balls. Use micro-vias or blind vias to connect inner layers. Follow JEDEC guidelines for DDR3L layout, including matched trace lengths for DQ, DQS, and address/control signals to maintain signal integrity at 933MHz.
Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed as close as possible to the balls. Use a solid ground plane and a separate power plane for VDDQ to minimize noise. The 1.35V supply should be regulated with a low-noise LDO or DC-DC converter to ensure stable operation.
The VFBGA package has a thermal resistance of approximately 20°C/W. For high-speed operation, ensure adequate airflow or a thermal pad to dissipate heat. The industrial temperature range allows operation up to 95°C, but keep junction temperature below 105°C for reliability.
Informações de conformidade
RoHS compliant and halogen-free per Winbond product documentation. AEC-Q100 not applicable for DRAM.
