W634GU6RB11I - 4Gb DDR3L SDRAM x16 933MHz | Winbond
MPN: W634GU6RB11I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.1 | $3.10 |
| 10 | $2.85 | $28.50 |
| 100 | $2.5 | $250.00 |
| 500 | $2.2 | $1,100.00 |
| 1,000 | $1.95 | $1,950.00 |
Drop-in alternatives for W634GU6RB11I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
W634GU6RB-11
✅ Drop-In✓ 99,999 In Stock
$32.8 / Unit
View Datasheet →W634GU6NB-11
✅ Drop-In📋 Reference alternative (not in catalog)
MT41K256M16HA-125
✅ Drop-In✓ 99,999 In Stock
$5.6 / Unit
View Datasheet →IS43TR16512B-125K
✅ Drop-In📋 Reference alternative (not in catalog)
K4B4G1646E-BYMA
✅ Drop-In✓ 99,999 In Stock
$11.5 / Unit
View Datasheet →W634GU6RB11I Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Memory Size | 4Gbit (256M x 16) |
| Interface | Parallel |
| Clock Frequency | 933 MHz |
| Access Time | 20 ns |
| Supply Voltage | 1.35V |
| Package | 96-VFBGA (7.5x13) |
| Operating Temperature | -40°C to +95°C (Industrial) |
| Data Bus Width | 16 bit |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Halogen Free | Yes |
| Organization | 256M x 16 |
| CAS Latency | 11 (at 933 MHz) |
| Refresh | Auto and Self Refresh |
W634GU6RB11I Pin Configuration
| Pin A1 | VDD — Power supply (1.35V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — I/O power supply |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — I/O ground |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
| Pin E1 | CK — Clock input |
| Pin E2 | CK# — Complementary clock input |
| Pin E3 | CKE — Clock enable |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
W634GU6RB11I is suitable for 6 applications: Networking Equipment, Industrial Automation, Embedded Computing, Consumer Electronics, Automotive Infotainment, Medical Devices.
Networking Equipment
The W634GU6RB11I's 4Gb density and 933MHz speed provide ample buffering for routers and switches. Its low 1.35V operation reduces power consumption in always-on network devices, while the industrial temperature range ensures reliability in telecom cabinets. The 16-bit interface simplifies PCB routing, and the VFBGA package fits compact line cards.
Recommended
Industrial Automation
In industrial controllers and PLCs, the W634GU6RB11I provides reliable, high-speed memory for data logging and real-time processing. Its industrial temperature rating (-40°C to +95°C) withstands harsh factory environments. The low-voltage operation minimizes heat generation, and the 4Gb capacity supports complex control algorithms. The parallel interface integrates easily with industrial SoCs.
Recommended
Embedded Computing
For embedded systems like single-board computers and IoT gateways, the W634GU6RB11I offers a balance of capacity, speed, and power efficiency. The 4Gb size supports operating systems and applications, while 933MHz ensures responsive performance. The 1.35V supply extends battery life in portable embedded devices. The VFBGA package is ideal for compact designs.
Recommended
Consumer Electronics
In smart TVs, set-top boxes, and gaming consoles, the W634GU6RB11I provides the memory bandwidth needed for HD video streaming and multitasking. Its low power consumption is crucial for energy-efficient consumer devices. The 16-bit interface reduces BOM cost, and the compact VFBGA package fits slim enclosures. The industrial temperature grade ensures durability in home environments.
Recommended
Automotive Infotainment
The W634GU6RB11I is suitable for automotive infotainment systems, providing high-speed memory for navigation, audio, and video processing. Its industrial temperature range covers automotive cabin environments, and the low-voltage operation reduces stress on vehicle power systems. The 4Gb capacity supports complex user interfaces, and the parallel interface connects to automotive SoCs.
Recommended
Medical Devices
In medical imaging and patient monitoring equipment, the W634GU6RB11I offers reliable, high-speed memory for data acquisition and processing. Its industrial temperature rating ensures operation in clinical environments, and the low power consumption is beneficial for battery-powered devices. The 4Gb capacity supports large data buffers, and the VFBGA package is suitable for compact medical devices.
Recommended
Recommended Products Summary
Engineering reference data for W634GU6RB11I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | W634GU6RB-11 | MT41K256M16HA-125 | IS43TR16512B-125K |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Micron Technology | ISSI |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Clock Frequency | 933 MHz | 933 MHz | 933 MHz | 933 MHz |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Industrial temperature range (vs MT41K256M16HA-125)
- Low-voltage operation (vs IS43TR16512B-125K)
- Same-brand availability (vs K4B4G1646E-BYMA)
Design Notes
For the 96-ball VFBGA package, ensure the PCB has adequate routing channels for the fine-pitch balls. Use micro-vias or blind vias to connect inner layers. Follow JEDEC guidelines for DDR3L layout, including matched trace lengths for DQ, DQS, and address/control signals to maintain signal integrity at 933MHz.
Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed as close as possible to the balls. Use a solid ground plane and a separate power plane for VDDQ to minimize noise. The 1.35V supply should be regulated with a low-noise LDO or DC-DC converter to ensure stable operation.
The VFBGA package has a thermal resistance of approximately 20°C/W. For high-speed operation, ensure adequate airflow or a thermal pad to dissipate heat. The industrial temperature range allows operation up to 95°C, but keep junction temperature below 105°C for reliability.
Compliance Information
RoHS compliant and halogen-free per Winbond product documentation. AEC-Q100 not applicable for DRAM.
